US9409254B2 - Ablation layers to prevent pitting in laser peening - Google Patents

Ablation layers to prevent pitting in laser peening Download PDF

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Publication number
US9409254B2
US9409254B2 US11/240,676 US24067605A US9409254B2 US 9409254 B2 US9409254 B2 US 9409254B2 US 24067605 A US24067605 A US 24067605A US 9409254 B2 US9409254 B2 US 9409254B2
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layer
tape
opaque
workpiece
onto
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US11/240,676
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US20070075062A1 (en
Inventor
Lloyd A. Hackel
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Lawrence Livermore National Security LLC
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Lawrence Livermore National Security LLC
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Priority to US11/240,676 priority Critical patent/US9409254B2/en
Assigned to U.S. DEPARTMENT OF ENERGY reassignment U.S. DEPARTMENT OF ENERGY CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS). Assignors: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
Priority to CN2006800360903A priority patent/CN101277780B/zh
Priority to PCT/US2006/038392 priority patent/WO2007086953A2/en
Priority to AT06849830T priority patent/ATE523285T1/de
Priority to ES06849830T priority patent/ES2377475T3/es
Priority to JP2008533740A priority patent/JP2009509771A/ja
Priority to EP06849830A priority patent/EP1960154B1/en
Priority to RU2008117136/02A priority patent/RU2433896C2/ru
Priority to BRPI0616606-7A priority patent/BRPI0616606B1/pt
Publication of US20070075062A1 publication Critical patent/US20070075062A1/en
Assigned to LAWRENCE LIVERMORE NATIONAL SECURITY, LLC reassignment LAWRENCE LIVERMORE NATIONAL SECURITY, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HACKEL, LLOYD A.
Publication of US9409254B2 publication Critical patent/US9409254B2/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B23K26/0081—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D10/00—Modifying the physical properties by methods other than heat treatment or deformation
    • C21D10/005—Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2201/18—
    • B23K2201/34—
    • B23K2203/08—
    • B23K2203/16—
    • B23K2203/50—

Definitions

  • the present invention relates laser peening, and more specifically, it relates to techniques for applying an ablative layer that will not create pitting when performing laser peening.
  • a laser peening apparatus and method for peening a workpiece utilizing a laser beam is described.
  • the system includes a foil aligned with a surface of the workpiece to be peened and lasing the aligned foil surface.
  • the foil absorbs energy from the beam and a portion of the foil vaporizes, which creates a hot plasma within the foil.
  • the plasma creates a shock wave which passes through the foil and peens the workpiece surface.
  • a high power laser is made incident onto a metal surface, ablating a thin surface layer, creating a plasma and a consequent intense shock.
  • This intense shock plastically strains the material and results in a compressive layer of residual stress in the surface.
  • a layer or layers of material are applied to the substrate surface to act as a source of ablation material and to provide insulation from the plasma's heat.
  • This plasma is the source of a shock wave that forms and consequently peens the material.
  • paint was used as the ablation layer but paint does not have sufficient tensile strength to keep from locally shearing when the shock locally compresses the surface. It also fractures and debonds when the shock ends and the surface rebounds.
  • Tapes with adhesive backing have proved to be a better ablation material. They are readily applied, stick to the surface and have sufficient tensile strength to allow continuous side-by-side peening without in general shearing or debonding.
  • small pockets of air often as small as 20 ⁇ m in semi-spherical size can be trapped under the tape and in contact with the metal surface. When these pockets are compressed by the shock wave they heat in an adiabatic manner and transmit this heat to the metal.
  • this transmitted heat can be sufficient to locally melt the metal and create a small pit of molten material that subsequently solidifies as a solid crater. This pit is undesirable as it solidifies in a tensile state forming a stress riser on the metal surface and potentially reduces the fatigue lifetime and resistance to corrosion of the peened sample.
  • a hybrid ablation layer that comprises a separate under layer is applied to a material to be peened.
  • the underlayer is in contact with the surface to be peened and is applied in a manner such that it does not have bubbles and voids that exceed an acceptable size.
  • One or more over layers such as metal foil or tape are applied over the under layer.
  • the under layer can, for example, be a sprayed on adhesive or a paint layer that goes down without bubbles. Subsequently any bubbles formed under the over layers are insulated from the surface to be peened. The process has been tested and significantly reduces the incidence of pits on peened surfaces.
  • the invention is useful in a variety of laser peening applications, such as laser peening of metals, laser peenforming of metals and laser peenmarking of metals.
  • FIG. 1 shows a material with a surface that has been prepared according to the present invention.
  • a hybrid ablation layer that comprises two or more layers is applied to a surface to be laser peened.
  • the hybride ablation layer is formed of an underlayer and one or more overlayers.
  • the under layer 10 must be one that can be applied so that the maximum size of bubbles or voids does not exceed a defined amount as discussed below.
  • This underlayer is applied in contact with a surface 12 to be peened and then one or more over layers 14 such as metal foil or tape are applied that provide the needed tensile strength.
  • the underlayer contains no voids or bubbles larger than 10 microns in diameter.
  • Aluminum tape that is about 3 mils thick and has about 1 mil of adhesive is applied in one embodiment. Two layers of tape may be used.
  • the under layer can for example be sprayed on adhesive or a paint layer that goes down without bubbles due to the nature of spraying.
  • the paint may be about 4 to 5 mils thick.
  • Another approach is to dip coat the underlayer and allow it to cure or, e.g., to cure it by applying appropriate heat in an oven or with heat lamps. Paint needs to be of the type that will bond well to the surface.
  • paint material can include high quality metal primers and thermally cured expoxies.
  • Spray on adhesives such as that produced by 3M corporation, (3M Metal Primer EC3901, 3M Structural Adhesive Primer EC-1593 or EC-1660) can be made to uniformly cover the surface and allow the tape without adhesive to be applied on top.
  • the top layer or layers of foil can next be applied.
  • air bubbles will be trapped under the surface. It is nearly impossible to remove them by vacuum pumping because they are trapped.
  • any bubbles formed between the under layer and the over layers are insulated from the surface to be peened. When these bubbles compress due to the shock compression, the heat generated within them would be dissipated in the under layer and thus would not come in contact with or melt or pit the metal to be peened. The process has been tested and significantly reduces the incidence of pits on peened surfaces.
  • the potential of an air bubble trapped under tape to create pits in laser peening can be calculated. To see whether an air bubble has enough heat capacity and temperature rise to melt a small pit underneath the tape in a laser peening process, a calculation is made of the heat capacity and temperature rise of a 1 mm diameter hemispherical bubble, and the heat energy required to melt a reasonable sized pit and the potential for this heat transfer to occur are evaluated.
  • STP standard temperature and pressure
  • R is the universal gas constant of value 8314.4 J/kmol*K deg.
  • the temperature rise of the bubble during laser shock compression is calculated.
  • the pressure increases from 1 atmosphere to 10 5 atmospheres.
  • ⁇ is the ratio of specific heat at constant volume to the specific heat at constant pressure.
  • ⁇ is approximately 5/3.
  • the heat diffused into the aluminum during the laser pulse is determined.
  • the diffusivity of a material that is the rate at which heat can diffuse into it, is given by the ratio of the thermal conductivity k and the product of the density, ⁇ and specific heat capacity, Cp.
  • k 0.048 kcal/s*m*C deg
  • ⁇ 2700 kg/m 3
  • Cp 0.212 kcal/kg*C deg
  • a bubble under the surface is a low density region and refracts and tends to focus the shock wave such as an optical lens would. This increased shock intensity could induce melting.
  • the protective layer applied without bubbles on top of the metal would diffuse the focusing intensity of the shock wave and reduce the potential to create a shock induced pit

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
  • Arc Welding In General (AREA)
US11/240,676 2005-09-30 2005-09-30 Ablation layers to prevent pitting in laser peening Active 2031-07-26 US9409254B2 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
US11/240,676 US9409254B2 (en) 2005-09-30 2005-09-30 Ablation layers to prevent pitting in laser peening
EP06849830A EP1960154B1 (en) 2005-09-30 2006-09-28 Laser peening method, product and apparatus with such product, using ablation layers to prevent pitting during laser peening
BRPI0616606-7A BRPI0616606B1 (pt) 2005-09-30 2006-09-28 Método para martelagem a laser e produto
AT06849830T ATE523285T1 (de) 2005-09-30 2006-09-28 Laser-peening-verfahren, produkt und vorrichtung mit solchem produkt, unter verwendung von ablationsschichten zur verhinderung von lochfrass beim laser-peening
ES06849830T ES2377475T3 (es) 2005-09-30 2006-09-28 Procedimiento de endurecimiento por granallado superficial mediante l�?ser, producto y aparato con tal producto, usando capas de ablación para evitar la formación de picaduras durante el endurecimiento por granallado superficial mediente l�?ser.
JP2008533740A JP2009509771A (ja) 2005-09-30 2006-09-28 レーザーピーニング中の孔食を防ぐよう除去層を使用するレーザーピーニング方法及び装置
CN2006800360903A CN101277780B (zh) 2005-09-30 2006-09-28 在激光喷丸期间用烧蚀层防止点蚀的激光喷丸方法和设备
RU2008117136/02A RU2433896C2 (ru) 2005-09-30 2006-09-28 Способ лазерной нагартовки и устройство, использующее абляционные слои для предотвращения выкрашивания при лазерной нагартовке
PCT/US2006/038392 WO2007086953A2 (en) 2005-09-30 2006-09-28 Laser peening method and apparatus using ablation layers to prevent pitting during laser peening

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/240,676 US9409254B2 (en) 2005-09-30 2005-09-30 Ablation layers to prevent pitting in laser peening

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US20070075062A1 US20070075062A1 (en) 2007-04-05
US9409254B2 true US9409254B2 (en) 2016-08-09

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US11/240,676 Active 2031-07-26 US9409254B2 (en) 2005-09-30 2005-09-30 Ablation layers to prevent pitting in laser peening

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US (1) US9409254B2 (es)
EP (1) EP1960154B1 (es)
JP (1) JP2009509771A (es)
CN (1) CN101277780B (es)
AT (1) ATE523285T1 (es)
BR (1) BRPI0616606B1 (es)
ES (1) ES2377475T3 (es)
RU (1) RU2433896C2 (es)
WO (1) WO2007086953A2 (es)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10807197B2 (en) 2015-06-24 2020-10-20 University Of Dundee Method of, and apparatus for, laser blackening of a surface, wherein the laser has a specific power density and/or a specific pulse duration
US10994369B2 (en) 2016-03-08 2021-05-04 University Of Dundee Method of reducing photoelectron yield and/or secondary electron yield of a ceramic surface; corresponding apparatus and product

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7268317B2 (en) * 2003-09-02 2007-09-11 Lsp Technologies, Inc. Laser peening process and apparatus using a liquid erosion-resistant opaque overlay coating
EP3147048B1 (en) * 2015-09-28 2020-08-05 Ecole Polytechnique Federale De Lausanne (Epfl) Method and device for implementing laser shock peening (lsp) or warm laser shock peening (wlsp) during selective laser melting (slm)
NL2018981B1 (en) * 2017-05-26 2018-12-07 Univ Johannesburg Witwatersrand Method and system for improving the surface fracture toughness of brittle materials, and a cutting tool produced by such method
FR3068290B1 (fr) * 2017-07-03 2021-02-19 Airbus Sas Dispositif de realisation de chocs laser
CN111850284B (zh) * 2019-04-26 2021-11-19 中国科学院宁波材料技术与工程研究所 一种激光冲击强化方法与系统
WO2021170156A1 (en) * 2020-02-28 2021-09-02 Ustav Termomechaniky Av Cr, V.V.I. Device for strengthening the surface of products, method and use thereof
LU102198B1 (en) 2020-11-05 2022-05-05 Centrum Vyzkumu Rez S R O A method for extending a fatigue life of a turbine blade affected by pitting and product thereof
CN113102884B (zh) * 2021-05-13 2022-04-15 山东大学 一种热力复合水下激光冲击的材料表面改性方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401477A (en) * 1982-05-17 1983-08-30 Battelle Development Corporation Laser shock processing
US4937421A (en) * 1989-07-03 1990-06-26 General Electric Company Laser peening system and method
US5131957A (en) 1990-01-11 1992-07-21 Battelle Memorial Institute Material properties
FR2714320A1 (fr) 1993-12-27 1995-06-30 Gec Alsthom Electromec Procédé de traitement de surface de pièces métalliques pour augmenter leur résistance à la fatigue en milieu corrosif.
US5674328A (en) 1996-04-26 1997-10-07 General Electric Company Dry tape covered laser shock peening
US5741559A (en) * 1995-10-23 1998-04-21 Lsp Technologies, Inc. Laser peening process and apparatus
US5932120A (en) 1997-12-18 1999-08-03 General Electric Company Laser shock peening using low energy laser
US6355322B1 (en) * 1998-12-08 2002-03-12 3M Innovative Properties Company Release liner incorporating a metal layer
US6440254B1 (en) 2000-01-03 2002-08-27 Hallmark Cards, Incorporated Method of bonding a layer of material to a substrate
US6677037B1 (en) * 2000-09-13 2004-01-13 General Electric Company Laser shock peening tape, method and article
US7115844B2 (en) * 2001-12-14 2006-10-03 Nel Technologies, Ltd. Flexible electric circuit for heating comprising a metallised fabric
US7262240B1 (en) * 1998-12-22 2007-08-28 Kennametal Inc. Process for making wear-resistant coatings

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05271900A (ja) * 1992-03-23 1993-10-19 Mitsubishi Heavy Ind Ltd 溶射皮膜の加熱加圧方法
WO2001096619A2 (en) * 2000-06-12 2001-12-20 The Regents Of The University Of California Ablation and insulation layer for laser peening
US6900409B2 (en) * 2003-08-22 2005-05-31 General Electric Company Single head laser high throughput laser shock peening
JP2006122969A (ja) * 2004-10-29 2006-05-18 Muneharu Kutsuna 金属材料及び金属クラッド材の溶接継手及び鋳造材のレーザピーニング処理
US7304266B2 (en) * 2004-12-09 2007-12-04 General Electric Company Laser shock peening coating with entrapped confinement medium

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401477A (en) * 1982-05-17 1983-08-30 Battelle Development Corporation Laser shock processing
US4937421A (en) * 1989-07-03 1990-06-26 General Electric Company Laser peening system and method
US5131957A (en) 1990-01-11 1992-07-21 Battelle Memorial Institute Material properties
FR2714320A1 (fr) 1993-12-27 1995-06-30 Gec Alsthom Electromec Procédé de traitement de surface de pièces métalliques pour augmenter leur résistance à la fatigue en milieu corrosif.
US5741559A (en) * 1995-10-23 1998-04-21 Lsp Technologies, Inc. Laser peening process and apparatus
US5674328A (en) 1996-04-26 1997-10-07 General Electric Company Dry tape covered laser shock peening
US5932120A (en) 1997-12-18 1999-08-03 General Electric Company Laser shock peening using low energy laser
US6355322B1 (en) * 1998-12-08 2002-03-12 3M Innovative Properties Company Release liner incorporating a metal layer
US7262240B1 (en) * 1998-12-22 2007-08-28 Kennametal Inc. Process for making wear-resistant coatings
US6440254B1 (en) 2000-01-03 2002-08-27 Hallmark Cards, Incorporated Method of bonding a layer of material to a substrate
US6677037B1 (en) * 2000-09-13 2004-01-13 General Electric Company Laser shock peening tape, method and article
US7115844B2 (en) * 2001-12-14 2006-10-03 Nel Technologies, Ltd. Flexible electric circuit for heating comprising a metallised fabric

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Translation of office action of Japan Patent Office, 2008-533740, Sep. 25, 2013, 3 pp.
Translation of office action of Japan Patent Office, for the present application, 2008-533740, Jun. 5, 2012, 3 pp.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10807197B2 (en) 2015-06-24 2020-10-20 University Of Dundee Method of, and apparatus for, laser blackening of a surface, wherein the laser has a specific power density and/or a specific pulse duration
US11033985B2 (en) 2015-06-24 2021-06-15 University Of Dundee Method of, and apparatus for, reducing photoelectron yield and/or secondary electron yield
US10994369B2 (en) 2016-03-08 2021-05-04 University Of Dundee Method of reducing photoelectron yield and/or secondary electron yield of a ceramic surface; corresponding apparatus and product

Also Published As

Publication number Publication date
CN101277780B (zh) 2011-11-30
EP1960154A2 (en) 2008-08-27
RU2433896C2 (ru) 2011-11-20
EP1960154B1 (en) 2011-09-07
WO2007086953A3 (en) 2007-09-20
BRPI0616606A2 (pt) 2011-06-28
CN101277780A (zh) 2008-10-01
JP2009509771A (ja) 2009-03-12
WO2007086953A2 (en) 2007-08-02
RU2008117136A (ru) 2009-11-10
ES2377475T3 (es) 2012-03-28
US20070075062A1 (en) 2007-04-05
ATE523285T1 (de) 2011-09-15
BRPI0616606B1 (pt) 2014-10-29

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