USD505121S1 - Portion of a matrix for surface mount package leadframe - Google Patents

Portion of a matrix for surface mount package leadframe Download PDF

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Publication number
USD505121S1
USD505121S1 US29/173,648 US17364803F USD505121S US D505121 S1 USD505121 S1 US D505121S1 US 17364803 F US17364803 F US 17364803F US D505121 S USD505121 S US D505121S
Authority
US
United States
Prior art keywords
matrix
surface mount
mount package
package leadframe
leadframe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/173,648
Inventor
James Harnden
Richard K. Williams
Anthony Chia
Chu Weibing
Allen K. Lam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GEM Services Inc USA
Original Assignee
GEM Services Inc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEM Services Inc USA filed Critical GEM Services Inc USA
Priority to US29/173,648 priority Critical patent/USD505121S1/en
Assigned to GEM SERVICES, INC. reassignment GEM SERVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAM, ALLEN K., CHIA, ANTHONY, WEIBING, CHU, HARNDEN, JAMES, WILLIAMS, RICHARD K.
Application granted granted Critical
Publication of USD505121S1 publication Critical patent/USD505121S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframes showing my new design;
FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,
FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframes showing my new design.

Claims (1)

  1. The ornamental design for portion of a matrix for surface mount package leadframe, as shown and described.
US29/173,648 2003-01-03 2003-01-03 Portion of a matrix for surface mount package leadframe Expired - Lifetime USD505121S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/173,648 USD505121S1 (en) 2003-01-03 2003-01-03 Portion of a matrix for surface mount package leadframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/173,648 USD505121S1 (en) 2003-01-03 2003-01-03 Portion of a matrix for surface mount package leadframe

Publications (1)

Publication Number Publication Date
USD505121S1 true USD505121S1 (en) 2005-05-17

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Family Applications (1)

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US29/173,648 Expired - Lifetime USD505121S1 (en) 2003-01-03 2003-01-03 Portion of a matrix for surface mount package leadframe

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD585847S1 (en) * 2006-09-08 2009-02-03 Cree, Inc. LED lighting tile
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
USD588557S1 (en) * 2007-10-02 2009-03-17 Gem Services, Inc. 4040-28J matrix leadframe
USD803801S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803800S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame

Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4118859A (en) 1976-12-01 1978-10-10 Amp Incorporated Packaging and assembly of sheet metal parts
US4234666A (en) 1978-07-26 1980-11-18 Western Electric Company, Inc. Carrier tapes for semiconductor devices
US4298883A (en) 1977-04-26 1981-11-03 Tokyo Shibaura Electric Co., Ltd. Plastic material package semiconductor device having a mechanically stable mounting unit for a semiconductor pellet
US4633582A (en) 1985-08-14 1987-01-06 General Instrument Corporation Method for assembling an optoisolator and leadframe therefor
US4809054A (en) 1986-07-25 1989-02-28 Kurt Waldner Semiconductor lead frame
US4818960A (en) 1987-04-06 1989-04-04 Tdk Corporation Composite part and method of manufacturing same
US4852250A (en) 1988-01-19 1989-08-01 Microelectronics And Computer Technology Corporation Hermetically sealed package having an electronic component and method of making
US4865193A (en) 1987-06-23 1989-09-12 Mitsubishi Denki Kabushiki Kaisha Tape carrier for tape automated bonding process and a method of producing the same
US5115299A (en) 1989-07-13 1992-05-19 Gte Products Corporation Hermetically sealed chip carrier with ultra violet transparent cover
US5554886A (en) 1994-03-30 1996-09-10 Goldstar Electron Co., Ltd. Lead frame and semiconductor package with such lead frame
US5900582A (en) 1992-06-05 1999-05-04 Mitsubishi Denki Kabushiki Kaisha Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame
US6016918A (en) 1998-08-18 2000-01-25 Dial Tool Industries, Inc. Part carrier strip
US6028350A (en) * 1998-02-09 2000-02-22 Advanced Micro Devices, Inc. Lead frame with strip-shaped die bonding pad
US6377742B1 (en) * 1998-03-16 2002-04-23 Sumitomo Electric Industries, Ltd. Lead frame, optical module, and a method of optical module
US20020106835A1 (en) * 2001-02-02 2002-08-08 Carter Jerry L. Single layer surface mount package
USD465207S1 (en) 2001-06-08 2002-11-05 Gem Services, Inc. Leadframe matrix for a surface mount package
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483337S1 (en) * 2002-11-25 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) * 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484103S1 (en) * 2002-11-15 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485243S1 (en) * 2002-10-22 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD486802S1 (en) * 2002-12-17 2004-02-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) * 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe

Patent Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4118859A (en) 1976-12-01 1978-10-10 Amp Incorporated Packaging and assembly of sheet metal parts
US4298883A (en) 1977-04-26 1981-11-03 Tokyo Shibaura Electric Co., Ltd. Plastic material package semiconductor device having a mechanically stable mounting unit for a semiconductor pellet
US4234666A (en) 1978-07-26 1980-11-18 Western Electric Company, Inc. Carrier tapes for semiconductor devices
US4633582A (en) 1985-08-14 1987-01-06 General Instrument Corporation Method for assembling an optoisolator and leadframe therefor
US4809054A (en) 1986-07-25 1989-02-28 Kurt Waldner Semiconductor lead frame
US4818960A (en) 1987-04-06 1989-04-04 Tdk Corporation Composite part and method of manufacturing same
US4865193A (en) 1987-06-23 1989-09-12 Mitsubishi Denki Kabushiki Kaisha Tape carrier for tape automated bonding process and a method of producing the same
US4852250A (en) 1988-01-19 1989-08-01 Microelectronics And Computer Technology Corporation Hermetically sealed package having an electronic component and method of making
US5115299A (en) 1989-07-13 1992-05-19 Gte Products Corporation Hermetically sealed chip carrier with ultra violet transparent cover
US5900582A (en) 1992-06-05 1999-05-04 Mitsubishi Denki Kabushiki Kaisha Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame
US5554886A (en) 1994-03-30 1996-09-10 Goldstar Electron Co., Ltd. Lead frame and semiconductor package with such lead frame
US6028350A (en) * 1998-02-09 2000-02-22 Advanced Micro Devices, Inc. Lead frame with strip-shaped die bonding pad
US6377742B1 (en) * 1998-03-16 2002-04-23 Sumitomo Electric Industries, Ltd. Lead frame, optical module, and a method of optical module
US6016918A (en) 1998-08-18 2000-01-25 Dial Tool Industries, Inc. Part carrier strip
US20020106835A1 (en) * 2001-02-02 2002-08-08 Carter Jerry L. Single layer surface mount package
USD465207S1 (en) 2001-06-08 2002-11-05 Gem Services, Inc. Leadframe matrix for a surface mount package
USD485243S1 (en) * 2002-10-22 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484103S1 (en) * 2002-11-15 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483337S1 (en) * 2002-11-25 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) * 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD486802S1 (en) * 2002-12-17 2004-02-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) * 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD585847S1 (en) * 2006-09-08 2009-02-03 Cree, Inc. LED lighting tile
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
USD588557S1 (en) * 2007-10-02 2009-03-17 Gem Services, Inc. 4040-28J matrix leadframe
USD803801S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803800S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame

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