USD489695S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD489695S1 USD489695S1 US29/168,230 US16823002F USD489695S US D489695 S1 USD489695 S1 US D489695S1 US 16823002 F US16823002 F US 16823002F US D489695 S USD489695 S US D489695S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- elevational view
- ornamental design
- side elevational
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a right side elevational view thereof.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002-008489 | 2002-03-29 | ||
| JP2002008489 | 2002-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD489695S1 true USD489695S1 (en) | 2004-05-11 |
Family
ID=32211465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/168,230 Expired - Lifetime USD489695S1 (en) | 2002-03-29 | 2002-09-30 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD489695S1 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD515520S1 (en) * | 2002-03-29 | 2006-02-21 | Kabushiki Kaisha Toshiba | Semiconductor device |
| US7050477B2 (en) | 2002-03-28 | 2006-05-23 | Kabushiki Kaisha Toshiba | Semiconductor laser apparatus |
| USD742842S1 (en) * | 2014-03-24 | 2015-11-10 | Lem Intellectual Property Sa | Electrical current transducer |
| USD743400S1 (en) * | 2010-06-11 | 2015-11-17 | Ricoh Company, Ltd. | Information storage device |
| USD877707S1 (en) * | 2017-03-30 | 2020-03-10 | Mitsubishi Electric Corporation | Semiconductor package |
| USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD922970S1 (en) * | 2019-10-28 | 2021-06-22 | Rohm Co., Ltd. | Semiconductor device |
| USD928105S1 (en) * | 2019-10-28 | 2021-08-17 | Rohm Co., Ltd. | Semiconductor device |
| USD1049065S1 (en) * | 2021-07-12 | 2024-10-29 | Jmj Korea Co., Ltd. | Semiconductor package |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4346396A (en) | 1979-03-12 | 1982-08-24 | Western Electric Co., Inc. | Electronic device assembly and methods of making same |
| USD280812S (en) | 1982-05-07 | 1985-10-01 | Stanley Electric Co., Ltd. | Light-emitting diode semiconductor chip with leads |
| US5459350A (en) | 1993-01-13 | 1995-10-17 | Mitsubishi Denki Kabushiki Kaisha | Resin sealed type semiconductor device |
| US5512784A (en) | 1994-04-19 | 1996-04-30 | Jerrold Communications, General Instrument Corporation | Surge protector semiconductor subassembly for 3-lead transistor aotline package |
| US5563441A (en) | 1992-12-11 | 1996-10-08 | Mitsubishi Denki Kabushiki Kaisha | Lead frame assembly including a semiconductor device and a resistance wire |
| USD420983S (en) | 1998-10-16 | 2000-02-22 | Ixys Corporation | Semiconductor power package with three leads |
| US6362517B1 (en) | 1999-09-22 | 2002-03-26 | Michael Ray Bell | High voltage package for electronic device |
| US6404065B1 (en) | 1998-07-31 | 2002-06-11 | I-Xys Corporation | Electrically isolated power semiconductor package |
-
2002
- 2002-09-30 US US29/168,230 patent/USD489695S1/en not_active Expired - Lifetime
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4346396A (en) | 1979-03-12 | 1982-08-24 | Western Electric Co., Inc. | Electronic device assembly and methods of making same |
| USD280812S (en) | 1982-05-07 | 1985-10-01 | Stanley Electric Co., Ltd. | Light-emitting diode semiconductor chip with leads |
| US5563441A (en) | 1992-12-11 | 1996-10-08 | Mitsubishi Denki Kabushiki Kaisha | Lead frame assembly including a semiconductor device and a resistance wire |
| US5459350A (en) | 1993-01-13 | 1995-10-17 | Mitsubishi Denki Kabushiki Kaisha | Resin sealed type semiconductor device |
| US5512784A (en) | 1994-04-19 | 1996-04-30 | Jerrold Communications, General Instrument Corporation | Surge protector semiconductor subassembly for 3-lead transistor aotline package |
| US6404065B1 (en) | 1998-07-31 | 2002-06-11 | I-Xys Corporation | Electrically isolated power semiconductor package |
| USD420983S (en) | 1998-10-16 | 2000-02-22 | Ixys Corporation | Semiconductor power package with three leads |
| US6362517B1 (en) | 1999-09-22 | 2002-03-26 | Michael Ray Bell | High voltage package for electronic device |
Cited By (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7050477B2 (en) | 2002-03-28 | 2006-05-23 | Kabushiki Kaisha Toshiba | Semiconductor laser apparatus |
| US20060126692A1 (en) * | 2002-03-28 | 2006-06-15 | Kabushiki Kaisha Toshiba | Semiconductor laser apparatus |
| US7173952B2 (en) | 2002-03-28 | 2007-02-06 | Kabushiki Kaisha Toshiba | Semiconductor laser apparatus |
| USD515520S1 (en) * | 2002-03-29 | 2006-02-21 | Kabushiki Kaisha Toshiba | Semiconductor device |
| US10754275B2 (en) | 2010-06-11 | 2020-08-25 | Ricoh Company, Ltd. | Apparatus and method for preventing an information storage device from falling from a removable device |
| US20180253028A1 (en) | 2010-06-11 | 2018-09-06 | Yasufumi Takahashi | Apparatus and method for preventing an information storage device from falling from a removable device |
| US9256158B2 (en) | 2010-06-11 | 2016-02-09 | Ricoh Company, Limited | Apparatus and method for preventing an information storage device from falling from a removable device |
| USD757161S1 (en) | 2010-06-11 | 2016-05-24 | Ricoh Company, Ltd. | Toner container |
| USD758482S1 (en) | 2010-06-11 | 2016-06-07 | Ricoh Company, Ltd. | Toner bottle |
| US9599927B2 (en) | 2010-06-11 | 2017-03-21 | Ricoh Company, Ltd. | Apparatus and method for preventing an information storage device from falling from a removable device |
| US9989887B2 (en) | 2010-06-11 | 2018-06-05 | Ricoh Company, Ltd. | Apparatus and method for preventing an information storage device from falling from a removable device |
| US11188007B2 (en) | 2010-06-11 | 2021-11-30 | Ricoh Company, Ltd. | Developer container which discharges toner from a lower side and includes a box section |
| US12416878B2 (en) | 2010-06-11 | 2025-09-16 | Ricoh Company, Limited | Information storage system including a plurality of terminals |
| US10725398B2 (en) | 2010-06-11 | 2020-07-28 | Ricoh Company, Ltd. | Developer container having a cap with three portions of different diameters |
| US11275327B2 (en) | 2010-06-11 | 2022-03-15 | Ricoh Company, Ltd. | Information storage system including a plurality of terminals |
| USD743400S1 (en) * | 2010-06-11 | 2015-11-17 | Ricoh Company, Ltd. | Information storage device |
| US11768448B2 (en) | 2010-06-11 | 2023-09-26 | Ricoh Company, Ltd. | Information storage system including a plurality of terminals |
| US11429036B2 (en) | 2010-06-11 | 2022-08-30 | Ricoh Company, Ltd. | Information storage system including a plurality of terminals |
| USD742842S1 (en) * | 2014-03-24 | 2015-11-10 | Lem Intellectual Property Sa | Electrical current transducer |
| USD908647S1 (en) | 2017-03-30 | 2021-01-26 | Mitsubishi Electric Corporation | Semiconductor package |
| USD909318S1 (en) | 2017-03-30 | 2021-02-02 | Mitsubishi Electric Corporation | Semiconductor package |
| USD909317S1 (en) | 2017-03-30 | 2021-02-02 | Mitsubishi Electric Corporation | Semiconductor package |
| USD908646S1 (en) | 2017-03-30 | 2021-01-26 | Mitsubishi Electric Corporation | Semiconductor package |
| USD877707S1 (en) * | 2017-03-30 | 2020-03-10 | Mitsubishi Electric Corporation | Semiconductor package |
| USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD922970S1 (en) * | 2019-10-28 | 2021-06-22 | Rohm Co., Ltd. | Semiconductor device |
| USD928105S1 (en) * | 2019-10-28 | 2021-08-17 | Rohm Co., Ltd. | Semiconductor device |
| USD1049065S1 (en) * | 2021-07-12 | 2024-10-29 | Jmj Korea Co., Ltd. | Semiconductor package |
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