US7685709B2 - Process for making a spring - Google Patents
Process for making a spring Download PDFInfo
- Publication number
- US7685709B2 US7685709B2 US11/512,877 US51287706A US7685709B2 US 7685709 B2 US7685709 B2 US 7685709B2 US 51287706 A US51287706 A US 51287706A US 7685709 B2 US7685709 B2 US 7685709B2
- Authority
- US
- United States
- Prior art keywords
- spring
- release
- layer
- resist
- depositing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title description 18
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 112
- 238000000151 deposition Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000005253 cladding Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound 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[Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
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- 230000035515 penetration Effects 0.000 claims 1
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- 230000035882 stress Effects 0.000 description 13
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- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
- Y10T29/49213—Metal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
Abstract
Description
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US11/512,877 US7685709B2 (en) | 2006-08-29 | 2006-08-29 | Process for making a spring |
Applications Claiming Priority (2)
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US11/512,877 US7685709B2 (en) | 2006-08-29 | 2006-08-29 | Process for making a spring |
US12/695,124 US8021167B2 (en) | 2006-08-29 | 2010-01-27 | ‘All in one’ spring process for cost-effective spring manufacturing and spring self-alignment |
Related Child Applications (1)
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US12/695,124 Division US8021167B2 (en) | 2006-08-29 | 2010-01-27 | ‘All in one’ spring process for cost-effective spring manufacturing and spring self-alignment |
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US20080057755A1 US20080057755A1 (en) | 2008-03-06 |
US7685709B2 true US7685709B2 (en) | 2010-03-30 |
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US11/512,877 Active US7685709B2 (en) | 2006-08-29 | 2006-08-29 | Process for making a spring |
US12/695,124 Expired - Fee Related US8021167B2 (en) | 2006-08-29 | 2010-01-27 | ‘All in one’ spring process for cost-effective spring manufacturing and spring self-alignment |
Family Applications After (1)
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US12/695,124 Expired - Fee Related US8021167B2 (en) | 2006-08-29 | 2010-01-27 | ‘All in one’ spring process for cost-effective spring manufacturing and spring self-alignment |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8172036B2 (en) * | 2010-09-10 | 2012-05-08 | The Boeing Company | Apparatus and method for providing acoustic metamaterial |
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US5613861A (en) * | 1995-06-07 | 1997-03-25 | Xerox Corporation | Photolithographically patterned spring contact |
US5944537A (en) * | 1997-12-15 | 1999-08-31 | Xerox Corporation | Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices |
US6290510B1 (en) * | 2000-07-27 | 2001-09-18 | Xerox Corporation | Spring structure with self-aligned release material |
US6499216B1 (en) * | 1994-07-07 | 2002-12-31 | Tessera, Inc. | Methods and structures for electronic probing arrays |
US6528350B2 (en) * | 2001-05-21 | 2003-03-04 | Xerox Corporation | Method for fabricating a metal plated spring structure |
US6815961B2 (en) * | 1999-07-28 | 2004-11-09 | Nanonexus, Inc. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US6973722B2 (en) | 2003-11-17 | 2005-12-13 | Palo Alto Research Center Incorporated | Release height adjustment of stressy metal devices by annealing before and after release |
US7006720B2 (en) * | 2002-04-30 | 2006-02-28 | Xerox Corporation | Optical switching system |
US20060105122A1 (en) * | 2004-11-12 | 2006-05-18 | Palo Alto Research Center Incorporated | Micro-machined structure production using encapsulation |
US7048548B2 (en) * | 1999-12-28 | 2006-05-23 | Formfactor, Inc. | Interconnect for microelectronic structures with enhanced spring characteristics |
US7082684B2 (en) | 2004-08-04 | 2006-08-01 | Palo Alto Research Center Incorporated | Intermetallic spring structure |
US7230440B2 (en) * | 2004-10-21 | 2007-06-12 | Palo Alto Research Center Incorporated | Curved spring structure with elongated section located under cantilevered section |
-
2006
- 2006-08-29 US US11/512,877 patent/US7685709B2/en active Active
-
2010
- 2010-01-27 US US12/695,124 patent/US8021167B2/en not_active Expired - Fee Related
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US6499216B1 (en) * | 1994-07-07 | 2002-12-31 | Tessera, Inc. | Methods and structures for electronic probing arrays |
US5613861A (en) * | 1995-06-07 | 1997-03-25 | Xerox Corporation | Photolithographically patterned spring contact |
US6184065B1 (en) * | 1995-06-07 | 2001-02-06 | Xerox Corporation | Photolithographically patterned spring contact |
US5944537A (en) * | 1997-12-15 | 1999-08-31 | Xerox Corporation | Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices |
US6815961B2 (en) * | 1999-07-28 | 2004-11-09 | Nanonexus, Inc. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US7048548B2 (en) * | 1999-12-28 | 2006-05-23 | Formfactor, Inc. | Interconnect for microelectronic structures with enhanced spring characteristics |
US6290510B1 (en) * | 2000-07-27 | 2001-09-18 | Xerox Corporation | Spring structure with self-aligned release material |
US20020013070A1 (en) * | 2000-07-27 | 2002-01-31 | Xerox Corporation | Spring structure with self-aligned release material |
US6658728B2 (en) * | 2000-07-27 | 2003-12-09 | Xerox Corporation | Method for fabricating a spring structure on a substrate |
US6528350B2 (en) * | 2001-05-21 | 2003-03-04 | Xerox Corporation | Method for fabricating a metal plated spring structure |
US7006720B2 (en) * | 2002-04-30 | 2006-02-28 | Xerox Corporation | Optical switching system |
US6973722B2 (en) | 2003-11-17 | 2005-12-13 | Palo Alto Research Center Incorporated | Release height adjustment of stressy metal devices by annealing before and after release |
US7082684B2 (en) | 2004-08-04 | 2006-08-01 | Palo Alto Research Center Incorporated | Intermetallic spring structure |
US7230440B2 (en) * | 2004-10-21 | 2007-06-12 | Palo Alto Research Center Incorporated | Curved spring structure with elongated section located under cantilevered section |
US20060105122A1 (en) * | 2004-11-12 | 2006-05-18 | Palo Alto Research Center Incorporated | Micro-machined structure production using encapsulation |
Cited By (1)
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US8172036B2 (en) * | 2010-09-10 | 2012-05-08 | The Boeing Company | Apparatus and method for providing acoustic metamaterial |
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US20080057755A1 (en) | 2008-03-06 |
US20100140858A1 (en) | 2010-06-10 |
US8021167B2 (en) | 2011-09-20 |
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