USD616393S1 - Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers - Google Patents

Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers Download PDF

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Publication number
USD616393S1
USD616393S1 US29/342,853 US34285309F USD616393S US D616393 S1 USD616393 S1 US D616393S1 US 34285309 F US34285309 F US 34285309F US D616393 S USD616393 S US D616393S
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US
United States
Prior art keywords
semiconductor wafers
manufacturing semiconductor
insulating cylinder
radiation fin
heat insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/342,853
Inventor
Izumi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SATO, IZUMI
Application granted granted Critical
Publication of USD616393S1 publication Critical patent/USD616393S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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FIG. 1 is front perspective view of a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers illustrating my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a front perspective view of a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers in use.
The broken lines are shown for illustrative purposes only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.
US29/342,853 2009-03-06 2009-09-02 Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers Expired - Lifetime USD616393S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009004988 2009-03-06
JP2009-004988 2009-03-06

Publications (1)

Publication Number Publication Date
USD616393S1 true USD616393S1 (en) 2010-05-25

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ID=42184698

Family Applications (1)

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US29/342,853 Expired - Lifetime USD616393S1 (en) 2009-03-06 2009-09-02 Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers

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US (1) USD616393S1 (en)
TW (1) TWD137195S1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655259S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655257S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD798250S1 (en) * 2015-12-01 2017-09-26 Nuflare Technology, Inc. Heater
USD1112115S1 (en) * 2023-06-12 2026-02-10 Kokusai Electric Corporation Insulation plate for a semiconductor manufacturing apparatus

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6056123A (en) * 1997-12-10 2000-05-02 Novus Corporation Semiconductor wafer carrier having the same composition as the wafers
US6062853A (en) * 1996-02-29 2000-05-16 Tokyo Electron Limited Heat-treating boat for semiconductor wafers
US6110285A (en) * 1997-04-15 2000-08-29 Toshiba Ceramics Co., Ltd. Vertical wafer boat
US20020113027A1 (en) * 2001-02-20 2002-08-22 Mitsubishi Denki Kabushiki Kaisha Retainer for use in heat treatment of substrate, substrate heat treatment equipment, and method of manufacturing the retainer
US7033168B1 (en) * 2005-01-24 2006-04-25 Memc Electronic Materials, Inc. Semiconductor wafer boat for a vertical furnace
US7484958B2 (en) * 2003-07-16 2009-02-03 Shin-Etsu Handotai Co., Ltd. Vertical boat for heat treatment and method for producing the same
USD600220S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6062853A (en) * 1996-02-29 2000-05-16 Tokyo Electron Limited Heat-treating boat for semiconductor wafers
US6110285A (en) * 1997-04-15 2000-08-29 Toshiba Ceramics Co., Ltd. Vertical wafer boat
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6056123A (en) * 1997-12-10 2000-05-02 Novus Corporation Semiconductor wafer carrier having the same composition as the wafers
US20020113027A1 (en) * 2001-02-20 2002-08-22 Mitsubishi Denki Kabushiki Kaisha Retainer for use in heat treatment of substrate, substrate heat treatment equipment, and method of manufacturing the retainer
US7484958B2 (en) * 2003-07-16 2009-02-03 Shin-Etsu Handotai Co., Ltd. Vertical boat for heat treatment and method for producing the same
US7033168B1 (en) * 2005-01-24 2006-04-25 Memc Electronic Materials, Inc. Semiconductor wafer boat for a vertical furnace
USD600220S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655259S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655257S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD798250S1 (en) * 2015-12-01 2017-09-26 Nuflare Technology, Inc. Heater
USD1112115S1 (en) * 2023-06-12 2026-02-10 Kokusai Electric Corporation Insulation plate for a semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
TWD137195S1 (en) 2010-10-01

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