US9194037B2 - Sputtering device - Google Patents
Sputtering device Download PDFInfo
- Publication number
- US9194037B2 US9194037B2 US13/925,376 US201313925376A US9194037B2 US 9194037 B2 US9194037 B2 US 9194037B2 US 201313925376 A US201313925376 A US 201313925376A US 9194037 B2 US9194037 B2 US 9194037B2
- Authority
- US
- United States
- Prior art keywords
- receiving space
- support members
- groove
- recessed portions
- sputtering device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 14
- 230000000717 retained effect Effects 0.000 claims abstract 2
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
Definitions
- the present disclosure relates to sputtering devices and, more particularly, to a sputtering device having a carrier with adjustable support members.
- Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles, which is commonly used for thin film deposition.
- workpieces are hung on support arms protruding from a rotary member of a carrier.
- the support arms are fixed to the rotary member and the distances between the support arms are fixed. The fixed distances limit the sizes of workpieces that can be hung on the support arms.
- FIG. 1 is an isometric view of a carrier of a sputtering device in accordance with an exemplary embodiment.
- FIG. 2 is a planar top view of the carrier of FIG. 1 .
- FIG. 3 is an isometric, exploded view of the carrier of FIG. 1 .
- FIG. 4 shows a target and the carrier of FIG. 1 .
- a sputtering device 10 includes a carrier 20 .
- the carrier 20 includes a rotary member 30 and a plurality of support members 40 for hanging workpieces.
- the rotary member 30 can be a cylinder and defines a receiving space 31 that extends along a longitudinal direction and includes an open end 32 and a closed end 33 .
- the cylinder 30 also includes a lateral surface 34 defining a plurality of grooves 35 that extend along the longitudinal direction from the open end 32 to the closed end 33 , and communicate with the receiving space 31 .
- Each groove 35 is defined by a first side surface 351 and a second side surface 352 facing each other.
- the side surface 352 defines a plurality of recessed portions 3520 extending from the lateral surface 34 to the inner surface of the receiving space 31 .
- the recessed portions 3520 are evenly spaced from each other.
- Each support member 40 can include four arms 41 connected together to form a cross. Each arm 41 extends through one recessed portion 3520 with one end protruding out of the lateral surface 34 and an opposite end received in the receiving space 31 . In another embodiment, the number of the arms 41 may be one or more according to need. When only one arm 41 is used, the recessed portion 3520 can be replaced with a through hole extending though the lateral surface 34 . The arm 41 passes through the through hole and is thus movably connected to the rotary member 30 .
- the first member 40 When needing to adjust the distance between two neighboring support members 40 (hereinafter a first member 40 and a second member 40 ), the first member 40 can be rotated to cause the arms 41 to move out of the recessed portions 3520 and into the grooves 35 .
- the arms 41 can thus move along the groove 35 to a position where a desired distance between the first member 40 and the second member 40 is obtained.
- the first member 40 is then rotated again to cause the arms 41 to move into the recessed portions 35 adjacent to the position. The first member 40 is thus held in position.
- a plurality of resilient members 50 may be used. Each resilient member 50 is received in the receiving space 31 and arranged between two neighboring support members 40 to apply a pushing force to the neighboring support members 40 , such that the neighboring support members 40 each can engage the recessed portions 3520 tightly.
- the plurality of resilient members 50 may be coil springs.
- workpieces (not shown) can be attached to the arms 41 in any conventional connection techniques.
- the rotary member 30 then rotates to allow every workpiece to face a target 200 to be coated.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/925,376 US9194037B2 (en) | 2009-09-02 | 2013-06-24 | Sputtering device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009103065098 | 2009-09-02 | ||
CN 200910306509 CN102002678B (en) | 2009-09-02 | 2009-09-02 | Sputtering material rack |
US12/817,191 US8500974B2 (en) | 2009-09-02 | 2010-06-17 | Carrier and sputtering device using the same |
US13/925,376 US9194037B2 (en) | 2009-09-02 | 2013-06-24 | Sputtering device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/817,191 Division US8500974B2 (en) | 2009-09-02 | 2010-06-17 | Carrier and sputtering device using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
US20130276699A1 US20130276699A1 (en) | 2013-10-24 |
US9194037B2 true US9194037B2 (en) | 2015-11-24 |
Family
ID=43623230
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/817,191 Expired - Fee Related US8500974B2 (en) | 2009-09-02 | 2010-06-17 | Carrier and sputtering device using the same |
US13/925,376 Expired - Fee Related US9194037B2 (en) | 2009-09-02 | 2013-06-24 | Sputtering device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/817,191 Expired - Fee Related US8500974B2 (en) | 2009-09-02 | 2010-06-17 | Carrier and sputtering device using the same |
Country Status (2)
Country | Link |
---|---|
US (2) | US8500974B2 (en) |
CN (1) | CN102002678B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102009277B1 (en) * | 2012-10-22 | 2019-08-09 | 엘지전자 주식회사 | Clothes treating apparatus with a heat pump and operating method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020078618A (en) * | 2001-04-06 | 2002-10-19 | 이정중 | Inductively Coupled Plasma Assisted Sputtering System with Multiple Coils And Method Thereby |
US8101055B2 (en) * | 2007-12-19 | 2012-01-24 | Kojima Press Industry Co., Ltd. | Sputtering apparatus and method for forming coating film by sputtering |
US8535496B2 (en) * | 2009-02-26 | 2013-09-17 | Hon Hai Precision Industry Co., Ltd. | Sputter-coating apparatus |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4230872C2 (en) * | 1992-09-16 | 1999-10-21 | Leybold Ag | Device for simultaneously holding a large number of substrates |
CN101358333B (en) * | 2007-08-02 | 2011-05-04 | 鸿富锦精密工业(深圳)有限公司 | Sputtering substrate holding device |
TWI387662B (en) * | 2007-08-17 | 2013-03-01 | Hon Hai Prec Ind Co Ltd | Sputtering bracket and sputtering device using the same |
TWI386510B (en) * | 2007-12-07 | 2013-02-21 | Hon Hai Prec Ind Co Ltd | Sputtering tool and sputtering device using the same |
-
2009
- 2009-09-02 CN CN 200910306509 patent/CN102002678B/en not_active Expired - Fee Related
-
2010
- 2010-06-17 US US12/817,191 patent/US8500974B2/en not_active Expired - Fee Related
-
2013
- 2013-06-24 US US13/925,376 patent/US9194037B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020078618A (en) * | 2001-04-06 | 2002-10-19 | 이정중 | Inductively Coupled Plasma Assisted Sputtering System with Multiple Coils And Method Thereby |
US8101055B2 (en) * | 2007-12-19 | 2012-01-24 | Kojima Press Industry Co., Ltd. | Sputtering apparatus and method for forming coating film by sputtering |
US8535496B2 (en) * | 2009-02-26 | 2013-09-17 | Hon Hai Precision Industry Co., Ltd. | Sputter-coating apparatus |
Also Published As
Publication number | Publication date |
---|---|
US8500974B2 (en) | 2013-08-06 |
CN102002678B (en) | 2013-08-28 |
US20110048937A1 (en) | 2011-03-03 |
US20130276699A1 (en) | 2013-10-24 |
CN102002678A (en) | 2011-04-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WANG, CHUNG-PEI;REEL/FRAME:030673/0552 Effective date: 20130618 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
LAPS | Lapse for failure to pay maintenance fees |
Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Expired due to failure to pay maintenance fee |
Effective date: 20191124 |