TWI387662B - Sputtering bracket and sputtering device using the same - Google Patents
Sputtering bracket and sputtering device using the same Download PDFInfo
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- TWI387662B TWI387662B TW96130536A TW96130536A TWI387662B TW I387662 B TWI387662 B TW I387662B TW 96130536 A TW96130536 A TW 96130536A TW 96130536 A TW96130536 A TW 96130536A TW I387662 B TWI387662 B TW I387662B
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Description
本發明涉及一種鍍膜裝置,尤其涉及一種鍍膜支架及鍍膜機。The invention relates to a coating device, in particular to a coating stent and a coating machine.
當前,許多工業產品表面都鍍有功能薄膜,以改善產品表面之各種性能。如於光學鏡片之表面鍍上一層抗反射膜,以降低鏡片表面之反射率,降低入射光通過鏡片之能量損耗。又如於某些濾光元件表面鍍上一層濾光膜,可濾掉某一預定波段之光,製成各種各樣之濾光片。Currently, many industrial products are coated with functional films to improve the surface properties of the product. For example, an anti-reflection film is coated on the surface of the optical lens to reduce the reflectivity of the lens surface and reduce the energy loss of incident light passing through the lens. Another example is that a filter film is coated on the surface of some filter elements to filter out light of a predetermined wavelength band to form a variety of filters.
而目前由於對光學性能要求之日益提高,很多光學鏡片或濾光片等光學工件表面之兩面皆需要鍍膜。例如,由於手機數位相機鏡頭裏之影像感測器,如電荷耦合感測器係通過感應光之能量來產生電流,所以即使於光線很暗之環境下仍然會因為溫度、紅外線、電磁波等因素之影響而產生雜訊(Noise);而紅外截止濾光片則可經由其形成於玻璃基材上之紅外截止光學膜層將紅外光濾除掉以降低其雜訊。隨著對高階手機數位相機鏡頭之需求越來越高,於紅外截止濾光片背面再鍍上一抗反射光學膜層(Anti-Reflective Coating,簡稱AR Coating)以提升光通過紅外截止濾光片之玻璃基材之穿透率之需求也逐漸產生。At present, due to the increasing requirements for optical performance, many optical surfaces such as optical lenses or filters need to be coated on both sides. For example, because image sensors in a digital camera lens of a mobile phone, such as a charge-coupled sensor, generate current by sensing the energy of light, even in a very dark environment, temperature, infrared, electromagnetic waves, and the like are still present. The noise is generated by the influence; and the infrared cut filter can filter the infrared light through the infrared cut-off optical film layer formed on the glass substrate to reduce the noise. With the increasing demand for high-end mobile digital camera lenses, an anti-reflective optical coating (AR Coating) is applied to the back of the infrared cut filter to enhance the light passing through the infrared cut filter. The demand for the penetration rate of the glass substrate is also gradually increasing.
而於鏡片鍍膜製程中,由在於鏡片之兩面皆需鍍膜,故於鍍完一面之後需將鏡片翻面再放入鍍膜機中進行第二面之鍍膜,實際上係將鏡片於鍍膜支架上翻面,通常係以人工之方式對每個鏡片逐一進行翻面,此舉相當耗時及人力。參見蘇成彬等人發表於1980年第2期之《儀錶技術與感測器》上之《空心圓柱面鍍膜用旋轉支架》一文,介紹了一種用於圓柱形光學零件之鍍膜用支架及其使用方法。先前技術中,也有一些鍍膜支架自動翻面機構,然其多為簡單機械控制機構,故未能精確控制支架翻面之角度,進而影響鍍膜品質。In the lens coating process, the coating needs to be coated on both sides of the lens. Therefore, after the plating is finished, the lens is turned over and then placed in the coating machine for the second surface coating. In fact, the lens is turned over on the coated stent. In this way, each lens is usually turned over one by one in a manual manner, which is quite time consuming and labor intensive. See "Spinning bracket for hollow cylindrical coating" by Su Chengbin et al., "Instrument Technology and Sensors", No. 2, 1980, which introduces a coating bracket for cylindrical optical parts and its use. method. In the prior art, there are also some automatic turning mechanism of the coating bracket, but most of them are simple mechanical control mechanisms, so the angle of the turning of the bracket cannot be precisely controlled, thereby affecting the coating quality.
有鑑於此,提供一種鍍膜支架,用於鍍膜設備中,可實現對鍍膜基片夾具自動翻面,且翻面角度控制精確之鍍膜支架及鍍膜機實為必要。In view of this, a coating stent is provided for use in a coating apparatus, which is capable of automatically turning over the coated substrate holder, and the coating bracket and the coating machine with precise turning angle control are necessary.
本發明提供了一種鍍膜支架,其包括一個支架本體及至少一個基片夾具,該每個基片夾具和該支架本體之間通過轉軸連接。該每個基片夾具相連之轉軸上設有一第一齒輪,該每個基片夾具對應設置有一磁流控制元件,該每個磁流控制元件可驅動一與該第一齒輪相互嚙合之第二齒輪,從而驅動轉軸轉動,帶動基片夾具翻轉。The present invention provides a coated stent comprising a stent body and at least one substrate holder, each of the substrate holders and the stent body being coupled by a rotating shaft. a first gear is disposed on the rotating shaft connected to each of the substrate holders, and each of the substrate holders is correspondingly provided with a magnetic flow control element, and each of the magnetic current control elements can drive a second meshing engagement with the first gear The gear, thereby driving the rotating shaft, drives the substrate fixture to flip.
本發明還提供了一種鍍膜機,其包括:一個真空容器;設置於該真空容器內之至少一個靶;及與靶相對設置之鍍膜用基板支架。該鍍膜支架包括一個支架本體及至少一個基片夾具,該每個基片夾具和該支架本體之間通過轉軸連接。該每個基片夾具相連之轉軸上設有一第一齒輪,該每個基片夾具對應設置有一磁流控制元件,該每個磁流控制元件可驅動一與該第一齒輪相互嚙合之第二齒輪,從而驅動轉軸轉動,帶動基片夾具翻轉。The present invention also provides a coating machine comprising: a vacuum container; at least one target disposed in the vacuum container; and a substrate holder for coating film disposed opposite the target. The coating holder includes a holder body and at least one substrate holder, and each of the substrate holders and the holder body are connected by a rotating shaft. a first gear is disposed on the rotating shaft connected to each of the substrate holders, and each of the substrate holders is correspondingly provided with a magnetic flow control element, and each of the magnetic current control elements can drive a second meshing engagement with the first gear The gear, thereby driving the rotating shaft, drives the substrate fixture to flip.
相較於先前技術,該鍍膜支架及鍍膜機具有可實現對鍍膜基片夾具自動翻面,且翻面角度控制精確之優點。Compared with the prior art, the coating holder and the coating machine have the advantages of automatically turning over the coated substrate holder and accurately controlling the turning angle.
下面將結合附圖,對本發明作進一步之詳細說明。The invention will be further described in detail below with reference to the accompanying drawings.
如圖1所示,本發明較佳實施例提供之鍍膜支架100包括:支架本體110及至少一個基片夾具120;每個基片夾具120對應設有一個磁流控制元件130,該磁流控制元件130用於驅動對應之基片夾具120翻轉。As shown in FIG. 1 , a coated stent 100 according to a preferred embodiment of the present invention includes: a stent body 110 and at least one substrate holder 120; each substrate holder 120 is correspondingly provided with a magnetic flow control element 130, and the magnetic flow control Element 130 is used to drive the corresponding substrate holder 120 to flip.
該支架本體110用導熱性能良好之金屬半圓盤製成,其材料可為銅、鋁或不銹鋼等金屬。於本實施例中,該支架本體110為不銹鋼半圓盤。The bracket body 110 is made of a metal semi-disc having good thermal conductivity, and the material thereof may be metal such as copper, aluminum or stainless steel. In this embodiment, the bracket body 110 is a stainless steel semi-disc.
該基片夾具120也係採用導熱性能良好之金屬製成,其材料可為銅、鋁或不銹鋼等金屬。該基片夾具120之形狀可為扇形,圓形,方形等形狀,其原則只要滿足於支架本體110內翻轉時不會與支架本體110碰撞即可。於本實施例中,該基片夾具120為扇形。The substrate holder 120 is also made of a metal having good thermal conductivity, and the material thereof may be metal such as copper, aluminum or stainless steel. The shape of the substrate holder 120 may be a fan shape, a circular shape, a square shape, or the like. The principle is that the substrate holder 120 does not collide with the holder body 110 when it is inverted in the holder body 110. In the embodiment, the substrate holder 120 has a fan shape.
該每個基片夾具120設置有至少一個容置通孔121,用以收容待鍍基片並暴露該待鍍基片之兩相對之待鍍表面。該待鍍基片為玻璃鏡片或塑膠鏡片等。Each of the substrate holders 120 is provided with at least one receiving through hole 121 for receiving the substrate to be plated and exposing the opposite surfaces to be plated of the substrate to be plated. The substrate to be plated is a glass lens or a plastic lens.
該基片夾具120和該支架本體110之間通過轉軸140連接。本實施例中,轉軸140設於基片夾具120之軸線位置。該每個基片夾具120對應之轉軸140上,設置有一第一齒輪141。於本實施例中,第一齒輪141設置於轉軸140之端部。該每個磁流控制元件130可驅動一與該第一齒輪141相互嚙合之第二齒輪142轉動,從而驅動基片120夾具翻轉。The substrate holder 120 and the holder body 110 are connected by a rotating shaft 140. In this embodiment, the rotating shaft 140 is disposed at the axial position of the substrate holder 120. A first gear 141 is disposed on the corresponding rotating shaft 140 of each of the substrate holders 120. In the embodiment, the first gear 141 is disposed at an end of the rotating shaft 140. Each of the magnetic flow control elements 130 can drive a second gear 142 that meshes with the first gear 141 to rotate, thereby driving the substrate 120 to flip the clamp.
該磁流控制元件130可固定於支架本體110上。該磁流控制元件130與第二齒輪142相連,用於控制第二齒輪142轉動,從而帶動第一齒輪141之轉動,以使基片夾具120翻轉。The magnetic flow control element 130 can be fixed to the bracket body 110. The magnetic flow control element 130 is coupled to the second gear 142 for controlling the rotation of the second gear 142 to drive the rotation of the first gear 141 to invert the substrate clamp 120.
該磁流控制元件130可間接控制基片夾具120翻轉。該磁流控制元件130可為電磁泵、磁流電動機或磁流變控制器等磁流控制裝置。此外於該磁流控制元件130之開關上可裝設一個無線裝置,利用遙控之方式來控制磁流控制元件130工作,從而可實現對基片夾具120翻轉之自動控制。The magnetic flow control element 130 can indirectly control the substrate clamp 120 to flip. The magnetic flow control element 130 can be a magnetic flow control device such as an electromagnetic pump, a magnetic current motor or a magnetorheological controller. In addition, a wireless device can be installed on the switch of the magnetic flow control component 130 to control the operation of the magnetic flow control component 130 by means of remote control, thereby realizing automatic control of the flipping of the substrate clamp 120.
由於磁流控制元件130之磁流變液相變之過程可於毫秒量級內完成,故磁流控制元件130具有靈敏度高,耗能小之優點。因此,可大大提高基片夾具120翻面之精准度。Since the process of the magnetorheological liquid phase change of the magnetic current control element 130 can be completed in the order of milliseconds, the magnetic current control element 130 has the advantages of high sensitivity and low energy consumption. Therefore, the accuracy of turning the substrate jig 120 can be greatly improved.
於本實施例中,該基片夾具120大小相同,且為對稱分佈於支架本體110上。於該每一基片夾具120上設置有一通孔122,每一對稱設置之兩個基片夾具120具有之通孔122應位於一條軸線上。此通孔122可便於對基片夾具120之翻轉角度進行監控。In the embodiment, the substrate fixtures 120 are the same size and are symmetrically distributed on the bracket body 110. Each of the substrate holders 120 is provided with a through hole 122, and each of the symmetrically disposed two substrate holders 120 has a through hole 122 on one axis. This through hole 122 facilitates monitoring of the flip angle of the substrate holder 120.
請一併參閱圖2,一個使用上述鍍膜支架100之鍍膜機200包括:一個真空容器210;設置於該真空容器210內之至少一個靶220;及與靶220相對設置之鍍膜支架100。本發明實施例提供之鍍膜機200還包括一發光光源150和一光接收裝置160。Referring to FIG. 2 together, a coating machine 200 using the above-mentioned coating holder 100 includes: a vacuum container 210; at least one target 220 disposed in the vacuum container 210; and a coating holder 100 disposed opposite the target 220. The coating machine 200 provided by the embodiment of the invention further includes an illuminating light source 150 and a light receiving device 160.
該鍍膜機200於使用時,首先對待鍍膜基片進行一面鍍膜,當一面鍍完後,只需使用該鍍膜支架100上之磁流控制元件130控制每一基片夾具120翻轉180度後,即可對另一面進行鍍膜。由於磁流控制元件130可採用電控或遙控之裝置來控制其動作,故此基片夾具120之翻面動作可自動進行。When the coating machine 200 is in use, first, the coated substrate is coated on one side. After one side is plated, only the magnetic flow control element 130 on the coating holder 100 is used to control each substrate holder 120 to be turned 180 degrees, that is, The other side can be coated. Since the magnetic flow control element 130 can be controlled by an electronically controlled or remotely controlled device, the flipping action of the substrate holder 120 can be performed automatically.
優選地,為了更好地監控基片夾具120翻轉之角度,於離鍍膜支架100不遠處設置一個發光光源150,與發光光源150對應於鍍膜支架100之另一端對稱之位置設置一個光接收裝置160。當對稱之兩個基片夾具120之翻轉角度均為180度時,發光光源150發出之光線可完全透過通孔122而被光接收裝置160接收。因此,當光接收裝置160可100%地接收到發光光源150發出之光時,可認為基片夾具120之翻轉角度為180。而當某一基片夾具120之翻轉角度不係180度,而存在一定誤差時,對應該基片夾具120上之通孔122和與其對稱之另一個基片夾具120上之通孔122就會不在一條直線上,發光光源150之光會被基片夾具120部分遮擋,因此,光接收裝置160就不能夠100%地接收到發光光源150發出之光。以此,根據光接收裝置160接收到之光量之比例,就可判斷基片夾具120是否精確翻轉了180度。於本實施例中,該發光光源150為紅外光源,該光接收裝置160為一個紅外光接收器。當然,其也可係其他種類之發光光源,而不僅限於這種光源。Preferably, in order to better monitor the angle at which the substrate holder 120 is turned over, an illuminating light source 150 is disposed not far from the coating holder 100, and a light receiving device is disposed at a position symmetrical with the other end of the illuminating light source 150 corresponding to the coating holder 100. 160. When the angles of the two symmetrical substrate holders 120 are both 180 degrees, the light emitted from the illuminating light source 150 can be completely transmitted through the through holes 122 and received by the light receiving device 160. Therefore, when the light receiving device 160 can receive the light emitted from the illuminating light source 150 100%, the flip angle of the substrate jig 120 can be considered to be 180. When a flip angle of a certain substrate jig 120 is not 180 degrees, and there is a certain error, the through hole 122 on the substrate jig 120 and the through hole 122 on the other substrate jig 120 symmetrical thereto are Not in a straight line, the light of the illuminating light source 150 is partially blocked by the substrate holder 120, and therefore, the light receiving device 160 cannot receive the light emitted from the illuminating light source 150 100%. Thus, based on the ratio of the amount of light received by the light receiving device 160, it can be judged whether or not the substrate holder 120 is accurately inverted by 180 degrees. In the embodiment, the illuminating light source 150 is an infrared light source, and the light receiving device 160 is an infrared light receiver. Of course, it can also be other types of illuminating light sources, and is not limited to such a light source.
相較於先前技術,該鍍膜支架及鍍膜機具有可實現對鍍膜基片夾具自動翻面,且翻面角度控制精確之優點。Compared with the prior art, the coating holder and the coating machine have the advantages of automatically turning over the coated substrate holder and accurately controlling the turning angle.
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
鍍膜支架...100Coated stent. . . 100
支架本體...110Bracket body. . . 110
基片夾具...120Substrate fixture. . . 120
容置通孔...121Hold through holes. . . 121
通孔...122Through hole. . . 122
磁流控制元件...130Magnetic flow control element. . . 130
轉軸...140Rotating shaft. . . 140
第一齒輪...141The first gear. . . 141
第二齒輪...142Second gear. . . 142
發光光源...150Luminous light source. . . 150
光接收裝置...160Light receiving device. . . 160
鍍膜機...200Coating machine. . . 200
真空容器...210Vacuum container. . . 210
靶...220target. . . 220
圖1係本發明較佳實施例之鍍膜用基板支架之示意圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a substrate holder for coating film according to a preferred embodiment of the present invention.
圖2係本發明較佳實施例之鍍膜機之示意圖。2 is a schematic view of a coating machine in accordance with a preferred embodiment of the present invention.
鍍膜支架...100Coated stent. . . 100
支架本體...110Bracket body. . . 110
基片夾具...120Substrate fixture. . . 120
容置通孔...121Hold through holes. . . 121
通孔...122Through hole. . . 122
磁流控制元件...130Magnetic flow control element. . . 130
轉軸...140Rotating shaft. . . 140
第一齒輪...141The first gear. . . 141
第二齒輪...142Second gear. . . 142
Claims (10)
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TW96130536A TWI387662B (en) | 2007-08-17 | 2007-08-17 | Sputtering bracket and sputtering device using the same |
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TW96130536A TWI387662B (en) | 2007-08-17 | 2007-08-17 | Sputtering bracket and sputtering device using the same |
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CN102002678B (en) * | 2009-09-02 | 2013-08-28 | 鸿富锦精密工业(深圳)有限公司 | Sputtering material rack |
TWI513842B (en) * | 2011-11-22 | 2015-12-21 | Hon Hai Prec Ind Co Ltd | Support mechanism and vacuum coating machine using the same |
CN111378949A (en) * | 2020-05-12 | 2020-07-07 | 无锡奥夫特光学技术有限公司 | Coating device capable of realizing high-precision control of surface shape of optical element |
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