USD459316S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD459316S1 USD459316S1 US29/144,819 US14481901F USD459316S US D459316 S1 USD459316 S1 US D459316S1 US 14481901 F US14481901 F US 14481901F US D459316 S USD459316 S US D459316S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- elevational view
- side elevational
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front, bottom and right side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right side elevational view thereof; the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross-sectional view thereof, taken along line 8—8 of FIG. 5, with the internal system omitted.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001003331 | 2001-02-15 | ||
| JP2001-003331 | 2001-02-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD459316S1 true USD459316S1 (en) | 2002-06-25 |
Family
ID=18871684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/144,819 Expired - Lifetime USD459316S1 (en) | 2001-02-15 | 2001-07-12 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD459316S1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD694724S1 (en) * | 2012-10-03 | 2013-12-03 | Honda Motor Co., Ltd. | Semiconductor device |
| USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
| USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
| USD1031678S1 (en) * | 2021-05-13 | 2024-06-18 | Mississippi State University, Office of Technology Management | Combined electrical enclosure and mount for wearable plug and play device |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3706840A (en) | 1971-05-10 | 1972-12-19 | Intersil Inc | Semiconductor device packaging |
| US4748538A (en) | 1985-07-08 | 1988-05-31 | Nec Corporation | Semiconductor module |
| US4843695A (en) | 1987-07-16 | 1989-07-04 | Digital Equipment Corporation | Method of assembling tab bonded semiconductor chip package |
| US5237201A (en) | 1989-07-21 | 1993-08-17 | Kabushiki Kaisha Toshiba | TAB type semiconductor device and method of manufacturing the same |
| USD345731S (en) | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
| US5464054A (en) | 1993-08-09 | 1995-11-07 | Thermalloy, Inc. | Spring clamp and heat sink assembly |
| USD416872S (en) | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
| US6020625A (en) | 1998-03-27 | 2000-02-01 | Mitsubishi Denki Kabushiki Kaisha | Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame |
| USD421969S (en) | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| US6093957A (en) | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
| USD432096S (en) | 1999-11-24 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
| USD432097S (en) | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
| USD448740S1 (en) | 2000-11-30 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| US6300685B1 (en) | 1998-08-20 | 2001-10-09 | Oki Electric Industry Co., Ltd. | Semiconductor package |
-
2001
- 2001-07-12 US US29/144,819 patent/USD459316S1/en not_active Expired - Lifetime
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3706840A (en) | 1971-05-10 | 1972-12-19 | Intersil Inc | Semiconductor device packaging |
| US4748538A (en) | 1985-07-08 | 1988-05-31 | Nec Corporation | Semiconductor module |
| US4843695A (en) | 1987-07-16 | 1989-07-04 | Digital Equipment Corporation | Method of assembling tab bonded semiconductor chip package |
| US5237201A (en) | 1989-07-21 | 1993-08-17 | Kabushiki Kaisha Toshiba | TAB type semiconductor device and method of manufacturing the same |
| USD345731S (en) | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
| US5464054A (en) | 1993-08-09 | 1995-11-07 | Thermalloy, Inc. | Spring clamp and heat sink assembly |
| US6093957A (en) | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
| USD416872S (en) | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
| US6020625A (en) | 1998-03-27 | 2000-02-01 | Mitsubishi Denki Kabushiki Kaisha | Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame |
| US6300685B1 (en) | 1998-08-20 | 2001-10-09 | Oki Electric Industry Co., Ltd. | Semiconductor package |
| USD421969S (en) | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD432097S (en) | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
| USD432096S (en) | 1999-11-24 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
| USD448740S1 (en) | 2000-11-30 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD694724S1 (en) * | 2012-10-03 | 2013-12-03 | Honda Motor Co., Ltd. | Semiconductor device |
| USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
| USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
| USD1031678S1 (en) * | 2021-05-13 | 2024-06-18 | Mississippi State University, Office of Technology Management | Combined electrical enclosure and mount for wearable plug and play device |
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