USD478556S1 - Speaker heat sink - Google Patents
Speaker heat sink Download PDFInfo
- Publication number
- USD478556S1 USD478556S1 US29/153,673 US15367302F USD478556S US D478556 S1 USD478556 S1 US D478556S1 US 15367302 F US15367302 F US 15367302F US D478556 S USD478556 S US D478556S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- speaker heat
- speaker
- ornamental design
- sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a perspective view of the ornamental design of the present invention;
FIG. 2 is a top view of the ornamental design shown in FIG. 1;
FIG. 3 is a bottom view of the ornamental design shown in FIG. 1;
FIG. 4 is a first elevation view of the ornamental design shown in FIG. 1; and,
FIG. 5 is a second elevation view of the ornamental design shown in FIG. 1.
Claims (1)
- The ornamental design for a speaker heat sink, as shown.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/153,673 USD478556S1 (en) | 2002-01-10 | 2002-01-10 | Speaker heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/153,673 USD478556S1 (en) | 2002-01-10 | 2002-01-10 | Speaker heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD478556S1 true USD478556S1 (en) | 2003-08-19 |
Family
ID=27733695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/153,673 Expired - Lifetime USD478556S1 (en) | 2002-01-10 | 2002-01-10 | Speaker heat sink |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD478556S1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD786201S1 (en) * | 2015-10-19 | 2017-05-09 | Tymphany Hk Limited | Heat sink for woofer |
| USD836571S1 (en) * | 2017-02-15 | 2018-12-25 | SAIJOINX Co., Ltd. | Heat sink |
| USD987167S1 (en) * | 2020-03-23 | 2023-05-23 | Osram Gmbh | Heatsink for a lamp |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3716098A (en) | 1971-01-28 | 1973-02-13 | G Dotto | Automotive apparatus |
| US4396935A (en) | 1980-10-06 | 1983-08-02 | Ncr Corporation | VLSI Packaging system |
| US5543663A (en) | 1993-12-27 | 1996-08-06 | Kabushiki Kaisha Toshiba | Semiconductor device and BGA package |
| US5789813A (en) | 1996-09-30 | 1998-08-04 | Lsi Logic Corporation | Ball grid array package with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom |
| USD404016S (en) | 1997-01-31 | 1999-01-12 | Tokyo Electron Limited | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| USD405428S (en) | 1997-01-31 | 1999-02-09 | Tokyo Electron Ltd. | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| USD410438S (en) | 1997-01-31 | 1999-06-01 | Tokyo Electron Limited | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| US6125924A (en) | 1999-05-03 | 2000-10-03 | Lin; Hao-Cheng | Heat-dissipating device |
| US6304446B1 (en) | 2000-08-30 | 2001-10-16 | Hsieh Hsin-Mao | Heat dissipater |
| US6330905B1 (en) | 2000-09-14 | 2001-12-18 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
-
2002
- 2002-01-10 US US29/153,673 patent/USD478556S1/en not_active Expired - Lifetime
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3716098A (en) | 1971-01-28 | 1973-02-13 | G Dotto | Automotive apparatus |
| US4396935A (en) | 1980-10-06 | 1983-08-02 | Ncr Corporation | VLSI Packaging system |
| US5543663A (en) | 1993-12-27 | 1996-08-06 | Kabushiki Kaisha Toshiba | Semiconductor device and BGA package |
| US5789813A (en) | 1996-09-30 | 1998-08-04 | Lsi Logic Corporation | Ball grid array package with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom |
| USD404016S (en) | 1997-01-31 | 1999-01-12 | Tokyo Electron Limited | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| USD405428S (en) | 1997-01-31 | 1999-02-09 | Tokyo Electron Ltd. | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| USD410438S (en) | 1997-01-31 | 1999-06-01 | Tokyo Electron Limited | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| US6125924A (en) | 1999-05-03 | 2000-10-03 | Lin; Hao-Cheng | Heat-dissipating device |
| US6304446B1 (en) | 2000-08-30 | 2001-10-16 | Hsieh Hsin-Mao | Heat dissipater |
| US6330905B1 (en) | 2000-09-14 | 2001-12-18 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD786201S1 (en) * | 2015-10-19 | 2017-05-09 | Tymphany Hk Limited | Heat sink for woofer |
| USD836571S1 (en) * | 2017-02-15 | 2018-12-25 | SAIJOINX Co., Ltd. | Heat sink |
| USD987167S1 (en) * | 2020-03-23 | 2023-05-23 | Osram Gmbh | Heatsink for a lamp |
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