US1935630A - Process of electrodepositing indium and indium and silver - Google Patents
Process of electrodepositing indium and indium and silver Download PDFInfo
- Publication number
- US1935630A US1935630A US190653A US19065327A US1935630A US 1935630 A US1935630 A US 1935630A US 190653 A US190653 A US 190653A US 19065327 A US19065327 A US 19065327A US 1935630 A US1935630 A US 1935630A
- Authority
- US
- United States
- Prior art keywords
- indium
- silver
- bath
- anode
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
Definitions
- This invention relates to a process of electrodepositing indium, and more particularly indium and silver, for the production, in either case, of tarnish-resisting products, either in the 5 form of finished articles, except for polishing, etc., or in the form of raw materials which may be used for various purposes including that of fabrication into finished articles.
- organic compounds of an acid nature may be used, such as glycine, cyanuric acid, abietic acid, adipic acid, acetyl m-aminobenzoic acid, acetyl p-aminobenzoic acid, acetaldehyde sodium bisulphite, m-aminobenzoic acid, so long as the compound used is one which, like glycine for example, will remedy the difl'iculty referred to without, at the same time, injuriously affecting the bath.
- glycine cyanuric acid
- abietic acid abietic acid
- adipic acid acetyl m-aminobenzoic acid
- acetyl p-aminobenzoic acid acetaldehyde sodium bisulphite
- m-aminobenzoic acid so long as the compound used is one which, like glycine for example, will remedy the difl'iculty referred to without
- Such agent or agents may be used where indium alone is plated, or where indium and silver are simultaneously plated, and where the indium or indium and silver are plated from the bath, in which case an insoluble anode is used, or through the bath from anodes of indium or indium and silver.
- an insoluble anode is used, or through the bath from anodes of indium or indium and silver.
- an anode consisting of an alloy or intimate mixture of the two metals instead of an anode of each.
- PROCESS 1 Indium plating Potassium cyanide 15 ozs. avoir. Glycine '7 ozs. avoir.
- Pnoorzss 2 IndiumSilver plating A bath such as that just described is prepared 5 and an anode alloy or intimate mixture of indium and silver is immersed in the bath. Current is then passed through the bath from the anode to eifect a partial solution of the anode and thereby introduce both indium and silver in sumcient 7 quantities to give a suitable deposit of both metals on further electrolysis.
- This process may also be used with two anodes, one of indium and the other of silver.
- indium or indium and silver from the bath, which for that purpose will be made up with the indium or indium and silver as ingredients thereof.
- an insoluble anode will be used, for example, one of carbon or platinum.
- a process of electro-depositing indium which comprises the steps of immersing an article to be plated as the cathode in a prepared bath, said bath comprising 1 gallon of water, 15 oz. potassium cyanide, and 7 oz. glycine, or equivalent thereof selected from the group: cyanuric acid, abietic acid, adipic acid, acetyl m-aminobenzoic acid, acetyl p-aminobenzoic acid, acetaldehyde sodium bisulphite, m-aminobenzoic acid, immersing an anode of indium in said bath, and passing a current of about .035 amperes and upwards per square inch at the cathode to deposit indium on said article.
- a process of electro-depositing indium which comprises the steps of immersing an article to be plated as the cathode in a prepared cyanide bath containing a material selected from the group: glycine, cyanuric acid, abietic acid, adipic acid, acetyl m-aminobenzoic acid, acetyl p-aminobenzoic acid, acetaldehyde sodium bisulphite, m-aminobenzoic acid, immersing an anode of indium in said bath, and passing a current therethrough to deposit indium on said article.
- a material selected from the group: glycine, cyanuric acid, abietic acid, adipic acid, acetyl m-aminobenzoic acid, acetyl p-aminobenzoic acid, acetaldehyde sodium bisulphite, m-aminobenzoic acid immersing an anode of indium in said
- a process of electro-depositing indium-silver alloy which comprises the steps of immersing an article to be plated as the cathode in a prepared cyanide bath containing a material selected from the group: glycine, cyanuric acid, abietic acid, adipic acid, acetyl m-aminobenzoic 5.
- steps which comprise immersing an article to be plated as the cathode in a prepared cyanide bath containing glycine, immersing an anode of indium and silver in said bath, and passing a current therethrough to deposit indium and silver on said article.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
Patented Nov. 21, 1933 PROCESS OF ELECTRODEPOSITING IND AND INDIUM AND SILVER Daniel Gray, Oneida, N. Y., assignor to Oneida Community, Limited, Oneida, N. Y., a corporation of New York No Drawing. Application May 11, 1927, Sam No. 190,653. Renewed August 9, .1932
Claims.
This invention relates to a process of electrodepositing indium, and more particularly indium and silver, for the production, in either case, of tarnish-resisting products, either in the 5 form of finished articles, except for polishing, etc., or in the form of raw materials which may be used for various purposes including that of fabrication into finished articles.
I have observed in the use of alkaline baths from or through which indium, alone or together with silver, is to be plated, that after a time a compound containing the indium is precipitated fromthe bath, rendering the bath valueless for the purpose of electro-depositing indium.
I have discovered, as the result of various experiments, that this may be efiectively prevented by the introduction into the bath of an organic compound of an acid nature which will effect the retention of the indium in solution and thus cause it to be properly plated.
Various organic compounds of an acid nature may be used, such as glycine, cyanuric acid, abietic acid, adipic acid, acetyl m-aminobenzoic acid, acetyl p-aminobenzoic acid, acetaldehyde sodium bisulphite, m-aminobenzoic acid, so long as the compound used is one which, like glycine for example, will remedy the difl'iculty referred to without, at the same time, injuriously affecting the bath.
Such agent or agents may be used where indium alone is plated, or where indium and silver are simultaneously plated, and where the indium or indium and silver are plated from the bath, in which case an insoluble anode is used, or through the bath from anodes of indium or indium and silver. Where the two metals are simultaneously plated through the bath I prefer to use an anode consisting of an alloy or intimate mixture of the two metals instead of an anode of each.
In the following description the process will be described specifically in connection with the plating of indium through the bath and the plating of indium and silver through the bath by the use of such an alloy anode of indium and silver.
PROCESS 1 Indium plating Potassium cyanide 15 ozs. avoir. Glycine '7 ozs. avoir.
Water 1 gallon Current density about .035 amperes and upwards per square inch at the cathode. The cathode and an anode of indium being immersed in the bath, current will be passed through the bath from the anode in order to efiect a partial solution of the anode and thereby introduce indium into the bath in sufiicient quantity to give a suitable deposit on further electrolysis.
Pnoorzss 2 IndiumSilver plating A bath such as that just described is prepared 5 and an anode alloy or intimate mixture of indium and silver is immersed in the bath. Current is then passed through the bath from the anode to eifect a partial solution of the anode and thereby introduce both indium and silver in sumcient 7 quantities to give a suitable deposit of both metals on further electrolysis.
This process may also be used with two anodes, one of indium and the other of silver.
It may also be used for plating indium or indium and silver from the bath, which for that purpose will be made up with the indium or indium and silver as ingredients thereof. In that case an insoluble anode will be used, for example, one of carbon or platinum.
What is claimed is:
1. A process of electro-depositing indium which comprises the steps of immersing an article to be plated as the cathode in a prepared bath, said bath comprising 1 gallon of water, 15 oz. potassium cyanide, and 7 oz. glycine, or equivalent thereof selected from the group: cyanuric acid, abietic acid, adipic acid, acetyl m-aminobenzoic acid, acetyl p-aminobenzoic acid, acetaldehyde sodium bisulphite, m-aminobenzoic acid, immersing an anode of indium in said bath, and passing a current of about .035 amperes and upwards per square inch at the cathode to deposit indium on said article.
2. A process of electro-depositing indium which comprises the steps of immersing an article to be plated as the cathode in a prepared cyanide bath containing a material selected from the group: glycine, cyanuric acid, abietic acid, adipic acid, acetyl m-aminobenzoic acid, acetyl p-aminobenzoic acid, acetaldehyde sodium bisulphite, m-aminobenzoic acid, immersing an anode of indium in said bath, and passing a current therethrough to deposit indium on said article.
3. A process of electro-depositing indium-silver alloy which comprises the steps of immersing an article to be plated as the cathode in a prepared cyanide bath containing a material selected from the group: glycine, cyanuric acid, abietic acid, adipic acid, acetyl m-aminobenzoic 5. In the process of electro-depositing indium and silver simultaneously, the steps which comprise immersing an article to be plated as the cathode in a prepared cyanide bath containing glycine, immersing an anode of indium and silver in said bath, and passing a current therethrough to deposit indium and silver on said article.
DANIEL GRAY.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US190653A US1935630A (en) | 1927-05-11 | 1927-05-11 | Process of electrodepositing indium and indium and silver |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US190653A US1935630A (en) | 1927-05-11 | 1927-05-11 | Process of electrodepositing indium and indium and silver |
Publications (1)
Publication Number | Publication Date |
---|---|
US1935630A true US1935630A (en) | 1933-11-21 |
Family
ID=22702222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US190653A Expired - Lifetime US1935630A (en) | 1927-05-11 | 1927-05-11 | Process of electrodepositing indium and indium and silver |
Country Status (1)
Country | Link |
---|---|
US (1) | US1935630A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2497725A (en) * | 1947-04-26 | 1950-02-14 | New Jersey Zinc Co | Recovery of manganese by electrolysis |
US2567934A (en) * | 1945-12-13 | 1951-09-18 | Vandervell Products Ltd | Process of electrodepositing an alloy of lead and indium |
US20090188808A1 (en) * | 2008-01-29 | 2009-07-30 | Jiaxiong Wang | Indium electroplating baths for thin layer deposition |
EP3686319A1 (en) * | 2019-01-25 | 2020-07-29 | Rohm and Haas Electronic Materials LLC | Indium electroplating compositions and methods for electroplating indium on nickel |
-
1927
- 1927-05-11 US US190653A patent/US1935630A/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2567934A (en) * | 1945-12-13 | 1951-09-18 | Vandervell Products Ltd | Process of electrodepositing an alloy of lead and indium |
US2497725A (en) * | 1947-04-26 | 1950-02-14 | New Jersey Zinc Co | Recovery of manganese by electrolysis |
US20090188808A1 (en) * | 2008-01-29 | 2009-07-30 | Jiaxiong Wang | Indium electroplating baths for thin layer deposition |
EP3686319A1 (en) * | 2019-01-25 | 2020-07-29 | Rohm and Haas Electronic Materials LLC | Indium electroplating compositions and methods for electroplating indium on nickel |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US2984604A (en) | Platinum plating composition and process | |
US3730853A (en) | Electroplating bath for depositing tin-lead alloy plates | |
US2250556A (en) | Electrodeposition of copper and bath therefor | |
US3149057A (en) | Acid gold plating | |
US1935630A (en) | Process of electrodepositing indium and indium and silver | |
US3174918A (en) | Bright gold electroplating | |
US2457059A (en) | Method for bonding a nickel electrodeposit to a nickel surface | |
US2770587A (en) | Bath for plating bright copper | |
US2075623A (en) | Zinc plating | |
US1849293A (en) | Process of electrodepositing indium | |
US2299054A (en) | Electroplating | |
US2984603A (en) | Platinum plating composition and process | |
US2133995A (en) | Process for gold plating chromium alloy steels | |
US2414438A (en) | Electrodeposition of selenium | |
US2497988A (en) | Indium plating | |
US4297179A (en) | Palladium electroplating bath and process | |
US2854389A (en) | Bright copper plating process | |
US1857664A (en) | Treatment of gold and silver | |
US2039328A (en) | Method for gold plating | |
US1801629A (en) | Electroplating magnesium and alloys thereof | |
US1905105A (en) | Electrodeposition of tin-gold alloys | |
US2866740A (en) | Electrodeposition of rhodium | |
US2891896A (en) | Improved cyanide copper plating baths | |
US2600699A (en) | Zinc-copper-tin alloy plating | |
US2143760A (en) | Method and composition for cadmium plating |