USB414481I5 - - Google Patents
Info
- Publication number
- USB414481I5 USB414481I5 US41448173A USB414481I5 US B414481 I5 USB414481 I5 US B414481I5 US 41448173 A US41448173 A US 41448173A US B414481 I5 USB414481 I5 US B414481I5
- Authority
- US
- United States
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
- B65G47/244—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning them about an axis substantially perpendicular to the conveying plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/414,481 US3982979A (en) | 1973-06-28 | 1973-11-09 | Methods for mounting an article on an adherent site on a substrate |
US05/703,031 US4062462A (en) | 1973-11-09 | 1976-07-06 | Method for orienting an article |
US05/703,385 US4070229A (en) | 1973-11-09 | 1976-07-07 | Apparatus for positioning and adhering a plurality of semiconductor devices to sites on an adherent site on a substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37443673A | 1973-06-28 | 1973-06-28 | |
US05/414,481 US3982979A (en) | 1973-06-28 | 1973-11-09 | Methods for mounting an article on an adherent site on a substrate |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US37443673A Continuation-In-Part | 1973-06-28 | 1973-06-28 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US05/703,031 Division US4062462A (en) | 1973-11-09 | 1976-07-06 | Method for orienting an article |
US05/703,385 Division US4070229A (en) | 1973-11-09 | 1976-07-07 | Apparatus for positioning and adhering a plurality of semiconductor devices to sites on an adherent site on a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
USB414481I5 true USB414481I5 (en) | 1976-01-20 |
US3982979A US3982979A (en) | 1976-09-28 |
Family
ID=27006605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US05/414,481 Expired - Lifetime US3982979A (en) | 1973-06-28 | 1973-11-09 | Methods for mounting an article on an adherent site on a substrate |
Country Status (1)
Country | Link |
---|---|
US (1) | US3982979A (en) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4029536A (en) * | 1976-04-07 | 1977-06-14 | Western Electric Company, Inc. | Methods of and apparatus for mounting articles to a carrier member |
DE2656019C3 (en) * | 1976-12-10 | 1980-07-17 | Brown, Boveri & Cie Ag, 6800 Mannheim | Device for aligning and soldering pedestals or discs with respect to or on the solderable ohmic contacts) of semiconductor components |
US4151945A (en) * | 1977-12-08 | 1979-05-01 | Universal Instruments Corporation | Automated hybrid circuit board assembly apparatus |
US4220491A (en) * | 1978-10-19 | 1980-09-02 | Ppg Industries, Inc. | Method for forming an accurately assembled laminate utilizing a vacuum holding press |
DE2852753C3 (en) * | 1978-12-06 | 1985-06-20 | Württembergische Metallwarenfabrik, 7340 Geislingen | Method for fastening components with flat connection contacts on a printed circuit board and template for carrying out the method |
DE2935021A1 (en) * | 1979-08-30 | 1981-03-19 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Machine which inserts components into circuit board - using suction tubes picking components from magazine and carrying to circuit boards |
DE2935081C2 (en) * | 1979-08-30 | 1985-12-19 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Device for assembling printed circuit boards. |
US4381602A (en) * | 1980-12-29 | 1983-05-03 | Honeywell Information Systems Inc. | Method of mounting an I.C. chip on a substrate |
US4363076A (en) * | 1980-12-29 | 1982-12-07 | Honeywell Information Systems Inc. | Integrated circuit package |
US4528747A (en) * | 1982-12-02 | 1985-07-16 | At&T Technologies, Inc. | Method and apparatus for mounting multilead components on a circuit board |
US4735671A (en) * | 1983-01-31 | 1988-04-05 | Xerox Corporation | Method for fabricating full width scanning arrays |
US4690391A (en) * | 1983-01-31 | 1987-09-01 | Xerox Corporation | Method and apparatus for fabricating full width scanning arrays |
US4512509A (en) * | 1983-02-25 | 1985-04-23 | At&T Technologies, Inc. | Technique for bonding a chip carrier to a metallized substrate |
US4607779A (en) * | 1983-08-11 | 1986-08-26 | National Semiconductor Corporation | Non-impact thermocompression gang bonding method |
US4722060A (en) * | 1984-03-22 | 1988-01-26 | Thomson Components-Mostek Corporation | Integrated-circuit leadframe adapted for a simultaneous bonding operation |
US4759818A (en) * | 1985-09-17 | 1988-07-26 | Sakurai Hiroshi | Thermo-transfer printing equipment |
US4731923A (en) * | 1986-03-15 | 1988-03-22 | Tdk Corporation | Apparatus and method for mounting circuit element on printed circuit board |
US4670981A (en) * | 1986-03-17 | 1987-06-09 | Nitto Kogyo Kabushiki Kaisha | Method of mounting electronic parts on the predetermined positions of a printed circuit board |
US4851966A (en) * | 1986-11-10 | 1989-07-25 | Motorola, Inc. | Method and apparatus of printed circuit board assembly with optimal placement of components |
US4813588A (en) * | 1987-09-25 | 1989-03-21 | Technical Manufacturing Corporation | Inspection and repair of tab lifted leads |
US5167558A (en) * | 1988-07-22 | 1992-12-01 | Zenith Electronics Corporation | System for registering and assembling tension masks and CRT faceplates |
US4899921A (en) * | 1988-10-28 | 1990-02-13 | The American Optical Corporation | Aligner bonder |
US5101550A (en) * | 1989-02-10 | 1992-04-07 | Honeywell Inc. | Removable drop-through die bond frame |
US4941255A (en) * | 1989-11-15 | 1990-07-17 | Eastman Kodak Company | Method for precision multichip assembly |
US5042709A (en) * | 1990-06-22 | 1991-08-27 | International Business Machines Corporation | Methods and apparatus for precise alignment of objects |
DE4219774C1 (en) * | 1992-06-17 | 1994-01-27 | Mannesmann Kienzle Gmbh | Method and device for stacking substrates to be bonded together |
US5828409A (en) * | 1995-06-30 | 1998-10-27 | Eastman Kodak Company | Film scanner mount assembly for a solid state sensor |
US6186092B1 (en) * | 1997-08-19 | 2001-02-13 | Applied Materials, Inc. | Apparatus and method for aligning and controlling edge deposition on a substrate |
US6168971B1 (en) | 1998-05-05 | 2001-01-02 | Fujitsu Limited | Method of assembling thin film jumper connectors to a substrate |
US20020100165A1 (en) | 2000-02-14 | 2002-08-01 | Amkor Technology, Inc. | Method of forming an integrated circuit device package using a temporary substrate |
US6517656B1 (en) * | 1999-10-05 | 2003-02-11 | Amkor Technology, Inc. | Method of making an integrated circuit package using a batch step for curing a die attachment film and a tool system for performing the method |
US6534338B1 (en) | 2001-06-29 | 2003-03-18 | Amkor Technology, Inc. | Method for molding semiconductor package having a ceramic substrate |
US6852191B2 (en) * | 2002-08-01 | 2005-02-08 | Equipements De Transformation Imac | Method and apparatus for manufacturing pressure sensitive adhesive label stocks with printing under adhesive and product produced thereby |
TWI340445B (en) * | 2007-01-10 | 2011-04-11 | Advanced Semiconductor Eng | Manufacturing method for integrating passive component within substrate |
US8148646B2 (en) * | 2008-09-29 | 2012-04-03 | Formfactor, Inc. | Process of positioning groups of contact structures |
US9051177B2 (en) * | 2008-10-27 | 2015-06-09 | The United States Of America As Represented By The Secretary Of The Army | Active optical limiting semiconductor device and method with active region transparent to light becoming opaque when not biased |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3465874A (en) * | 1967-06-12 | 1969-09-09 | Frances Hugle | Carrier for semiconductor devices |
US3472356A (en) * | 1968-02-28 | 1969-10-14 | Western Electric Co | Apparatus for selecting articles having a desired orientation |
US3559819A (en) * | 1969-05-07 | 1971-02-02 | Western Electric Co | Method and apparatus for orienting articles with tapered ends |
US3645581A (en) * | 1968-11-26 | 1972-02-29 | Ind Modular Systems Corp | Apparatus and method for handling and treating articles |
US3663326A (en) * | 1970-01-09 | 1972-05-16 | Western Electric Co | Article holding methods and assemblage |
US3669333A (en) * | 1970-02-02 | 1972-06-13 | Western Electric Co | Bonding with a compliant medium |
US3670396A (en) * | 1971-04-12 | 1972-06-20 | Us Navy | Method of making a circuit assembly |
US3752717A (en) * | 1971-08-05 | 1973-08-14 | Bell Telephone Labor Inc | Mounting media for semiconductor fabrication |
US3776394A (en) * | 1972-08-23 | 1973-12-04 | Western Electric Co | Methods and apparatus for imparting a desired orientation to an article |
-
1973
- 1973-11-09 US US05/414,481 patent/US3982979A/en not_active Expired - Lifetime
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3465874A (en) * | 1967-06-12 | 1969-09-09 | Frances Hugle | Carrier for semiconductor devices |
US3472356A (en) * | 1968-02-28 | 1969-10-14 | Western Electric Co | Apparatus for selecting articles having a desired orientation |
US3645581A (en) * | 1968-11-26 | 1972-02-29 | Ind Modular Systems Corp | Apparatus and method for handling and treating articles |
US3559819A (en) * | 1969-05-07 | 1971-02-02 | Western Electric Co | Method and apparatus for orienting articles with tapered ends |
US3663326A (en) * | 1970-01-09 | 1972-05-16 | Western Electric Co | Article holding methods and assemblage |
US3669333A (en) * | 1970-02-02 | 1972-06-13 | Western Electric Co | Bonding with a compliant medium |
US3670396A (en) * | 1971-04-12 | 1972-06-20 | Us Navy | Method of making a circuit assembly |
US3752717A (en) * | 1971-08-05 | 1973-08-14 | Bell Telephone Labor Inc | Mounting media for semiconductor fabrication |
US3776394A (en) * | 1972-08-23 | 1973-12-04 | Western Electric Co | Methods and apparatus for imparting a desired orientation to an article |
Also Published As
Publication number | Publication date |
---|---|
US3982979A (en) | 1976-09-28 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: AT & T TECHNOLOGIES, INC., Free format text: CHANGE OF NAME;ASSIGNOR:WESTERN ELECTRIC COMPANY, INCORPORATED;REEL/FRAME:004251/0868 Effective date: 19831229 |