US8913229B2 - Multi-stage system, a control method therefor, and a lithographic apparatus - Google Patents
Multi-stage system, a control method therefor, and a lithographic apparatus Download PDFInfo
- Publication number
- US8913229B2 US8913229B2 US13/477,669 US201213477669A US8913229B2 US 8913229 B2 US8913229 B2 US 8913229B2 US 201213477669 A US201213477669 A US 201213477669A US 8913229 B2 US8913229 B2 US 8913229B2
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- US
- United States
- Prior art keywords
- stage
- stator
- magnets
- subset
- electric coils
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/203—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure comprising an imagewise exposure to electromagnetic radiation or corpuscular radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
- G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D3/00—Control of position or direction
- G05D3/12—Control of position or direction using feedback
- G05D3/125—Control of position or direction using feedback using discrete position sensor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
Description
a sensor system to determine the position of the first and second stage relative to the stator;
a control unit to position the first and second stage relative to the stator in the first direction, wherein the control unit is configured to:
the multi-stage system further comprising:
a sensor system to determine the position of the first and second stage relative to the carrier;
a control unit to position the first and second stage relative to the carrier in the first and second direction, wherein the control unit is configured to:
said method comprising:
-
- determining the position of the first stage relative to the stator in the first direction;
- selecting a first subset of electric coils that are capable of having a non-negligible interaction with the magnetic field of the system of magnets of the first stage in the determined position of the first stage;
- determining the position of the second stage relative to the stator in the first direction;
- selecting a second subset of electric coils that are capable of having a non-negligible interaction with the magnetic field of the system of magnets of the second stage in the determined position of the second stage; and
- activating the electric coils of the first and second subset in order to position the first and second stage relative to the stator,
wherein activating the electric coils of the first and second subset comprises:
2. In scan mode, the patterning device support (e.g. mask table) MT or “mask support” and the substrate table WT or “substrate support” are scanned synchronously while a pattern imparted to the radiation beam is projected onto a target portion C (i.e. a single dynamic exposure). The velocity and direction of the substrate table WT or “substrate support” relative to the patterning device support (e.g. mask table) MT or “mask support” may be determined by the (de-)magnification and image reversal characteristics of the projection system PS. In scan mode, the maximum size of the exposure field limits the width (in the non-scanning direction) of the target portion in a single dynamic exposure, whereas the length of the scanning motion determines the height (in the scanning direction) of the target portion.
3. In another mode, the patterning device support (e.g. mask table) MT or “mask support” is kept essentially stationary holding a programmable patterning device, and the substrate table WT or “substrate support” is moved or scanned while a pattern imparted to the radiation beam is projected onto a target portion C. In this mode, generally a pulsed radiation source is employed and the programmable patterning device is updated as required after each movement of the substrate table WT or “substrate support” or in between successive radiation pulses during a scan. This mode of operation can be readily applied to maskless lithography that utilizes programmable patterning device, such as a programmable mirror array of a type as referred to above.
-
- determine the position of the
first stage 3 relative to thestator 1 in the first and second direction based on the output of the sensor system; - select a first subset of
electric coils 5 that are capable of having a non-negligible interaction with the first magnetic field of the first system of magnets of thefirst stage 3 in the determined position of thefirst stage 3; - determine the position of the
second stage 7 relative to thestator 1 in the first and second direction based on the output of the sensor system; - select a second subset of
electric coils 5 that are capable of having a non-negligible interaction with the second magnetic field of the second system of magnets of thesecond stage 7 in the determined position of thesecond stage 7; - activate the electric coils of the first and second subset using the drive signal DS in order to position the first and
second stage stator 1,
wherein the control unit or controller CU is further configured, prior to activating the electric coils of the first and second subset, to determine the electric coils that are part of both the first and second subset and to exclude at least one electric coil that is part of both the first and second subset from activating.
- determine the position of the
Claims (15)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/477,669 US8913229B2 (en) | 2011-05-25 | 2012-05-22 | Multi-stage system, a control method therefor, and a lithographic apparatus |
US14/542,263 US9128390B2 (en) | 2011-05-25 | 2014-11-14 | Multi-stage system, a control method therefor, and a lithographic apparatus |
US14/817,998 US9442394B2 (en) | 2011-05-25 | 2015-08-04 | Multi-stage system, a control method therefor, and a lithographic apparatus |
US15/258,758 US9726988B2 (en) | 2011-05-25 | 2016-09-07 | Multi-stage system, a control method therefor, and a lithographic apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161489796P | 2011-05-25 | 2011-05-25 | |
US13/477,669 US8913229B2 (en) | 2011-05-25 | 2012-05-22 | Multi-stage system, a control method therefor, and a lithographic apparatus |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/542,263 Continuation US9128390B2 (en) | 2011-05-25 | 2014-11-14 | Multi-stage system, a control method therefor, and a lithographic apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
US20120300186A1 US20120300186A1 (en) | 2012-11-29 |
US8913229B2 true US8913229B2 (en) | 2014-12-16 |
Family
ID=47198208
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/477,669 Active 2033-06-22 US8913229B2 (en) | 2011-05-25 | 2012-05-22 | Multi-stage system, a control method therefor, and a lithographic apparatus |
US14/542,263 Active US9128390B2 (en) | 2011-05-25 | 2014-11-14 | Multi-stage system, a control method therefor, and a lithographic apparatus |
US14/817,998 Active US9442394B2 (en) | 2011-05-25 | 2015-08-04 | Multi-stage system, a control method therefor, and a lithographic apparatus |
US15/258,758 Active US9726988B2 (en) | 2011-05-25 | 2016-09-07 | Multi-stage system, a control method therefor, and a lithographic apparatus |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/542,263 Active US9128390B2 (en) | 2011-05-25 | 2014-11-14 | Multi-stage system, a control method therefor, and a lithographic apparatus |
US14/817,998 Active US9442394B2 (en) | 2011-05-25 | 2015-08-04 | Multi-stage system, a control method therefor, and a lithographic apparatus |
US15/258,758 Active US9726988B2 (en) | 2011-05-25 | 2016-09-07 | Multi-stage system, a control method therefor, and a lithographic apparatus |
Country Status (6)
Country | Link |
---|---|
US (4) | US8913229B2 (en) |
JP (5) | JP5730816B2 (en) |
KR (1) | KR101389883B1 (en) |
CN (1) | CN102799072B (en) |
NL (1) | NL2008696A (en) |
TW (1) | TWI510872B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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NL2008696A (en) | 2011-05-25 | 2012-11-27 | Asml Netherlands Bv | A multi-stage system, a control method therefor, and a lithographic apparatus. |
WO2013059934A1 (en) | 2011-10-27 | 2013-05-02 | The University Of British Columbia | Displacement devices and methods for fabrication, use and control of same |
WO2013153744A1 (en) * | 2012-04-13 | 2013-10-17 | 株式会社ニコン | Mobile body device, exposure device, and device production method |
JP6373992B2 (en) | 2013-08-06 | 2018-08-15 | ザ・ユニバーシティ・オブ・ブリティッシュ・コロンビア | Displacement device and method and apparatus for detecting and estimating motion associated therewith |
WO2015179962A1 (en) | 2014-05-30 | 2015-12-03 | The University Of British Columbia | Displacement devices and methods for fabrication, use and control of same |
WO2015184553A1 (en) | 2014-06-07 | 2015-12-10 | The University Of British Columbia | Methods and systems for controllably moving multiple moveable stages in a displacement device |
WO2015188281A1 (en) | 2014-06-14 | 2015-12-17 | The University Of British Columbia | Displacement devices, moveable stages for displacement devices and methods for fabrication, use and control of same |
CN107852082B (en) | 2015-07-06 | 2020-05-26 | 不列颠哥伦比亚大学 | Method and system for controllably moving one or more movable stages on a displacement device |
WO2017137181A1 (en) * | 2016-02-12 | 2017-08-17 | Asml Netherlands B.V. | Multiphase linear motor, multiphase planar motor, stage, lithographic apparatus and device manufacturing method |
US11303175B2 (en) | 2016-02-12 | 2022-04-12 | Asml Netherlands B.V. | Multiphase linear motor, multiphase planar motor, stage, lithographic apparatus and device manufacturing method |
DE102021100200A1 (en) * | 2021-01-08 | 2022-07-14 | benjamin Systems GmbH | Surface motor and method for driving a surface motor |
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2012
- 2012-04-24 NL NL2008696A patent/NL2008696A/en not_active Application Discontinuation
- 2012-05-08 TW TW101116396A patent/TWI510872B/en active
- 2012-05-21 CN CN201210158034.4A patent/CN102799072B/en active Active
- 2012-05-22 US US13/477,669 patent/US8913229B2/en active Active
- 2012-05-24 KR KR1020120055386A patent/KR101389883B1/en active IP Right Grant
- 2012-05-24 JP JP2012118423A patent/JP5730816B2/en active Active
-
2014
- 2014-11-14 US US14/542,263 patent/US9128390B2/en active Active
- 2014-12-02 JP JP2014243879A patent/JP5890509B2/en active Active
-
2015
- 2015-08-04 US US14/817,998 patent/US9442394B2/en active Active
- 2015-08-12 JP JP2015159465A patent/JP6081538B2/en active Active
-
2016
- 2016-09-07 US US15/258,758 patent/US9726988B2/en active Active
-
2017
- 2017-01-18 JP JP2017006689A patent/JP6343042B2/en active Active
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2018
- 2018-05-17 JP JP2018095138A patent/JP6580203B2/en active Active
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Also Published As
Publication number | Publication date |
---|---|
US20160377993A1 (en) | 2016-12-29 |
KR101389883B1 (en) | 2014-04-29 |
US9128390B2 (en) | 2015-09-08 |
US20120300186A1 (en) | 2012-11-29 |
JP2015207024A (en) | 2015-11-19 |
NL2008696A (en) | 2012-11-27 |
CN102799072B (en) | 2014-10-15 |
US9442394B2 (en) | 2016-09-13 |
JP6343042B2 (en) | 2018-06-13 |
JP2012248838A (en) | 2012-12-13 |
JP5890509B2 (en) | 2016-03-22 |
JP2017102470A (en) | 2017-06-08 |
JP5730816B2 (en) | 2015-06-10 |
JP6081538B2 (en) | 2017-02-15 |
US9726988B2 (en) | 2017-08-08 |
US20150062554A1 (en) | 2015-03-05 |
US20150338752A1 (en) | 2015-11-26 |
JP2015092584A (en) | 2015-05-14 |
KR20120132385A (en) | 2012-12-05 |
JP6580203B2 (en) | 2019-09-25 |
TW201303528A (en) | 2013-01-16 |
TWI510872B (en) | 2015-12-01 |
CN102799072A (en) | 2012-11-28 |
JP2018159934A (en) | 2018-10-11 |
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