USB480292I5 - - Google Patents
Info
- Publication number
- USB480292I5 USB480292I5 US48029274A USB480292I5 US B480292 I5 USB480292 I5 US B480292I5 US 48029274 A US48029274 A US 48029274A US B480292 I5 USB480292 I5 US B480292I5
- Authority
- US
- United States
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/113—Isolations within a component, i.e. internal isolations
- H10D62/115—Dielectric isolations, e.g. air gaps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
- H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/113—Isolations within a component, i.e. internal isolations
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48098295A JPS5242634B2 (enrdf_load_stackoverflow) | 1973-09-03 | 1973-09-03 | |
JA48-98295 | 1973-09-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
USB480292I5 true USB480292I5 (enrdf_load_stackoverflow) | 1976-03-16 |
US3994011A US3994011A (en) | 1976-11-23 |
Family
ID=14215919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US05/480,292 Expired - Lifetime US3994011A (en) | 1973-09-03 | 1974-06-17 | High withstand voltage-semiconductor device with shallow grooves between semiconductor region and field limiting rings |
Country Status (2)
Country | Link |
---|---|
US (1) | US3994011A (enrdf_load_stackoverflow) |
JP (1) | JPS5242634B2 (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0262356A3 (en) * | 1986-09-30 | 1989-09-20 | Siemens Aktiengesellschaft | Process for manufacturing a high-voltage resistant pn junction |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5922383B2 (ja) * | 1975-05-23 | 1984-05-26 | 三菱電機株式会社 | 半導体装置 |
JPS5227274A (en) * | 1975-08-25 | 1977-03-01 | Hitachi Ltd | Semiconductor unit and its manufacturing process |
JPS5264881A (en) * | 1975-11-25 | 1977-05-28 | Hitachi Ltd | Semiconductor device and its production |
US4384299A (en) * | 1976-10-29 | 1983-05-17 | Massachusetts Institute Of Technology | Capacitor memory and methods for reading, writing, and fabricating capacitor memories |
US4125853A (en) * | 1977-03-28 | 1978-11-14 | Bell Telephone Laboratories, Incorporated | Integrated circuit transistor |
US4131910A (en) * | 1977-11-09 | 1978-12-26 | Bell Telephone Laboratories, Incorporated | High voltage semiconductor devices |
CH633907A5 (de) * | 1978-10-10 | 1982-12-31 | Bbc Brown Boveri & Cie | Leistungshalbleiterbauelement mit zonen-guard-ringen. |
JPS55150265A (en) * | 1979-05-11 | 1980-11-22 | Toyo Electric Mfg Co Ltd | Flat type diode with pressing force strengthening mechanism |
CH668505A5 (de) * | 1985-03-20 | 1988-12-30 | Bbc Brown Boveri & Cie | Halbleiterbauelement. |
GB8817459D0 (en) * | 1988-07-22 | 1988-08-24 | Gen Electric | Semiconductor devices |
US5430324A (en) * | 1992-07-23 | 1995-07-04 | Siliconix, Incorporated | High voltage transistor having edge termination utilizing trench technology |
JP3923256B2 (ja) | 1999-01-07 | 2007-05-30 | インフィネオン テクノロジース アクチエンゲゼルシャフト | ドーピングされた領域を分離するためのトレンチを備えた半導体装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1294558B (de) * | 1961-06-07 | 1969-05-08 | Westinghouse Electric Corp | Hochspannungsgleichrichter und Verfahren zum Herstellen |
US3241010A (en) * | 1962-03-23 | 1966-03-15 | Texas Instruments Inc | Semiconductor junction passivation |
GB1078273A (en) * | 1964-10-19 | 1967-08-09 | Sony Corp | Semiconductor device |
US3391287A (en) * | 1965-07-30 | 1968-07-02 | Westinghouse Electric Corp | Guard junctions for p-nu junction semiconductor devices |
US3492174A (en) * | 1966-03-19 | 1970-01-27 | Sony Corp | Method of making a semiconductor device |
US3489622A (en) * | 1967-05-18 | 1970-01-13 | Ibm | Method of making high frequency transistors |
US3717507A (en) * | 1969-06-19 | 1973-02-20 | Shibaura Electric Co Ltd | Method of manufacturing semiconductor devices utilizing ion-implantation and arsenic diffusion |
NL170348C (nl) * | 1970-07-10 | 1982-10-18 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting, waarbij op een oppervlak van een halfgeleiderlichaam een tegen dotering en tegen thermische oxydatie maskerend masker wordt aangebracht, de door de vensters in het masker vrijgelaten delen van het oppervlak worden onderworpen aan een etsbehandeling voor het vormen van verdiepingen en het halfgeleiderlichaam met het masker wordt onderworpen aan een thermische oxydatiebehandeling voor het vormen van een oxydepatroon dat de verdiepingen althans ten dele opvult. |
NL169121C (nl) * | 1970-07-10 | 1982-06-01 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting met een halfgeleiderlichaam, dat aan een oppervlak is voorzien van een althans ten dele in het halfgeleiderlichaam verzonken, door thermische oxydatie gevormd oxydepatroon. |
-
1973
- 1973-09-03 JP JP48098295A patent/JPS5242634B2/ja not_active Expired
-
1974
- 1974-06-17 US US05/480,292 patent/US3994011A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0262356A3 (en) * | 1986-09-30 | 1989-09-20 | Siemens Aktiengesellschaft | Process for manufacturing a high-voltage resistant pn junction |
Also Published As
Publication number | Publication date |
---|---|
JPS5049980A (enrdf_load_stackoverflow) | 1975-05-06 |
JPS5242634B2 (enrdf_load_stackoverflow) | 1977-10-25 |
US3994011A (en) | 1976-11-23 |