US9271399B2 - Electronic module and method for the production thereof - Google Patents

Electronic module and method for the production thereof Download PDF

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Publication number
US9271399B2
US9271399B2 US14/009,144 US201214009144A US9271399B2 US 9271399 B2 US9271399 B2 US 9271399B2 US 201214009144 A US201214009144 A US 201214009144A US 9271399 B2 US9271399 B2 US 9271399B2
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United States
Prior art keywords
connection element
electronic module
connection
support plate
module according
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Expired - Fee Related, expires
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US14/009,144
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US20140029220A1 (en
Inventor
Holger Braun
Helmut Bubeck
Matthias Lausmann
Ralf Schinzel
Klaus Voigtlaender
Thomas Mueller
Benjamin Bertsch
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Robert Bosch GmbH
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Robert Bosch GmbH
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Assigned to ROBERT BOSCH GMBH reassignment ROBERT BOSCH GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BRAUN, HOLGER, LAUSMANN, MATTHIAS, MUELLER, THOMAS, BUBECK, HELMUT, SCHINZEL, RALF, BERTSCH, Benjamin, VOIGTLAENDER, KLAUS
Publication of US20140029220A1 publication Critical patent/US20140029220A1/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
    • F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2400/00—Special features of vehicle units
    • B60Y2400/30—Sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

  • the present invention relates to an electronic module, as, for example, a transmission controller for motor vehicles, as well as to a method for the production thereof.
  • a plurality of sensors is required at multiple locations, for example, in transmission control systems in order to acquire different signals, as, e.g., temperature, pressure and rotational speed.
  • Feed lines to said sensors consist, for example, of flex foils or cables and are connected to the transmission controller which typically comprises a small printed circuit board.
  • the transmission controller typically comprises a small printed circuit board.
  • a very large assembly outlay is incurred and the necessary connections between sensors and printed circuit board are relatively expensive.
  • a large number of procedural steps as, e.g., bonding, soldering, welding or adhesive bonding, are required. It would therefore be desirable to provide a cost effective electronic module which particularly can be used in transmission control systems of motor vehicles.
  • the inventive electronic module has in contrast the advantage that a cost effective electronic module which can easily be equipped can be provided, wherein electronic and/or electric components, in particular sensors and/or actuators, can be disposed at arbitrary positions.
  • a cost effective, extensive support plate e.g. a printed circuit board, or a ceramic or a substrate, can be used.
  • the components can be mounted in a normal surface-mount process (SMT process) and therefore very cost-effectively.
  • SMT process normal surface-mount process
  • the support plate comprises a base area and a connection element.
  • the connection element is a part of the base area and is arranged at an angle to said base area, i.e.
  • connection element is integrally formed with the base area and protrudes from said base area.
  • the connection element is arranged by bending the base area upward at an arbitrary angle to said base area.
  • at least one component is thereby disposed on the connection element.
  • a component can therefore be disposed according to the invention at an arbitrary position and at an arbitrary distance from the base plane.
  • different sensors can, for example, be disposed at various positions which are spaced differently from the base area, only one single support plate being necessary in this arrangement.
  • Temperature sensors, pressure sensors or rotational speed sensors can, for example, be used as sensors.
  • the connection elements are preferably bent at an angle of 90° to the base area. Any other angle is, however, also conceivable.
  • Support plates are basically commercial substrates, in particular multi-layered substrates, for example substrates having at least one copper layer and at least one insulation layer.
  • the connection element is preferably milled from the base area. In so doing, the connection element has, for example, a width of 3-7 mm starting from the intended bending line in the substrate. The width of the connection element is selected as a function of the concrete application.
  • the connection element is pivoted upward in a radius along the intended bending line. Experiments show that such commercial substrates withstand multiple bending without incurring damage.
  • connection element is furthermore preferably disposed in an end portion of the connection element.
  • connection element and/or the support plate is surrounded by a sealing compound or the like.
  • a detent connection is provided on the connection element, preferably a plurality of detent connections for connecting said connection element to a counter body.
  • the detent connections can thereby be provided on all sides of said connection element.
  • the detent connection preferably comprises a detent lug and a recess for receiving said detent lug. In so doing, a reliable fastening can particularly be achieved during assembly. In a preferable manner, a sealing of the electronic module and a filling of cavities with sealing compound can subsequently take place.
  • the electronic module comprises a base plate, in particular a sheet metal plate, wherein the support plate is disposed on the base plate, in particular laminated to said base plate.
  • the electronic module gains stability on the one hand and the base plate can furthermore be used for cooling.
  • the region of the base plate located under the connection element is likewise preferably exposed and bent.
  • the invention relates to a structural component comprising an inventive electronic module and a counter body with a recess, at least one end portion of the connection element being disposed in the recess.
  • the end region of the connection element can thereby be inserted deeply into the counter body and desired signals can be acquired by means of the sensor arranged in the connection element.
  • the recess in the counter body is preferably a blind hole.
  • the invention furthermore relates to a method for producing an electronic module.
  • a support plate is equipped with at least one electronic or electric component, in particular a sensor, and a connection element is exposed from the support plate. Said component is thereby situated on the connection element, and said connection element is bent out of the plane of the support plate.
  • the components can be disposed in a different plane than a base area of the support plate and nevertheless be mounted by means of a surface-mount process. It should noted that the equipping of the support plate with the component can be carried out prior to or after exposing the connection element.
  • connection element is milled out of the support plate by means of a milling process, said connection element remaining connected to the base area of the support plate via a remaining connecting area. If the connection element is provided on an edge of the support plate, said connection element can be produced by means of a milling process on one side.
  • the present invention is particularly used in transmission control systems of motor vehicles, in which a plurality of values are to be acquired by means of sensors.
  • FIG. 1 shows a schematic sectional view of an electronic module pursuant to a first exemplary embodiment of the invention
  • FIG. 2 shows a top view of the electronic module from FIG. 1 ;
  • FIG. 3 shows a schematic, perspective view of the support plate of the electronic module from FIG. 1 ;
  • FIG. 4 shows a schematic sectional view of an electronic module pursuant to a second exemplary embodiment of the invention.
  • FIG. 5 shows a schematic top view of the electronic module from FIG. 4 .
  • FIGS. 1 to 3 An electronic module 1 pursuant to a first preferred exemplary embodiment of the invention is described below in detail with reference to FIGS. 1 to 3 .
  • the electronic module 1 comprises a support plate 2 , which is a printed circuit board in this exemplary embodiment.
  • the support plate 2 has a base area 20 and a plurality of connection elements 21 (cf. FIG. 3 ), which are tilted upward from the base area 20 at an angle ⁇ of 90°.
  • the printed circuit board is thereby an inexpensive, extensive printed circuit board and serves as a connection printed circuit board.
  • the electronic module 1 further comprises electronic and/or electric components 3 , which are sensors in this exemplary embodiment. The sensors are thereby in each case disposed in an end portion 21 a of the connection elements 21 .
  • connection elements 21 can be produced by means of milling one side of the support plate, a recess 23 being formed in an edge region of the support plate 2 , or by means of milling three sides of said support plate, in which milling process a recess 23 is formed in the support plate 2 (cf. FIG. 3 ).
  • the printed circuit board is equipped with the components 3 using the conventional surface mounted technology, said printed circuit board can thereby be very easily equipped with further electronic components 9 .
  • two production methods result.
  • the printed circuit board can initially be equipped with all of the components and the connection elements are subsequently milled out of the base area 20 of said printed circuit board and then tilted upwards.
  • the connection elements are initially milled out of said base area, the printed circuit board is then equipped with components and finally the connection elements are tilted upwards.
  • connection elements are preferably reinforced by means of separate reinforcing elements 24 .
  • the reinforcing elements 24 can, for example, be clipped onto the connection elements 21 .
  • the support plate 2 is disposed on a sheet metal plate 8 , wherein the sheet metal plate 8 serves as a heat sink so that heat can be easily dissipated from the printed circuit board.
  • attitude sensors for example attitude sensors, position sensors, pressure sensors, temperature sensors, etc.
  • pressure sensors for example attitude sensors, position sensors, pressure sensors, temperature sensors, etc.
  • the further electronic components 9 can, for example, also be pressure sensors which are fixed to the printed circuit board using a clip connector.
  • Connection lines which are not depicted, are provided on the surface or in an internal layer of the support plate 8 and are connected to a switching element, etc.
  • a plug connection 7 is provided on the support plate 2 . Only one singe printed circuit board has, e.g., to be provided for a transmission control.
  • connection elements 21 are disposed in recesses 5 which are provided in a counter body 4 .
  • the recesses 5 are in the form of a blind hole, and a motor winding 6 is, for example, arranged on the counter body 4 , wherein the sensor provided on the connection element 21 is intended to acquire an engine variable.
  • the recess 5 can also be foamed or filled with a sealing compound. As a result, a secure and vibration-free positioning of the sensors in the end portion 21 a of the connection elements 21 can be achieved.
  • sensors can therefore according to the invention be disposed at various positions, starting at the base area 20 which forms a base plane, without undue expense or effort.
  • the connection elements 21 can be equipped with components, as described above, during the normal SMT process. The milling procedure and the positioning of said connection elements in the counter body can then take place. In addition, the additional processes required until now in the prior art, such as wiring, soldering, adhesive bonding, etc. are eliminated.
  • FIGS. 4 and 5 show an electronic module 1 pursuant to a second exemplary embodiment of the invention, wherein identical or functionally identical parts are designated with the same reference numerals as in the first exemplary embodiment.
  • the electronic module 1 of the second exemplary embodiment additionally comprises another separate fixing device for the connection elements 21 in the form of a detent connection 10 .
  • the detent connection 10 comprises a detent lug 11 , which is disposed on the counter body 4 , as well as a correspondingly formed recess 12 in the connection element 21 .
  • a plurality of detent connections can be provided in order to facilitate a reliable and redundant fixing of the connection elements 21 .
  • the recess to be provided on the counter body 4 and the detent lug to be disposed on the connection element 21 . Otherwise this exemplary embodiment corresponds to the preceding exemplary embodiment; and therefore reference can be made to the description provided therefore.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The invention relates to an electronic module, a support plate (2) having a base area (20) and at least one connection element (21). Said connection element (21) is a part of the base area (20) and is arranged at an angle (a) to the base area (20), in addition to at least one electronic component (3), in particular a sensor, which is arranged in the connection element (21).

Description

BACKGROUND OF THE INVENTION
The present invention relates to an electronic module, as, for example, a transmission controller for motor vehicles, as well as to a method for the production thereof.
In the prior art, a plurality of sensors is required at multiple locations, for example, in transmission control systems in order to acquire different signals, as, e.g., temperature, pressure and rotational speed. Feed lines to said sensors consist, for example, of flex foils or cables and are connected to the transmission controller which typically comprises a small printed circuit board. As a result, a very large assembly outlay is incurred and the necessary connections between sensors and printed circuit board are relatively expensive. In addition, a large number of procedural steps, as, e.g., bonding, soldering, welding or adhesive bonding, are required. It would therefore be desirable to provide a cost effective electronic module which particularly can be used in transmission control systems of motor vehicles.
SUMMARY OF THE INVENTION
The inventive electronic module has in contrast the advantage that a cost effective electronic module which can easily be equipped can be provided, wherein electronic and/or electric components, in particular sensors and/or actuators, can be disposed at arbitrary positions. According to the invention, a cost effective, extensive support plate, e.g. a printed circuit board, or a ceramic or a substrate, can be used. As a result, the components can be mounted in a normal surface-mount process (SMT process) and therefore very cost-effectively. This is achieved according to the invention by the fact that the support plate comprises a base area and a connection element. The connection element is a part of the base area and is arranged at an angle to said base area, i.e. said connection element is integrally formed with the base area and protrudes from said base area. The connection element is arranged by bending the base area upward at an arbitrary angle to said base area. According to the invention, at least one component is thereby disposed on the connection element. By bending the connection elements upward from the base plane, a component can therefore be disposed according to the invention at an arbitrary position and at an arbitrary distance from the base plane. As a result, different sensors can, for example, be disposed at various positions which are spaced differently from the base area, only one single support plate being necessary in this arrangement. Temperature sensors, pressure sensors or rotational speed sensors can, for example, be used as sensors. The connection elements are preferably bent at an angle of 90° to the base area. Any other angle is, however, also conceivable.
Support plates are basically commercial substrates, in particular multi-layered substrates, for example substrates having at least one copper layer and at least one insulation layer. The connection element is preferably milled from the base area. In so doing, the connection element has, for example, a width of 3-7 mm starting from the intended bending line in the substrate. The width of the connection element is selected as a function of the concrete application. The connection element is pivoted upward in a radius along the intended bending line. Experiments show that such commercial substrates withstand multiple bending without incurring damage.
The component is furthermore preferably disposed in an end portion of the connection element. In addition, the connection element and/or the support plate is surrounded by a sealing compound or the like. As a result, the connection element can be quickly and simply fastened to a counter body.
According to a further preferred embodiment of the invention, a detent connection is provided on the connection element, preferably a plurality of detent connections for connecting said connection element to a counter body. The detent connections can thereby be provided on all sides of said connection element. The detent connection preferably comprises a detent lug and a recess for receiving said detent lug. In so doing, a reliable fastening can particularly be achieved during assembly. In a preferable manner, a sealing of the electronic module and a filling of cavities with sealing compound can subsequently take place.
In a further preferred manner, the electronic module comprises a base plate, in particular a sheet metal plate, wherein the support plate is disposed on the base plate, in particular laminated to said base plate. As a result, the electronic module gains stability on the one hand and the base plate can furthermore be used for cooling. The region of the base plate located under the connection element is likewise preferably exposed and bent.
In addition, the invention relates to a structural component comprising an inventive electronic module and a counter body with a recess, at least one end portion of the connection element being disposed in the recess. The end region of the connection element can thereby be inserted deeply into the counter body and desired signals can be acquired by means of the sensor arranged in the connection element. The recess in the counter body is preferably a blind hole.
The invention furthermore relates to a method for producing an electronic module. In the method according to the invention, a support plate is equipped with at least one electronic or electric component, in particular a sensor, and a connection element is exposed from the support plate. Said component is thereby situated on the connection element, and said connection element is bent out of the plane of the support plate. As a result, the components can be disposed in a different plane than a base area of the support plate and nevertheless be mounted by means of a surface-mount process. It should noted that the equipping of the support plate with the component can be carried out prior to or after exposing the connection element. In a particularly preferred manner, the connection element is milled out of the support plate by means of a milling process, said connection element remaining connected to the base area of the support plate via a remaining connecting area. If the connection element is provided on an edge of the support plate, said connection element can be produced by means of a milling process on one side.
The present invention is particularly used in transmission control systems of motor vehicles, in which a plurality of values are to be acquired by means of sensors.
BRIEF DESCRIPTION OF THE DRAWINGS
Preferred embodiments of the invention are described below in detail with reference to the accompanying drawings. In the drawings:
FIG. 1 shows a schematic sectional view of an electronic module pursuant to a first exemplary embodiment of the invention;
FIG. 2 shows a top view of the electronic module from FIG. 1;
FIG. 3 shows a schematic, perspective view of the support plate of the electronic module from FIG. 1;
FIG. 4 shows a schematic sectional view of an electronic module pursuant to a second exemplary embodiment of the invention; and
FIG. 5 shows a schematic top view of the electronic module from FIG. 4.
 DETAILED DESCRIPTION
An electronic module 1 pursuant to a first preferred exemplary embodiment of the invention is described below in detail with reference to FIGS. 1 to 3.
As can especially be seen from FIG. 1, the electronic module 1 comprises a support plate 2, which is a printed circuit board in this exemplary embodiment. The support plate 2 has a base area 20 and a plurality of connection elements 21 (cf. FIG. 3), which are tilted upward from the base area 20 at an angle α of 90°. The printed circuit board is thereby an inexpensive, extensive printed circuit board and serves as a connection printed circuit board. The electronic module 1 further comprises electronic and/or electric components 3, which are sensors in this exemplary embodiment. The sensors are thereby in each case disposed in an end portion 21 a of the connection elements 21.
The connection elements 21 can be produced by means of milling one side of the support plate, a recess 23 being formed in an edge region of the support plate 2, or by means of milling three sides of said support plate, in which milling process a recess 23 is formed in the support plate 2 (cf. FIG. 3). When the printed circuit board is equipped with the components 3 using the conventional surface mounted technology, said printed circuit board can thereby be very easily equipped with further electronic components 9. In so doing, two production methods result. On the hand, the printed circuit board can initially be equipped with all of the components and the connection elements are subsequently milled out of the base area 20 of said printed circuit board and then tilted upwards. Alternatively on the other hand, the connection elements are initially milled out of said base area, the printed circuit board is then equipped with components and finally the connection elements are tilted upwards.
The connection elements are preferably reinforced by means of separate reinforcing elements 24. The reinforcing elements 24 can, for example, be clipped onto the connection elements 21.
The support plate 2 is disposed on a sheet metal plate 8, wherein the sheet metal plate 8 serves as a heat sink so that heat can be easily dissipated from the printed circuit board.
All types of sensors, for example attitude sensors, position sensors, pressure sensors, temperature sensors, etc., are worth considering as components 3.
The further electronic components 9 can, for example, also be pressure sensors which are fixed to the printed circuit board using a clip connector.
Connection lines, which are not depicted, are provided on the surface or in an internal layer of the support plate 8 and are connected to a switching element, etc. In addition, a plug connection 7 is provided on the support plate 2. Only one singe printed circuit board has, e.g., to be provided for a transmission control.
As can be seen further from FIGS. 1 and 2, the connection elements 21 are disposed in recesses 5 which are provided in a counter body 4. The recesses 5 are in the form of a blind hole, and a motor winding 6 is, for example, arranged on the counter body 4, wherein the sensor provided on the connection element 21 is intended to acquire an engine variable. The recess 5 can also be foamed or filled with a sealing compound. As a result, a secure and vibration-free positioning of the sensors in the end portion 21 a of the connection elements 21 can be achieved.
By means of a respectively individual selection of the length of the connection elements, sensors can therefore according to the invention be disposed at various positions, starting at the base area 20 which forms a base plane, without undue expense or effort. The connection elements 21 can be equipped with components, as described above, during the normal SMT process. The milling procedure and the positioning of said connection elements in the counter body can then take place. In addition, the additional processes required until now in the prior art, such as wiring, soldering, adhesive bonding, etc. are eliminated.
FIGS. 4 and 5 show an electronic module 1 pursuant to a second exemplary embodiment of the invention, wherein identical or functionally identical parts are designated with the same reference numerals as in the first exemplary embodiment.
In contrast to the first exemplary embodiment, the electronic module 1 of the second exemplary embodiment additionally comprises another separate fixing device for the connection elements 21 in the form of a detent connection 10. The detent connection 10 comprises a detent lug 11, which is disposed on the counter body 4, as well as a correspondingly formed recess 12 in the connection element 21. In so doing, a plurality of detent connections can be provided in order to facilitate a reliable and redundant fixing of the connection elements 21. In addition, it is also possible for the recess to be provided on the counter body 4 and the detent lug to be disposed on the connection element 21. Otherwise this exemplary embodiment corresponds to the preceding exemplary embodiment; and therefore reference can be made to the description provided therefore.

Claims (20)

What is claimed is:
1. An electronic module, comprising:
a support plate (2) having a base area (20) and at least one connection element (21) extending from the base area (20), wherein said at least one connection element (21) is arranged at a non-zero angle (α) relative to the base area (20),
at least one electronic component (3) coupled to the at least one connection element (21), and
a detent connection (10) on the at least one connection element (21), the detent connection (10) is configured to connect the at least one connection element (21) to a counter body (4).
2. The electronic module according to claim 1, characterized in that the at least one electronic component is arranged in an end portion (21 a) of the at least one connection element (21).
3. The electronic module according to claim 1, characterized in that at least one of the at least one connection element (21) or the support plate (2) is surrounded by a sealing compound or a foaming material.
4. The electronic module according to claim 1, characterized in that the at least one connection element (21) includes a plurality of connection elements (21) that each extend from the base area (20), wherein the connection elements (21) have various lengths.
5. The electronic module according to claim 1, furthermore comprising a base plate (8), the support plate (2) being disposed on the base plate (8).
6. The electronic module according to claim 1, characterized in that the at least one electronic component is at least one sensor.
7. The electronic module according to claim 1, characterized in that the at least one connection element (21) includes a plurality of connection elements (21) that each extend from the base area (20) and are each arranged at non-angles (α) to the base area (20).
8. The electronic module according to claim 1, furthermore comprising a base plate (8), which is a sheet metal plate, the support plate (2) being disposed on the base plate (8).
9. The electronic module according to claim 1, wherein the detent connection (10) includes a lug (11) on the at least one connection element (21).
10. The electronic module according to claim 9, further comprising the counter body (4), wherein the counter body (4) has a recess (12) that is configured to receive the lug (11).
11. The electronic module according to claim 1, wherein the detent connection (10) includes a recess (12) on the at least one connection element (21).
12. The electronic module according to claim 11, further comprising the counter body (4) having a lug (11) configured to be received within the recess (12).
13. The electronic module according to claim 1, wherein the at least one connection element (21) is integrally formed with the base area (20).
14. A structural component, comprising:
an electronic module according to claim 1, and
the counter body (4) having a recess (5),
wherein at least one end portion (21 a) of the at least one connection element (21) being disposed in the recess (5).
15. The structural component according to claim 14, characterized in that the recess (5) is a blind hole.
16. The structural component according to claim 14, characterized in that the recess (5) is filled with a sealing compound.
17. The structural component according to claim 16, characterized in that the recess (5) is a blind hole.
18. A method for producing an electronic module, comprising the steps:
a) equipping a support plate (2) with at least one electronic component (3),
b) forming a connection element (21) from the support plate (2), the at least one electronic component (3) being situated on the connection element (21),
(c) forming a detent connection (10) on the connection element (21), the detent connection (10) is configured to connect the connection element (21) to a counter body (4), and
d) bending the connection element (21) out of a plane of the support plate (2),
wherein step a) is carried out prior to or after step b).
19. The method according to claim 18, characterized in that the connection element (21) is milled out of the support plate (2) prior to the step of the bending.
20. The method according to claim 18, characterized in that the at least one electronic component (3) is at least one sensor.
US14/009,144 2011-04-01 2012-02-29 Electronic module and method for the production thereof Expired - Fee Related US9271399B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11536594B2 (en) 2017-08-23 2022-12-27 Vitesco Technologies Germany Gmbh Sensor component, pre-assembly arrangement for a sensor component, and method for producing a sensor component

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011006632A1 (en) * 2011-04-01 2012-10-04 Robert Bosch Gmbh electronic module
DE102014205386A1 (en) * 2014-03-24 2015-09-24 Robert Bosch Gmbh Electronic module, in particular for transmission control unit, with integrated electronic sensor element
DE102015211505A1 (en) * 2015-06-23 2016-12-29 Zf Friedrichshafen Ag Device for gear selection of a motor vehicle
DE102022201176A1 (en) 2022-02-04 2023-08-10 Zf Friedrichshafen Ag Temperature sensor for an inverter for operating an electric drive in an electric vehicle or a hybrid vehicle, inverter with such a temperature sensor

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0627487A (en) 1992-07-08 1994-02-04 Fujitsu Ltd Thin-film transistor matrix and its production
EP0740365A2 (en) 1995-04-28 1996-10-30 TEMIC TELEFUNKEN microelectronic GmbH Control module for motor vehicle
DE19839843A1 (en) 1998-09-02 2000-03-09 Knorr Bremse Systeme Pressure control device for vehicles
DE19907949A1 (en) 1999-02-24 2000-09-14 Siemens Ag Control device for a motor vehicle
JP2002026481A (en) 2000-07-11 2002-01-25 Funai Electric Co Ltd Structure for mounting sensor component on board
EP1239710A2 (en) 2001-03-06 2002-09-11 Conti Temic microelectronic GmbH Electronic assembly
US6469902B1 (en) 1997-05-15 2002-10-22 Siemens Aktiengesellschaft Adhesive joint assembly
US6700074B2 (en) * 2000-10-19 2004-03-02 Cherry Gmbh Electrical component housing structures and their method of manufacture
DE102004053958B3 (en) 2004-11-09 2005-09-01 Behr Hella Thermocontrol Gmbh Device for detecting electromagnetic radiation, especially sunlight, for use in vehicle, has metal core conducting plate with region(s) inclined to its plane, at least one optoelectronic component arranged in inclined region
US7044751B2 (en) * 2003-08-08 2006-05-16 Sumito Wiring Systems, Ltd. Construction for connecting a circuit board and an electrical part, a brake oil pressure control unit
DE102005002813A1 (en) 2005-01-20 2006-08-10 Robert Bosch Gmbh control module
DE102006001890A1 (en) 2006-01-14 2007-08-02 Zf Friedrichshafen Ag Electronic add-on controller for a controllable unit fits externally on the unit's casing with a support plate for an electronics module to control the unit
JP2008004627A (en) 2006-06-20 2008-01-10 Nidec Sankyo Corp Mounting structure for electronic component, and optical head device
EP2031740A2 (en) 2007-08-31 2009-03-04 Siemens AG Österreich Circuit board for brush-less DC motors
DE102007042449A1 (en) 2007-09-06 2009-03-12 Continental Automotive Gmbh Integrated sensor module
US7749134B2 (en) * 2004-12-22 2010-07-06 Robert Bosch Gmbh Control module
WO2012013176A1 (en) 2010-06-29 2012-02-02 Conti Temic Microelectronic Gmbh Sensor carrier and sensor module, in particular for use in an on-board control unit for a motor vehicle
US20140240927A1 (en) * 2011-04-01 2014-08-28 Robert Bosch Gmbh Electronic module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6027487U (en) * 1983-07-31 1985-02-25 日本精機株式会社 Fixed structure of flexible printed wiring board
JP2006303251A (en) * 2005-04-21 2006-11-02 Fujikura Ltd Mounting structure of flexible printed board to stationary member

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0627487A (en) 1992-07-08 1994-02-04 Fujitsu Ltd Thin-film transistor matrix and its production
EP0740365A2 (en) 1995-04-28 1996-10-30 TEMIC TELEFUNKEN microelectronic GmbH Control module for motor vehicle
US6469902B1 (en) 1997-05-15 2002-10-22 Siemens Aktiengesellschaft Adhesive joint assembly
DE19839843A1 (en) 1998-09-02 2000-03-09 Knorr Bremse Systeme Pressure control device for vehicles
US6817247B1 (en) 1998-09-02 2004-11-16 Knorr-Bremse Systeme Fuer Nutzfahrzeuge Gmbh Pressure control device for vehicles
DE19907949A1 (en) 1999-02-24 2000-09-14 Siemens Ag Control device for a motor vehicle
US6570773B1 (en) 1999-02-24 2003-05-27 Siemens Aktiengesellschaft Control apparatus for an automobile
JP2002026481A (en) 2000-07-11 2002-01-25 Funai Electric Co Ltd Structure for mounting sensor component on board
US6700074B2 (en) * 2000-10-19 2004-03-02 Cherry Gmbh Electrical component housing structures and their method of manufacture
EP1239710A2 (en) 2001-03-06 2002-09-11 Conti Temic microelectronic GmbH Electronic assembly
US7044751B2 (en) * 2003-08-08 2006-05-16 Sumito Wiring Systems, Ltd. Construction for connecting a circuit board and an electrical part, a brake oil pressure control unit
DE102004053958B3 (en) 2004-11-09 2005-09-01 Behr Hella Thermocontrol Gmbh Device for detecting electromagnetic radiation, especially sunlight, for use in vehicle, has metal core conducting plate with region(s) inclined to its plane, at least one optoelectronic component arranged in inclined region
US7749134B2 (en) * 2004-12-22 2010-07-06 Robert Bosch Gmbh Control module
DE102005002813A1 (en) 2005-01-20 2006-08-10 Robert Bosch Gmbh control module
US20080019106A1 (en) 2005-01-20 2008-01-24 Gerhard Wetzel Control Module
US7656674B2 (en) * 2005-01-20 2010-02-02 Robert Bosch Gmbh Control module
DE102006001890A1 (en) 2006-01-14 2007-08-02 Zf Friedrichshafen Ag Electronic add-on controller for a controllable unit fits externally on the unit's casing with a support plate for an electronics module to control the unit
JP2008004627A (en) 2006-06-20 2008-01-10 Nidec Sankyo Corp Mounting structure for electronic component, and optical head device
EP2031740A2 (en) 2007-08-31 2009-03-04 Siemens AG Österreich Circuit board for brush-less DC motors
DE102007042449A1 (en) 2007-09-06 2009-03-12 Continental Automotive Gmbh Integrated sensor module
WO2012013176A1 (en) 2010-06-29 2012-02-02 Conti Temic Microelectronic Gmbh Sensor carrier and sensor module, in particular for use in an on-board control unit for a motor vehicle
US20130161478A1 (en) * 2010-06-29 2013-06-27 Conti Temic Microelectronic Gmbh Sensor Carrier and Sensor Module, in Particular for Use in a Local Control Unit for Motor Vehicles
US20140240927A1 (en) * 2011-04-01 2014-08-28 Robert Bosch Gmbh Electronic module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
International Search Report for Application No. PCT/EP2012/053422 dated Jun. 5, 2012 (3 pages).

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11536594B2 (en) 2017-08-23 2022-12-27 Vitesco Technologies Germany Gmbh Sensor component, pre-assembly arrangement for a sensor component, and method for producing a sensor component

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DE102011006622A1 (en) 2012-10-04
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JP5882446B2 (en) 2016-03-09
JP2014512097A (en) 2014-05-19
US20140029220A1 (en) 2014-01-30
CN103460814A (en) 2013-12-18

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