USD556157S1 - Load-lock chamber - Google Patents

Load-lock chamber Download PDF

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Publication number
USD556157S1
USD556157S1 US29/217,730 US21773004F USD556157S US D556157 S1 USD556157 S1 US D556157S1 US 21773004 F US21773004 F US 21773004F US D556157 S USD556157 S US D556157S
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US
United States
Prior art keywords
load
lock chamber
view
chamber
lock
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/217,730
Inventor
Keisuke Kondoh
Hiroki Oka
Makoto Tashiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KONDOH, KEISUKE, OKA, HIROKI, TASHIRO, MAKOTO
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Publication of USD556157S1 publication Critical patent/USD556157S1/en
Anticipated expiration legal-status Critical
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The present article relates to a load-lock chamber for a multi-chamber type semiconductor substrate processing apparatus for a film forming process and other processes for semiconductor substrates, and others to be processed. The load-lock chamber is, as shown in a reference drawing illustrating a state of usage of the load-lock chamber, connected to a transfer-chamber wherein load-in and load-out of substrates to be processed are carried out without exposing the transfer-chamber to air.
FIG. 1 is a top view of the load-lock chamber,
FIG. 2 is a front elevational view thereof;
FIG. 3 is a back elevational view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a sectional view taken along line 7-7 in FIG. 1;
FIG. 8 is a perspective view thereof; and,
FIG. 9 is a reference figure showing a bottom perspective view thereof.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a load-lock chamber, as shown and described.
US29/217,730 2004-05-28 2004-11-22 Load-lock chamber Expired - Lifetime USD556157S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-015723 2004-05-28
JP2004015723 2004-05-28

Publications (1)

Publication Number Publication Date
USD556157S1 true USD556157S1 (en) 2007-11-27

Family

ID=38722360

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/217,730 Expired - Lifetime USD556157S1 (en) 2004-05-28 2004-11-22 Load-lock chamber

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US (1) USD556157S1 (en)
TW (1) TWD107405S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD973116S1 (en) * 2020-11-17 2022-12-20 Applied Materials, Inc. Mainframe of substrate processing system
USD973737S1 (en) * 2020-11-17 2022-12-27 Applied Materials, Inc. Mainframe of substrate processing system
USD1029066S1 (en) * 2022-03-11 2024-05-28 Applied Materials, Inc. Mainframe of dual-robot substrate processing system
USD1076836S1 (en) * 2022-02-28 2025-05-27 Applied Materials, Inc. Mainframe with integrated lid

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6045620A (en) * 1997-07-11 2000-04-04 Applied Materials, Inc. Two-piece slit valve insert for vacuum processing system
US6270582B1 (en) * 1997-12-15 2001-08-07 Applied Materials, Inc Single wafer load lock chamber for pre-processing and post-processing wafers in a vacuum processing system
US6382902B1 (en) * 1997-04-08 2002-05-07 Komatsu, Ltd Method for controlling handling robot
US20050005847A1 (en) * 2002-01-08 2005-01-13 Tsutomu Hiroki Semiconductor processing system and semiconductor carrying mechanism
US20050095088A1 (en) * 2003-10-20 2005-05-05 Applied Materials, Inc. Load lock chamber for large area substrate processing system
US20050193948A1 (en) * 2004-03-08 2005-09-08 Yuuzou Oohirabaru Vacuum processing apparatus
US20050205012A1 (en) * 2003-06-02 2005-09-22 Jusung Engineering Co., Ltd. Transfer chamber for cluster system
US20050247265A1 (en) * 2004-04-21 2005-11-10 Devine Daniel J Multi-workpiece processing chamber
US20060021575A1 (en) * 2002-09-25 2006-02-02 Tokyo Electron Limited Method for carrying object to be processed

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6382902B1 (en) * 1997-04-08 2002-05-07 Komatsu, Ltd Method for controlling handling robot
US6045620A (en) * 1997-07-11 2000-04-04 Applied Materials, Inc. Two-piece slit valve insert for vacuum processing system
US6270582B1 (en) * 1997-12-15 2001-08-07 Applied Materials, Inc Single wafer load lock chamber for pre-processing and post-processing wafers in a vacuum processing system
US20050005847A1 (en) * 2002-01-08 2005-01-13 Tsutomu Hiroki Semiconductor processing system and semiconductor carrying mechanism
US20060021575A1 (en) * 2002-09-25 2006-02-02 Tokyo Electron Limited Method for carrying object to be processed
US20050205012A1 (en) * 2003-06-02 2005-09-22 Jusung Engineering Co., Ltd. Transfer chamber for cluster system
US20050095088A1 (en) * 2003-10-20 2005-05-05 Applied Materials, Inc. Load lock chamber for large area substrate processing system
US20050193948A1 (en) * 2004-03-08 2005-09-08 Yuuzou Oohirabaru Vacuum processing apparatus
US20050247265A1 (en) * 2004-04-21 2005-11-10 Devine Daniel J Multi-workpiece processing chamber

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD973116S1 (en) * 2020-11-17 2022-12-20 Applied Materials, Inc. Mainframe of substrate processing system
USD973737S1 (en) * 2020-11-17 2022-12-27 Applied Materials, Inc. Mainframe of substrate processing system
USD991994S1 (en) 2020-11-17 2023-07-11 Applied Materials, Inc. Mainframe of substrate processing system
USD992611S1 (en) 2020-11-17 2023-07-18 Applied Materials, Inc. Mainframe of substrate processing system
USD1076836S1 (en) * 2022-02-28 2025-05-27 Applied Materials, Inc. Mainframe with integrated lid
USD1109784S1 (en) * 2022-02-28 2026-01-20 Applied Materials, Inc. Mainframe with integrated lid
USD1112395S1 (en) * 2022-02-28 2026-02-10 Applied Materials, Inc. Mainframe with integrated lid
USD1029066S1 (en) * 2022-03-11 2024-05-28 Applied Materials, Inc. Mainframe of dual-robot substrate processing system
USD1098220S1 (en) 2022-03-11 2025-10-14 Applied Materials, Inc. Mainframe of dual-robot substrate processing system

Also Published As

Publication number Publication date
TWD107405S1 (en) 2005-11-01

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