US7982204B2 - Using unstable nitrides to form semiconductor structures - Google Patents
Using unstable nitrides to form semiconductor structures Download PDFInfo
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- US7982204B2 US7982204B2 US12/788,603 US78860310A US7982204B2 US 7982204 B2 US7982204 B2 US 7982204B2 US 78860310 A US78860310 A US 78860310A US 7982204 B2 US7982204 B2 US 7982204B2
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- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
- H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
- H01L21/28562—Selective deposition
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76867—Barrier, adhesion or liner layers characterized by methods of formation other than PVD, CVD or deposition from a liquids
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
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- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
Definitions
- This invention relates generally to the fabrication of integrated circuits.
- incompatible it is intended to mean that the upper material cannot be deposited onto the lower layer with sufficient adherence to the lower layer to avoid delamination.
- FIG. 1 is an enlarged, cross-sectional view at an early stage of manufacture according to one embodiment
- FIG. 2 is an enlarged, cross-sectional view at a subsequent stage of manufacture according to one embodiment
- FIG. 3 is an enlarged, cross-sectional view at a stage subsequent to the stage shown in FIG. 1 according to one embodiment
- FIG. 4 is an enlarged, cross-sectional view at a subsequent stage to FIG. 3 in accordance with one embodiment of the present invention
- FIG. 5 is an enlarged, cross-sectional view of another embodiment of the present invention.
- FIG. 6 is an enlarged, cross-sectional view of still another embodiment of the present invention.
- a layer of a first material 12 may receive on its upper surface a deposit of a second material 14 .
- the material 14 and the material 12 may be sufficiently compatible that adequate adherence can be obtained between the materials 12 and 14 in some embodiments.
- the material 14 now adhered to the material 12 , may then be converted to another material incompatible with the material 12 if directly deposited on the material 12 .
- the incompatible material may be successfully adhered to the first material 12 .
- the material 12 may be a nitrided barrier layer such as titanium nitride or tungsten nitride.
- the material 14 in one embodiment, may be an unstable metal nitride, such as Cu 3 N or Cu 4 N, as two examples.
- the material 14 may be Ni 3 N.
- the material 14 is deposited by a atomic layer deposition (ALD) and/or chemical vapor deposition (CVD).
- ALD atomic layer deposition
- CVD chemical vapor deposition
- Precursors may be used to deposit the unstable metal nitrides by ALD or CVD, including, but not limited to, copper amidinate variants, betadiketiminates, azaallyis, betadiketonates, pyridines, cyclic arenes, and alkenes.
- Deposition of the material 14 may take place at a substrate temperature between 80° C. and 150° C., under chamber pressures between 100 mTorr to 10 Torr, in some embodiments.
- Co-reactants may be pulsed or flown to form unstable metal nitrides such as Cu 3 N or Cu/Cu 3 N mixtures.
- the co-reactants may include, but are not limited to, NH 3 , primary amines, secondary amines, tertiary amines, hydrazine, BR3-amine adducts (where R is alkyl, proton or both and the amine is primary, secondary, tertiary), azides, as well as pure nitrogen, nitrogen plasma, or N 2 /H 2 plasma, as well as any plasma and combinations from aforementioned chemicals.
- the material 14 may be decomposed to form a pure or substantially nitride free metal layer 16 .
- the layer 16 is decomposed to pure copper, in one embodiment, or pure nickel, in another embodiment, where Ni 3 N is used.
- Methods for decomposing the material 14 include thermal annealing in pure hydrogen gas, diluted hydrogen gas in an inert gas, annealing in NH 3 or nitrogen gas, at temperatures ranging from 200° C. to 500° C., for times ranging between five minutes to 120 minutes.
- the Cu 3 N material 14 may transform into near bulk copper conductivity within about one hour.
- an electron beam may be used to decompose the Cu 3 N into copper.
- Other thermal decomposition techniques may be used, including rapid thermal annealing in vacuum and joule heating using a resistive underlayer.
- Non-thermal decomposition may also be used, including ion implantation, ion bombardment, light, and plasma (remote and near) annealing.
- the material 14 may be converted entirely into a pure metal layer 16 .
- the conversion may be incomplete, leaving a thin layer of material 14 between the pure metal layer 16 and the material 12 .
- the material 14 remains in contact with the first material 12 over a substrate 10 , such as a silicon substrate.
- the material 14 may serve as an adhesion layer to the nitrided barrier material 12 .
- the conversion of the material 14 allows the deposition of two consecutive ALD or CVD layers for barrier and seed, all in one deposition step in some embodiments.
- a nitrided barrier material 12 may also act as a getterer of nitrogen and may not allow the formation of CuN layers in the pure copper film.
- a preferred embodiment uses ALD TaN as the nitrided barrier with Cu-nitride deposition.
- the Cu 3 N material may be deposited directly on silicon or carbon doped silicon to form SiCN, which may act as a barrier to copper diffusion.
- the Cu 3 N layer is deposited on porous low dielectric constant material and can serve as a dual sacrificial pore sealing/adhesion layer.
- a Cu 3 N layer 14 a may be used as a sacrificial/morphing non-reflective coating on a copper metal layer 16 to permit further patterning using optical techniques.
- a Cu 3 N layer 14 a may first be deposited and post-treated to pure copper metal layer 16 , as indicated in FIG. 3 .
- a second Cu 3 N layer 14 a may be deposited over the reflective metal layer 16 .
- the Cu 3 N layer 14 a acts as a non-reflective layer for patterning an overlying resist and etching.
- the Cu 3 N . layer 14 a can act as an adhesion layer or be reverted back to a conductive or pure metal layer.
- copper and Cu 3 N may be used as selective etching layers, or Cu 3 N can be selectively etched over copper to produce conductive copper lines.
- an atomic layer deposition metal nitride material 14 may be formed over a nitrided barrier material 12 on top of a substrate 10 , such as a silicon substrate.
- the material 14 may be selectively converted into pure or substantially nitride free copper metal strip 16 a by the use of an electron beam E or other methods already mentioned.
- a nano-patterned metal strip 16 a shown in FIG. 6 , may be obtained by placing the nanometer sized (i.e., of a width on the order of a billionth of a meter) electron beam E at exact locations using a reticle or precise beam location.
- a nanowire may be formed by moving the electron beam over the material 14 .
- the surrounding unconverted dielectric material 14 can be used as an encapsulating material to avoid line shorting.
- the present invention it is possible to deposit films with precise thickness and composition control.
- the deposition of conformal, uniform, and nanometer-sized films may be achieved in some embodiments with a nitrided cap and sidewalls to prevent full line oxidation.
- Conductive lines or layers may be precisely located in some cases and improved adhesion to silicon or nitrided substrates may be achieved.
- low reflectivity enabling patterning may be accomplished in some cases.
- deposition and patterning of ultra-thin lines may be achieved with width and height less than ten nanometers or to a size enabled by electron beams or scanning tunneling microscopy (STM) resolution.
- STM scanning tunneling microscopy
- references throughout this specification to “one embodiment” or “an embodiment” mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one implementation encompassed within the present invention. Thus, appearances of the phrase “one embodiment” or “in an embodiment” are not necessarily referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be instituted in other suitable forms other than the particular embodiment illustrated and all such forms may be encompassed within the claims of the present application.
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US12/788,603 US7982204B2 (en) | 2006-02-22 | 2010-05-27 | Using unstable nitrides to form semiconductor structures |
US13/185,094 US8344352B2 (en) | 2006-02-22 | 2011-07-18 | Using unstable nitrides to form semiconductor structures |
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US11/359,060 US7749906B2 (en) | 2006-02-22 | 2006-02-22 | Using unstable nitrides to form semiconductor structures |
US12/788,603 US7982204B2 (en) | 2006-02-22 | 2010-05-27 | Using unstable nitrides to form semiconductor structures |
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US12/788,603 Active US7982204B2 (en) | 2006-02-22 | 2010-05-27 | Using unstable nitrides to form semiconductor structures |
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US7682891B2 (en) * | 2006-12-28 | 2010-03-23 | Intel Corporation | Tunable gate electrode work function material for transistor applications |
US8105937B2 (en) * | 2008-08-13 | 2012-01-31 | International Business Machines Corporation | Conformal adhesion promoter liner for metal interconnects |
JP5781428B2 (en) * | 2011-12-20 | 2015-09-24 | 日東電工株式会社 | Conductive film and conductive film roll |
US9190323B2 (en) * | 2012-01-19 | 2015-11-17 | GlobalFoundries, Inc. | Semiconductor devices with copper interconnects and methods for fabricating same |
CN103377884B (en) * | 2012-04-23 | 2016-02-03 | 中芯国际集成电路制造(上海)有限公司 | Hard mask layer structure and low K dielectric layer lithographic method |
KR102142387B1 (en) * | 2020-06-11 | 2020-08-07 | 서울과학기술대학교 산학협력단 | Cu Bonding method by 2 step plasma treatment and Cu Bonding package |
Citations (3)
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US4897287A (en) * | 1988-10-06 | 1990-01-30 | The Boc Group, Inc. | Metallization process for an integrated circuit |
US20060099758A1 (en) * | 2004-10-21 | 2006-05-11 | Sharp Laboratories Of America, Inc. | Iridium oxide nanotubes and method for forming same |
US20060269729A1 (en) * | 2005-05-25 | 2006-11-30 | Au Optronics Corp. | Copper conducting wire structure and fabricating method thereof |
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US6165894A (en) * | 1998-07-09 | 2000-12-26 | Advanced Micro Devices, Inc. | Method of reliably capping copper interconnects |
JP3516941B2 (en) * | 2000-11-30 | 2004-04-05 | キヤノン販売株式会社 | Semiconductor device and manufacturing method thereof |
KR100531178B1 (en) | 2003-07-08 | 2005-11-28 | 재단법인서울대학교산학협력재단 | Growth method of nitride epitaxial layer using conversion of nitride interlayer into metallic phase |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4897287A (en) * | 1988-10-06 | 1990-01-30 | The Boc Group, Inc. | Metallization process for an integrated circuit |
US20060099758A1 (en) * | 2004-10-21 | 2006-05-11 | Sharp Laboratories Of America, Inc. | Iridium oxide nanotubes and method for forming same |
US20060269729A1 (en) * | 2005-05-25 | 2006-11-30 | Au Optronics Corp. | Copper conducting wire structure and fabricating method thereof |
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US8344352B2 (en) | 2013-01-01 |
US20100230817A1 (en) | 2010-09-16 |
US20110272811A1 (en) | 2011-11-10 |
US7749906B2 (en) | 2010-07-06 |
US20070194287A1 (en) | 2007-08-23 |
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