US7521271B2 - Method of manufacturing a transponder - Google Patents

Method of manufacturing a transponder Download PDF

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Publication number
US7521271B2
US7521271B2 US10/505,286 US50528604A US7521271B2 US 7521271 B2 US7521271 B2 US 7521271B2 US 50528604 A US50528604 A US 50528604A US 7521271 B2 US7521271 B2 US 7521271B2
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Prior art keywords
transponder
carrier
intermediate product
transmission element
longitudinal direction
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US10/505,286
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US20050181530A1 (en
Inventor
Christian Brugger
Reinhard Fritz
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Morgan Stanley Senior Funding Inc
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NXP BV
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Assigned to KONINKLIJKE PHILPS ELECTRONICS N.V. reassignment KONINKLIJKE PHILPS ELECTRONICS N.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BRUGGER, CHRISTIAN, FRITZ, REINHARD
Publication of US20050181530A1 publication Critical patent/US20050181530A1/en
Assigned to NXP B.V. reassignment NXP B.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KONINKLIJKE PHILIPS ELECTRONICS N.V.
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Assigned to MORGAN STANLEY SENIOR FUNDING, INC. reassignment MORGAN STANLEY SENIOR FUNDING, INC. SECURITY AGREEMENT SUPPLEMENT Assignors: NXP B.V.
Assigned to MORGAN STANLEY SENIOR FUNDING, INC. reassignment MORGAN STANLEY SENIOR FUNDING, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Assignors: NXP B.V.
Assigned to MORGAN STANLEY SENIOR FUNDING, INC. reassignment MORGAN STANLEY SENIOR FUNDING, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Assignors: NXP B.V.
Assigned to MORGAN STANLEY SENIOR FUNDING, INC. reassignment MORGAN STANLEY SENIOR FUNDING, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Assignors: NXP B.V.
Assigned to NXP B.V. reassignment NXP B.V. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
Assigned to PHILIPS SEMICONDUCTORS INTERNATIONAL B.V. reassignment PHILIPS SEMICONDUCTORS INTERNATIONAL B.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Assigned to NXP B.V. reassignment NXP B.V. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: MORGAN STANLEY SENIOR FUNDING, INC.
Assigned to MORGAN STANLEY SENIOR FUNDING, INC. reassignment MORGAN STANLEY SENIOR FUNDING, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Assignors: NXP B.V.
Assigned to MORGAN STANLEY SENIOR FUNDING, INC. reassignment MORGAN STANLEY SENIOR FUNDING, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Assignors: NXP B.V.
Assigned to MORGAN STANLEY SENIOR FUNDING, INC. reassignment MORGAN STANLEY SENIOR FUNDING, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Assignors: NXP B.V.
Assigned to MORGAN STANLEY SENIOR FUNDING, INC. reassignment MORGAN STANLEY SENIOR FUNDING, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Assignors: NXP B.V.
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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07788—Antenna details the antenna being of the capacitive type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a method of manufacturing a transponder, which transponder is provided and designed for contactless communication with a communications station suitable therefor and which transponder comprises a transponder IC comprising two IC contacts and two substantially planar transmission elements.
  • the invention also relates to a transponder for contactless communication with a communications station suitable therefor, which transponder comprises a transponder IC comprising two IC contacts and two substantially planar transmission elements.
  • a method as described above in the first paragraph for manufacturing a transponder as described above in the second paragraph has long been known.
  • a “metal lead frame” configuration is used, which is of tape-like construction and in which there is provided a plurality of pairs of planar transmission elements lying next to one another in the longitudinal direction of this metal lead frame configuration, each transponder IC being connected via each of its two IC contacts to a transmission element from a pair of transmission elements, the transponder IC being connected to the pair of transmission elements in a mechanically stable manner by potting with a plastics compound, whereby a “module” is obtained which is connected to a transmission coil in the course of further execution of the method of manufacturing a transponder, this connection being achieved in that the two transmission elements of a pair of transmission elements are each electrically conductively connected to a terminal of the transmission coil, such that a finished transponder is obtained after said connection.
  • each transponder IC has to be positioned with a relatively high level of precision relative to a pair of transmission elements, before the transponder IC is brought into communication-capable connection, via its IC contacts with the transmission elements of a pair of transmission elements, this which requires a relatively high degree of positioning effort during extension of the known method.
  • a method according to the invention is characterized as follows:
  • a method of manufacturing a transponder which transponder is provided and designed for contactless communication with a communications station suitable therefor and which transponder comprises a transponder IC comprising two IC contacts and two substantially planar transmission elements, in which method the transponder IC is brought into communication-capable connection via each time one of its two IC contacts with one of two transmission element strips provided on a tape-like carrier of an intermediate product and extending substantially parallel to the longitudinal direction of the carrier, and in which the intermediate product is then cut along two cutting zones extending perpendicularly to the longitudinal direction of the carrier and each lying at a distance from the transponder IC, and in which the transponder IC is connected to the portion of the intermediate product lying between the cutting zones.
  • a method of manufacturing a transponder which offers the advantage that, when performing the method, a transponder IC has to be positioned relatively precisely with regard to the intermediate product used in only one direction extending perpendicularly to the longitudinal direction of the carrier, which position may be performed in a relatively simple manner, and that the relative position of a transponder IC relative to the intermediate product in the longitudinal carrier direction of the intermediate product is not critical.
  • a further advantage obtained with the method according to the invention is that it is very simply possible to produce transmission elements of different sizes, by producing portions of the intermediate product of different sizes, this is made possible by appropriate selection of the position of the cutting zones relative to the transponder IC located between two cutting zones.
  • a connection capable of capacitive communication may be produced between each IC contact and the relevant transmission element strip; this is highly desirable and advantageous for many applications.
  • each IC contact is connected in electrically conductive manner the relevant transmission element strip. This ensures that each IC contact forms a connection capable of ohmic, i.e. electrically conductive, communication with the relevant transmission element strip.
  • cutting of the intermediate product can be performed along cutting zones extending obliquely relative to the longitudinal direction of the carrier. It has proven particularly advantageous, however, when the cutting of the intermediate product is performed along cutting zones extending perpendicularly to the longitudinal direction of the carrier. The advantage is thereby obtained that the portions of intermediate product produced are of rectangular shape.
  • a transponder IC may be connected to the intermediate product between two cutting zones by producing a laser weld joint or by producing a thermocompression joint.
  • a transponder IC is connected to the portion of the intermediate product by a glued joint.
  • Producing such a glued joint has proven particularly advantageous as a consequence of the use of the intermediate product consisting of the tape-like carrier and the two transmission element strips provided thereon.
  • a transponder IC with a quadrilateral main surface may be used, in which transponder IC the IC contacts are formed by two IC contacts extending parallel to two mutually parallel delimiting edges and wherein the transponder IC being connected to the portion of intermediate product in such a position that the two IC contacts extending parallel to one another extend parallel to the longitudinal direction of the carrier.
  • transponder IC with a quadrilateral main surface
  • the IC contacts are provided in two corner areas of the main surface lying on a diagonal of the main surface, and the transponder IC is connected to the portion of the intermediate product in such a position that the diagonal of the main surface extends perpendicularly to the longitudinal direction of the carrier.
  • the distance between the transmission element strips of the intermediate product may be selected to be of optimum size so as to match the large distance between the IC contacts; this is of particular importance and advantage if the portions of the intermediate product produced as planar transmission elements in the course of manufacture of the transponder are provided as communication elements for capacitive contactless communication.
  • a transponder according to the invention has advantageously been manufactured using a method according to the invention.
  • FIG. 1 is a schematic plan view of a transponder IC with two IC contacts each adjoining a lateral delimiting edge.
  • FIG. 2 is a plan view of an intermediate product with a tape-like carrier and two transmission element strips provided thereon.
  • FIG. 3 shows, in similar manner to FIG. 2 , the intermediate product according to FIG. 2 with three transponder ICs according to FIG. 1 connected thereto.
  • FIG. 4 shows, in similar manner to the FIGS. 2 and 3 , the intermediate product according to the FIGS. 2 and 3 together with the three transponder ICs attached thereto and four cutting zones located adjacent to the transponder ICs.
  • FIG. 5 is a plan view of a transponder produced by means of the intermediate product illustrated in the FIGS. 2 to 4 .
  • FIG. 6 shows, in similar manner to FIG. 1 , a transponder IC with two IC contacts provided in corner areas lying diagonally opposite one another.
  • FIG. 7 shows, in similar manner to FIG. 3 , an intermediate product with three transponder ICs according to FIG. 6 connected thereto.
  • FIG. 8 shows, in similar manner to FIG. 4 , an intermediate product with transponder ICs attached thereto and with four cutting zones provided thereon.
  • FIG. 9 shows, in similar manner to FIG. 5 , a transponder produced by means of the intermediate product illustrated in the FIGS. 7 and 8 .
  • the transponder 1 is provided and designed for contactless communication with a communications station suitable therefor.
  • the transponder 1 includes a transponder IC 2 and two planar communication elements 3 and 4 , which in the present case are capable of capacitive communication.
  • the communication elements 3 and 4 are attached to a carrier element 5 and firmly connected mechanically to the carrier element 5 by means of glued joints (not shown).
  • the transponder IC 2 is firmly connected mechanically to the carrier element 5 by means of a glued joint 6 indicated schematically in FIG. 5 .
  • the transponder IC 2 comprises two IC contacts 7 and 8 , which are each shaped as a strip and in their longitudinal strip direction extends parallel to two lateral delimiting edges 9 and 10 of the transponder IC 2 , each contact being provided on the transponder IC 2 in such a manner as to be directly adjacent to one of the two delimiting edges 9 and 10 .
  • the transponder IC 2 illustrated in FIG. 1 is brought into communication-capable connection via in each case one of its two IC contacts 7 and 8 with one of two transmission element strips 13 or 14 respectively provided on a tape-like carrier 11 of an intermediate product 12 and extending parallel to the longitudinal direction of the carrier.
  • a drop of glue 15 is applied to predetermined points of the intermediate product 12 prior to formation of a communication-capable connection between the two IC contacts 7 and 8 and the two transmission element strips 13 and 14 .
  • a transponder IC 2 is in each case applied to the intermediate product 12 , wherein, by means of the glue drops 15 , a glued joint 6 is produced between each transponder IC 2 and the intermediate product 12 , as is clear from FIG. 3 .
  • the communication-capable connections between each of the IC contacts 7 and 8 and the relevant transmission element strips 13 or 14 , respectively, are also formed in this method step.
  • each glued joint 6 extends beyond the delimiting edges of the relevant transponder IC 2 and thus has an insulating effect between the IC contacts 7 and 8 and the transmission element strips 13 and 14 .
  • the glued joints 6 act as a dielectric.
  • the transmission element strips 13 and 14 each consist in this case of a copper foil which is glued to the carrier 11 . However, the transmission element strips 13 and 14 may also each take the form of an aluminum foil. The transmission element strips 13 and 14 may also be produced by applying a carbon paste or another paste containing conductive particles to the carrier 11 .
  • the carrier 11 consists in this instance of paper. However, it may also consist of plastics, for example PVC or polyester.
  • the intermediate product 12 comprising the tape-like carrier 11 and the two transmission element strips 13 and 14 provided on the tape-like carrier 11 is then cut through along, with regard to in each case one transponder IC 2 , two cutting zones 16 extending transversely relative of the longitudinal direction of the carrier, and in the present case precisely perpendicularly to the longitudinal direction of the carrier and each located at a distance from the relevant transponder IC 2 , which cutting zones 16 are indicated with dash-dotted lines in FIG. 4 .
  • a finished transponder 1 is in this case present between every two such cutting zones 16 .
  • connection of each transponder IC 2 to the portion of the intermediate product 12 located between two cutting zones 16 is effected by producing the glued joint 6 prior to cutting through the intermediate product 12 along the cutting zones 16 .
  • the transponder ICs 2 may be connected to the intermediate product 12 merely by means of a temporary connection, in order to ensure positioning of the respective transponder IC 2 on the intermediate product 12 , final connection of each transponder IC 2 to the portion of the intermediate product 12 located between two cutting zones 16 is then effected only after cutting along the cutting zones 16 , for example by laser welding.
  • a method according to a second version of the invention is described with reference to FIGS. 6 to 9 .
  • a transponder IC 2 with a quadrilateral main surface is used; in this transponder IC 2 the two IC contacts 7 and 8 are provided in two corner areas of the main surface which are located on a diagonal 17 of the main surface, as is clear from FIG. 6 .
  • the two IC contacts 7 and 8 comprise bumps raised relative to the main surface of the transponder IC 2 .
  • each transponder IC 2 is connected to the to the intermediate product 12 , and consequently to the portion of intermediate product 12 obtained after cutting through along the cutting zones 16 , in such a position that the diagonal 17 of the main surface extends perpendicularly to the longitudinal carrier direction of the intermediate product 12 .
  • a respective glued joint 6 is also provided in this case, which glued joint 6 in this case occupies so small an area that it does not effect any electrical insulation between the IC contacts 7 and 8 and the two transmission element strips 13 and 14 . This results here in an ohmic, i.e.
  • planar transmission elements do not absolutely have to comprise a continuous surface throughout; rather, such planar transmission elements may also be provided with at least one through-hole or be of more or less net-like construction.
  • planar transmission elements produced by means of the transmission element strips 13 and 14 do not absolutely have to be provided for capacitive communication; rather, such planar transmission elements may also be provided with a transmission coil for producing electrically conductive and, consequently, transmission-capable and communication-capable connections, the transmission coil then being provided and used for contactless communication with a communications station suitable therefor.
  • the transmission element strips are defined by linear delimiting edges extending parallel to the longitudinal direction of the carrier. This does not absolutely have to be the case, because such transmission element strips may also be delimited by wavy or sawtooth-shaped or zigzag edges, in particular in the inner edge areas which lie adjacent the central area of the carrier.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)
  • Train Traffic Observation, Control, And Security (AREA)
US10/505,286 2002-02-19 2003-02-03 Method of manufacturing a transponder Active 2024-09-05 US7521271B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP02100148.2 2002-02-19
EP02100148 2002-02-19
PCT/IB2003/000357 WO2003071476A1 (fr) 2002-02-19 2003-02-03 Procede de fabrication d'un transpondeur

Publications (2)

Publication Number Publication Date
US20050181530A1 US20050181530A1 (en) 2005-08-18
US7521271B2 true US7521271B2 (en) 2009-04-21

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US10/505,286 Active 2024-09-05 US7521271B2 (en) 2002-02-19 2003-02-03 Method of manufacturing a transponder

Country Status (7)

Country Link
US (1) US7521271B2 (fr)
EP (1) EP1479040A1 (fr)
JP (1) JP2005517592A (fr)
KR (1) KR20040083527A (fr)
CN (1) CN100390821C (fr)
AU (1) AU2003201740A1 (fr)
WO (1) WO2003071476A1 (fr)

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US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
WO2005022455A1 (fr) * 2003-08-26 2005-03-10 Mühlbauer Ag Cavaliers de modules pour etiquettes intelligentes
JP2007503635A (ja) * 2003-08-26 2007-02-22 ミュールバウアー アーゲー モジュールブリッジ製造方法
JP4672384B2 (ja) * 2004-04-27 2011-04-20 大日本印刷株式会社 Ｉｃタグ付シートの製造方法、ｉｃタグ付シートの製造装置、ｉｃタグ付シート、ｉｃチップの固定方法、ｉｃチップの固定装置、およびｉｃタグ
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
EP1835796B9 (fr) * 2004-12-03 2011-02-23 Hallys Corporation Dispositif de collage d'element d'interposition
WO2006059731A1 (fr) * 2004-12-03 2006-06-08 Hallys Corporation Procede de fabrication de composant electronique et equipement de fabrication de composant electronique
US7712674B1 (en) * 2005-02-22 2010-05-11 Eigent Technologies Llc RFID devices for verification of correctness, reliability, functionality and security
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US8220718B2 (en) * 2008-09-15 2012-07-17 Vasco Data Security, Inc. Method for post-manufacturing data transfer to and from a sealed device
FR3039680B1 (fr) 2015-07-31 2018-10-19 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif de traitement pour puces electroniques d'un element allonge

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US6140146A (en) * 1999-08-03 2000-10-31 Intermec Ip Corp. Automated RFID transponder manufacturing on flexible tape substrates
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US20020003496A1 (en) * 2000-06-01 2002-01-10 Brady Michael John Adjustable length antenna system for RF transponders
US20020057221A1 (en) * 2000-09-14 2002-05-16 Yoshitaka Matsushita IC card, antenna frame for IC card and method for manufacturing the same
US6400323B2 (en) * 2000-06-23 2002-06-04 Toyo Aluminium Kabushiki Kaisha Antenna coil for IC card and manufacturing method thereof
US20020125546A1 (en) * 2001-01-31 2002-09-12 Tadayoshi Muta Semiconductor device, production method therefor, and electrophotographic apparatus
US20040262722A1 (en) * 2003-06-24 2004-12-30 Canon Kabushiki Kaisha Chip mounting method and mounted substrate manufacturing apparatus

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US5386214A (en) * 1989-02-14 1995-01-31 Fujitsu Limited Electronic circuit device
EP0994440A1 (fr) 1997-07-10 2000-04-19 Rohm Co., Ltd. Carte a circuit integre sans contacts
US6140146A (en) * 1999-08-03 2000-10-31 Intermec Ip Corp. Automated RFID transponder manufacturing on flexible tape substrates
US6147662A (en) 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
US20020003496A1 (en) * 2000-06-01 2002-01-10 Brady Michael John Adjustable length antenna system for RF transponders
US6535175B2 (en) * 2000-06-01 2003-03-18 Intermec Ip Corp. Adjustable length antenna system for RF transponders
US6400323B2 (en) * 2000-06-23 2002-06-04 Toyo Aluminium Kabushiki Kaisha Antenna coil for IC card and manufacturing method thereof
US20020057221A1 (en) * 2000-09-14 2002-05-16 Yoshitaka Matsushita IC card, antenna frame for IC card and method for manufacturing the same
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US20040262722A1 (en) * 2003-06-24 2004-12-30 Canon Kabushiki Kaisha Chip mounting method and mounted substrate manufacturing apparatus

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Publication number Publication date
WO2003071476A1 (fr) 2003-08-28
EP1479040A1 (fr) 2004-11-24
CN100390821C (zh) 2008-05-28
US20050181530A1 (en) 2005-08-18
KR20040083527A (ko) 2004-10-02
AU2003201740A1 (en) 2003-09-09
JP2005517592A (ja) 2005-06-16
CN1633674A (zh) 2005-06-29

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