US9095879B2 - Probe for ultrasonic diagnostic apparatus and method of manufacturing the same - Google Patents

Probe for ultrasonic diagnostic apparatus and method of manufacturing the same Download PDF

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Publication number
US9095879B2
US9095879B2 US12/725,371 US72537110A US9095879B2 US 9095879 B2 US9095879 B2 US 9095879B2 US 72537110 A US72537110 A US 72537110A US 9095879 B2 US9095879 B2 US 9095879B2
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Prior art keywords
connector
electrodes
layer
backing
piezoelectric member
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US12/725,371
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US20100241004A1 (en
Inventor
Jin Woo JUNG
Jeong Cheol Seo
Jae Yk Kim
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Samsung Medison Co Ltd
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Samsung Medison Co Ltd
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Assigned to MEDISON CO., LTD. reassignment MEDISON CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JUNG, JIN WOO, KIM, JAE YK, SEO, JEONG CHEOL
Publication of US20100241004A1 publication Critical patent/US20100241004A1/en
Assigned to SAMSUNG MEDISON CO., LTD. reassignment SAMSUNG MEDISON CO., LTD. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: MEDISON CO., LTD.
Priority to US14/749,409 priority Critical patent/US9538986B2/en
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/004—Mounting transducers, e.g. provided with mechanical moving or orienting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

Definitions

  • the present invention relates to probes and, more particularly, to a probe for an ultrasonic diagnostic apparatus that generates internal images of a patient body using ultrasound waves, and a method of manufacturing the same.
  • an ultrasonic diagnostic apparatus refers to a non-invasive apparatus that irradiates an ultrasound signal from a surface of a patient body towards a target internal organ beneath the body surface and obtains an image of a monolayer or blood flow in soft tissue from information in the reflected ultrasound signal (ultrasound echo-signal).
  • the ultrasonic diagnostic apparatus has been widely used for diagnosis of the heart, the abdomen, the urinary organs, and in obstetrics and gynecology due to various merits such as small size, low price, real-time image display, and high stability through elimination of radiation exposure, as compared with other image diagnostic systems, such as X-ray diagnostic systems, computerized tomography scanners (CT scanners), magnetic resonance imagers (MRIs), nuclear medicine diagnostic apparatuses, and the like.
  • CT scanners computerized tomography scanners
  • MRIs magnetic resonance imagers
  • nuclear medicine diagnostic apparatuses nuclear medicine diagnostic apparatuses, and the like.
  • the ultrasonic diagnostic apparatus includes a probe which transmits an ultrasound signal to a patient body and receives the ultrasound echo-signal reflected therefrom to obtain the ultrasound image of the patient body.
  • the probe includes a transducer, a case with an open upper end, a cover coupled to the open upper end of the case to directly contact the body surface of the patient, and the like.
  • the transducer includes a piezoelectric layer in which a piezoelectric material converts electrical signals into sound signals or vice versa while vibrating, a sound matching layer reducing a difference in sound impedance between the piezoelectric layer and a patient body to allow as much of the ultrasound waves generated from the piezoelectric layer as possible to be transferred to the patient body, a lens layer focusing the ultrasound waves, which travel in front of the piezoelectric layer, onto a predetermined point, and a backing layer blocking the ultrasound waves from traveling in a rearward direction of the piezoelectric layer to prevent image distortion.
  • the piezoelectric layer includes a piezoelectric member and electrodes provided to upper and lower ends of the piezoelectric member, respectively. Further, a printed circuit board (PCB) is bonded to the piezoelectric layer. The PCB is provided with wiring electrodes that are connected to the electrodes of the piezoelectric layer to transfer signals from the piezoelectric member. The PCB is connected to the piezoelectric layer by connecting the wiring electrodes of the PCB and the electrodes of the piezoelectric layer.
  • PCB printed circuit board
  • connection of the wiring electrodes of the PCB to the electrodes of the piezoelectric layer is a laborious operation, which increases fabrication time and causes deterioration in performance of the probe due to low durability and non-uniformity of a connected part therebetween. Therefore, there is a need to provide a probe for an ultrasonic diagnostic apparatus that overcomes such problems.
  • the present invention is conceived to solve the problems of the related art as described above, and an aspect of the present invention is to provide an improved probe for an ultrasonic diagnostic apparatus configured to allow easy manufacture of the probe while preventing deterioration in performance caused by defective connection between a piezoelectric layer and a PCB, and a method of manufacturing the same.
  • a probe for an ultrasonic diagnostic apparatus includes: a backing layer including backing members; a first connector bonded between the backing members and including electrodes spaced from each other in an arrangement direction; a ground connector bonded between the backing members to be spaced from the first connector; and a piezoelectric member electrically connected to the electrodes and the ground connector.
  • At least one of the first connector and the ground connector may include a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • the backing layer may include a first electrode layer electrically connected to the electrodes.
  • the first electrode layer may be formed on a surface of the backing layer.
  • the backing layer may further include a second electrode layer electrically connected to the ground connector.
  • the second electrode layer may be formed on the surface of the backing layer to be separated from the first electrode layer.
  • the backing layer may be formed with a mounting groove, and the piezoelectric member may be inserted into the mounting groove.
  • the probe may further include a second connector bonded between the backing members and including electrodes spaced from each other in the arrangement direction.
  • the second connector may be disposed in the height direction of the backing members such that the electrodes of the first connector alternate with the electrodes of the second connector.
  • the electrodes of the first and second connectors may be signal electrodes.
  • a method of manufacturing a probe for an ultrasonic diagnostic apparatus includes: forming electrodes on a first connector to be spaced from each other in an arrangement direction; forming a ground connector; forming a backing layer by bonding the first connector and the ground connector between backing members; and stacking a piezoelectric member on the backing layer to be electrically connected to the electrodes and the ground connector.
  • the method may further include forming a first electrode layer on the backing layer to be electrically connected to the piezoelectric member and the electrodes after forming the backing layer.
  • the method may further include forming a second electrode layer on the backing layer to be electrically connected to the piezoelectric member and the ground connector after forming the backing layer.
  • the forming a second electrode layer on the backing layer may include forming the second electrode layer to be separated from the first electrode layer.
  • a method of manufacturing a probe for an ultrasonic diagnostic apparatus includes: forming electrodes on a first connector to be spaced from each other in an arrangement direction; forming electrodes on a second connector to be spaced from each other in the arrangement direction; forming a ground connector; forming a backing layer by bonding the ground connector, the first connector and the second connector between backing members; and stacking a piezoelectric member on the backing layer to be electrically connected to the ground connector and the electrodes of the first and second connectors.
  • the method may further include forming a first electrode layer on the backing layer to be electrically connected to the piezoelectric member, the ground connector, and the electrodes of the first and second connectors after forming the backing layer.
  • the forming a backing layer may include disposing the second connector in a height direction of the backing members such that the electrodes of the first connector alternate with the electrodes of the second connector.
  • the method may further include forming a second electrode layer on the backing layer to be electrically connected to the piezoelectric member and the ground connector after forming the backing layer.
  • the forming a second electrode layer on the backing layer may include forming the second electrode layer to be separated from the first electrode layer.
  • the method may further include forming a mounting groove on the backing layer, wherein the stacking a piezoelectric member on the backing layer includes inserting the piezoelectric member into the mounting groove.
  • FIG. 1 is a schematic view of a probe for an ultrasonic diagnostic apparatus according to a first embodiment of the present invention
  • FIG. 2 is a flowchart of a method of manufacturing the probe for an ultrasonic diagnostic apparatus according to the first embodiment of the invention
  • FIGS. 3 and 4 are views of a process of forming a backing layer of the probe according to the first embodiment of the invention.
  • FIG. 5 is a view of a process of forming first and second electrode layers on the backing layer of the probe according to the first embodiment of the invention
  • FIG. 6 is a schematic view of a probe for an ultrasonic diagnostic apparatus according to a second embodiment of the invention.
  • FIG. 7 is a flowchart of a method of manufacturing the probe for an ultrasonic diagnostic apparatus according to the second embodiment of the invention.
  • FIGS. 8 and 9 are views of a process of forming a backing layer of the probe according to the second embodiment of the invention.
  • FIG. 10 is a view of a process of forming first and second electrode layers on the backing layer of the probe according to the second embodiment of the invention.
  • FIG. 11 is a perspective view of a probe for an ultrasonic diagnostic apparatus according to a third embodiment of the invention.
  • FIG. 12 is a schematic view of the probe shown in FIG. 11 ;
  • FIG. 13 is a flowchart of a method of manufacturing the probe for an ultrasonic diagnostic apparatus according to the third embodiment of the invention.
  • FIGS. 14 and 15 are views of a process of forming a backing layer of the probe according to the third embodiment of the invention.
  • FIG. 16 is a view of a process of forming first and second electrode layers on the backing layer of the probe according to the third embodiment of the invention.
  • FIG. 17 is a view showing a separated state of the backing layer of the probe according to the third embodiment of the invention.
  • FIG. 1 is a schematic view of a probe for an ultrasonic diagnostic apparatus according to a first embodiment of the invention.
  • a probe 100 for an ultrasonic diagnostic apparatus includes a backing layer 110 , a first connector 120 , a ground connector 130 , and a piezoelectric member 160 .
  • the backing layer 110 is disposed behind the piezoelectric member 160 described below.
  • the backing layer 110 reduces a pulse width of an ultrasound wave by suppressing free vibration of the piezoelectric member 160 and prevents image distortion by blocking unnecessary propagation of the ultrasound wave in the rearward direction of the piezoelectric member 160 .
  • the backing layer 110 includes multiple backing members 111 , 112 , 113 and is formed by bonding the backing members 111 , 112 , 113 .
  • the backing layer 110 may be formed of a material containing a rubber to which epoxy, tungsten powder, and the like are added.
  • the first connector 120 includes an insulation part (reference numeral omitted) and electrodes 125 .
  • the multiple electrodes 125 are disposed on the insulation part to be separated from each other in an “arrangement direction.”
  • the term “arrangement direction” refers to a direction in which multiple piezoelectric members 160 are arranged in an array. In other words, the electrodes 125 are spaced from each other in the arrangement direction of piezoelectric members 160 arranged in an array (see FIG. 3 ).
  • each of the electrodes 125 of the first connector 120 is a signal electrode that is electrically connected to a first electrode 161 of the piezoelectric member 160 described below.
  • the first connector 120 including the electrodes 125 is bonded between the backing members 111 , 112 , 113 .
  • the first connector 120 is inserted and bonded between two backing members 111 , 112 among the three backing members 111 , 112 , 113 .
  • the first connector 120 is disposed in a “height direction of the backing members 111 , 112 , 113 .”
  • the backing members 111 , 112 are bonded to opposite sides of the first connector 120 , thereby forming a part of the backing layer 110 .
  • the term “height direction of the backing members 111 , 112 , 113 ” refers to a direction perpendicular to a direction in which a first electrode layer 140 described below is formed (see FIG. 3 ).
  • One end of the first connector 120 bonded between the backing members 111 , 112 is exposed on a front side of the backing layer 110 adjacent to the piezoelectric member 160 , and the other end thereof extends through a rear side of the backing layer 110 .
  • the electrodes 125 of the first connector 120 are exposed on the front side of the backing layer 110 .
  • the first connector 120 may include a flexible printed circuit board (FPCB), a printed circuit board (PCB) or any configuration capable of supplying signals or electricity.
  • FPCB flexible printed circuit board
  • PCB printed circuit board
  • the ground connector 130 is bonded between the backing members 112 , 113 .
  • the ground connector 130 is inserted and bonded between the two backing members 112 , 113 among the three backing members 111 , 112 , 113 .
  • the ground connector 130 is spaced from the first connector 120 by a width occupied by the backing member 112 .
  • the ground connector 130 includes an insulation part (reference numeral omitted) and multiple electrodes 135 . Like the electrodes 125 of the first connector 120 , the multiple electrodes 135 are spaced from each other in the arrangement direction. Alternatively, the electrodes 135 may be formed to constitute the entirety of the ground connector 130 .
  • the multiple electrodes 135 are formed on the ground connector 130 and are ground electrodes, each of which is electrically connected to the second electrode 165 of the piezoelectric member 160 described below.
  • the ground connector 130 including the electrodes 135 is disposed in the height direction of the backing members 111 , 112 , 113 .
  • the backing members 112 , 113 are bonded to opposite sides of the ground connector 130 , thereby forming the backing layer 110 along with the backing member 111 .
  • One end of the ground connector 130 bonded between the backing members 112 , 113 is exposed on the front side of the backing layer 110 adjacent to the piezoelectric member 160 , and the other end thereof extends through the rear side of the backing layer 110 .
  • the electrodes 135 of the ground connector 130 are exposed on the front side of the backing layer 110 .
  • the backing layer 110 includes the first electrode layer 140 .
  • the first electrode layer 140 is formed on the backing layer 110 to be disposed between the backing layer 110 and the piezoelectric member 160 .
  • the first electrode layer 140 is electrically connected to the electrodes 125 of the first connector 120 .
  • the first electrode layer 140 is formed on a surface of the backing layer 110 .
  • the first electrode layer 140 may be formed on the front surface of the backing layer 110 adjacent to the piezoelectric member 160 .
  • the backing layer 110 may further includes a second electrode layer 150 .
  • the second electrode layer 150 is also formed on the backing layer 110 to be disposed between the backing layer 110 and the piezoelectric member 160 .
  • the second electrode layer 150 is electrically connected to the electrodes 135 of the ground connector 130 .
  • the second electrode layer 150 may be formed on the surface of the backing layer 110 , particularly, on the front surface of the backing layer 110 adjacent to the piezoelectric member 160 , while being separated from the first electrode layer 140 .
  • the first and second electrode layers 140 , 150 may be formed of a highly electrically conductive material by deposition, sputtering, plating, spraying, or the like.
  • the piezoelectric member 160 is electrically connected to the electrodes 125 of the first connector 120 and the electrodes 135 of the ground connector 130 .
  • the piezoelectric member 160 generates ultrasound waves using a resonance phenomenon and may be formed of a ceramic of lead zirconate titanate (PZT), a PZNT single crystal made of a solid solution of lead zinc niobate and lead titanate, a PZMT single crystal made of a solid solution of lead magnesium niobate and lead titanate, or the like.
  • PZT lead zirconate titanate
  • PZNT PZNT single crystal made of a solid solution of lead zinc niobate and lead titanate
  • PZMT single crystal made of a solid solution of lead magnesium niobate and lead titanate
  • the piezoelectric member 160 is formed with first and second electrodes 161 , 165 .
  • the first and second electrodes 161 , 165 are disposed on front and rear sides of the piezoelectric member 160 , respectively.
  • the first electrode 161 is electrically connected to the first electrode layer 140 and the second electrode 165 is electrically connected to the first electrode layer 150 .
  • the first and second electrodes 161 , 165 may be formed of a highly electrically conductive metal.
  • one of the first and second electrodes 161 , 165 serves as a positive pole or signal electrode of the piezoelectric member 160
  • the other serves as a negative pole or ground electrode of the piezoelectric member 160 .
  • the first and second electrodes 161 , 165 are separated from each other to allow the signal electrode and the ground electrode to be separated from each other.
  • the first and second electrodes 161 , 165 are illustrated as serving as the signal and ground electrodes, respectively.
  • the first and second electrodes 161 , 165 are symmetrical to each other such that an upper side of the piezoelectric member 160 is symmetrical to a lower side thereof.
  • Each of the first and second electrodes 161 , 165 may have a “J”-shape to surround the piezoelectric member 160 .
  • the upper and lower sides of the piezoelectric member 160 including the first and second electrodes 161 , 165 are symmetrical to each other, thereby enabling the piezoelectric member 160 to be provided to a probe without being restricted by an orientation, such as the upper or lower side, of the piezoelectric member 160 .
  • the piezoelectric member 160 is electrically connected to the electrodes 125 of the first connector 120 via the first electrode layer 140 and the first electrode 161 which are electrically connected to each other.
  • the first electrode 161 electrically connecting the first electrode layer 140 and the piezoelectric member 160 may be a signal electrode.
  • the piezoelectric member 160 is electrically connected to the electrodes 135 of the ground connector 130 via the second electrode layer 150 and the second electrode 165 which are electrically connected to each other.
  • the second electrode 165 electrically connecting the second electrode layer 150 and the piezoelectric member 160 may be a ground electrode.
  • the piezoelectric member 160 may be composed of a plurality of piezoelectric members 160 arranged in an array to provide multiple channels. Accordingly, the first electrode layer 140 may also be composed of a plurality of first electrode layers arranged side by side in an array so as to correspond to the piezoelectric members 160 arranged in an array. The piezoelectric members 160 and the first electrode layers 140 are correspondingly connected to the electrodes 125 spaced from each other in the arrangement direction.
  • the probe 100 may further include a sound matching layer 170 .
  • the sound matching layer 170 is disposed on a front side of the piezoelectric member 160 .
  • the sound matching layer 170 allows ultrasound signals generated from the piezoelectric member 160 to be efficiently transferred to a target by matching sound impedances of the piezoelectric member 160 and the target.
  • the sound matching layer 170 is configured to have an intermediate value between the sound impedance of the piezoelectric member 160 and the sound impedance of the target.
  • the sound matching layer 170 may be formed of a glass or resin material, and includes a first sound matching layer 172 and a second sound matching layer 174 , which are formed of different materials to allow the sound impedance of the sound matching layer 170 to be changed stepwise from the piezoelectric member 160 to the target.
  • the probe 100 may further include a lens layer disposed in front of the sound matching layer 170 to focus forwardly traveling ultrasound waves on a predetermined point.
  • the probe 100 for an ultrasonic diagnostic apparatus may be a linear type probe having a linear surface or a convex type probe having a convexly rounded surface.
  • FIG. 2 is a flowchart of a method of manufacturing the probe for an ultrasonic diagnostic apparatus according to the first embodiment of the invention
  • FIGS. 3 and 4 are views of a process of forming the backing layer of the probe according to the first embodiment of the invention
  • FIG. 5 is a view of a process of forming the first and second electrode layers on the backing layer of the probe according to the first embodiment of the invention.
  • electrodes 125 are formed on a first connector 120 in S 110 and a ground connector 130 is formed in S 120 , as shown in FIG. 3 .
  • the electrodes 125 of the first connector 120 are formed in the height direction of backing members 111 , 112 and are spaced from each other in the arrangement direction in which piezoelectric members 160 are arranged.
  • the first connector 120 includes, but is not limited to, a flexible printed circuit board (FPCB).
  • the first connector 120 may include a printed circuit board or any configuration capable of supplying signals or electricity as well as the flexible printed circuit board (FPCB).
  • the ground connector 130 may also include a printed circuit board or any configuration capable of supplying signals or electricity as well as the flexible printed circuit board (FPCB).
  • the ground connector 130 may be formed with electrodes 135 , which are the same as or similar to the electrodes 125 of the first connector 120 .
  • the first connector 120 and the ground connector 130 are bonded between backing members 111 , 112 , 113 to form a backing layer 110 in S 130 , as shown in FIG. 4 .
  • the backing members 111 , 112 , 113 are formed of a material including a rubber to which epoxy resin, tungsten powder, and the like are added. Then, with the first connector 120 disposed between the backing members 111 , 112 in the height direction, the backing members 111 , 112 are bonded to opposite sides of the first connector 120 .
  • the backing members 112 , 113 are bonded to opposite sides of the ground connector 130 , thereby completing formation of the backing layer 110 .
  • each of the first connector 120 and the ground connector 130 bonded between the backing members 111 , 112 , 113 is exposed on the front side of the backing layer 110 adjacent to the piezoelectric member 160 , and the other end thereof extends through the rear side of the backing layer 110 .
  • a first electrode layer 140 is formed on the backing layer 110 to be electrically connected to the piezoelectric member 160 and the electrodes 125 of the first connector 120 in S 140 , as shown in FIG. 5 .
  • the first electrode layer 140 is formed on a surface of the backing layer 110 .
  • the first electrode layer 140 may be formed on the front surface of the backing layer 110 adjacent to the piezoelectric member 160 .
  • the rear side of the first electrode layer 140 adjoining the surface of the backing layer 110 is electrically connected to the electrodes 125 of the first connector 120 .
  • a second electrode layer 150 is formed on the backing layer 110 to be electrically connected to the piezoelectric member 160 and the electrodes 135 of the ground connector 130 in S 150 .
  • the second electrode layer 150 is formed on a surface of the backing layer 110 .
  • the second electrode layer 150 may be formed on the front surface of the backing layer 110 adjacent to the piezoelectric member 160 while being separated from the first electrode layer 140 .
  • the first and second electrode layers 140 , 150 may be formed of a highly electrically conductive material by deposition, sputtering, plating, spraying, or the like.
  • the first and second electrode layers 140 , 150 may be separately formed initially or may be separated from each other by cutting after being integrally formed.
  • the piezoelectric member 160 is stacked on the backing layer 110 to be electrically connected to the electrodes 125 of the first connector 120 and the electrodes 135 of the ground connector 130 in S 160 .
  • a first electrode 161 of the piezoelectric member 160 is electrically connected to the first electrode layer 140 .
  • the piezoelectric member 160 is electrically connected to the electrodes 125 of the first connector 120 via the first electrode layer 140 and the first electrode 161 which are electrically connected to each other.
  • a second electrode 165 of the piezoelectric member 160 is electrically connected to the second electrode layer 150 .
  • the piezoelectric member 160 is electrically connected to the electrodes 135 of the ground connector 130 via the second electrode layer 150 and the second electrode 165 which are electrically connected to each other.
  • the piezoelectric member 160 may be divided into multiple piezoelectric members 160 spaced a predetermined distance from each other and arranged side by side in an array, so that the multiple piezoelectric members 160 can be used as multiple channels corresponding to the multiple electrodes 125 , 135 formed on the first connector 120 and the ground connector 130 , respectively.
  • Each of the first and second electrode layers 140 , 150 may also be divided into multiple electrode layers, which are arranged side by side in an array so as to correspond one-to-one to each of the first and second electrodes 161 , 165 .
  • stacks of the backing layer 110 and the piezoelectric member 160 are diced by a dicing machine (not shown). Dicing is performed to a depth such that the first and second electrode layers 140 , 150 can be reliably divided into the multiple first and second electrode layers, respectively.
  • the piezoelectric member 160 is divided into the multiple piezoelectric members 160 spaced a predetermined distance from each other, such that first and second electrodes 161 , 165 formed on each of the piezoelectric members 160 can be electrically completely separated from first and second electrodes 161 , 165 formed on other piezoelectric members 160 adjacent thereto.
  • each of the divided first electrodes layers 140 and each of the divided second electrode layers 150 are electrically completely separated from other first electrode layers 140 and other second electrode layers 150 adjacent thereto such that only one divided first electrode layer 140 and one divided second electrode layer 150 are connected to the first electrode 161 and the second electrode 165 formed on one divided piezoelectric member 160 , respectively.
  • the first and second electrode layers 140 , 150 are illustrated as being diced together with the piezoelectric member 160 so as to correspond to the first electrode 161 and the second electrode 165 of the piezoelectric member 160 .
  • the invention is not limited thereto.
  • the first and second electrode layers 140 , 150 may be subjected to a patterning process to correspond to the first electrode 161 and the second electrode 165 , respectively, by optical etching, etching or the like before the piezoelectric member 160 is stacked on the backing layer 110 .
  • a sound matching layer 170 is stacked on the piezoelectric member 160 as shown in FIG. 1 .
  • the method S 100 of manufacturing a probe for an ultrasonic diagnostic apparatus is not limited to the sequence described above.
  • the processes of the method may be performed in a different sequence or at the same time.
  • the first connector 120 and the ground connector 130 are connected to the piezoelectric member 160 via the first and second electrode layers 140 , 150 instead of using a complicated and laborious soldering operation in manufacture of the probe, thereby enabling easy connection between the piezoelectric member 160 and the connectors 120 , 130 while preventing deterioration in performance caused by defective connection therebetween and deterioration in performance of the piezoelectric member 160 caused by heat during manufacture.
  • the first connector 120 and the ground connector 130 are bonded between the backing members 111 , 112 , 113 , instead of being disposed between the backing layer 110 and the piezoelectric member 160 , to be electrically connected to the piezoelectric member 160 via the first and second electrode layers 140 , 150 , thereby preventing deterioration in performance caused by defective connection between the piezoelectric member 160 , the first connector 120 and the ground connector 130 , and preventing damage of the first and ground connectors 120 , 130 caused by bending.
  • individual formation and maintenance of the backing layer 110 can be achieved by bonding the first connector 120 and the ground connector 130 to the backing members 111 , 112 , 113 and forming the first and second electrode layers 140 , 150 thereon, so that the backing layer 110 can be prepared in desired shapes and dimensions so as to be easily assembled to other components, thereby enabling easy manufacture of the probe at lower cost while enhancing uniformity of final products.
  • the probe 100 has narrow spaces between the electrodes 125 of the first connector 120 , that is, signal electrodes, and the electrodes 135 of the ground connector 130 , that is, ground electrodes, thereby reducing noise.
  • FIG. 6 is a schematic view of a probe for an ultrasonic diagnostic apparatus according to a second embodiment of the invention.
  • a probe 200 for an ultrasonic diagnostic apparatus includes a backing layer 210 .
  • the backing layer 210 is disposed behind the piezoelectric member 160 .
  • the backing layer 210 includes multiple backing members 211 , 212 , 213 and is formed by bonding the backing members 211 , 212 , 213 .
  • the backing layer 210 may be formed of a material containing a rubber to which epoxy, tungsten powder, and the like are added.
  • a mounting groove 216 is formed on the backing layer 210 .
  • the mounting groove 216 is formed on the front side of the backing layer adjacent to the piezoelectric member 160 .
  • the piezoelectric member 160 is inserted into the mounting groove 216 .
  • the mounting groove 216 is depressed into the backing layer 210 in a shape corresponding to the piezoelectric member 160 to allow the piezoelectric member 160 to be inserted into the backing layer 210 .
  • the backing layer 210 includes first and second electrode layers 240 , 250 .
  • the first and second electrode layers 240 , 250 are formed on the backing layer 210 and are disposed between the backing layer 210 and the piezoelectric member 160 .
  • the first and second electrode layers 240 , 250 may be formed on the mounting groove 216 .
  • first and second electrode layers 240 , 250 are similar to those of the first and second electrode layers 140 , 150 according to the first embodiment, and a detailed description thereof will be omitted herein.
  • FIG. 7 is a flowchart of a method of manufacturing the probe for an ultrasonic diagnostic apparatus according to the second embodiment of the invention
  • FIGS. 8 and 9 are views of a process of forming the backing layer of the probe according to the second embodiment of the invention
  • FIG. 10 is a view of a process of forming the first and second electrode layers on the backing layer of the probe according to the second embodiment of the invention.
  • a mounting groove 216 is formed on a backing layer 210 in S 210 , as shown in FIG. 8 .
  • the backing members 211 , 213 are formed to have steps at both sides of the backing member 212 interposed between the backing members 211 , 213 .
  • the backing members 211 , 213 are disposed adjacent to the backing layer 212 by forming lower step sections to be coplanar with the backing layer 212 interposed between the backing members 211 , 213 .
  • electrodes 125 are formed on a first connector 120 in S 220 , and a ground connector 130 is formed in S 230 .
  • the first connector 120 and the ground connector 130 are bonded between backing members 211 , 212 , 213 to form a backing layer 210 in S 240 , as shown in FIG. 9 .
  • a first electrode layer 240 is formed on the backing layer 210 to be electrically connected to the piezoelectric member 160 and the electrodes 125 of the first connector 120 in S 250 , as shown in FIG. 10 .
  • the first electrode layer 240 may be formed on the mounting groove 216 .
  • the rear side of the first electrode layer 240 adjoining a surface of the mounting groove 216 is electrically connected to the electrodes 125 of the first connector 120 .
  • a second electrode layer 250 is formed on the backing layer 110 to be electrically connected to the piezoelectric member 160 and the electrodes 135 of the ground connector 130 in S 260 .
  • the second electrode layer 250 may be formed on the mounting groove 216 while being separated from the first electrode layer 240 .
  • the rear side of the second electrode layer 250 adjoining the surface of the mounting groove 216 is electrically connected to the electrodes 135 of the ground connectors 130 .
  • the piezoelectric member 160 is stacked on the backing layer 210 by inserting the piezoelectric member 160 into the mounting groove 216 to be electrically connected to the electrodes 125 , 135 of the first connector 120 and the ground connector 130 in S 270 .
  • This configuration is similar to that of the first embodiment, and thus a detailed description thereof will be omitted herein.
  • a sound matching layer 170 is inserted into the mounting groove 216 to stack the sound matching layer 170 on the piezoelectric member 160 .
  • the mounting groove 216 is formed on the backing members 211 , 212 , 213 such that the piezoelectric member 160 can be inserted into the mounting groove 216 to thereby reduce the size of the probe and allow easy connection between the piezoelectric member 160 and the first connector 120 and the ground connector 130 while ensuring an enhanced support structure of the piezoelectric member 160 and preventing defective connection and deterioration in performance of the probe caused thereby.
  • FIG. 11 is a perspective view of a probe for an ultrasonic diagnostic apparatus according to a third embodiment of the invention
  • FIG. 12 is a schematic view of the probe shown in FIG. 11 .
  • a probe 300 for an ultrasonic diagnostic apparatus includes a backing layer 310 , a first connector 120 , a second connector 380 , ground connectors 130 , a first electrode layer 340 , a second electrode layer 350 , a piezoelectric member 360 , and a sound matching layer 370 .
  • the backing layer 310 is disposed behind the piezoelectric member 360 .
  • the backing layer 310 includes multiple backing members 311 , 312 , 313 , 314 , 315 and is formed by bonding the backing members 311 , 312 , 313 , 314 , 315 .
  • the backing layer 310 may be formed of a material containing a rubber to which epoxy, tungsten powder, and the like are added.
  • a mounting groove 316 is formed on the backing layer 310 .
  • the mounting groove 316 is formed on the front side of the backing layer 310 adjacent to the piezoelectric member 360 .
  • the piezoelectric member 360 is inserted into the mounting groove 316 .
  • the mounting groove 316 is depressed into the backing layer 310 in a shape corresponding to the piezoelectric member 360 to allow the piezoelectric member 360 to be inserted into the backing layer 310 .
  • the first connector 120 is bonded between the backing members 312 , 313 .
  • the first connector 120 is inserted and bonded between two backing members 312 , 313 among the five backing members 311 , 312 , 313 , 314 , 315 .
  • One end of the first connector 120 bonded between the backing members 312 , 313 is exposed on a front side of the backing layer 310 adjacent to the piezoelectric member 360 , and the other end thereof extends through a rear side of the backing layer 310 .
  • electrodes 125 of the first connector 120 are exposed on the front side of the backing layer 310 .
  • the second connector 380 includes an insulation part (reference numeral omitted) and electrodes 385 .
  • the multiple electrodes 385 are formed on the insulation part and spaced from each other in the arrangement direction.
  • the second connector 380 is inserted and bonded between the backing members 313 , 314 .
  • the second connector 380 is disposed in the height direction of the backing members 311 , 312 , 313 , 314 , 315 , and the backing members 313 , 314 are bonded to opposite sides of the second connector 380 .
  • One end of the second connector 380 bonded between the backing members 313 , 314 is exposed on the front side of the backing layer 310 adjacent to the piezoelectric member 160 , and the other end thereof extends through the rear side of the backing layer 310 .
  • the electrodes 385 of the second connector 380 are exposed on the front side of the backing layer 310 .
  • the second connector 380 may include a flexible printed circuit board (FPCB), a printed circuit board (PCB) or any configuration capable of supplying signals or electricity.
  • FPCB flexible printed circuit board
  • PCB printed circuit board
  • the second connector 380 is spaced from the first connector 120 by a width occupied by the backing member 313 , and the electrodes 385 of the second connector 380 are disposed to alternate with the electrodes 125 of the first connector 120 .
  • the electrodes 125 , 385 of the first and second connectors 120 , 380 are signal electrodes that are electrically connected to a first electrode 361 of the piezoelectric member 360 .
  • ground connectors 130 are bonded between the backing members 311 , 312 , 314 , 315 .
  • Each of the ground connectors 130 may comprise multiple ground connectors 130 , and the number of ground connectors 130 corresponds to a sum of the number of first connectors 120 and the number of second connectors 380 . In this embodiment, two ground connectors 130 are illustrated.
  • one of the ground connectors 130 is disposed adjacent to the first connector 120 and is bonded between the backing members 311 , 312 .
  • the other ground connector 130 is disposed adjacent to the second connector 380 and is bonded between the backing members 314 , 315 .
  • each ground connector 130 bonded between the backing members 311 , 312 , 314 , 315 is exposed on the front side of the backing layer 310 adjacent to the piezoelectric member 360 , and the other end thereof extends through the rear side of the backing layer 310 .
  • the electrodes 135 of each ground connector 130 are exposed on the front side of the backing layer 310 .
  • the backing layer 310 includes first and second electrode layers 340 , 350 .
  • the first electrode layer 340 is formed on the mounting groove 316 and the second electrode layer 350 is formed on an upper step section of the backing layer 310 to be spaced from the first electrode layer 340 .
  • the first electrode layer 340 is disposed between the mounting groove 316 and the piezoelectric member 360 to be electrically connected to the electrodes 125 , 385 of the first and second connectors 120 , 380
  • the second electrode layer 350 is disposed between an upper step section of the backing layer 310 and a sound matching layer 370 described below to be electrically connected to the electrodes 135 of the ground connectors 130 .
  • the piezoelectric member 360 is electrically connected to the electrodes 125 , 385 of the first and second connectors 120 , 380 and the electrodes 135 of the ground connectors 130 .
  • the piezoelectric member 360 is formed with first and second electrodes 361 and 365 .
  • the first and second electrodes 361 and 365 are disposed on front and rear sides of the piezoelectric member 360 , respectively.
  • the first electrode 361 is electrically connected to the first electrode layer 340 .
  • the first and second electrodes 361 and 365 may be formed of a highly electrically conductive metal.
  • one of the first and second electrodes 361 and 365 serves as a positive pole or signal electrode of the piezoelectric member 360
  • the other serves as a negative pole or ground electrode of the piezoelectric member 360 .
  • the first and second electrodes 361 and 365 are separated from each other to allow the signal electrode and the ground electrode to be separated from each other.
  • the first and second electrodes 361 and 365 are illustrated as serving as the signal electrode and the ground electrode, respectively.
  • the piezoelectric member 360 is electrically connected to the electrodes 125 , 385 of the first and second connectors 120 , 380 via the first electrode layer 340 and the first electrode 361 which are electrically connected to each other.
  • the sound matching layer 370 includes an electrode part 375 .
  • the electrode part 375 may be formed of a highly electrically conductive material by deposition, sputtering, plating, spraying, or the like.
  • the electrode part 375 is electrically connected to a second electrode 365 of the piezoelectric member 360 .
  • the piezoelectric member 360 is electrically connected to the electrode part 375 .
  • the electrode part 375 is illustrated as being formed on a rear side of a first sound matching layer 372 adjacent to the piezoelectric member 360 , but the invention is not limited thereto.
  • the sound matching layer 370 may be formed with an electrode part 375 that entirely surrounds the sound matching layer 370 .
  • the sound matching layer 370 may be entirely or partially (for example, the first sound matching layer) formed of an electrically conductive material so as to be directly electrically connected to the piezoelectric member 360 .
  • the sound matching layer can be realized in various forms.
  • the piezoelectric member 360 may be composed of multiple piezoelectric members 360 arranged in an array to provide multiple channels. Accordingly, each of the first electrode layer 340 , the second electrode layer 350 , and the electrode part 375 may also be composed of multiple components arranged in an array so as to correspond to the multiple piezoelectric members 360 arranged in an array.
  • the piezoelectric members 360 , first electrode layers 340 , second electrode layers 350 , and electrode parts 375 arranged in an array are correspondingly connected to the electrodes 125 , 385 of the first and second connectors 120 , 380 and to the electrodes 135 of the ground connectors 130 .
  • FIG. 13 is a flowchart of a method of manufacturing the probe for an ultrasonic diagnostic apparatus according to the third embodiment of the invention
  • FIGS. 14 and 15 are views of a process of forming the backing layer of the probe according to the third embodiment of the invention.
  • FIG. 16 is a view of a process of forming first and second electrode layers on the backing layer of the probe according to the third embodiment of the invention.
  • a mounting groove 316 is formed on a backing layer 310 , as shown in FIG. 14 , in S 310 .
  • the backing members 312 , 314 are formed to have steps at both sides of the backing member 313 interposed between the backing members 312 , 314 .
  • the backing members 312 , 314 are disposed adjacent to the backing layer 313 interposed between the backing members 312 , 314 by forming lower step sections to be coplanar with the backing layer 313 .
  • the backing members 311 , 315 disposed at opposite sides of the backing members 312 , 314 are formed to be coplanar with upper step sections of the backing members 312 , 314 which are formed at both sides of the backing member 313 interposed between the backing members 312 , 314 .
  • electrodes 125 are formed on a first connector 120 in S 320
  • electrodes 385 are formed on a second connector 380 in S 330
  • ground connectors 130 are formed in S 340 .
  • the first and second connectors 120 , 380 and the ground connectors 130 are bonded between backing members 311 , 312 , 313 , 314 , 315 to form a backing layer 310 in S 350 , as shown in FIG. 15 .
  • the backing members 311 , 312 , 313 , 314 , 315 are formed of a material including a rubber to which epoxy resin, tungsten powder, and the like are added. Then, with the ground connectors 130 disposed between the backing members 311 , 312 in the height direction, the backing members 311 , 312 are bonded to opposite sides of the ground connectors 130 .
  • the backing members 312 , 313 are bonded to opposite sides of the first connector 120
  • the backing members 313 , 314 are bonded to opposite sides of the second connector 380 .
  • the backing members 314 , 315 are bonded to opposite sides of the ground connectors 130 , thereby completing formation of the backing layer 310 .
  • One end of each of the first and second connectors 120 , 380 and the ground connectors 130 bonded between the backing members 311 , 312 , 313 , 314 , 315 is exposed on the front side of the backing layer 310 adjacent to the piezoelectric member 360 , and the other end thereof extends through the rear side of the backing layer 310 .
  • the electrodes 385 of the second connector 380 are exposed on the front side of the backing layer 310 .
  • a first electrode layer 340 is formed on the backing layer 310 to be electrically connected to the piezoelectric member 360 and the electrodes 125 , 385 of the first and second connectors 120 , 380 in S 360 , as shown in FIG. 16 .
  • the first electrode layer 340 may be formed on the mounting groove 316 .
  • the rear side of the first electrode layer 340 adjoining the surface of the mounting groove 316 is electrically connected to the electrodes 125 of the first connectors 120 .
  • a second electrode layer 350 is formed on the backing layer 310 to be electrically connected to the piezoelectric member 360 and the electrodes 135 of the ground connectors 130 in S 370 .
  • the second electrode layer 350 may be formed on the mounting groove 316 .
  • the second electrode layer 350 is spaced from the first electrode layer 340 and may be formed on an upper step section of the backing layer 310 disposed outside the mounting groove 316 .
  • the rear side of the second electrode layer 350 adjoining the surface of the upper step section of the backing layer 310 is electrically connected to the electrodes 135 of the ground connectors 130 .
  • the piezoelectric member 360 is stacked on the backing layer 310 by inserting the piezoelectric member 360 into the mounting groove 316 to be electrically connected to the electrodes 125 , 385 of the first and second connectors 120 , 380 and to the electrodes 135 of the ground connectors 130 in S 380 .
  • a first electrode 361 of the piezoelectric member 360 is electrically connected to the front side of the first electrode layer 340 .
  • the piezoelectric member 360 is electrically connected to the electrodes 125 , 385 of the first and second connectors 120 , 380 via the first electrode layer 340 and the first electrode 361 which are electrically connected to each other.
  • the piezoelectric member 360 is electrically connected to the electrodes 135 of the ground connectors 130 via the sound matching layer 370 .
  • the piezoelectric member 360 is stacked on the backing layer 310 , the sound matching layer 370 is stacked on the piezoelectric member 360 .
  • a second electrode 365 of the piezoelectric member 360 is electrically connected to an electrode part 375 of the sound matching layer 370 .
  • the piezoelectric member 360 is electrically connected to the electrodes 135 of the ground connectors 130 via the second electrode layer 350 , the electrode part 375 , and the second electrode 365 which are electrically connected to each other.
  • the piezoelectric member 360 may be divided into multiple piezoelectric members 360 spaced a predetermined distance from each other and arranged side by side in an array, so that the multiple piezoelectric members 360 can be used as multiple channels corresponding to the multiple electrodes 125 , 385 , 135 formed on the first, second, and ground connectors 120 , 380 , 130 .
  • each of the first and second electrode layers 340 , 350 and the electrode part 375 is also divided into multiple components so as to correspond to first electrodes 361 and second electrodes 365 of the piezoelectric members 360 .
  • the multiple first electrode layers 340 , the multiple second electrode layers 350 , and the multiple electrode parts 375 may be arranged corresponding to the first and second electrodes 361 , 365 of the multiple piezoelectric members 360 , respectively.
  • stacks of the backing layer 310 and the piezoelectric member 360 are diced by a dicing machine (not shown). Dicing is performed to a depth such that the first and second electrode layers 340 , 350 and the electrode part 375 can be reliably divided into the multiple first and second electrode layers and the multiple electrode parts, respectively.
  • the piezoelectric member 360 is divided into the multiple piezoelectric members 360 spaced a predetermined distance from each other, such that the first and second electrodes 361 , 365 formed on each of the piezoelectric members 360 can be electrically completely separated from first and second electrodes 361 and 365 formed on other piezoelectric members 360 adjacent thereto.
  • each of the first electrodes layers 340 is electrically completely separated from other first electrode layers 340 adjacent thereto such that only one first electrode layer 340 can be connected to a first electrode 361 of one piezoelectric member 360 .
  • each of the second electrodes layers 350 is electrically completely separated from other second electrode layers 350 adjacent thereto such that a single divided second electrode layer 350 and a single divided electrode part 375 can be connected to a second electrode 365 formed on a single divided piezoelectric member 360 .
  • FIG. 17 is a view showing a separated state of the backing layer of the probe according to the third embodiment of the invention.
  • FIG. 17 separation between the backing layer, the first and second connectors and the ground connectors by dicing will be described.
  • the first and second electrode layers are omitted.
  • the backing layer 310 by dicing the stacks of the backing layer 310 and the piezoelectric member 360 (see FIG. 12 ), the backing layer 310 , the first electrode layer 340 (see FIG. 12 ) formed on the backing layer 310 , and the first and second connectors 120 and 380 electrically connected to the first electrode layer 340 are divided as follows.
  • each of the divided first electrodes layers 340 is electrically completely separated from other first electrode layers 340 adjacent thereto.
  • only one of the electrodes 125 , 385 of the first and second connectors 120 , 380 is connected to one first electrode layer 340 .
  • portions of the first connector 120 corresponding to center lines between the respective electrodes 125 of the first connector 120 disposed in the arrangement direction are divided and portions of the second connector 380 corresponding to center lines between the respective electrodes 385 of the second connector 380 disposed in the arrangement direction are divided.
  • the respective dividing lines (d) formed on the first electrode layer 340 to divide the first electrode layer 340 by dicing are formed between the respective electrodes 125 of the first connector 120 and between the respective electrodes 385 of the second connector 380 disposed to alternate with the respective electrodes 125 of the first connector 120 .
  • the piezoelectric member 360 is electrically connected to the first and second connectors 120 , 380 , that is, multiple connectors 120 , 380 , so that distances between the first and second connectors 120 , 380 and the ground connectors 130 can be decreased.
  • the probe 300 has narrow spaces between the electrodes 125 , 385 of the first and second connectors 120 , 380 , that is, signal electrodes, and the electrodes of the ground connectors 130 , that is, ground electrodes, thereby reducing noise.
  • the multiple connectors 120 , 130 , 380 are bonded in the backing layer 310 and the electrodes 125 of the first connector 120 are disposed to alternate with the electrodes 385 of the second connector 380 , so that the respective components of the probe 300 divided by dicing may have sufficient strength and be arranged at a narrower pitch to have a high density and a small size.
  • a first connector and a ground connector or first and second connectors and the ground connector are connected to a piezoelectric member via first and second electrode layers instead of using a complicated and laborious soldering operation in manufacture of the probe, thereby enabling easy connection between the piezoelectric member and the connectors, preventing deterioration in performance caused by defective connection therebetween, and preventing deterioration in performance of the piezoelectric member caused by heat during manufacture.
  • the first connector and the ground connector or the first and second connectors and the ground connector are bonded between backing members, instead of being disposed between a backing layer and the piezoelectric member, to be electrically connected to the piezoelectric member via the first and second electrode layers, thereby preventing deterioration in performance caused by defective connection between the piezoelectric member, the first connector and the ground connector or between the piezoelectric member, the first and second connectors and the ground connector, and preventing damage of the first and second connectors and the ground connector caused by bending.
  • individual formation and maintenance of the backing layer can be achieved by bonding the first connector and the ground connector or the first and second connectors and the ground connector to the backing members and forming the first and second electrode layers thereon, so that the backing layer can be prepared in desired shapes and dimensions so as to be easily assembled to other components, thereby enabling easy manufacture of the probe at lower cost while enhancing uniformity of final products.
  • the probe has narrow spaces between signal electrodes and ground electrodes, thereby reducing noise.
  • the piezoelectric member is inserted into a mounting groove formed on the backing layer, thereby enabling size reduction and easy connection between the piezoelectric member, the first connector and the ground connector or between the piezoelectric member, the first and second connectors, and the ground connector while providing a more rigid support structure to the piezoelectric member to prevent deterioration in performance caused by defective connection therebetween.
  • electrodes of the first connector alternate with those of the second connector, so that respective components divided by dicing have sufficient strength at a narrower pitch to have a high density and a small size.

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE47414E1 (en) 2010-09-06 2019-06-04 Samsung Medison Co., Ltd. Probe for ultrasonic diagnostic apparatus
USRE48051E1 (en) 2010-09-06 2020-06-16 Samsung Medison Co., Ltd. Probe for ultrasonic diagnostic apparatus
US20180021815A1 (en) * 2015-05-22 2018-01-25 Halliburton Energy Services, Inc. Ultrasonic Transducers with Piezoelectric Material Embedded in Backing
US11117166B2 (en) * 2015-05-22 2021-09-14 Halliburton Energy Services, Inc. Ultrasonic transducers with piezoelectric material embedded in backing

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US9538986B2 (en) 2017-01-10
JP2010220216A (ja) 2010-09-30
EP3189902A1 (de) 2017-07-12
EP2230028A1 (de) 2010-09-22
US20150313574A1 (en) 2015-11-05
KR101137262B1 (ko) 2012-04-20
EP2230028B1 (de) 2017-12-27
KR20100104535A (ko) 2010-09-29
US20100241004A1 (en) 2010-09-23

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