USB414481I5 - - Google Patents

Info

Publication number
USB414481I5
USB414481I5 US41448173A USB414481I5 US B414481 I5 USB414481 I5 US B414481I5 US 41448173 A US41448173 A US 41448173A US B414481 I5 USB414481 I5 US B414481I5
Authority
US
United States
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to US05/414,481 priority Critical patent/US3982979A/en
Publication of USB414481I5 publication Critical patent/USB414481I5/en
Priority to US05/703,031 priority patent/US4062462A/en
Priority to US05/703,385 priority patent/US4070229A/en
Application granted granted Critical
Publication of US3982979A publication Critical patent/US3982979A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
    • B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
    • B65G47/244—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning them about an axis substantially perpendicular to the conveying plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
US05/414,481 1973-06-28 1973-11-09 Methods for mounting an article on an adherent site on a substrate Expired - Lifetime US3982979A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US05/414,481 US3982979A (en) 1973-06-28 1973-11-09 Methods for mounting an article on an adherent site on a substrate
US05/703,031 US4062462A (en) 1973-11-09 1976-07-06 Method for orienting an article
US05/703,385 US4070229A (en) 1973-11-09 1976-07-07 Apparatus for positioning and adhering a plurality of semiconductor devices to sites on an adherent site on a substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37443673A 1973-06-28 1973-06-28
US05/414,481 US3982979A (en) 1973-06-28 1973-11-09 Methods for mounting an article on an adherent site on a substrate

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US37443673A Continuation-In-Part 1973-06-28 1973-06-28

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US05/703,031 Division US4062462A (en) 1973-11-09 1976-07-06 Method for orienting an article
US05/703,385 Division US4070229A (en) 1973-11-09 1976-07-07 Apparatus for positioning and adhering a plurality of semiconductor devices to sites on an adherent site on a substrate

Publications (2)

Publication Number Publication Date
USB414481I5 true USB414481I5 (en) 1976-01-20
US3982979A US3982979A (en) 1976-09-28

Family

ID=27006605

Family Applications (1)

Application Number Title Priority Date Filing Date
US05/414,481 Expired - Lifetime US3982979A (en) 1973-06-28 1973-11-09 Methods for mounting an article on an adherent site on a substrate

Country Status (1)

Country Link
US (1) US3982979A (en)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4029536A (en) * 1976-04-07 1977-06-14 Western Electric Company, Inc. Methods of and apparatus for mounting articles to a carrier member
DE2656019C3 (en) * 1976-12-10 1980-07-17 Brown, Boveri & Cie Ag, 6800 Mannheim Device for aligning and soldering pedestals or discs with respect to or on the solderable ohmic contacts) of semiconductor components
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
US4220491A (en) * 1978-10-19 1980-09-02 Ppg Industries, Inc. Method for forming an accurately assembled laminate utilizing a vacuum holding press
DE2852753C3 (en) * 1978-12-06 1985-06-20 Württembergische Metallwarenfabrik, 7340 Geislingen Method for fastening components with flat connection contacts on a printed circuit board and template for carrying out the method
DE2935081C2 (en) * 1979-08-30 1985-12-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Device for assembling printed circuit boards.
DE2935021A1 (en) * 1979-08-30 1981-03-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Machine which inserts components into circuit board - using suction tubes picking components from magazine and carrying to circuit boards
US4381602A (en) * 1980-12-29 1983-05-03 Honeywell Information Systems Inc. Method of mounting an I.C. chip on a substrate
US4437235A (en) 1980-12-29 1984-03-20 Honeywell Information Systems Inc. Integrated circuit package
US4363076A (en) * 1980-12-29 1982-12-07 Honeywell Information Systems Inc. Integrated circuit package
US4528747A (en) * 1982-12-02 1985-07-16 At&T Technologies, Inc. Method and apparatus for mounting multilead components on a circuit board
US4690391A (en) * 1983-01-31 1987-09-01 Xerox Corporation Method and apparatus for fabricating full width scanning arrays
US4735671A (en) * 1983-01-31 1988-04-05 Xerox Corporation Method for fabricating full width scanning arrays
US4512509A (en) * 1983-02-25 1985-04-23 At&T Technologies, Inc. Technique for bonding a chip carrier to a metallized substrate
US4607779A (en) * 1983-08-11 1986-08-26 National Semiconductor Corporation Non-impact thermocompression gang bonding method
US4722060A (en) * 1984-03-22 1988-01-26 Thomson Components-Mostek Corporation Integrated-circuit leadframe adapted for a simultaneous bonding operation
US4759818A (en) * 1985-09-17 1988-07-26 Sakurai Hiroshi Thermo-transfer printing equipment
US4731923A (en) * 1986-03-15 1988-03-22 Tdk Corporation Apparatus and method for mounting circuit element on printed circuit board
US4670981A (en) * 1986-03-17 1987-06-09 Nitto Kogyo Kabushiki Kaisha Method of mounting electronic parts on the predetermined positions of a printed circuit board
US4851966A (en) * 1986-11-10 1989-07-25 Motorola, Inc. Method and apparatus of printed circuit board assembly with optimal placement of components
US4813588A (en) * 1987-09-25 1989-03-21 Technical Manufacturing Corporation Inspection and repair of tab lifted leads
US5167558A (en) * 1988-07-22 1992-12-01 Zenith Electronics Corporation System for registering and assembling tension masks and CRT faceplates
US4899921A (en) * 1988-10-28 1990-02-13 The American Optical Corporation Aligner bonder
US5101550A (en) * 1989-02-10 1992-04-07 Honeywell Inc. Removable drop-through die bond frame
US4941255A (en) * 1989-11-15 1990-07-17 Eastman Kodak Company Method for precision multichip assembly
US5042709A (en) * 1990-06-22 1991-08-27 International Business Machines Corporation Methods and apparatus for precise alignment of objects
DE4219774C1 (en) * 1992-06-17 1994-01-27 Mannesmann Kienzle Gmbh Method and device for stacking substrates to be bonded together
US5828409A (en) * 1995-06-30 1998-10-27 Eastman Kodak Company Film scanner mount assembly for a solid state sensor
US6186092B1 (en) * 1997-08-19 2001-02-13 Applied Materials, Inc. Apparatus and method for aligning and controlling edge deposition on a substrate
US6168971B1 (en) 1998-05-05 2001-01-02 Fujitsu Limited Method of assembling thin film jumper connectors to a substrate
US20020100165A1 (en) 2000-02-14 2002-08-01 Amkor Technology, Inc. Method of forming an integrated circuit device package using a temporary substrate
US6517656B1 (en) * 1999-10-05 2003-02-11 Amkor Technology, Inc. Method of making an integrated circuit package using a batch step for curing a die attachment film and a tool system for performing the method
US6534338B1 (en) 2001-06-29 2003-03-18 Amkor Technology, Inc. Method for molding semiconductor package having a ceramic substrate
US6852191B2 (en) * 2002-08-01 2005-02-08 Equipements De Transformation Imac Method and apparatus for manufacturing pressure sensitive adhesive label stocks with printing under adhesive and product produced thereby
TWI340445B (en) * 2007-01-10 2011-04-11 Advanced Semiconductor Eng Manufacturing method for integrating passive component within substrate
US8148646B2 (en) * 2008-09-29 2012-04-03 Formfactor, Inc. Process of positioning groups of contact structures
US9051177B2 (en) * 2008-10-27 2015-06-09 The United States Of America As Represented By The Secretary Of The Army Active optical limiting semiconductor device and method with active region transparent to light becoming opaque when not biased

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3465874A (en) * 1967-06-12 1969-09-09 Frances Hugle Carrier for semiconductor devices
US3472356A (en) * 1968-02-28 1969-10-14 Western Electric Co Apparatus for selecting articles having a desired orientation
US3559819A (en) * 1969-05-07 1971-02-02 Western Electric Co Method and apparatus for orienting articles with tapered ends
US3645581A (en) * 1968-11-26 1972-02-29 Ind Modular Systems Corp Apparatus and method for handling and treating articles
US3663326A (en) * 1970-01-09 1972-05-16 Western Electric Co Article holding methods and assemblage
US3669333A (en) * 1970-02-02 1972-06-13 Western Electric Co Bonding with a compliant medium
US3670396A (en) * 1971-04-12 1972-06-20 Us Navy Method of making a circuit assembly
US3752717A (en) * 1971-08-05 1973-08-14 Bell Telephone Labor Inc Mounting media for semiconductor fabrication
US3776394A (en) * 1972-08-23 1973-12-04 Western Electric Co Methods and apparatus for imparting a desired orientation to an article

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3465874A (en) * 1967-06-12 1969-09-09 Frances Hugle Carrier for semiconductor devices
US3472356A (en) * 1968-02-28 1969-10-14 Western Electric Co Apparatus for selecting articles having a desired orientation
US3645581A (en) * 1968-11-26 1972-02-29 Ind Modular Systems Corp Apparatus and method for handling and treating articles
US3559819A (en) * 1969-05-07 1971-02-02 Western Electric Co Method and apparatus for orienting articles with tapered ends
US3663326A (en) * 1970-01-09 1972-05-16 Western Electric Co Article holding methods and assemblage
US3669333A (en) * 1970-02-02 1972-06-13 Western Electric Co Bonding with a compliant medium
US3670396A (en) * 1971-04-12 1972-06-20 Us Navy Method of making a circuit assembly
US3752717A (en) * 1971-08-05 1973-08-14 Bell Telephone Labor Inc Mounting media for semiconductor fabrication
US3776394A (en) * 1972-08-23 1973-12-04 Western Electric Co Methods and apparatus for imparting a desired orientation to an article

Also Published As

Publication number Publication date
US3982979A (en) 1976-09-28

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Legal Events

Date Code Title Description
AS Assignment

Owner name: AT & T TECHNOLOGIES, INC.,

Free format text: CHANGE OF NAME;ASSIGNOR:WESTERN ELECTRIC COMPANY, INCORPORATED;REEL/FRAME:004251/0868

Effective date: 19831229