USD516046S1 - Base for a semiconductor carrier - Google Patents

Base for a semiconductor carrier Download PDF

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Publication number
USD516046S1
USD516046S1 US29/229,567 US22956705F USD516046S US D516046 S1 USD516046 S1 US D516046S1 US 22956705 F US22956705 F US 22956705F US D516046 S USD516046 S US D516046S
Authority
US
United States
Prior art keywords
base
semiconductor carrier
semiconductor
carrier
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/229,567
Inventor
Yuji Nakamura
Katsumi Suzuki
Takahiro Ishibashi
Eiji Kobori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaichi Electronics Co Ltd
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Priority to US29/229,567 priority Critical patent/USD516046S1/en
Application granted granted Critical
Publication of USD516046S1 publication Critical patent/USD516046S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front view of a base for a semiconductor carrier showing our new design, the rear view being a mirror image thereof;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof, the perforations shown in dashed lines being no part of the claimed design;
FIG. 4 is a right-side view thereof;
FIG. 5 is a left-side view thereof; and,
FIG. 6 is a perspective view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a base for a semiconductor carrier, as shown and described.
US29/229,567 2004-02-20 2005-05-10 Base for a semiconductor carrier Expired - Lifetime USD516046S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/229,567 USD516046S1 (en) 2004-02-20 2005-05-10 Base for a semiconductor carrier

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004004834 2004-02-20
JP2004-004834 2004-02-20
US29/211,532 USD507545S1 (en) 2004-02-20 2004-08-18 Semiconductor carrier
US29/229,567 USD516046S1 (en) 2004-02-20 2005-05-10 Base for a semiconductor carrier

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/211,532 Division USD507545S1 (en) 2004-02-20 2004-08-18 Semiconductor carrier

Publications (1)

Publication Number Publication Date
USD516046S1 true USD516046S1 (en) 2006-02-28

Family

ID=34737212

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/211,532 Expired - Lifetime USD507545S1 (en) 2004-02-20 2004-08-18 Semiconductor carrier
US29/229,567 Expired - Lifetime USD516046S1 (en) 2004-02-20 2005-05-10 Base for a semiconductor carrier

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/211,532 Expired - Lifetime USD507545S1 (en) 2004-02-20 2004-08-18 Semiconductor carrier

Country Status (1)

Country Link
US (2) USD507545S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1049066S1 (en) * 2022-02-28 2024-10-29 Syskey Technology Co., Ltd. Base for a multi-chamber semiconductor

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD694724S1 (en) * 2012-10-03 2013-12-03 Honda Motor Co., Ltd. Semiconductor device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD359028S (en) 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
US5451165A (en) 1994-07-27 1995-09-19 Minnesota Mining And Manufacturing Company Temporary package for bare die test and burn-in
US5519332A (en) 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
US5541525A (en) 1991-06-04 1996-07-30 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
USD401567S (en) 1997-04-25 1998-11-24 Micron Technology, Inc. Temporary package for semiconductor dice
US20010043074A1 (en) 1998-08-28 2001-11-22 David R. Hembree Test carrier with molded interconnect for testing semiconductor components
US20040016993A1 (en) 2002-07-24 2004-01-29 Mirae Corporation Test tray with carrier modules for a semiconductor device handler

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5519332A (en) 1991-06-04 1996-05-21 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
US5541525A (en) 1991-06-04 1996-07-30 Micron Technology, Inc. Carrier for testing an unpackaged semiconductor die
USD359028S (en) 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
US5451165A (en) 1994-07-27 1995-09-19 Minnesota Mining And Manufacturing Company Temporary package for bare die test and burn-in
USD401567S (en) 1997-04-25 1998-11-24 Micron Technology, Inc. Temporary package for semiconductor dice
US20010043074A1 (en) 1998-08-28 2001-11-22 David R. Hembree Test carrier with molded interconnect for testing semiconductor components
US20040016993A1 (en) 2002-07-24 2004-01-29 Mirae Corporation Test tray with carrier modules for a semiconductor device handler

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1049066S1 (en) * 2022-02-28 2024-10-29 Syskey Technology Co., Ltd. Base for a multi-chamber semiconductor

Also Published As

Publication number Publication date
USD507545S1 (en) 2005-07-19

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