USD626097S1 - Light-emitting diode - Google Patents

Light-emitting diode Download PDF

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Publication number
USD626097S1
USD626097S1 US29/355,533 US35553310F USD626097S US D626097 S1 USD626097 S1 US D626097S1 US 35553310 F US35553310 F US 35553310F US D626097 S USD626097 S US D626097S
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US
United States
Prior art keywords
light
emitting diode
view
ornamental design
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/355,533
Inventor
Teruo Takeuchi
Tatsuo Tonedachi
Kazuhisa Iwashita
Satoshi Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IWASHITA, KAZUHISA, SHIMIZU, SATOSHI, TAKEUCHI, TERUO, TONEDACHI, TATSUO
Application granted granted Critical
Publication of USD626097S1 publication Critical patent/USD626097S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front perspective view of a light-emitting diode, showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side elevational view thereof; and,
FIG. 8 is a left side elevational view thereof.

Claims (1)

  1. The ornamental design for a light-emitting diode, as shown and described.
US29/355,533 2009-10-16 2010-02-09 Light-emitting diode Expired - Lifetime USD626097S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009024368 2009-10-16
JP2009-024368 2009-10-16

Publications (1)

Publication Number Publication Date
USD626097S1 true USD626097S1 (en) 2010-10-26

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ID=42987951

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/355,533 Expired - Lifetime USD626097S1 (en) 2009-10-16 2010-02-09 Light-emitting diode

Country Status (2)

Country Link
US (1) USD626097S1 (en)
TW (1) TWD140389S1 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD656110S1 (en) * 2011-04-28 2012-03-20 Kabushiki Kaisha Toshiba Light-emitting diode
USD656469S1 (en) * 2011-04-28 2012-03-27 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
USD731989S1 (en) * 2014-06-06 2015-06-16 Genesis Photonics Inc. Light emitting diode chip
USD756942S1 (en) * 2015-05-06 2016-05-24 Xiamen Sanan Optoelectronics Technology Co., Ltd. Light-emitting diode package
USD761215S1 (en) * 2015-05-06 2016-07-12 Xiamen Sanan Optoelectronics Technology Co., Ltd. Package for light-emitting diode
USD768095S1 (en) * 2015-10-08 2016-10-04 Xiameng Sanan Optoelectronics Technology Co., Ltd. Light-emitting diode package
USD825500S1 (en) * 2016-03-24 2018-08-14 Hamamatsu Photonics K.K. Optical semiconductor element
USD826184S1 (en) * 2016-03-24 2018-08-21 Hamamatsu Photonics K.K. Optical semiconductor element
USD831593S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K Optical semiconductor element
USD831592S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD832802S1 (en) * 2016-03-24 2018-11-06 Hamamatsu Photonics K.K. Optical semiconductor element
USD847102S1 (en) 2013-02-08 2019-04-30 Epistar Corporation Light emitting diode
USD1074628S1 (en) 2021-01-20 2025-05-13 Hamamatsu Photonics K.K. Light-emitting element module
USD1083850S1 (en) 2021-01-20 2025-07-15 Hamamatsu Photonics K.K. Light-emitting element module
USD1089808S1 (en) * 2021-01-20 2025-08-19 Hamamatsu Photonics K.K. Light-emitting element module
USD1089807S1 (en) * 2021-01-20 2025-08-19 Hamamatsu Photonics K.K. Light-emitting element module
USD1089089S1 (en) 2021-01-20 2025-08-19 Hamamatsu Photonics K.K. Light-emitting element module

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020121684A1 (en) * 2001-01-12 2002-09-05 Rohm Co., Ltd. Surface-mounting semiconductor device and method of making the same
US20030122225A1 (en) * 2001-12-27 2003-07-03 Mitsui High-Tec, Inc.. Lead frame and semiconductor device made using the lead frame
US6677667B1 (en) * 2000-11-28 2004-01-13 National Semiconductor Corporation Leadless leadframe package design that provides a greater structural integrity
US6713317B2 (en) * 2002-08-12 2004-03-30 Semiconductor Components Industries, L.L.C. Semiconductor device and laminated leadframe package
US7298034B2 (en) * 2004-06-28 2007-11-20 Semiconductor Components Industries, L.L.C. Multi-chip semiconductor connector assemblies
USD576571S1 (en) 2007-06-14 2008-09-09 Rohm Co., Ltd. Light emitting diode module
US20090057855A1 (en) * 2007-08-30 2009-03-05 Maria Clemens Quinones Semiconductor die package including stand off structures

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6677667B1 (en) * 2000-11-28 2004-01-13 National Semiconductor Corporation Leadless leadframe package design that provides a greater structural integrity
US20020121684A1 (en) * 2001-01-12 2002-09-05 Rohm Co., Ltd. Surface-mounting semiconductor device and method of making the same
US6734536B2 (en) * 2001-01-12 2004-05-11 Rohm Co., Ltd. Surface-mounting semiconductor device and method of making the same
US20030122225A1 (en) * 2001-12-27 2003-07-03 Mitsui High-Tec, Inc.. Lead frame and semiconductor device made using the lead frame
US6713317B2 (en) * 2002-08-12 2004-03-30 Semiconductor Components Industries, L.L.C. Semiconductor device and laminated leadframe package
US7298034B2 (en) * 2004-06-28 2007-11-20 Semiconductor Components Industries, L.L.C. Multi-chip semiconductor connector assemblies
USD576571S1 (en) 2007-06-14 2008-09-09 Rohm Co., Ltd. Light emitting diode module
US20090057855A1 (en) * 2007-08-30 2009-03-05 Maria Clemens Quinones Semiconductor die package including stand off structures

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD656110S1 (en) * 2011-04-28 2012-03-20 Kabushiki Kaisha Toshiba Light-emitting diode
USD656469S1 (en) * 2011-04-28 2012-03-27 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
USD847102S1 (en) 2013-02-08 2019-04-30 Epistar Corporation Light emitting diode
USD731989S1 (en) * 2014-06-06 2015-06-16 Genesis Photonics Inc. Light emitting diode chip
USD763805S1 (en) * 2014-06-06 2016-08-16 Genesis Photonics Inc. Light emitting diode chip
USD756942S1 (en) * 2015-05-06 2016-05-24 Xiamen Sanan Optoelectronics Technology Co., Ltd. Light-emitting diode package
USD761215S1 (en) * 2015-05-06 2016-07-12 Xiamen Sanan Optoelectronics Technology Co., Ltd. Package for light-emitting diode
USD768095S1 (en) * 2015-10-08 2016-10-04 Xiameng Sanan Optoelectronics Technology Co., Ltd. Light-emitting diode package
USD831592S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD831593S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K Optical semiconductor element
USD826184S1 (en) * 2016-03-24 2018-08-21 Hamamatsu Photonics K.K. Optical semiconductor element
USD832802S1 (en) * 2016-03-24 2018-11-06 Hamamatsu Photonics K.K. Optical semiconductor element
USD846512S1 (en) * 2016-03-24 2019-04-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD846511S1 (en) * 2016-03-24 2019-04-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD825500S1 (en) * 2016-03-24 2018-08-14 Hamamatsu Photonics K.K. Optical semiconductor element
USD1074628S1 (en) 2021-01-20 2025-05-13 Hamamatsu Photonics K.K. Light-emitting element module
USD1083850S1 (en) 2021-01-20 2025-07-15 Hamamatsu Photonics K.K. Light-emitting element module
USD1089808S1 (en) * 2021-01-20 2025-08-19 Hamamatsu Photonics K.K. Light-emitting element module
USD1089807S1 (en) * 2021-01-20 2025-08-19 Hamamatsu Photonics K.K. Light-emitting element module
USD1089089S1 (en) 2021-01-20 2025-08-19 Hamamatsu Photonics K.K. Light-emitting element module

Also Published As

Publication number Publication date
TWD140389S1 (en) 2011-05-01

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