US6380344B1 - Cyanate ester composition and cured product thereof - Google Patents

Cyanate ester composition and cured product thereof Download PDF

Info

Publication number
US6380344B1
US6380344B1 US09/309,267 US30926799A US6380344B1 US 6380344 B1 US6380344 B1 US 6380344B1 US 30926799 A US30926799 A US 30926799A US 6380344 B1 US6380344 B1 US 6380344B1
Authority
US
United States
Prior art keywords
cyanate ester
ester composition
epoxy resin
composition according
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US09/309,267
Inventor
Toshiaki Hayashi
Nobuyuki Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Assigned to SUMITOMO CHEMICAL COMPANY, LIMITED reassignment SUMITOMO CHEMICAL COMPANY, LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAYASHI, TOSHIAKI, NAKAJIMA, NOBUYUKI
Application granted granted Critical
Publication of US6380344B1 publication Critical patent/US6380344B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors

Definitions

  • the present invention relates to polyfunctional cyanate ester (herein-after, referred to as “cyanate ester”) compositions providing a cured product which is excellent in mechanical properties, and to cured products thereof.
  • cyanate ester polyfunctional cyanate ester
  • the cyanate ester composition of the present invention is particularly useful as an encapsulating material, a material for laminated boards, a structure material and a paint material.
  • a cyanate esters have been mainly used as insulation materials for printed circuit boards because of their high glass transition temperatures and low dielectric properties.
  • the cyanate ester is usually modified with other components and used in a composition.
  • Japanese Patent Publication (Kokoku) No.46-41112 has been known as providing one such modification method.
  • a cyanate ester is usually produced by a reaction of a poly-valent phenol with a cyanogen halide.
  • An object of the present invention is to provide a composition that is capable of producing a cured product which is excellent in mechanical properties, and a cured product thereof.
  • the present inventors have studied intensively and as a result, found that a cured product which is particularly excellent in mechanical properties is produced in combination with an epoxy resin by using a cyanate ester in which the total content of impurities containing imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols is reduced to 5% or less, and thereby have completed the present invention.
  • the present invention relates to a cyanate ester composition, comprising (A) a cyanate ester in which the total content of imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols as impurities is reduced to 5% or less, or a prepolymer thereof, and (B) an epoxy resin as essential components, and a cured product thereof.
  • the cyanate ester(A) used in the present invention is a cyanate ester in which the total content of imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols as impurities is 5% or less.
  • the cyanate ester is a compound having at least two cyanate ester groups, with examples thereof including difunctional cyanate compounds such as 2,2-bis(4-cyanatophenyl)propane, 1,1-bis(4-cyanatophenyl)ethane, bis(4-cyanato-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanatophenyl-1-(methylethylidene))benzene, bis(4-cyanatophenyl) thioether, bis(4-cyanatophenyl)ether and the like; and polyfunctional cyanate compounds derived from a phenol novolac, a cresol and the like, but the same is not limited thereto.
  • difunctional cyanate compounds such as 2,2-bis(4-cyanatophenyl)propane, 1,1-bis(4-cyanatophenyl)ethane, bis(4-cyanato-3,5-dimethylphenyl)methane, 1,
  • Any cyanate ester (A) in the present invention can be used, but a cyanate ester(A) derived from bisphenol A is preferable from the viewpoint of reactivity and heat resistance, in particular.
  • the cyanate ester used in the present invention may be used as it is, that is, as a monomer or as a prepolymer thereof.
  • Such a prepolymer can be obtained by heating the cyanate ester alone or in a mixture of 2 or more of the cyanate esters in a solvent or without a solvent at 50 to 200° C., or by heating them in a solvent or without a solvent at about 50 to 200° C. in the presence of a curing catalyst (C) as described below.
  • the cyanate ester used in the present invention has the total content of imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols of 5% or less as impurities.
  • the total content of all impurities is 5% or less.
  • the impurities being maintained at the low total level of 5% or less may consist essentially of imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols.
  • the cyanate ester can be obtained, for example, by carrying out a de-hydrohalogenation of a phenol as a raw material with a cyanogen halide represented by cyanogen chloride or cyanogen bromide in an appropriate solvent.
  • a cyanogen halide represented by cyanogen chloride or cyanogen bromide in an appropriate solvent.
  • the cyanate ester which is obtained by this method occasionally contains a remarkable amount of impurities depending on production conditions such as reaction temperature, solvent utilized and the like. Accordingly, when a compound is used in the present invention, the total content of imino carbonates, alkyl cyanamides and partially substituted cyanates(cyanate monoesters) as by-products and unreacted phenols in the cyanate ester is required to be 5% or less.
  • the content of the impurities can be reduced to be 5% or less, by properly selecting the kind of solvent used in a crystallization step and washing step after the synthesis of the cyanate ester. Further, the kind of a solvent differs depending upon the system of reaction and the kind of the cyanate ester being utilized.
  • the content in other words, purity of the cyanate ester used in the present invention is determined by using a high speed liquid chromatography method (LC) or a gas chromatography method (GC). Contents were determined by the peak area ratio of respective components to the total peak area (set as 100) derived from the synthesized product of a chromatogram. Specific measurement conditions may be properly selected depending on the kind of the compound, and in LC, the content can be measured by changing the condition of a mobile phase, depending upon the kind of the compound used, for example among the conditions indicated in the Examples herein provided.
  • LC liquid chromatography method
  • GC gas chromatography method
  • epoxy resins (B) in the present invention can be used, and epoxy resins obtained by any known processes can be also used.
  • n is an average repeating number and represents a number of 0 to 10
  • h represents an integer of 1 to 3(preferably 2 to 3)
  • j represents an integer of 1 to 3
  • i represents zero or an integer of 1 to 4
  • l is zero or integer of 1 to 3
  • each of the R groups independently represents a bromine atom, a chlorine atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 5 to 7 carbon atoms, a hydrocarbon group having 6 to 20 carbon atoms, which includes a cycloalkyl group having 5 to 7 carbon atoms, or a group represented by the structural formula (3) described below:
  • m represents a number of 0 to 9, and each of the R groups may be the same or different when i is 2 or more, Gly represents a glycidyl group, and A represents any one of an oxygen atom, a sulfur atom, or a group represented by the structural formulae (4) to (14) below:
  • each of the T groups represents independently an alkyl group having 1 to 10 carbon atoms, and k is zero or an integer of 1 to 4; and further epoxy resins represented by the structural formulae (15) and (16) described below,
  • each of the U groups independently represents a halogen atom or an alkyl group having 1 to 10 carbon atoms, and T and i are as defined above).
  • Examples of the epoxy resin represented by the above-mentioned structural formula (1) or (2) include difunctional epoxy resins derived from bisphenol A, tetrabromobisphenol A, bisphenol S, an alkyl-substituted dihydroxybiphenyl, dihydroxystilbene, an alkyl-substituted hydroquinone and the like; novolac type epoxy resins derived from a phenol novolac, a cresol novolac, a formaldehyde novolac of bisphenol A, a benzaldehyde novolac of phenol, an alkyl-substituted phenol, or the like; aralkyl type epoxy resins derived from phenol and terephthalaldehyde, an alkyl-substituted phenol and terephthalaldehyde, or the like; and epoxy resins derived from dicyclopentadiene or a dicyclopentadiene novolac.
  • novolac type epoxy resins derived from a formaldehyde novolac of naphthol and aralkyl type epoxy resins derived from naphthol and terephthalaldehyde, naphthol and an alkyl-substituted terephthalaldehyde, or the like can be exemplified.
  • mixtures of these epoxy resins can be exemplified.
  • the epoxy resins are not limited thereto.
  • the compounding ratio of the cyanate ester compound to the epoxy resin is properly selected, and usually from 1:99 to 99:1 (weight ratio). Further, the ratio is preferably 30:70 to 95:5, and more preferably 50:50 to 90:10, because with these weight ratios, there are obtained cured products which possess good and preferable properties in heat resistance and toughness.
  • the epoxy resin used in the present invention may be used in a form for bestowing the flame resistance by previously reacting a bromine-containing phenol or a bromine-containing epoxy resin.
  • the flame resistance of the composition is preferably enhanced to a certain level in which the level V-0 of the UL Standard is attained, for use as an electronics material.
  • the curing catalyst (C) used in the present invention is a curing catalyst for cyanate esters, and any well-known one can be used. Specific examples thereof include protonic acids such as hydrogen chloride, phosphoric acid and the like; Lewis acids such as aluminum chloride, a boron trifluoride complex, zinc chloride and the like; aromatic hydroxy compounds such as phenol, pyrocatechol, dihydroxynaphthalene and the like; organic metal salts such as zinc naphthenate, cobalt naphthenate, stannic octylate, cobalt octylate and the like; organometallic complexes such as copper acetylacetonate, aluminum acetylacetonate and the like; tertiary amines such as triethylamine, tributylamine, quinoline, isoquinoline, diazabicyclo[2,2,2]octane and the like; quaternary ammonium salts such as tetraeth
  • organic metal salts such as zinc naphthenate, cobalt octylate, stannic octylate and the like; organic metal complexes such as copper acetylacetonate and the like; imidazoles; phenols or mixtures thereof are more preferable to attain the present objects.
  • the curing catalyst can be added to the resin composition at an arbitrary ratio, and they are usually blended so that the gelation time of the total resin composition is 1 minute to 15 minutes at respectively fixed temperatures of from 80° C. to 250° C.
  • thermosetting resins can also be used in combination without departing from the object of the present invention.
  • examples thereof include bismaleimides; addition polymers of bismaleimides with diamines; alkenyl aryl ether or amine resins represented by a vinyl-benzylation product of bisphenol A and a vinyl-benzylation product of diaminodiphenyl methane; alkynyl ether or amine resins represented by a dipropargylation product of bisphenol A and a dipropargylation product of diaminodiphenyl methane; in addition, phenol resins, resol resins, aryl ether type compounds, aryl amine type compounds, isocyanates, triarylisocyanurates, polyolefin compounds containing a vinyl group, and the like, but the instant invention is not limited thereto.
  • thermoplastic resin or rubber can be also added, and examples thereof include polyphenylene ethers, polystyrenes, polyethylenes, polybutadienes, polyimides, polycarbonates, polyacrylates, polymethacrylates, and polybutadiene-acrylonitrile rubbers modified with a terminal amine or a terminal carboxyl group and a modified product thereof but are not limited thereto.
  • the thermoplastic resin or rubber may be mixed in the cyanate ester composition, or may be used by being previously reacted with the composition.
  • additives such as organic flame retardants, inorganic flame retardants, releasing agents, surface-treating agents, fillers and the like may be added to the composition depending upon uses.
  • organic flame retardant examples include bromine-containing polycarbonates, bromine-containing polyphenylene oxides, bromine-containing polyacrylates, bromine-containing polystyrenes and the like
  • inorganic flame retardant examples include antimony oxide, aluminum hydroxide, red phosphorous and the like.
  • the releasing agent includes waxes, zinc stearate and the like
  • the surface-treating agent includes a silane coupling agent and the like.
  • the filler includes silica, alumina, talc, clays and the like.
  • polyfunctional cyanate ester compositions of the present invention can be utilized to produce a cured product that is excellent in mechanical strength, and that is particularly useful as an encapsulating material, a laminated board material, a structural material and a paint material.
  • the polyfunctional cyanate esters having different contents of impurities which are used in Examples below were obtained by changing the kind of a solvent which is used in the crystallization step and washing step, after the synthesis reaction.
  • Mobile phase A liquid; 1.0% by weight aqueous solution of acetic acid (acetic acid is extra pure grade and manufactured by Wako Pure Chemical Industries, Ltd.) B liquid; acetonitrile (for LC use)
  • the present Examples relate to preparation examples of cured products using polyfunctional cyanate ester compositions of the present invention.
  • the polyfunctional cyanate ester compositions of the invention were compounded at the compounding ratio (by weight) described in Table 1, and were melt-kneaded at 90° C.
  • the resulting melt-kneaded mixture was poured on a casting plate made of glass plate and cured at a condition of 175° C. ⁇ 2 hours to obtain a cured product with a thickness of 3 mm.
  • a three points-bending test of the cured products was carried out. The result is shown in Table 1.
  • the polyfunctional cyanate ester compositions compounded at the compounding ratio described in Table 1 were melt-kneaded at 90° C.
  • the resulting melt-kneaded mixture was poured on a casting plate made of glass plate and cured at a condition of 175° C. ⁇ 2 hours to obtain a cured article with a thickness of 3 mm.
  • Three points-bending test was carried out using the cured article. The result is shown in Table 1.
  • the strength shown in Table 1 was measured by the three points-bending test according to JIS-C-6481.
  • the cured product of the cyanate ester composition of the present invention is excellent in mechanical property.

Abstract

A cyanate ester-epoxy resin composition that can be cured to obtain a product which has excellent mechanical properties is provided. More particularly, a cyanate ester composition comprising (A) a cyanate ester in which the total content of impurities containing imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols is 5% or less, or a prepolymer thereof and (B) an epoxy resin is provided.

Description

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to polyfunctional cyanate ester (herein-after, referred to as “cyanate ester”) compositions providing a cured product which is excellent in mechanical properties, and to cured products thereof. The cyanate ester composition of the present invention is particularly useful as an encapsulating material, a material for laminated boards, a structure material and a paint material.
2. Description of the Related Art
A cyanate esters have been mainly used as insulation materials for printed circuit boards because of their high glass transition temperatures and low dielectric properties. In this case, the cyanate ester is usually modified with other components and used in a composition. Further, as a composition of a cyanate ester and an epoxy resin, Japanese Patent Publication (Kokoku) No.46-41112 has been known as providing one such modification method.
A cyanate ester is usually produced by a reaction of a poly-valent phenol with a cyanogen halide.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a composition that is capable of producing a cured product which is excellent in mechanical properties, and a cured product thereof.
The present inventors have studied intensively and as a result, found that a cured product which is particularly excellent in mechanical properties is produced in combination with an epoxy resin by using a cyanate ester in which the total content of impurities containing imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols is reduced to 5% or less, and thereby have completed the present invention.
The present invention relates to a cyanate ester composition, comprising (A) a cyanate ester in which the total content of imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols as impurities is reduced to 5% or less, or a prepolymer thereof, and (B) an epoxy resin as essential components, and a cured product thereof.
DETAILED DESCRIPTION OF THE INVENTION
The present invention is illustrated in detail below.
The cyanate ester(A) used in the present invention is a cyanate ester in which the total content of imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols as impurities is 5% or less.
The cyanate ester is a compound having at least two cyanate ester groups, with examples thereof including difunctional cyanate compounds such as 2,2-bis(4-cyanatophenyl)propane, 1,1-bis(4-cyanatophenyl)ethane, bis(4-cyanato-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanatophenyl-1-(methylethylidene))benzene, bis(4-cyanatophenyl) thioether, bis(4-cyanatophenyl)ether and the like; and polyfunctional cyanate compounds derived from a phenol novolac, a cresol and the like, but the same is not limited thereto.
Any cyanate ester (A) in the present invention can be used, but a cyanate ester(A) derived from bisphenol A is preferable from the viewpoint of reactivity and heat resistance, in particular.
The cyanate ester used in the present invention may be used as it is, that is, as a monomer or as a prepolymer thereof.
Such a prepolymer can be obtained by heating the cyanate ester alone or in a mixture of 2 or more of the cyanate esters in a solvent or without a solvent at 50 to 200° C., or by heating them in a solvent or without a solvent at about 50 to 200° C. in the presence of a curing catalyst (C) as described below.
The cyanate ester used in the present invention has the total content of imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols of 5% or less as impurities. Preferably the total content of all impurities is 5% or less. But, the impurities being maintained at the low total level of 5% or less may consist essentially of imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols.
The cyanate ester can be obtained, for example, by carrying out a de-hydrohalogenation of a phenol as a raw material with a cyanogen halide represented by cyanogen chloride or cyanogen bromide in an appropriate solvent. However, the cyanate ester which is obtained by this method occasionally contains a remarkable amount of impurities depending on production conditions such as reaction temperature, solvent utilized and the like. Accordingly, when a compound is used in the present invention, the total content of imino carbonates, alkyl cyanamides and partially substituted cyanates(cyanate monoesters) as by-products and unreacted phenols in the cyanate ester is required to be 5% or less.
The content of the impurities can be reduced to be 5% or less, by properly selecting the kind of solvent used in a crystallization step and washing step after the synthesis of the cyanate ester. Further, the kind of a solvent differs depending upon the system of reaction and the kind of the cyanate ester being utilized.
The content, in other words, purity of the cyanate ester used in the present invention is determined by using a high speed liquid chromatography method (LC) or a gas chromatography method (GC). Contents were determined by the peak area ratio of respective components to the total peak area (set as 100) derived from the synthesized product of a chromatogram. Specific measurement conditions may be properly selected depending on the kind of the compound, and in LC, the content can be measured by changing the condition of a mobile phase, depending upon the kind of the compound used, for example among the conditions indicated in the Examples herein provided.
Any epoxy resins (B) in the present invention can be used, and epoxy resins obtained by any known processes can be also used.
There is illustratively mentioned a process which comprises reacting a phenol or its derivative with an epihalohydrin in the presence of an alkali such as sodium hydroxide or the like, as a common process for producing an epoxy resin, but the present invention is not limited thereto.
Examples of the epoxy resin include epoxy resins represented by the structural formula (1) or (2) below:
Figure US06380344-20020430-C00001
wherein, n is an average repeating number and represents a number of 0 to 10, h represents an integer of 1 to 3(preferably 2 to 3), j represents an integer of 1 to 3, i represents zero or an integer of 1 to 4, l is zero or integer of 1 to 3, and each of the R groups independently represents a bromine atom, a chlorine atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 5 to 7 carbon atoms, a hydrocarbon group having 6 to 20 carbon atoms, which includes a cycloalkyl group having 5 to 7 carbon atoms, or a group represented by the structural formula (3) described below:
Figure US06380344-20020430-C00002
wherein m represents a number of 0 to 9, and each of the R groups may be the same or different when i is 2 or more, Gly represents a glycidyl group, and A represents any one of an oxygen atom, a sulfur atom, or a group represented by the structural formulae (4) to (14) below:
Figure US06380344-20020430-C00003
wherein each of the T groups represents independently an alkyl group having 1 to 10 carbon atoms, and k is zero or an integer of 1 to 4; and further epoxy resins represented by the structural formulae (15) and (16) described below,
Figure US06380344-20020430-C00004
wherein h, j and n are as defined above, and B represents any one of the structural formula (4) as described above or the structural formula (17) below,
Figure US06380344-20020430-C00005
(wherein each of the U groups independently represents a halogen atom or an alkyl group having 1 to 10 carbon atoms, and T and i are as defined above)].
Examples of the epoxy resin represented by the above-mentioned structural formula (1) or (2) include difunctional epoxy resins derived from bisphenol A, tetrabromobisphenol A, bisphenol S, an alkyl-substituted dihydroxybiphenyl, dihydroxystilbene, an alkyl-substituted hydroquinone and the like; novolac type epoxy resins derived from a phenol novolac, a cresol novolac, a formaldehyde novolac of bisphenol A, a benzaldehyde novolac of phenol, an alkyl-substituted phenol, or the like; aralkyl type epoxy resins derived from phenol and terephthalaldehyde, an alkyl-substituted phenol and terephthalaldehyde, or the like; and epoxy resins derived from dicyclopentadiene or a dicyclopentadiene novolac.
Further, as the epoxy resin represented by the above-mentionedstructural formula (13) or (14), novolac type epoxy resins derived from a formaldehyde novolac of naphthol; and aralkyl type epoxy resins derived from naphthol and terephthalaldehyde, naphthol and an alkyl-substituted terephthalaldehyde, or the like can be exemplified. Moreover, mixtures of these epoxy resins can be exemplified. However, the epoxy resins are not limited thereto. The compounding ratio of the cyanate ester compound to the epoxy resin is properly selected, and usually from 1:99 to 99:1 (weight ratio). Further, the ratio is preferably 30:70 to 95:5, and more preferably 50:50 to 90:10, because with these weight ratios, there are obtained cured products which possess good and preferable properties in heat resistance and toughness.
It is possible to use a well-known flame retardant in combination when flame resistance is desired to be bestowed to a cured product, but the epoxy resin used in the present invention may be used in a form for bestowing the flame resistance by previously reacting a bromine-containing phenol or a bromine-containing epoxy resin. The flame resistance of the composition is preferably enhanced to a certain level in which the level V-0 of the UL Standard is attained, for use as an electronics material.
The curing catalyst (C) used in the present invention is a curing catalyst for cyanate esters, and any well-known one can be used. Specific examples thereof include protonic acids such as hydrogen chloride, phosphoric acid and the like; Lewis acids such as aluminum chloride, a boron trifluoride complex, zinc chloride and the like; aromatic hydroxy compounds such as phenol, pyrocatechol, dihydroxynaphthalene and the like; organic metal salts such as zinc naphthenate, cobalt naphthenate, stannic octylate, cobalt octylate and the like; organometallic complexes such as copper acetylacetonate, aluminum acetylacetonate and the like; tertiary amines such as triethylamine, tributylamine, quinoline, isoquinoline, diazabicyclo[2,2,2]octane and the like; quaternary ammonium salts such as tetraethylammonium chloride, tetrabutylammonium bromide and the like; imidazoles; and sodium hydroxide, sodium methylate, triphenylphosphine and a mixture thereof.
Among these curing catalysts, organic metal salts such as zinc naphthenate, cobalt octylate, stannic octylate and the like; organic metal complexes such as copper acetylacetonate and the like; imidazoles; phenols or mixtures thereof are more preferable to attain the present objects.
The curing catalyst can be added to the resin composition at an arbitrary ratio, and they are usually blended so that the gelation time of the total resin composition is 1 minute to 15 minutes at respectively fixed temperatures of from 80° C. to 250° C.
In the resin composition of the present invention, other thermosetting resins can also be used in combination without departing from the object of the present invention. Examples thereof include bismaleimides; addition polymers of bismaleimides with diamines; alkenyl aryl ether or amine resins represented by a vinyl-benzylation product of bisphenol A and a vinyl-benzylation product of diaminodiphenyl methane; alkynyl ether or amine resins represented by a dipropargylation product of bisphenol A and a dipropargylation product of diaminodiphenyl methane; in addition, phenol resins, resol resins, aryl ether type compounds, aryl amine type compounds, isocyanates, triarylisocyanurates, polyolefin compounds containing a vinyl group, and the like, but the instant invention is not limited thereto.
If necessary, a thermoplastic resin or rubber can be also added, and examples thereof include polyphenylene ethers, polystyrenes, polyethylenes, polybutadienes, polyimides, polycarbonates, polyacrylates, polymethacrylates, and polybutadiene-acrylonitrile rubbers modified with a terminal amine or a terminal carboxyl group and a modified product thereof but are not limited thereto. The thermoplastic resin or rubber may be mixed in the cyanate ester composition, or may be used by being previously reacted with the composition.
In the present invention, known additives such as organic flame retardants, inorganic flame retardants, releasing agents, surface-treating agents, fillers and the like may be added to the composition depending upon uses.
Examples of the organic flame retardant include bromine-containing polycarbonates, bromine-containing polyphenylene oxides, bromine-containing polyacrylates, bromine-containing polystyrenes and the like, and examples of the inorganic flame retardant include antimony oxide, aluminum hydroxide, red phosphorous and the like. The releasing agent includes waxes, zinc stearate and the like, and the surface-treating agent includes a silane coupling agent and the like. The filler includes silica, alumina, talc, clays and the like.
As the polyfunctional cyanate ester compositions of the present invention can be utilized to produce a cured product that is excellent in mechanical strength, and that is particularly useful as an encapsulating material, a laminated board material, a structural material and a paint material.
EXAMPLE
Synthesis Examples of polyfunctional cyanate ester compositions and Examples of cured products thereof are illustrated below, but the present invention is not limited thereto.
Synthesis Example 1
In 500 g of water, 20 g (0.0865 mol) of 2,2-bis(4-hydroxyphenyl)propane (manufactured by Mitsui Toatsu Chemicals Inc.) and 18.25 g (0.438 mol) of 96% sodium hydroxide were homogeneously dissolved to prepare a phenolate solution, and the solution was cooled to 5° C.
Into a reactor equipped with a thermometer, a stirrer, a dropping funnel and a refluxing condenser, 100 g of water previously cooled to 0 to 5° C. was charged, and 7.97 g (0.130 mol) of cyanogen chloride was charged. The above-mentioned phenolate solution and 23.94 g (0.389 mol) of cyanogen chloride were simultaneously added dropwise in parallel into the reaction vessel over 40 minutes while keeping the temperature of the inner vessel between 0 and 10° C., and after completion of the dropwise addition, the temperature of the mixture was kept at the same temperature for 15 minutes.
Then, 200 g of methylisobutyl ketone was charged into the reaction vessel, the solution was subjected to layer-separation at 40° C., and then the organic layer was rinsed twice with 100 g of water. Then, after the organic layer was concentrated to 30 g under reduced pressure, 100 g of isopropanol was added dropwise to the concentrated organic layer, and the mixture was cooled to 2° C. and stirred for 1 hour. The slurry obtained was filtered to obtain a solid, and the resulting solid was washed with 10 g of isopropyl alcohol and dried in air to obtain 19.73 g (yield: 82%) of a white crystalline cyanate ester with a melting point of 80° C.
When the product was analyzed according to a liquid chromatography method (LC), bisphenol and a monocyanate compound of unreacted raw material were not detected. Iminocarbonates, which are produced from a side reaction were also not detected(purity: 99+%). Further, chlorine ion detected with potentiometric titration using silver nitrate was 10 ppm or less.
Synthesis Example 2
The same operation as in Synthesis Example 1 was carried out to obtain a synthesized product by using hexane in place of isopropanol described in Synthesis Example 1.
When the objective obtained composition was analyzed according to LC, bisphenol and a monocyanate compound of unreacted raw material and iminocarbonates which were produced from a side reaction were detected, and the total content thereof was 15% by weight. Further, the purity of a difunctional cyanate ester compound was 82% (by weight).
The polyfunctional cyanate esters having different contents of impurities which are used in Examples below were obtained by changing the kind of a solvent which is used in the crystallization step and washing step, after the synthesis reaction.
The specific measurement conditions of the purity of the polyfunctional cyanate ester and the respective contents of imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols differ depending upon the kind of said compound. 2,2′-bis(4-cyanatophenyl)propane as indicated in Examples was measured below. LC method:
In 20 ml of acetonitrile (for high speed liquid chromatography; manufactured by Wako Pure Chemical Industries, Ltd.), 100 to 200 mg of the product obtained was dissolved, and the purity and the respective contents were determined by the peak area ratio of respective components to the total peak area (set as 100) derived from the synthesized product of a chromatogram which was obtained by the LC measurement conditions described below. LC measurement conditions:
Equipment: HITACHI L-6200 type
Guard column: SUMIPAX PG-ODS (4mmφ×4 mm)
Column: Wakosil-II 3C18HG(3 μm, 4.6 mmφ×15 cm)
Mobile phase: A liquid; 1.0% by weight aqueous solution of acetic acid (acetic acid is extra pure grade and manufactured by Wako Pure Chemical Industries, Ltd.) B liquid; acetonitrile (for LC use)
Gradient:
Initial composition; B=50%(0 min.)
Gradient; B=50% →(30 min.)→B=100%
Final composition; B=100%(10 min.)
Flow rate: 1.0 ml/min.
Column temperature: 40° C.
Detection: 254 nm
Injection volume: 5 μl
Examples 1 to 6
The present Examples relate to preparation examples of cured products using polyfunctional cyanate ester compositions of the present invention.
The polyfunctional cyanate ester compositions of the invention were compounded at the compounding ratio (by weight) described in Table 1, and were melt-kneaded at 90° C. The resulting melt-kneaded mixture was poured on a casting plate made of glass plate and cured at a condition of 175° C.×2 hours to obtain a cured product with a thickness of 3 mm. A three points-bending test of the cured products was carried out. The result is shown in Table 1.
Comparative Examples 1 and 2
The polyfunctional cyanate ester compositions compounded at the compounding ratio described in Table 1 were melt-kneaded at 90° C. The resulting melt-kneaded mixture was poured on a casting plate made of glass plate and cured at a condition of 175° C.×2 hours to obtain a cured article with a thickness of 3 mm. Three points-bending test was carried out using the cured article. The result is shown in Table 1.
The strength shown in Table 1 was measured by the three points-bending test according to JIS-C-6481.
TABLE 1
Comparative
Example Example
1 2 3 4 5 6 1 2
2,2-bis(4-
cyanatophenyl)
propane
Total content
of impurities
Less than 1% 50 50
2% 50 50
4% 50 50
15% 50 50
Sumiepoxy ® 50 50 50 50
ESCN-195
LDX-4127 50 50 50 50
Zinc 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1
naphthenate
Strength 15 16 16 14 12 15 11 11
(kg/mm2)
Sumiepoxy ® ESCN-195: Cresol novolac type epoxy resin (manufactured by Sumitomo Chemical Co., Ltd.)
LDX-4127: Bromine-containing novolac type epoxy resin (manufactured by Sumitomo Chemical Co., Ltd.)
The cured product of the cyanate ester composition of the present invention is excellent in mechanical property.

Claims (17)

What is claimed is:
1. A cyanate ester composition comprising (A) a cyanate ester in which the total content of imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols as impurities is 5% or less, or a prepolymer thereof, (B) an epoxy resin, and (C) a curing catalyst selected from the group consisting of a metal naphthenate and a metal octylate.
2. The cyanate ester composition according to claim 1, wherein the cyanate ester (A) is one derived from bisphenol A, or a prepolymer thereof.
3. The cyanate ester composition according to claim 1, wherein the epoxy resin (B) is an epoxy resin represented by structural formula (1) or (2) below:
Figure US06380344-20020430-C00006
wherein, n is an average repeating number and represents a number of 0 to 10, h represents an integer of 1 to 3, j represents an integer of 1 to 3, i represents zero or an integer of 1 to 4, l is zero or integer of 1 to 3, each of the R groups independently represents a bromine atom, a chlorine atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 5 to 7 carbon atoms, a hydrocarbon group having 6 to 20 carbon atoms, which contains a cycloalkyl group having 5 to 7 carbon atoms, or a group represented by the structural formula (3) described below:
Figure US06380344-20020430-C00007
wherein m represents a number of 0 to 9, and each of the R groups may be the same or different when i is 2 or more, Gly represents a glycidyl group, and A represents an oxygen atom, a sulfur atom, or a group represented by the structural formulae (4) to (14) below:
Figure US06380344-20020430-C00008
wherein each of the T groups represents an alkyl group having 1 to 10 carbon atoms, and k is zero or an integer of 1 to 4.
4. The cyanate ester composition according to claim 3, wherein the epoxy resin (B) is a reaction product of the epoxy resin, tetrabromo bisphenol A and a glycidyl ether of tetrabromo-bisphenol A.
5. The cyanate ester composition according to claim 1, wherein the curing catalyst is a metal naphthenate.
6. A cyanate ester composition comprising (A) a cyanate ester in which the total content of imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols as impurities is 5% or less, or a prepolymer thereof, and (B) an epoxy resin wherein the epoxy resin (B) is an epoxy resin represented by the structural formula (15) or (16) below:
Figure US06380344-20020430-C00009
wherein n is an average repeating number and represents a number of 0 to 10, h represents an integer of 1 to 3, j represents an integer of 1 to 3, Gly represents a glycidyl group, and B represents any one of the structural formal (4) or (17) below:
Figure US06380344-20020430-C00010
wherein each of the U groups independently represents a halogen atom or an alkyl group having 1 to 10 carbon atoms, each of the T groups represents an alkyl group having 1 to 10 carbon atoms and i represents zero or an integer of 1 to 4.
7. The cyanate ester composition according to claim 6, wherein the epoxy resin (B) is a reaction product of the epoxy resin, tetrabromo-bisphenol A and a glycidyl ether of tetrabromo-bisphenol A.
8. The cyanate ester composition according to claim 6, wherein said cyanate ester composition further contains (C) a curing catalyst selected from the group consisting of a metal naphthenate and a metal octylate.
9. The cyanate ester composition composition according to claim 8, when the curing catalyst is selected from the class of metal naphthenates.
10. The ester composition according to claim 8, wherein the curing catalyst is selected from the group consisting of zinc naphthenate, cobalt naphthenate, stannic octylate, and cobalt octylate.
11. A cured product comprising a cyanate ester composition according to claim 8, which has been cured.
12. A cured product obtained by curing the cyanate ester composition of claim 1.
13. A cured product obtained by curing the cyanate ester composition of claim 2.
14. A cured product obtained by curing the cyanate ester composition of claim 3.
15. A cured product obtained by curing the cyanate ester composition according to claim 4.
16. A cured product obtained by curing the cyanate ester composition according to claim 6.
17. A cured product obtained by curing the cyanate ester composition according to claim 7.
US09/309,267 1998-05-13 1999-05-11 Cyanate ester composition and cured product thereof Expired - Fee Related US6380344B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13020198 1998-05-13
JP10-130201 1998-05-13

Publications (1)

Publication Number Publication Date
US6380344B1 true US6380344B1 (en) 2002-04-30

Family

ID=15028519

Family Applications (1)

Application Number Title Priority Date Filing Date
US09/309,267 Expired - Fee Related US6380344B1 (en) 1998-05-13 1999-05-11 Cyanate ester composition and cured product thereof

Country Status (6)

Country Link
US (1) US6380344B1 (en)
EP (1) EP0957123A3 (en)
KR (1) KR19990088162A (en)
CN (1) CN1140560C (en)
SG (1) SG87031A1 (en)
TW (1) TW541323B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120123082A1 (en) * 2009-01-29 2012-05-17 Adeka Corporation One liquid type cyanate ester-epoxy composite resin composition
CN103173172A (en) * 2013-03-23 2013-06-26 东莞市松山湖微电子材料研发中心 High-damping halogen-free pouring sealant and preparation method thereof
CN103189418A (en) * 2010-08-06 2013-07-03 日立化成株式会社 Process for producing compatibilized resin, thermosetting resin composition, prepreg, and laminate
US20130288063A1 (en) * 2011-02-04 2013-10-31 Mitsubishi Gas Chemical Company, Inc. Curable resin composition and cured product thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100561070B1 (en) * 2003-09-05 2006-03-15 주식회사 엘지화학 Thermosetting resin composition for high speed transmission circuit film
JP4843944B2 (en) * 2005-01-13 2011-12-21 三菱瓦斯化学株式会社 Resin composition and prepreg and laminate using the same
CN1300210C (en) * 2005-06-17 2007-02-14 中国航空工业第一集团公司北京航空材料研究院 Cyanate modified epoxy resin system catalystzed by organic titanium epoxy resin

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562214A (en) 1967-06-01 1971-02-09 Bayer Ag Resins based on aromatic cyanic acid esters and polyepoxide compounds
US4361623A (en) * 1979-11-13 1982-11-30 Basf Wyandotte Corporation Flame retardant antistatic additives and antistatic fibers
US4661553A (en) * 1986-02-24 1987-04-28 The Dow Chemical Company Vinyl esters of polyepoxides of polyphenol cyanate mixture and polymaleimide co-oligomers
EP0301787A1 (en) 1987-07-27 1989-02-01 Interez, Inc. Metal acetylacetonate/alkylphenol curing catalyst for polycyanate esters of polyhydric phenols
US4900848A (en) * 1985-09-27 1990-02-13 Sumitomo Chemical Company, Limited Low-viscosity epoxy resin, and fiber-reinforced composite material from triglycidyl m-aminophenols
US4918157A (en) * 1987-07-08 1990-04-17 Amoco Corporation Thermosetting composition comprising cyanate ester, urea compound and epoxy resin
US4931496A (en) * 1987-07-08 1990-06-05 Amoco Corporation Damage tolerant fiber-reinforced composites based on cyanate ester/urea thermosetting composition
US5284968A (en) * 1986-11-24 1994-02-08 Ciba-Geigy Corporation Process for preparing bis (4-cyanatophenyl)-1,1-ethane
JPH0834832A (en) 1994-07-21 1996-02-06 Sumitomo Chem Co Ltd Thermosetting resin composition and copper-clad laminate
EP0739879A1 (en) 1995-04-24 1996-10-30 Sumitomo Chemical Company Limited Halogen-containing cyanate ester, process for producing the same and thermosetting resin composition containing the same
JPH09278882A (en) 1996-04-12 1997-10-28 Sumitomo Chem Co Ltd Flame-retardant cyanic ester resin composition and copper-clad laminate
JPH1077332A (en) 1996-07-12 1998-03-24 Sumitomo Chem Co Ltd Polyfunctional cyanic acid ester resin composition and copper-clad laminate
US5955543A (en) * 1996-01-11 1999-09-21 International Business Machines Corporation Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or hydroxystyrene resin

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140276A (en) * 1997-11-11 1999-05-25 Sumitomo Chem Co Ltd Polyfuctional cyanic acid ester resin composition and resin-encapsulated semiconductor device

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562214A (en) 1967-06-01 1971-02-09 Bayer Ag Resins based on aromatic cyanic acid esters and polyepoxide compounds
US4361623A (en) * 1979-11-13 1982-11-30 Basf Wyandotte Corporation Flame retardant antistatic additives and antistatic fibers
US4900848A (en) * 1985-09-27 1990-02-13 Sumitomo Chemical Company, Limited Low-viscosity epoxy resin, and fiber-reinforced composite material from triglycidyl m-aminophenols
US4661553A (en) * 1986-02-24 1987-04-28 The Dow Chemical Company Vinyl esters of polyepoxides of polyphenol cyanate mixture and polymaleimide co-oligomers
US5284968A (en) * 1986-11-24 1994-02-08 Ciba-Geigy Corporation Process for preparing bis (4-cyanatophenyl)-1,1-ethane
US4918157A (en) * 1987-07-08 1990-04-17 Amoco Corporation Thermosetting composition comprising cyanate ester, urea compound and epoxy resin
US4931496A (en) * 1987-07-08 1990-06-05 Amoco Corporation Damage tolerant fiber-reinforced composites based on cyanate ester/urea thermosetting composition
EP0301787A1 (en) 1987-07-27 1989-02-01 Interez, Inc. Metal acetylacetonate/alkylphenol curing catalyst for polycyanate esters of polyhydric phenols
JPH0834832A (en) 1994-07-21 1996-02-06 Sumitomo Chem Co Ltd Thermosetting resin composition and copper-clad laminate
EP0739879A1 (en) 1995-04-24 1996-10-30 Sumitomo Chemical Company Limited Halogen-containing cyanate ester, process for producing the same and thermosetting resin composition containing the same
US5955543A (en) * 1996-01-11 1999-09-21 International Business Machines Corporation Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or hydroxystyrene resin
JPH09278882A (en) 1996-04-12 1997-10-28 Sumitomo Chem Co Ltd Flame-retardant cyanic ester resin composition and copper-clad laminate
JPH1077332A (en) 1996-07-12 1998-03-24 Sumitomo Chem Co Ltd Polyfunctional cyanic acid ester resin composition and copper-clad laminate

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Patent Abstracts of Japan, vol. 1996, No. 06, Jun. 28, 1996 & JP 08 034832 A (Sumitomo Chem Co Ltd), Feb. 6, 1996.
Patent Abstracts of Japan, vol. 1998, No. 02, Jan. 30, 1998 & JP 09 278882 A (Sumitomo Chem Co Ltd), Oct. 28, 1997.
Patent Abstracts of Japan, vol. 1998, No. 08, Jun. 30, 1998 & JP 10 077332 A (Sumitomo Chem Co Ltd), Mar. 24, 1998.

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120123082A1 (en) * 2009-01-29 2012-05-17 Adeka Corporation One liquid type cyanate ester-epoxy composite resin composition
US9303114B2 (en) * 2009-01-29 2016-04-05 Adeka Corporation One liquid type cyanate ester-epoxy composite resin composition
CN103189418A (en) * 2010-08-06 2013-07-03 日立化成株式会社 Process for producing compatibilized resin, thermosetting resin composition, prepreg, and laminate
CN103189418B (en) * 2010-08-06 2015-08-12 日立化成株式会社 The manufacture method of compatible resin, hot curing resin composition, prepreg and plywood
US20130288063A1 (en) * 2011-02-04 2013-10-31 Mitsubishi Gas Chemical Company, Inc. Curable resin composition and cured product thereof
US9657173B2 (en) * 2011-02-04 2017-05-23 Mitsubishi Gas Chemical Company, Inc. Curable resin composition and cured product thereof
CN103173172A (en) * 2013-03-23 2013-06-26 东莞市松山湖微电子材料研发中心 High-damping halogen-free pouring sealant and preparation method thereof

Also Published As

Publication number Publication date
SG87031A1 (en) 2002-03-19
EP0957123A3 (en) 2000-05-10
TW541323B (en) 2003-07-11
CN1236789A (en) 1999-12-01
CN1140560C (en) 2004-03-03
EP0957123A2 (en) 1999-11-17
KR19990088162A (en) 1999-12-27

Similar Documents

Publication Publication Date Title
JP4285491B2 (en) Epoxy resin composition, cured product thereof, novel epoxy resin, novel phenol resin, and semiconductor sealing material
US9045508B2 (en) Phosphorus-containing oligomer and method for producing the same, curable resin composition and cured product of the same, and printed wiring board
TWI454498B (en) Curable resin composition, cured article thereof, print wiring board, epoxy resin and method for producing the same
JP4259536B2 (en) Method for producing phenol resin and method for producing epoxy resin
EP2532710B1 (en) Phenol resin composition, curable resin composition, cured products thereof, and printed circuit board
EP3620459B1 (en) Phosphorus-containing phenolic compound, phosphorus-containing epoxy resin, curable resin composition thereof, or epoxy resin composition and cured product thereof
JP5664817B2 (en) Phenolic hydroxyl group-containing compound, phenol resin, curable composition, cured product thereof, semiconductor sealing material, and printed wiring board
US6380344B1 (en) Cyanate ester composition and cured product thereof
KR102376061B1 (en) Epoxy resin mixture, epoxy resin composition, cured product and semiconductor device
EP0477724B1 (en) Epoxy resin, epoxy resin composition and cured product thereof
US6903180B2 (en) Epoxy resins, process for preparation thereof, epoxy resin compositions and cured articles
KR100531072B1 (en) Polyhydric phenol compounds, epoxy resins, epoxy resin compositions and cured products thereof
JPH07316252A (en) Production and composition of epoxy resin excellent in dielectric property
KR20190025852A (en) Active ester resins and their cured products
JP3062822B2 (en) Epoxy resin composition
KR102145814B1 (en) Epoxy compound, epoxy resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board
JP2000034345A (en) Polyfunctional cyanic ester resin composition and cured product thereof
JP5850228B2 (en) Curable resin composition, cured product thereof, cyanate ester resin, semiconductor sealing material, prepreg, circuit board, and build-up film
JP2003034711A (en) Epoxy resin, epoxy resin composition and cured product thereof
JP3178058B2 (en) Epoxy compound and composition thereof
JPH08253582A (en) Thermosetting resin composition and copper-clad laminate
JPH06172242A (en) Polyhydroxy compound, thermosetting compound derived therefrom and composition thereof
EP0465738A2 (en) Process for producing tetraepoxy resins, epoxy resin compositions, tetraepoxy resins and tetrahydric phenol compounds
JP2003034712A (en) Epoxy resin, epoxy resin composition, aromatic polyol compound and cured product thereof
JPH0436309A (en) Epoxy resin composition

Legal Events

Date Code Title Description
AS Assignment

Owner name: SUMITOMO CHEMICAL COMPANY, LIMITED, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HAYASHI, TOSHIAKI;NAKAJIMA, NOBUYUKI;REEL/FRAME:010122/0431

Effective date: 19990707

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAY Fee payment

Year of fee payment: 4

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20100430