TWD146222S - LED Package - Google Patents

LED Package

Info

Publication number
TWD146222S
TWD146222S TW099305566F TW99305566F TWD146222S TW D146222 S TWD146222 S TW D146222S TW 099305566 F TW099305566 F TW 099305566F TW 99305566 F TW99305566 F TW 99305566F TW D146222 S TWD146222 S TW D146222S
Authority
TW
Taiwan
Prior art keywords
electronic components
creation
package
leds
accommodating
Prior art date
Application number
TW099305566F
Other languages
Chinese (zh)
Inventor
Christopher P Hussell
Shuying Huang
Original Assignee
克立公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 克立公司 filed Critical 克立公司
Publication of TWD146222S publication Critical patent/TWD146222S/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Abstract

【物品用途】;本創作係關於一種表面黏著型發光二極體之封裝，用以容納一或多個發光元件，例如，發光二極體。;【創作特點】;本創作係關於一種用以容納一或多個發光二極體之封裝。該封裝可包括一方型或矩型之本體，其中配置一或多個電子元件。該一或多個電子元件可由本體之相對邊延伸出，且在本體邊緣向內彎折，使得該相對之電子元件相互面對，該電子元件可倚靠在本體底面上。一發熱元件由該封裝本體底面突出，使其位在該電子元件之間。;本創作係關於一種新穎且獨特的外觀設計，其不僅可達成預期的功能，且亦提供一從未見於任何先前技藝中並具有賞心悅目之視覺效果的獨特外觀。[Article Use];This creation is about a surface mount type LED package for accommodating one or more light emitting elements, such as LEDs.; [Creation Features];This creation is about a package for accommodating one or more LEDs. The package may include a square or rectangular body in which one or more electronic components are arranged. The one or more electronic components may extend from opposite sides of the body and bend inward at the edge of the body so that the opposite electronic components face each other, and the electronic components may lean on the bottom surface of the body. A heating element protrudes from the bottom surface of the package body so that it is located between the electronic components. ;This creation is about a novel and unique appearance design, which not only achieves the expected functions, but also provides a unique appearance that has never been seen in any previous technology and has a pleasing visual effect.

TW099305566F 2010-04-30 2010-10-29 LED Package TWD146222S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/360,791 USD648686S1 (en) 2010-04-30 2010-04-30 Light emitting diode (LED) package

Publications (1)

Publication Number Publication Date
TWD146222S true TWD146222S (en) 2012-04-01

Family

ID=44907302

Family Applications (2)

Application Number Title Priority Date Filing Date
TW099305566F TWD146222S (en) 2010-04-30 2010-10-29 LED Package
TW100305347F TWD148144S1 (en) 2010-04-30 2010-10-29 Light emitting diode (led) package

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW100305347F TWD148144S1 (en) 2010-04-30 2010-10-29 Light emitting diode (led) package

Country Status (2)

Country Link
US (2) USD648686S1 (en)
TW (2) TWD146222S (en)

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US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
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US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting

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Publication number Priority date Publication date Assignee Title
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting

Also Published As

Publication number Publication date
USD648686S1 (en) 2011-11-15
TWD148144S1 (en) 2012-07-11
USD659657S1 (en) 2012-05-15

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