USD540272S1 - Semiconductor module - Google Patents
Semiconductor module Download PDFInfo
- Publication number
- USD540272S1 USD540272S1 US29/238,804 US23880405F USD540272S US D540272 S1 USD540272 S1 US D540272S1 US 23880405 F US23880405 F US 23880405F US D540272 S USD540272 S US D540272S
- Authority
- US
- United States
- Prior art keywords
- semiconductor module
- view
- semiconductor
- module
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 3
Images
Description
FIG. 1 is a front view of a semiconductor module showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side view thereof; and,
FIG. 6 is a right side view thereof.
The broken lines shown in the drawings are for illustrative purposes only and form no part of the claimed design.
Claims (1)
- The ornamental design for a semiconductor module, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005011529 | 2005-04-18 | ||
| JP2005-011529(D) | 2005-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD540272S1 true USD540272S1 (en) | 2007-04-10 |
Family
ID=37904659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/238,804 Expired - Lifetime USD540272S1 (en) | 2005-04-18 | 2005-09-22 | Semiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD540272S1 (en) |
Cited By (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD690672S1 (en) * | 2011-10-04 | 2013-10-01 | Kabushiki Kaisha Yaskawa Denki | Encoder optical module |
| USD699201S1 (en) * | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
| USD743356S1 (en) * | 2011-06-17 | 2015-11-17 | Soraa, Inc. | Diamond-shaped semiconductor die |
| USD754083S1 (en) * | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
| USD761745S1 (en) * | 2013-06-28 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| USD768115S1 (en) * | 2015-02-05 | 2016-10-04 | Armen E. Kazanchian | Module |
| USD784937S1 (en) | 2014-11-13 | 2017-04-25 | Tokyo Electron Limited | Dummy wafer |
| USD785576S1 (en) | 2014-11-13 | 2017-05-02 | Tokyo Electron Limited | Dummy wafer |
| USD786810S1 (en) * | 2014-11-13 | 2017-05-16 | Tokyo Electron Limited | Dummy wafer |
| USD813182S1 (en) * | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
| USD830348S1 (en) * | 2013-09-26 | 2018-10-09 | Murata Manufacturing Co., Ltd. | Wireless transmission/reception module |
| USD846513S1 (en) * | 2016-04-27 | 2019-04-23 | Ngk Insulators, Ltd. | Sheet heater for electrostatic chuck |
| USD872033S1 (en) * | 2018-09-14 | 2020-01-07 | Telit Communications S.P.A. | Connection module |
| USD872032S1 (en) * | 2018-09-14 | 2020-01-07 | Telit Communications S.P.A. | Connection module |
| USD892774S1 (en) * | 2013-09-26 | 2020-08-11 | Murata Manufacturing Co., Ltd. | Wireless transmission/reception module |
| USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
| USD904355S1 (en) * | 2015-12-11 | 2020-12-08 | Gemalto M2M Gmbh | Radio module |
| USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD942974S1 (en) * | 2018-11-20 | 2022-02-08 | Thales Dis Ais Deutschland Gmbh | Cellular module |
| USD947800S1 (en) * | 2018-07-23 | 2022-04-05 | CACI, Inc.—Federal | Integrated module |
| USD951214S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951212S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951213S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951215S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD988300S1 (en) * | 2021-03-09 | 2023-06-06 | Thales Dis Ais Deutschland Gmbh | IoT module |
| USD1035656S1 (en) * | 2021-12-10 | 2024-07-16 | Lg Electronics Inc. | Wireless communication module for automobile |
| USD1054390S1 (en) * | 2022-01-05 | 2024-12-17 | Nec Corporation | Semiconductor device |
| USD1054389S1 (en) * | 2022-01-05 | 2024-12-17 | Nec Corporation | Semiconductor device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD318461S (en) * | 1988-04-13 | 1991-07-23 | Ibiden Co., Ltd. | Semi-conductor mounting substrate |
| US5994772A (en) * | 1996-12-19 | 1999-11-30 | Lg Semicon Co., Ltd. | Semiconductor package |
| US6127729A (en) * | 1998-06-29 | 2000-10-03 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor chip with corner electrode terminals and detecting wiring for defect inspection |
| US6373447B1 (en) * | 1998-12-28 | 2002-04-16 | Kawasaki Steel Corporation | On-chip antenna, and systems utilizing same |
| US6781239B1 (en) * | 2001-12-05 | 2004-08-24 | National Semiconductor Corporation | Integrated circuit and method of forming the integrated circuit having a die with high Q inductors and capacitors attached to a die with a circuit as a flip chip |
| US6836002B2 (en) * | 2000-03-09 | 2004-12-28 | Sharp Kabushiki Kaisha | Semiconductor device |
| US6992395B2 (en) * | 2001-07-04 | 2006-01-31 | Sony Corporation | Semiconductor device and semiconductor module having external electrodes on an outer periphery |
| US20060043544A1 (en) * | 2004-08-31 | 2006-03-02 | Sharp Kabushiki Kaisha | Semiconductor device, semiconductor module, and manufacturing method of semiconductor device |
| US20060097374A1 (en) * | 2004-11-10 | 2006-05-11 | Yoshimi Egawa | Multi chip package |
| US20060131715A1 (en) * | 2004-12-16 | 2006-06-22 | Motoaki Satou | Multi-level semiconductor module |
-
2005
- 2005-09-22 US US29/238,804 patent/USD540272S1/en not_active Expired - Lifetime
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD318461S (en) * | 1988-04-13 | 1991-07-23 | Ibiden Co., Ltd. | Semi-conductor mounting substrate |
| US5994772A (en) * | 1996-12-19 | 1999-11-30 | Lg Semicon Co., Ltd. | Semiconductor package |
| US6127729A (en) * | 1998-06-29 | 2000-10-03 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor chip with corner electrode terminals and detecting wiring for defect inspection |
| US6373447B1 (en) * | 1998-12-28 | 2002-04-16 | Kawasaki Steel Corporation | On-chip antenna, and systems utilizing same |
| US6836002B2 (en) * | 2000-03-09 | 2004-12-28 | Sharp Kabushiki Kaisha | Semiconductor device |
| US6992395B2 (en) * | 2001-07-04 | 2006-01-31 | Sony Corporation | Semiconductor device and semiconductor module having external electrodes on an outer periphery |
| US6781239B1 (en) * | 2001-12-05 | 2004-08-24 | National Semiconductor Corporation | Integrated circuit and method of forming the integrated circuit having a die with high Q inductors and capacitors attached to a die with a circuit as a flip chip |
| US20060043544A1 (en) * | 2004-08-31 | 2006-03-02 | Sharp Kabushiki Kaisha | Semiconductor device, semiconductor module, and manufacturing method of semiconductor device |
| US20060097374A1 (en) * | 2004-11-10 | 2006-05-11 | Yoshimi Egawa | Multi chip package |
| US20060131715A1 (en) * | 2004-12-16 | 2006-06-22 | Motoaki Satou | Multi-level semiconductor module |
Cited By (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD743356S1 (en) * | 2011-06-17 | 2015-11-17 | Soraa, Inc. | Diamond-shaped semiconductor die |
| USD690672S1 (en) * | 2011-10-04 | 2013-10-01 | Kabushiki Kaisha Yaskawa Denki | Encoder optical module |
| USD699201S1 (en) * | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
| USD761745S1 (en) * | 2013-06-28 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| USD892774S1 (en) * | 2013-09-26 | 2020-08-11 | Murata Manufacturing Co., Ltd. | Wireless transmission/reception module |
| USD830348S1 (en) * | 2013-09-26 | 2018-10-09 | Murata Manufacturing Co., Ltd. | Wireless transmission/reception module |
| USD754083S1 (en) * | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
| USD775093S1 (en) | 2013-10-17 | 2016-12-27 | Vlt, Inc. | Electric terminal |
| USD775092S1 (en) | 2013-10-17 | 2016-12-27 | Vlt, Inc. | Electric terminal |
| USD942406S1 (en) | 2013-10-17 | 2022-02-01 | Vicor Corporation | Electric terminal |
| USD877708S1 (en) | 2013-10-17 | 2020-03-10 | Vlt, Inc. | Electrical terminal |
| USD798249S1 (en) | 2013-10-17 | 2017-09-26 | Vlt, Inc. | Electric terminal |
| USD834548S1 (en) | 2013-10-17 | 2018-11-27 | Vlt, Inc. | Electric terminal |
| USD785576S1 (en) | 2014-11-13 | 2017-05-02 | Tokyo Electron Limited | Dummy wafer |
| USD784937S1 (en) | 2014-11-13 | 2017-04-25 | Tokyo Electron Limited | Dummy wafer |
| USD786810S1 (en) * | 2014-11-13 | 2017-05-16 | Tokyo Electron Limited | Dummy wafer |
| USD768115S1 (en) * | 2015-02-05 | 2016-10-04 | Armen E. Kazanchian | Module |
| USD904355S1 (en) * | 2015-12-11 | 2020-12-08 | Gemalto M2M Gmbh | Radio module |
| USD846513S1 (en) * | 2016-04-27 | 2019-04-23 | Ngk Insulators, Ltd. | Sheet heater for electrostatic chuck |
| USD813182S1 (en) * | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
| USD947800S1 (en) * | 2018-07-23 | 2022-04-05 | CACI, Inc.—Federal | Integrated module |
| US11333677B2 (en) | 2018-07-23 | 2022-05-17 | CACI, Inc.—Federal | Methods and apparatuses for detecting tamper using heuristic models |
| US11747775B2 (en) | 2018-07-23 | 2023-09-05 | CACI, Inc.—Federal | Integrated tamper detection system and methods |
| US11662698B2 (en) | 2018-07-23 | 2023-05-30 | CACI, Inc.—Federal | Methods and apparatuses for detecting tamper using machine learning models |
| USD872032S1 (en) * | 2018-09-14 | 2020-01-07 | Telit Communications S.P.A. | Connection module |
| USD872033S1 (en) * | 2018-09-14 | 2020-01-07 | Telit Communications S.P.A. | Connection module |
| USD942974S1 (en) * | 2018-11-20 | 2022-02-08 | Thales Dis Ais Deutschland Gmbh | Cellular module |
| USD1054404S1 (en) | 2018-11-20 | 2024-12-17 | Kontron Europe Gmbh | Cellular module |
| USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
| USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD951214S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951215S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951213S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951212S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD988300S1 (en) * | 2021-03-09 | 2023-06-06 | Thales Dis Ais Deutschland Gmbh | IoT module |
| USD1035656S1 (en) * | 2021-12-10 | 2024-07-16 | Lg Electronics Inc. | Wireless communication module for automobile |
| USD1054390S1 (en) * | 2022-01-05 | 2024-12-17 | Nec Corporation | Semiconductor device |
| USD1054389S1 (en) * | 2022-01-05 | 2024-12-17 | Nec Corporation | Semiconductor device |
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