USD1056862S1 - Semiconductor package - Google Patents

Semiconductor package Download PDF

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Publication number
USD1056862S1
USD1056862S1 US29/866,001 US202229866001F USD1056862S US D1056862 S1 USD1056862 S1 US D1056862S1 US 202229866001 F US202229866001 F US 202229866001F US D1056862 S USD1056862 S US D1056862S
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United States
Prior art keywords
semiconductor package
view
package
semiconductor
ornamental design
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Active
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US29/866,001
Inventor
Geza DEZSI
Devarajan Balaraman
Brice Mcpherson
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Wolfspeed Inc
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Wolfspeed Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Assigned to WOLFSPEED, INC. reassignment WOLFSPEED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BALARAMAN, DEVARAJAN, DEZSI, Geza, MCPHERSON, BRICE
Priority to US29/866,001 priority Critical patent/USD1056862S1/en
Priority to JP2023002248F priority patent/JP1762672S/en
Priority to JP2023022179F priority patent/JP1766482S/en
Priority to JP2023022178F priority patent/JP1766481S/en
Assigned to U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION reassignment U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION SECURITY INTEREST Assignors: WOLFSPEED, INC.
Publication of USD1056862S1 publication Critical patent/USD1056862S1/en
Application granted granted Critical
Assigned to U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT NOTICE OF GRANT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Assignors: WOLFSPEED, INC.
Assigned to U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT NOTICE OF GRANT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Assignors: WOLFSPEED, INC.
Assigned to U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT NOTICE OF GRANT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Assignors: WOLFSPEED, INC.
Assigned to U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT NOTICE OF GRANT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Assignors: WOLFSPEED, INC.
Assigned to WOLFSPEED, INC. reassignment WOLFSPEED, INC. RELEASE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY COLLATERAL AT REEL/FRAME NO. 64185/0755 Assignors: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top perspective view of a semiconductor package;
FIG. 2 is a bottom perspective view of the semiconductor package of FIG. 1 ;
FIG. 3 is a top view of the semiconductor package of FIG. 1 ;
FIG. 4 is a bottom view of the semiconductor package of FIG. 1 ;
FIG. 5 is a side view of the semiconductor package of FIG. 1 ;
FIG. 6 is an opposing side view of the semiconductor package of FIG. 1 ;
FIG. 7 is an end view of the semiconductor package of FIG. 1 ; and,
FIG. 8 is an opposing end view of the semiconductor package of FIG. 1 .
The broken lines shown in the drawings depict portions of the semiconductor package that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor package, as shown and described.
US29/866,001 2022-08-24 2022-08-24 Semiconductor package Active USD1056862S1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US29/866,001 USD1056862S1 (en) 2022-08-24 2022-08-24 Semiconductor package
JP2023002248F JP1762672S (en) 2022-08-24 2023-02-08 semiconductor package
JP2023022179F JP1766482S (en) 2022-08-24 2023-02-08 semiconductor package
JP2023022178F JP1766481S (en) 2022-08-24 2023-02-08 Semiconductor Package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/866,001 USD1056862S1 (en) 2022-08-24 2022-08-24 Semiconductor package

Publications (1)

Publication Number Publication Date
USD1056862S1 true USD1056862S1 (en) 2025-01-07

Family

ID=89704413

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/866,001 Active USD1056862S1 (en) 2022-08-24 2022-08-24 Semiconductor package

Country Status (2)

Country Link
US (1) USD1056862S1 (en)
JP (3) JP1762672S (en)

Citations (41)

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US5912808A (en) * 1997-08-11 1999-06-15 Mitsubishi Denki Kabushiki Kaisha Semiconductor component
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
US20030213979A1 (en) 2002-03-08 2003-11-20 Mitsubishi Denki Kabushiki Kaisha Power semiconductor device
US20050029634A1 (en) 2003-08-05 2005-02-10 International Rectifier Corporation Topless semiconductor package
USD510915S1 (en) * 2003-07-09 2005-10-25 Matsushita Electric Industrial Co., Ltd. Optoelectronic IC package
USD511331S1 (en) * 2003-07-09 2005-11-08 Matsushita Electric Industrial Co., Ltd. Optoelectronic IC package
US20070052072A1 (en) 2005-09-07 2007-03-08 Denso Corporation Resin mold type semiconductor device
US7242582B2 (en) 2004-04-20 2007-07-10 Denso Corporation Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module
US20070216013A1 (en) 2006-03-20 2007-09-20 Sunao Funakoshi Power semiconductor module
US20080020517A1 (en) 2004-12-17 2008-01-24 Texas Instruments Incorporated Multi Lead Frame Power Package
US20130021759A1 (en) * 2011-05-17 2013-01-24 Ixys Semiconductor Gmbh Power Semiconductor Module with Asymmetrical Lead Spacing
US8450845B2 (en) 2008-04-09 2013-05-28 Fuji Electric Co., Ltd. Semiconductor device
US9142493B2 (en) * 2012-01-18 2015-09-22 Mitsubishi Electric Corporation Semiconductor device
USD758322S1 (en) * 2014-06-10 2016-06-07 Pacific Engineering Corp. Fuse
US20160204046A1 (en) 2013-08-30 2016-07-14 Denso Corporation Semiconductor device
US9468087B1 (en) 2015-07-13 2016-10-11 Texas Instruments Incorporated Power module with improved cooling and method for making
WO2017027315A1 (en) 2015-08-07 2017-02-16 Vishay Dale Electronics, Llc Molded body and electrical device having a molded body for high voltage applications
US20170317006A1 (en) 2014-11-21 2017-11-02 Denso Corporation Semiconductor device and power module
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
US20190080973A1 (en) 2017-09-08 2019-03-14 Infineon Technologies Austria Ag SMD Package with Top Side Cooling
US10253729B2 (en) 2014-11-20 2019-04-09 Denso Corporation Cooling module
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
US20200273782A1 (en) 2019-02-27 2020-08-27 Semiconductor Components Industries, Llc Semiconductor package with heatsink
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
US20210118778A1 (en) 2019-10-21 2021-04-22 Semiconductor Components Industries, Llc Semiconductor package having a lead frame and a heat-sink lead frame
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
US20210175141A1 (en) 2016-03-07 2021-06-10 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing semiconductor device
US20210305166A1 (en) 2020-03-27 2021-09-30 Cree, Inc. Power semiconductor package with improved performance
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
US20220028765A1 (en) * 2020-07-22 2022-01-27 Texas Instruments Incorporated Coated semiconductor devices
US20220122905A1 (en) 2020-10-19 2022-04-21 Infineon Technologies Ag Leadframe package with isolation layer
US20220157686A1 (en) 2020-11-13 2022-05-19 Infineon Technologies Ag Molded semiconductor package with dual integrated heat spreaders
US20220359351A1 (en) 2021-05-07 2022-11-10 Materion Corporation Microelectronics package assemblies and processes for making
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
US20230143679A1 (en) 2020-04-17 2023-05-11 Stmicroelectronics S.R.L. Packaged stackable electronic power device for surface mounting and circuit arrangement
US20230260861A1 (en) * 2022-02-11 2023-08-17 Wolfspeed, Inc. Semiconductor packages with increased power handling
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device

Patent Citations (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5912808A (en) * 1997-08-11 1999-06-15 Mitsubishi Denki Kabushiki Kaisha Semiconductor component
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
US20030213979A1 (en) 2002-03-08 2003-11-20 Mitsubishi Denki Kabushiki Kaisha Power semiconductor device
USD510915S1 (en) * 2003-07-09 2005-10-25 Matsushita Electric Industrial Co., Ltd. Optoelectronic IC package
USD511331S1 (en) * 2003-07-09 2005-11-08 Matsushita Electric Industrial Co., Ltd. Optoelectronic IC package
US20050029634A1 (en) 2003-08-05 2005-02-10 International Rectifier Corporation Topless semiconductor package
US7242582B2 (en) 2004-04-20 2007-07-10 Denso Corporation Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module
US20080020517A1 (en) 2004-12-17 2008-01-24 Texas Instruments Incorporated Multi Lead Frame Power Package
US20070052072A1 (en) 2005-09-07 2007-03-08 Denso Corporation Resin mold type semiconductor device
US20070216013A1 (en) 2006-03-20 2007-09-20 Sunao Funakoshi Power semiconductor module
US8450845B2 (en) 2008-04-09 2013-05-28 Fuji Electric Co., Ltd. Semiconductor device
US20130021759A1 (en) * 2011-05-17 2013-01-24 Ixys Semiconductor Gmbh Power Semiconductor Module with Asymmetrical Lead Spacing
US9142493B2 (en) * 2012-01-18 2015-09-22 Mitsubishi Electric Corporation Semiconductor device
US20160204046A1 (en) 2013-08-30 2016-07-14 Denso Corporation Semiconductor device
USD758322S1 (en) * 2014-06-10 2016-06-07 Pacific Engineering Corp. Fuse
US10253729B2 (en) 2014-11-20 2019-04-09 Denso Corporation Cooling module
US20170317006A1 (en) 2014-11-21 2017-11-02 Denso Corporation Semiconductor device and power module
US9468087B1 (en) 2015-07-13 2016-10-11 Texas Instruments Incorporated Power module with improved cooling and method for making
WO2017027315A1 (en) 2015-08-07 2017-02-16 Vishay Dale Electronics, Llc Molded body and electrical device having a molded body for high voltage applications
US20210175141A1 (en) 2016-03-07 2021-06-10 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing semiconductor device
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
US20190080973A1 (en) 2017-09-08 2019-03-14 Infineon Technologies Austria Ag SMD Package with Top Side Cooling
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
US20200273782A1 (en) 2019-02-27 2020-08-27 Semiconductor Components Industries, Llc Semiconductor package with heatsink
US20210118778A1 (en) 2019-10-21 2021-04-22 Semiconductor Components Industries, Llc Semiconductor package having a lead frame and a heat-sink lead frame
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
US20210305166A1 (en) 2020-03-27 2021-09-30 Cree, Inc. Power semiconductor package with improved performance
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
US20230143679A1 (en) 2020-04-17 2023-05-11 Stmicroelectronics S.R.L. Packaged stackable electronic power device for surface mounting and circuit arrangement
US20220028765A1 (en) * 2020-07-22 2022-01-27 Texas Instruments Incorporated Coated semiconductor devices
US20220122905A1 (en) 2020-10-19 2022-04-21 Infineon Technologies Ag Leadframe package with isolation layer
US20220157686A1 (en) 2020-11-13 2022-05-19 Infineon Technologies Ag Molded semiconductor package with dual integrated heat spreaders
US20220359351A1 (en) 2021-05-07 2022-11-10 Materion Corporation Microelectronics package assemblies and processes for making
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
US20230260861A1 (en) * 2022-02-11 2023-08-17 Wolfspeed, Inc. Semiconductor packages with increased power handling

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Publication number Publication date
JP1766481S (en) 2024-03-26
JP1766482S (en) 2024-03-26
JP1762672S (en) 2024-01-31

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