USD576963S1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
USD576963S1
USD576963S1 US29/271,914 US27191407F USD576963S US D576963 S1 USD576963 S1 US D576963S1 US 27191407 F US27191407 F US 27191407F US D576963 S USD576963 S US D576963S
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US
United States
Prior art keywords
heat sink
view
elevational view
ornamental design
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/271,914
Inventor
Masataka Mochizuki
Yuji Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to US29/271,914 priority Critical patent/USD576963S1/en
Assigned to FUJIKURA LTD. reassignment FUJIKURA LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOCHIZUKI, MASATAKA, SAITO, YUJI
Application granted granted Critical
Publication of USD576963S1 publication Critical patent/USD576963S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the top, front and left side of a heat sink showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right elevational view thereof;
FIG. 4 is a left elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a perspective view similar to FIG. 1 showing the fan removed form the extrusion.
A rear elevational view is the same as the right elevational view.

Claims (1)

    CLAIM
  1. The ornamental design for a heat sink, as shown and described.
US29/271,914 2007-01-30 2007-01-30 Heat sink Expired - Lifetime USD576963S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/271,914 USD576963S1 (en) 2007-01-30 2007-01-30 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/271,914 USD576963S1 (en) 2007-01-30 2007-01-30 Heat sink

Publications (1)

Publication Number Publication Date
USD576963S1 true USD576963S1 (en) 2008-09-16

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ID=39743526

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/271,914 Expired - Lifetime USD576963S1 (en) 2007-01-30 2007-01-30 Heat sink

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US (1) USD576963S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080202729A1 (en) * 2007-02-27 2008-08-28 Fujikura Ltd. Heat sink
US20080251239A1 (en) * 2007-04-10 2008-10-16 Fujikura Ltd. Heat sink
US20090147478A1 (en) * 2007-12-07 2009-06-11 Nidec Corporation Heat sink fan
US20090310305A1 (en) * 2008-06-13 2009-12-17 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Fan impeller and heat dissipating device incorporating the same
USD829183S1 (en) * 2017-06-15 2018-09-25 Shenzhen Gaoyu Electronic Technology Co., Ltd. Graphic card radiator

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6407919B1 (en) * 2000-12-18 2002-06-18 Fargo Chou Structure of computer CPU heat dissipation module
US20020182068A1 (en) * 2001-05-21 2002-12-05 Ching-Tang Liu Frame structure for radiator fan
USD501450S1 (en) * 2003-06-10 2005-02-01 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
US20050141992A1 (en) * 2003-12-25 2005-06-30 Fang-Cheng Lin Fan assembly
US20050271506A1 (en) * 2004-06-03 2005-12-08 Ming-Hui Pan Supporting frame with locating function
US20050280992A1 (en) * 2001-09-10 2005-12-22 Intel Corporation Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods
US20060219386A1 (en) * 2005-04-01 2006-10-05 Delta Electronics, Inc. Heat dissipating assembly with composite heat dissipating structure
US7221567B2 (en) * 2004-04-12 2007-05-22 Nidec Corporation Heat sink fan

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6407919B1 (en) * 2000-12-18 2002-06-18 Fargo Chou Structure of computer CPU heat dissipation module
US20020182068A1 (en) * 2001-05-21 2002-12-05 Ching-Tang Liu Frame structure for radiator fan
US20050280992A1 (en) * 2001-09-10 2005-12-22 Intel Corporation Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods
USD501450S1 (en) * 2003-06-10 2005-02-01 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
US20050141992A1 (en) * 2003-12-25 2005-06-30 Fang-Cheng Lin Fan assembly
US7221567B2 (en) * 2004-04-12 2007-05-22 Nidec Corporation Heat sink fan
US20050271506A1 (en) * 2004-06-03 2005-12-08 Ming-Hui Pan Supporting frame with locating function
US20060219386A1 (en) * 2005-04-01 2006-10-05 Delta Electronics, Inc. Heat dissipating assembly with composite heat dissipating structure

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080202729A1 (en) * 2007-02-27 2008-08-28 Fujikura Ltd. Heat sink
US20080251239A1 (en) * 2007-04-10 2008-10-16 Fujikura Ltd. Heat sink
US7942194B2 (en) 2007-04-10 2011-05-17 Fujikura Ltd. Heat sink
US20090147478A1 (en) * 2007-12-07 2009-06-11 Nidec Corporation Heat sink fan
US8365811B2 (en) * 2007-12-07 2013-02-05 Nidec Corporation Heat sink fan
US20090310305A1 (en) * 2008-06-13 2009-12-17 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Fan impeller and heat dissipating device incorporating the same
US7778032B2 (en) * 2008-06-13 2010-08-17 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Fan impeller and heat dissipating device incorporating the same
USD829183S1 (en) * 2017-06-15 2018-09-25 Shenzhen Gaoyu Electronic Technology Co., Ltd. Graphic card radiator

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