USD515520S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD515520S1
USD515520S1 US29/168,222 US16822202F USD515520S US D515520 S1 USD515520 S1 US D515520S1 US 16822202 F US16822202 F US 16822202F US D515520 S USD515520 S US D515520S
Authority
US
United States
Prior art keywords
semiconductor device
view
elevational view
ornamental design
side elevational
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/168,222
Inventor
Satoshi Komoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOMOTO, SATOSHI
Application granted granted Critical
Publication of USD515520S1 publication Critical patent/USD515520S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a right side elevational view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/168,222 2002-03-29 2002-09-30 Semiconductor device Expired - Lifetime USD515520S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002-008490 2002-03-29
JP2002008490 2002-03-29

Publications (1)

Publication Number Publication Date
USD515520S1 true USD515520S1 (en) 2006-02-21

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ID=35811115

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/168,222 Expired - Lifetime USD515520S1 (en) 2002-03-29 2002-09-30 Semiconductor device

Country Status (1)

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US (1) USD515520S1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD554587S1 (en) * 2006-07-19 2007-11-06 Mitsumi Electric Co., Ltd. Circuit module for protecting the battery
USD556687S1 (en) * 2006-06-06 2007-12-04 Mitsumi Electric Co., Ltd. Circuit module for protecting the battery
USD742842S1 (en) * 2014-03-24 2015-11-10 Lem Intellectual Property Sa Electrical current transducer
US10383240B2 (en) 2017-06-13 2019-08-13 Honeywell International Inc. Housing to retain integrated circuit package
USD877707S1 (en) * 2017-03-30 2020-03-10 Mitsubishi Electric Corporation Semiconductor package
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD922970S1 (en) * 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device
USD1049065S1 (en) * 2021-07-12 2024-10-29 Jmj Korea Co., Ltd. Semiconductor package

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5563441A (en) * 1992-12-11 1996-10-08 Mitsubishi Denki Kabushiki Kaisha Lead frame assembly including a semiconductor device and a resistance wire
USD420983S (en) 1998-10-16 2000-02-22 Ixys Corporation Semiconductor power package with three leads
US6404065B1 (en) * 1998-07-31 2002-06-11 I-Xys Corporation Electrically isolated power semiconductor package
USD482666S1 (en) * 2001-11-30 2003-11-25 Nichia Corporation Light emitting diode (LED)
USD489695S1 (en) * 2002-03-29 2004-05-11 Kabushiki Kaisha Toshiba Semiconductor device
USD497879S1 (en) * 2003-02-13 2004-11-02 Sharp Kabushiki Kaisha Infrared sensor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5563441A (en) * 1992-12-11 1996-10-08 Mitsubishi Denki Kabushiki Kaisha Lead frame assembly including a semiconductor device and a resistance wire
US6404065B1 (en) * 1998-07-31 2002-06-11 I-Xys Corporation Electrically isolated power semiconductor package
USD420983S (en) 1998-10-16 2000-02-22 Ixys Corporation Semiconductor power package with three leads
USD482666S1 (en) * 2001-11-30 2003-11-25 Nichia Corporation Light emitting diode (LED)
USD489695S1 (en) * 2002-03-29 2004-05-11 Kabushiki Kaisha Toshiba Semiconductor device
USD497879S1 (en) * 2003-02-13 2004-11-02 Sharp Kabushiki Kaisha Infrared sensor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Extract of Denpa Shimbun (newspaper) showing an insulated gate transistor, Oct. 13, 1998.

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD556687S1 (en) * 2006-06-06 2007-12-04 Mitsumi Electric Co., Ltd. Circuit module for protecting the battery
USD554587S1 (en) * 2006-07-19 2007-11-06 Mitsumi Electric Co., Ltd. Circuit module for protecting the battery
USD742842S1 (en) * 2014-03-24 2015-11-10 Lem Intellectual Property Sa Electrical current transducer
USD909318S1 (en) 2017-03-30 2021-02-02 Mitsubishi Electric Corporation Semiconductor package
USD877707S1 (en) * 2017-03-30 2020-03-10 Mitsubishi Electric Corporation Semiconductor package
USD908646S1 (en) 2017-03-30 2021-01-26 Mitsubishi Electric Corporation Semiconductor package
USD908647S1 (en) 2017-03-30 2021-01-26 Mitsubishi Electric Corporation Semiconductor package
USD909317S1 (en) 2017-03-30 2021-02-02 Mitsubishi Electric Corporation Semiconductor package
US10383240B2 (en) 2017-06-13 2019-08-13 Honeywell International Inc. Housing to retain integrated circuit package
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD922970S1 (en) * 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device
USD1049065S1 (en) * 2021-07-12 2024-10-29 Jmj Korea Co., Ltd. Semiconductor package

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