USD459705S1 - Semiconductor package - Google Patents

Description

FIG. 1 is a front, plan and right side perspective view of a semiconductor package showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 is a right side elevational view thereof.

The broken lines are shown in the views for illustrative purposes only and form no part of the claimed design.

Claims (1)

1. The ornamental design for a semiconductor package, as shown and described.

Images