US8116092B2 - Circuit board and method of manufacturing same - Google Patents
Circuit board and method of manufacturing same Download PDFInfo
- Publication number
- US8116092B2 US8116092B2 US12/035,819 US3581908A US8116092B2 US 8116092 B2 US8116092 B2 US 8116092B2 US 3581908 A US3581908 A US 3581908A US 8116092 B2 US8116092 B2 US 8116092B2
- Authority
- US
- United States
- Prior art keywords
- land pads
- pair
- insulating layer
- circuit board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 229910000679 solder Inorganic materials 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 23
- 238000007689 inspection Methods 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 17
- 239000002184 metal Substances 0.000 description 24
- 229910052751 metal Inorganic materials 0.000 description 24
- 238000012360 testing method Methods 0.000 description 8
- 239000006071 cream Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 238000007648 laser printing Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000007736 thin film deposition technique Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/168—Wrong mounting prevention
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007041755A JP4912917B2 (en) | 2007-02-22 | 2007-02-22 | Circuit board, portable electronic device, and circuit board manufacturing method |
JP2007-041755 | 2007-02-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20080212300A1 US20080212300A1 (en) | 2008-09-04 |
US8116092B2 true US8116092B2 (en) | 2012-02-14 |
Family
ID=39732912
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/035,819 Expired - Fee Related US8116092B2 (en) | 2007-02-22 | 2008-02-22 | Circuit board and method of manufacturing same |
Country Status (3)
Country | Link |
---|---|
US (1) | US8116092B2 (en) |
JP (1) | JP4912917B2 (en) |
CN (1) | CN101252807B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104080270A (en) * | 2013-03-25 | 2014-10-01 | 飞思卡尔半导体公司 | Separation pad for circuit board |
US9806005B2 (en) * | 2014-04-23 | 2017-10-31 | Kyocera Corporation | Electronic element mounting substrate and electronic device |
TWI620475B (en) * | 2015-01-12 | 2018-04-01 | 南亞電路板股份有限公司 | Printed circuit board and method for fabricating the same |
CN108139395A (en) * | 2015-10-16 | 2018-06-08 | 东洋纺株式会社 | Immunochromatographytest test piece |
JP6834979B2 (en) * | 2015-12-02 | 2021-02-24 | 東洋紡株式会社 | Immunochromatographic test piece |
CN110610932A (en) * | 2019-08-27 | 2019-12-24 | 华东光电集成器件研究所 | Method for preventing conductive band of thick film integrated circuit from breaking |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4254445A (en) * | 1979-05-07 | 1981-03-03 | International Business Machines Corporation | Discretionary fly wire chip interconnection |
US4414741A (en) * | 1981-05-22 | 1983-11-15 | Augat Inc. | Process for interconnecting components on a PCB |
JPS624165A (en) | 1985-06-27 | 1987-01-10 | Shinko Electric Co Ltd | Tension control method for winder or rewinder |
JPH0786729A (en) | 1993-09-09 | 1995-03-31 | Ibiden Co Ltd | Connection structure of jumper land in printed-wiring board and connection of jumper land |
US5877033A (en) * | 1997-03-10 | 1999-03-02 | The Foxboro Company | System for detection of unsoldered components |
US20030098178A1 (en) * | 2001-11-27 | 2003-05-29 | Nec Corporation | Printed circuit board having test points formed on sides thereof |
JP2003168501A (en) | 2001-11-29 | 2003-06-13 | Toko Inc | Jumper chip and its manufacturing method |
US20030164551A1 (en) * | 2002-03-04 | 2003-09-04 | Lee Teck Kheng | Method and apparatus for flip-chip packaging providing testing capability |
US20040065473A1 (en) * | 2002-10-08 | 2004-04-08 | Siliconware Precision Industries, Ltd., Taiwan | Warpage preventing substrate |
US20070103182A1 (en) * | 2005-08-29 | 2007-05-10 | Kyocera Corporation | Circuit Board, Electronic Device Including a Circuit Board, and Method of Manufacturing a Circuit Board |
US20080190651A1 (en) * | 2005-03-01 | 2008-08-14 | Arno Klamminger | Multi-Layered Printed Circuit Board Comprising Conductive Test Surfaces, and Method for Determining a Misalignment of an Inner Layer |
US20090000814A1 (en) * | 2004-12-01 | 2009-01-01 | Primavera Anthony A | Multiple layer printed circuit board having misregistration testing pattern |
US7699321B2 (en) * | 2004-10-15 | 2010-04-20 | Hainbuch Gmbh Spannende Technik | Clamping device and method for the production of a clamping device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03120065A (en) * | 1989-10-03 | 1991-05-22 | Oki Electric Ind Co Ltd | Printer |
JP2818911B2 (en) * | 1991-03-20 | 1998-10-30 | イビデン株式会社 | Printed wiring board |
JPH0563327A (en) * | 1991-09-04 | 1993-03-12 | Canon Inc | Printed wiring board with land for inspection use and inspecting method thereof |
JP4423630B2 (en) * | 2000-08-03 | 2010-03-03 | ミネベア株式会社 | Microchip controller board and manufacturing method thereof |
JP2002280693A (en) * | 2001-03-19 | 2002-09-27 | Denso Corp | Method for mounting electronic part |
JP3692314B2 (en) * | 2001-07-17 | 2005-09-07 | 日東電工株式会社 | Printed circuit board |
JP2005032815A (en) * | 2003-07-08 | 2005-02-03 | Alps Electric Co Ltd | Flexible wiring board and its manufacturing method |
JP2006005151A (en) * | 2004-06-17 | 2006-01-05 | Casio Comput Co Ltd | Flexible printed wiring board and its ground connection structure |
-
2007
- 2007-02-22 JP JP2007041755A patent/JP4912917B2/en not_active Expired - Fee Related
-
2008
- 2008-02-22 CN CN2008100814466A patent/CN101252807B/en not_active Expired - Fee Related
- 2008-02-22 US US12/035,819 patent/US8116092B2/en not_active Expired - Fee Related
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4254445A (en) * | 1979-05-07 | 1981-03-03 | International Business Machines Corporation | Discretionary fly wire chip interconnection |
US4414741A (en) * | 1981-05-22 | 1983-11-15 | Augat Inc. | Process for interconnecting components on a PCB |
JPS624165A (en) | 1985-06-27 | 1987-01-10 | Shinko Electric Co Ltd | Tension control method for winder or rewinder |
JPH0786729A (en) | 1993-09-09 | 1995-03-31 | Ibiden Co Ltd | Connection structure of jumper land in printed-wiring board and connection of jumper land |
US5877033A (en) * | 1997-03-10 | 1999-03-02 | The Foxboro Company | System for detection of unsoldered components |
US20030098178A1 (en) * | 2001-11-27 | 2003-05-29 | Nec Corporation | Printed circuit board having test points formed on sides thereof |
JP2003168501A (en) | 2001-11-29 | 2003-06-13 | Toko Inc | Jumper chip and its manufacturing method |
US20030164551A1 (en) * | 2002-03-04 | 2003-09-04 | Lee Teck Kheng | Method and apparatus for flip-chip packaging providing testing capability |
US7915718B2 (en) * | 2002-03-04 | 2011-03-29 | Micron Technology, Inc. | Apparatus for flip-chip packaging providing testing capability |
US20040065473A1 (en) * | 2002-10-08 | 2004-04-08 | Siliconware Precision Industries, Ltd., Taiwan | Warpage preventing substrate |
US7699321B2 (en) * | 2004-10-15 | 2010-04-20 | Hainbuch Gmbh Spannende Technik | Clamping device and method for the production of a clamping device |
US20090000814A1 (en) * | 2004-12-01 | 2009-01-01 | Primavera Anthony A | Multiple layer printed circuit board having misregistration testing pattern |
US20080190651A1 (en) * | 2005-03-01 | 2008-08-14 | Arno Klamminger | Multi-Layered Printed Circuit Board Comprising Conductive Test Surfaces, and Method for Determining a Misalignment of an Inner Layer |
US20070103182A1 (en) * | 2005-08-29 | 2007-05-10 | Kyocera Corporation | Circuit Board, Electronic Device Including a Circuit Board, and Method of Manufacturing a Circuit Board |
Also Published As
Publication number | Publication date |
---|---|
JP4912917B2 (en) | 2012-04-11 |
JP2008205335A (en) | 2008-09-04 |
CN101252807A (en) | 2008-08-27 |
CN101252807B (en) | 2011-02-02 |
US20080212300A1 (en) | 2008-09-04 |
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Legal Events
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Owner name: KYOCERA CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ISHIDA, YUJI;TAKEKAWA, HIDETO;HARIKAE, MASATO;AND OTHERS;REEL/FRAME:020974/0064 Effective date: 20080421 |
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Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
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Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
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FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20240214 |