USD354275S - Low-profile detachable integrated circuit module - Google Patents

Low-profile detachable integrated circuit module Download PDF

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Publication number
USD354275S
USD354275S US29/021,052 US2105294F USD354275S US D354275 S USD354275 S US D354275S US 2105294 F US2105294 F US 2105294F US D354275 S USD354275 S US D354275S
Authority
US
United States
Prior art keywords
integrated circuit
low
circuit module
detachable integrated
profile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/021,052
Inventor
Harry M. Siegel
Tom Q. Lao
Krishnan Kelappan
Michael J. Hundt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics lnc USA
Original Assignee
SGS Thomson Microelectronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics Inc filed Critical SGS Thomson Microelectronics Inc
Priority to US29/021,052 priority Critical patent/USD354275S/en
Assigned to SGS THOMSON MICROELECTRONICS, INC. reassignment SGS THOMSON MICROELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUNDT, MICHAEL J., KELAPPAN, KRISHNAN, LAO, TOM QUOC, SIEGEL, HARRY MICHAEL
Application granted granted Critical
Publication of USD354275S publication Critical patent/USD354275S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the low-profile detachable integrated circuit module illustrating its cooperative relationship with a packaged integrated circuit. The broken line showing of the packaged integrated circuit is included for the purpose of illustrating an environmental element only and forms no part of the claimed design;
FIGS. 2 and 3 are opposing side elevation views of the detachable module;
FIG. 4 is an end elevation view of the detachable module from its end nearer the lockout key;
FIG. 5 is an end elevation view of the detachable module from its end opposite that from the lockout key;
FIG. 6 is a top plan view of the detachable module; and,
FIG. 7 is a bottom plan view of the detachable module.

Claims (1)

  1. The ornamental design for the low-profile detachable integrated circuit module, as shown and described.
US29/021,052 1994-04-08 1994-04-08 Low-profile detachable integrated circuit module Expired - Lifetime USD354275S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/021,052 USD354275S (en) 1994-04-08 1994-04-08 Low-profile detachable integrated circuit module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/021,052 USD354275S (en) 1994-04-08 1994-04-08 Low-profile detachable integrated circuit module

Publications (1)

Publication Number Publication Date
USD354275S true USD354275S (en) 1995-01-10

Family

ID=64350414

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/021,052 Expired - Lifetime USD354275S (en) 1994-04-08 1994-04-08 Low-profile detachable integrated circuit module

Country Status (1)

Country Link
US (1) USD354275S (en)

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