TWD146222S - Light emitting diode (led) package - Google Patents
Light emitting diode (led) packageInfo
- Publication number
- TWD146222S TWD146222S TW099305566F TW99305566F TWD146222S TW D146222 S TWD146222 S TW D146222S TW 099305566 F TW099305566 F TW 099305566F TW 99305566 F TW99305566 F TW 99305566F TW D146222 S TWD146222 S TW D146222S
- Authority
- TW
- Taiwan
- Prior art keywords
- package
- electronic components
- creation
- light emitting
- leds
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000000007 visual effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
Abstract
【物品用途】;本創作係關於一種表面黏著型發光二極體之封裝,用以容納一或多個發光元件,例如,發光二極體。;【創作特點】;本創作係關於一種用以容納一或多個發光二極體之封裝。該封裝可包括一方型或矩型之本體,其中配置一或多個電子元件。該一或多個電子元件可由本體之相對邊延伸出,且在本體邊緣向內彎折,使得該相對之電子元件相互面對,該電子元件可倚靠在本體底面上。一發熱元件由該封裝本體底面突出,使其位在該電子元件之間。;本創作係關於一種新穎且獨特的外觀設計,其不僅可達成預期的功能,且亦提供一從未見於任何先前技藝中並具有賞心悅目之視覺效果的獨特外觀。[Article Use];This creation is about a surface mount type LED package for accommodating one or more light emitting elements, such as LEDs.; [Creation Features];This creation is about a package for accommodating one or more LEDs. The package may include a square or rectangular body in which one or more electronic components are arranged. The one or more electronic components may extend from opposite sides of the body and bend inward at the edge of the body so that the opposite electronic components face each other, and the electronic components may lean on the bottom surface of the body. A heating element protrudes from the bottom surface of the package body so that it is located between the electronic components. ;This creation is about a novel and unique appearance design, which not only achieves the expected functions, but also provides a unique appearance that has never been seen in any previous technology and has a pleasing visual effect.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/360,791 USD648686S1 (en) | 2010-04-30 | 2010-04-30 | Light emitting diode (LED) package |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD146222S true TWD146222S (en) | 2012-04-01 |
Family
ID=44907302
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099305566F TWD146222S (en) | 2010-04-30 | 2010-10-29 | Light emitting diode (led) package |
TW100305347F TWD148144S1 (en) | 2010-04-30 | 2010-10-29 | Light emitting diode (led) package |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100305347F TWD148144S1 (en) | 2010-04-30 | 2010-10-29 | Light emitting diode (led) package |
Country Status (2)
Country | Link |
---|---|
US (2) | USD648686S1 (en) |
TW (2) | TWD146222S (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9859471B2 (en) | 2011-01-31 | 2018-01-02 | Cree, Inc. | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
US11101408B2 (en) | 2011-02-07 | 2021-08-24 | Creeled, Inc. | Components and methods for light emitting diode (LED) lighting |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8598602B2 (en) | 2009-01-12 | 2013-12-03 | Cree, Inc. | Light emitting device packages with improved heat transfer |
US7923739B2 (en) | 2009-06-05 | 2011-04-12 | Cree, Inc. | Solid state lighting device |
US9685592B2 (en) | 2009-01-14 | 2017-06-20 | Cree Huizhou Solid State Lighting Company Limited | Miniature surface mount device with large pin pads |
US8686445B1 (en) | 2009-06-05 | 2014-04-01 | Cree, Inc. | Solid state lighting devices and methods |
US8860043B2 (en) * | 2009-06-05 | 2014-10-14 | Cree, Inc. | Light emitting device packages, systems and methods |
US9111778B2 (en) | 2009-06-05 | 2015-08-18 | Cree, Inc. | Light emitting diode (LED) devices, systems, and methods |
US8648359B2 (en) | 2010-06-28 | 2014-02-11 | Cree, Inc. | Light emitting devices and methods |
US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
USD643819S1 (en) * | 2010-07-16 | 2011-08-23 | Cree, Inc. | Package for light emitting diode (LED) lighting |
US8610140B2 (en) | 2010-12-15 | 2013-12-17 | Cree, Inc. | Light emitting diode (LED) packages, systems, devices and related methods |
USD679842S1 (en) | 2011-01-03 | 2013-04-09 | Cree, Inc. | High brightness LED package |
CN102934228B (en) | 2011-03-02 | 2017-09-01 | 惠州科锐半导体照明有限公司 | Light emission diode package member and light emitting diode |
US10683971B2 (en) | 2015-04-30 | 2020-06-16 | Cree, Inc. | Solid state lighting components |
USD782989S1 (en) * | 2015-05-15 | 2017-04-04 | Citizen Electronics Co., Ltd. | Light-emitting diode |
USD777694S1 (en) * | 2015-05-15 | 2017-01-31 | Citizen Electronics Co., Ltd. | Light-emitting diode |
TWD204009S (en) | 2019-03-22 | 2020-04-11 | 晶元光電股份有限公司 | Part of light-emitting device |
TWD204008S (en) | 2019-03-22 | 2020-04-11 | 晶元光電股份有限公司 | Part of light-emitting device |
-
2010
- 2010-04-30 US US29/360,791 patent/USD648686S1/en active Active
- 2010-10-29 TW TW099305566F patent/TWD146222S/en unknown
- 2010-10-29 TW TW100305347F patent/TWD148144S1/en unknown
-
2011
- 2011-09-14 US US29/401,692 patent/USD659657S1/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9859471B2 (en) | 2011-01-31 | 2018-01-02 | Cree, Inc. | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
US11101408B2 (en) | 2011-02-07 | 2021-08-24 | Creeled, Inc. | Components and methods for light emitting diode (LED) lighting |
Also Published As
Publication number | Publication date |
---|---|
USD659657S1 (en) | 2012-05-15 |
TWD148144S1 (en) | 2012-07-11 |
USD648686S1 (en) | 2011-11-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWD148144S1 (en) | Light emitting diode (led) package | |
USD806308S1 (en) | Optical diffuser | |
USD637339S1 (en) | LED light fixture | |
TWD148141S (en) | Multiple configuration light emitting device package | |
USD644781S1 (en) | Light emitting diode lamp | |
TWD153057S (en) | Display module for an electronic device | |
TWD148537S (en) | Light-emitting diode package | |
TWD152509S (en) | Light-emitting diode package | |
TWD152382S (en) | Led lamp | |
USD716975S1 (en) | Light-emitting diode lamp | |
TWD147577S (en) | Light emitting diode package | |
TWD155826S (en) | Narrow beam led module | |
TWD154427S (en) | Light emitting diode package | |
TWD159498S (en) | Led package | |
TWD148774S (en) | Led lamp | |
USD642997S1 (en) | Light source of light emitting diode | |
PH12018500074B1 (en) | Position light structure for motorcycle | |
USD683894S1 (en) | Light emitting diode lamp | |
WO2013107705A3 (en) | Damp-proof led luminaire | |
USD638809S1 (en) | Substrate for light source of light emitting diode | |
TWD148336S (en) | Light emitting diode package | |
USD639997S1 (en) | Light emitting diode lamp | |
TWD152780S (en) | Led light bulb | |
USD715992S1 (en) | Architectural structure for LED light | |
TWD147384S (en) | Light emitting diode package |