US799218A - Process of depositing metal on non-metallic bodies. - Google Patents

Process of depositing metal on non-metallic bodies. Download PDF

Info

Publication number
US799218A
US799218A US24110905A US1905241109A US799218A US 799218 A US799218 A US 799218A US 24110905 A US24110905 A US 24110905A US 1905241109 A US1905241109 A US 1905241109A US 799218 A US799218 A US 799218A
Authority
US
United States
Prior art keywords
mold
silver
depositing metal
metallic
metallic bodies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US24110905A
Inventor
Cassius F Blacklidge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US24110905A priority Critical patent/US799218A/en
Application granted granted Critical
Publication of US799218A publication Critical patent/US799218A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Description

- alcohol.
UNITED STATES PATENT OFFICE.
PROCESS OF DEPOSITING METAL ON NON-METALLIC BODIES- Specification of Letters Patent.
Patented Sept. 12, 1905.
Application filed n ary 14, 1905. Serial No. 241,109.
To 11,2] whom it may concern.-
Be it known that I, CASSIUS F. Brnoxmnon, a citizen of the United States, residing at lV-ashington, in theDistrict of Columbia, have invented new and useful Improvements in Processes of Depositing Metal on Non-Metallic Bodies, of which the following is a specification.
My invention pertains to depositing or precipitating metal on non-metallic bodies; and it contemplates the provision of a process calculated to assure the quick deposition or precipitation of a compact and uniform surface of metallic silver upon a wax or other nonmetallic mold with a view of making the mold electrically conductive, and thereby accelerating and rendering certain and perfect a subsequent operation of depositing metal, preferably nickel, on the mold by electrolysis to make an elect-rotype or the like.
In the preferable practice of my invention I prepare a silver solution by adding nitrate of silver to water in about the proportions of twenty grains of the former to one ounce of the latter and adding liquid ammonia until the precipitate is redissolved. Ialso prepare a reducing agent consisting of forty per cent. formaldehyde or formalin or the chemical equivalent thereof diluted with water in about the proportions of one ounce of the former to three ounces of the latter. The wax or other non-metallic mold to be coated with silver is prepared, precedent to the application of the commingled silver and reducing agent, by applying to the mold an alcoholic substratum of collodion. This latter is made by dissolving about one grain of guncotton (pyroxylin) in about one-fourth of an ounce of sulfuric ether and about threefourths of an ounce of ninety-five per cent. It is flowed over the mold or is applied to the same with a brush or in any other approved manner, and after the application the mold is permitted to dry. The said substratum of collodion conduces to the proper deposition or precipitation of the metallic silver on the mold and is preferably employed for such reason. I desire it distinctly understood, however, that I do not confine myself to the use of collodion, as any other substance compatible with the purpose of my invention may be employed; also, that I do not confine myself to treating the mold in any manner whatsoever precedent to the deposition of the silver thereon, inasmuch as good results are obtainable without so treating the mold.
.ln practicing my novel process I add the reducing agent described to the ammonia nitrate-of-silver solution in about the proportions of six drams of the former to two ounces of the latter and immediately thereafter ap ply the mixture to the mold, preferably by pouring it on the face of the mold and ma nipulating the mold so that the mixture is spread evenly over the face. The mold is gently oscillated until the metallic silver is reduced upon its face, which takes place in a very short time i. 0., from two to live minutes when the mold will have a compact and uniform metallic surface.
My novel process is designed more particularly for depositing nickel on a mold of nonconductive material by electrolysis, and when the mold is provided with a compact and uniform metallic surface in the manner just stated the quick and perfect deposition of the nickel by electrolysis is assured and the nickel is not liable to peel during the use of the electrotype.
I have entered into a detailed description of my novel process as I prefer to practice it in order to impart a full, clear, and exact understanding of the same. I do not desire, however, to be understood as confining myself to the specific practice liereinbefore pointed out or to the proportions of the ingredients entering into the several compositions or to the specific ingredients, as such changes or modifications may be made in practice as fairly fall within the scope of my invention as claimed.
Having described my invention, what I claim, and desire to secure by Letters Patent,
1. The electrotyping process which consists in preparing a mold of non-conductive material, coating the mold with substance that will conduce to the precipitation of metallic silver on the mold, adding liquid ammonia to a nitrate-of-silver solution until the precipitate is redissolved and adding formaldehyde to the mixture, applying this mixture to the coated mold, and depositing metal on the silver surface of the mold by electrolysis.
2. The electroty ping process which consists in preparing a mold of non-conductive material, coating the mold with substance that will conduce to the precipitation of metallic silver on the mold, adding liquid ammonia to a nimy hand in presence of two subscribing Wittrate-of-silver solution until the precipitate nesses. 4 is redissolved and adding formaldehyde to the mixture, applying this mixture to the coated OASSIUS BLACKLIDGE- l 5 mold and depositing nickel on the silver sur- Witnesses:
face of the mold by electrolysis. THOS. Gr. LEWIS,
In testimony whereof I have hereunto set l/VM. BERRY.
US24110905A 1905-01-14 1905-01-14 Process of depositing metal on non-metallic bodies. Expired - Lifetime US799218A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US24110905A US799218A (en) 1905-01-14 1905-01-14 Process of depositing metal on non-metallic bodies.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24110905A US799218A (en) 1905-01-14 1905-01-14 Process of depositing metal on non-metallic bodies.

Publications (1)

Publication Number Publication Date
US799218A true US799218A (en) 1905-09-12

Family

ID=2867706

Family Applications (1)

Application Number Title Priority Date Filing Date
US24110905A Expired - Lifetime US799218A (en) 1905-01-14 1905-01-14 Process of depositing metal on non-metallic bodies.

Country Status (1)

Country Link
US (1) US799218A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3533921A (en) * 1968-03-08 1970-10-13 Frost Co Method of finishing the surface of metal articles

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3533921A (en) * 1968-03-08 1970-10-13 Frost Co Method of finishing the surface of metal articles

Similar Documents

Publication Publication Date Title
US2454610A (en) Method for metalization on nonconductors
FR2459300A1 (en) SOLUTION FOR THE ELECTROCHEMICAL METALLIZATION OF DIELECTRIC MATERIALS, METHOD FOR ELECTROCHEMICAL METALLIZATION OF DIELECTRIC MATERIALS USING THE SAME SOLUTION, AND DIELECTRIC MATERIALS TREATED IN ACCORDANCE WITH THE METHOD
JPS63500624A (en) Conductive composition and conductive powder used therein
US2639997A (en) Metallization of nonmetallic surfaces
US4158074A (en) Process for preparing colored aluminum powder
US3123484A (en) Ihzijm
US799218A (en) Process of depositing metal on non-metallic bodies.
US1352331A (en) Process of electroplating non-conducting substances with copper
US3064313A (en) Preparation of free acid cellulose ether films
US1208507A (en) Preparation for silvering or gilding metal articles.
US242338A (en) Constant laval
US2482354A (en) Copper plating solution
GB1013673A (en) Improvements in or relating to electroplating processes
US2113977A (en) Manufacture of mirrors
US675413A (en) Process of coating fibrous material with metal.
US1834812A (en) Metallizing or coating substances with metals
US838977A (en) Solution for use in art of electrotyping.
US1935630A (en) Process of electrodepositing indium and indium and silver
US1036576A (en) Attaching rubber to metals.
US2457515A (en) Insulating coating compositions and method of making
US2093031A (en) Product and method and composition for cadmium-tin alloy plating
US1887967A (en) Composition for coating metals and method of making the same
US1291396A (en) Process of manufacturing waterproof adhesives.
JPS59500221A (en) Powder used in dry activation process for electroless metallization
US33721A (en) Justus von liebig