USD597971S1 - Light emitting diode module - Google Patents

Light emitting diode module Download PDF

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Publication number
USD597971S1
USD597971S1 US29/310,815 US31081508F USD597971S US D597971 S1 USD597971 S1 US D597971S1 US 31081508 F US31081508 F US 31081508F US D597971 S USD597971 S US D597971S
Authority
US
United States
Prior art keywords
light emitting
emitting diode
diode module
view
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/310,815
Inventor
Masahiko Kobayakawa
Kazuhiro Mireba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOBAYAKAWA, MASAHIKO, MIREBA, KAZUHIRO
Application granted granted Critical
Publication of USD597971S1 publication Critical patent/USD597971S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

FIG. 1 is a perspective view of a light emitting diode module according to my new design;
FIG. 2 is a front view of the same module;
FIG. 3 is a rear view of the same module;
FIG. 4 is a top plan view of the same module;
FIG. 5 is a bottom view of the same module;
FIG. 6 is a left side view of the same module;
FIG. 7 is a right side view of the same module; and,
FIG. 8 is a sectional view of the same module taken along lines 8—8 in FIG. 4.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a light emitting diode module, as shown.
US29/310,815 2008-03-13 2008-09-11 Light emitting diode module Expired - Lifetime USD597971S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008006278 2008-03-13
JP2008-006278 2008-03-13

Publications (1)

Publication Number Publication Date
USD597971S1 true USD597971S1 (en) 2009-08-11

Family

ID=40934648

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/310,815 Expired - Lifetime USD597971S1 (en) 2008-03-13 2008-09-11 Light emitting diode module

Country Status (1)

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US (1) USD597971S1 (en)

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100133554A1 (en) * 2009-06-05 2010-06-03 Cree, Inc. Solid state lighting device
USD619977S1 (en) * 2009-10-16 2010-07-20 Everlight Electronics Co., Ltd. Light emitting diode
USD622682S1 (en) * 2009-11-09 2010-08-31 Alti-Semiconductor Co., Ltd Light emitting diode
USD622680S1 (en) * 2009-12-04 2010-08-31 Silitek Electronic (Guangzhou) Go., Ltd. Package of a light emitting diode
USD623150S1 (en) * 2009-02-04 2010-09-07 Everlight Electronics Co., Ltd. Light emitting diode package device
USD628541S1 (en) * 2010-06-14 2010-12-07 Everlight Electronics Co., Ltd. Light emitting diode
USD629369S1 (en) * 2010-04-30 2010-12-21 Everlight Electronics Co., Ltd. Light emitting diode
USD632267S1 (en) * 2010-02-12 2011-02-08 Lextar Electronics Corp. Light emitting diode packaging carrier
US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
USD632659S1 (en) * 2009-11-11 2011-02-15 Everlight Electronics Co., Ltd. Light emitting diode lamp
USD640993S1 (en) * 2009-12-17 2011-07-05 Everlight Electronics Co., Ltd. Light emitting diode
USD641719S1 (en) 2009-06-05 2011-07-19 Cree, Inc. Light emitting diode
US20110186873A1 (en) * 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
USD643819S1 (en) * 2010-07-16 2011-08-23 Cree, Inc. Package for light emitting diode (LED) lighting
USD646645S1 (en) * 2010-07-30 2011-10-11 Everlight Electronics Co., Ltd. Light emitting diode
USD646646S1 (en) * 2010-07-30 2011-10-11 Everlight Electronics Co., Ltd. Light emitting diode
USD646647S1 (en) * 2010-07-30 2011-10-11 Everlight Electronics Co., Ltd. Light emitting diode
USD646644S1 (en) * 2010-07-30 2011-10-11 Everlight Electronics Co., Ltd. Light emitting diode
USD647491S1 (en) * 2010-07-30 2011-10-25 Everlight Electronics Co., Ltd. Light emitting diode
USD648687S1 (en) 2009-06-05 2011-11-15 Cree, Inc. Light emitting device package
USD648686S1 (en) * 2010-04-30 2011-11-15 Cree, Inc. Light emitting diode (LED) package
US20120170265A1 (en) * 2009-09-17 2012-07-05 Koninklijke Philips Electronics N.V. Light-source module and light-emitting device
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
USD676003S1 (en) * 2011-08-29 2013-02-12 Toyoda Gosei Co., Ltd. Light emitting diode
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
USD762183S1 (en) * 2015-04-24 2016-07-26 Lg Electronics Inc. LED package body
USD778848S1 (en) * 2015-04-07 2017-02-14 Cree, Inc. Solid state light emitter component
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
TWD235936S (en) 2024-05-07 2025-01-11 葳天科技股份有限公司 桃園市中壢區西園路89號 (中華民國) LED
USD1117119S1 (en) * 2023-03-20 2026-03-10 Rohm Co., Ltd. Light-emitting semiconductor module

Citations (8)

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Publication number Priority date Publication date Assignee Title
US6586721B2 (en) * 1998-08-28 2003-07-01 Osram Opto Semiconductors Gmbh & Co. Ohg Movement detector including a vertical resonator and receiver disposed within an open housing
USD491899S1 (en) * 2002-05-22 2004-06-22 Nichia Corporation Light emitting diode
US20060220050A1 (en) * 2003-08-26 2006-10-05 Sumitomo Electric Industries, Ltd. Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same
US20070075325A1 (en) * 2005-10-04 2007-04-05 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package
USD570797S1 (en) * 2006-07-14 2008-06-10 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
USD573114S1 (en) * 2007-05-04 2008-07-15 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
US20080170391A1 (en) * 2007-01-12 2008-07-17 Aizar Abdul Karim Norfidathul Multi-chip Packaged LED Light Source
US20080210964A1 (en) * 2006-09-22 2008-09-04 Kabushiki Kaisha Toshiba Optical semiconductor device and method for manufacturing optical semiconductor device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6586721B2 (en) * 1998-08-28 2003-07-01 Osram Opto Semiconductors Gmbh & Co. Ohg Movement detector including a vertical resonator and receiver disposed within an open housing
USD491899S1 (en) * 2002-05-22 2004-06-22 Nichia Corporation Light emitting diode
US20060220050A1 (en) * 2003-08-26 2006-10-05 Sumitomo Electric Industries, Ltd. Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same
US20070075325A1 (en) * 2005-10-04 2007-04-05 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package
USD570797S1 (en) * 2006-07-14 2008-06-10 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
US20080210964A1 (en) * 2006-09-22 2008-09-04 Kabushiki Kaisha Toshiba Optical semiconductor device and method for manufacturing optical semiconductor device
US20080170391A1 (en) * 2007-01-12 2008-07-17 Aizar Abdul Karim Norfidathul Multi-chip Packaged LED Light Source
USD573114S1 (en) * 2007-05-04 2008-07-15 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode

Cited By (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9123874B2 (en) 2009-01-12 2015-09-01 Cree, Inc. Light emitting device packages with improved heat transfer
US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
USD623150S1 (en) * 2009-02-04 2010-09-07 Everlight Electronics Co., Ltd. Light emitting diode package device
US20100133554A1 (en) * 2009-06-05 2010-06-03 Cree, Inc. Solid state lighting device
USD648687S1 (en) 2009-06-05 2011-11-15 Cree, Inc. Light emitting device package
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
US20110186873A1 (en) * 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
USD661264S1 (en) 2009-06-05 2012-06-05 Cree, Inc. Light emiting device package
US8497522B2 (en) 2009-06-05 2013-07-30 Cree, Inc. Solid state lighting device
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US7923739B2 (en) 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
USD641719S1 (en) 2009-06-05 2011-07-19 Cree, Inc. Light emitting diode
US9743521B2 (en) * 2009-09-17 2017-08-22 Philips Lighting Holding B.V. Light-source module and light-emitting device
US20120170265A1 (en) * 2009-09-17 2012-07-05 Koninklijke Philips Electronics N.V. Light-source module and light-emitting device
USD631021S1 (en) 2009-10-16 2011-01-18 Everlight Electronics Co., Ltd. Light emitting diode
USD619977S1 (en) * 2009-10-16 2010-07-20 Everlight Electronics Co., Ltd. Light emitting diode
USD622682S1 (en) * 2009-11-09 2010-08-31 Alti-Semiconductor Co., Ltd Light emitting diode
USD632659S1 (en) * 2009-11-11 2011-02-15 Everlight Electronics Co., Ltd. Light emitting diode lamp
USD622680S1 (en) * 2009-12-04 2010-08-31 Silitek Electronic (Guangzhou) Go., Ltd. Package of a light emitting diode
USD640993S1 (en) * 2009-12-17 2011-07-05 Everlight Electronics Co., Ltd. Light emitting diode
USD632267S1 (en) * 2010-02-12 2011-02-08 Lextar Electronics Corp. Light emitting diode packaging carrier
USD659657S1 (en) 2010-04-30 2012-05-15 Cree, Inc. Light emitting diode (LED) package
USD629369S1 (en) * 2010-04-30 2010-12-21 Everlight Electronics Co., Ltd. Light emitting diode
USD648686S1 (en) * 2010-04-30 2011-11-15 Cree, Inc. Light emitting diode (LED) package
USD628541S1 (en) * 2010-06-14 2010-12-07 Everlight Electronics Co., Ltd. Light emitting diode
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
USD667801S1 (en) 2010-07-16 2012-09-25 Cree, Inc. Package for light emitting diode (LED) lighting
USD643819S1 (en) * 2010-07-16 2011-08-23 Cree, Inc. Package for light emitting diode (LED) lighting
USD708156S1 (en) * 2010-07-16 2014-07-01 Cree, Inc. Package for light emitting diode (LED) lighting
USD646645S1 (en) * 2010-07-30 2011-10-11 Everlight Electronics Co., Ltd. Light emitting diode
USD646644S1 (en) * 2010-07-30 2011-10-11 Everlight Electronics Co., Ltd. Light emitting diode
USD647491S1 (en) * 2010-07-30 2011-10-25 Everlight Electronics Co., Ltd. Light emitting diode
USD646646S1 (en) * 2010-07-30 2011-10-11 Everlight Electronics Co., Ltd. Light emitting diode
USD646647S1 (en) * 2010-07-30 2011-10-11 Everlight Electronics Co., Ltd. Light emitting diode
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
USD704358S1 (en) 2011-01-03 2014-05-06 Cree, Inc. High brightness LED package
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
USD676003S1 (en) * 2011-08-29 2013-02-12 Toyoda Gosei Co., Ltd. Light emitting diode
USD778848S1 (en) * 2015-04-07 2017-02-14 Cree, Inc. Solid state light emitter component
USD762183S1 (en) * 2015-04-24 2016-07-26 Lg Electronics Inc. LED package body
USD1117119S1 (en) * 2023-03-20 2026-03-10 Rohm Co., Ltd. Light-emitting semiconductor module
TWD235936S (en) 2024-05-07 2025-01-11 葳天科技股份有限公司 桃園市中壢區西園路89號 (中華民國) LED

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