US6130107A - Corrosion protection in the fabrication of optoelectronic assemblies - Google Patents

Corrosion protection in the fabrication of optoelectronic assemblies Download PDF

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Publication number
US6130107A
US6130107A US09/291,854 US29185499A US6130107A US 6130107 A US6130107 A US 6130107A US 29185499 A US29185499 A US 29185499A US 6130107 A US6130107 A US 6130107A
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Prior art keywords
substrate
layer
aluminum
aluminum layer
over
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US09/291,854
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Michael Francis Brady
Mindaugas Fernand Dautartas
Casimir Roman Nijander
John William Osenbach
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Avago Technologies International Sales Pte Ltd
Nokia of America Corp
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Lucent Technologies Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers

Definitions

  • This invention relates to optoelectronics assemblies, and in particular, to a method of protecting metal from corrosion during the manufacture of such assemblies.
  • Such assemblies typically include a semiconductor laser mounted on the surface of the silicon substrate in alignment with a light guiding element such as a spherical lens which is mounted within a cavity formed in the silicon substrate.
  • the lens is typically made of a high index material such as yttrium aluminum garnet (YAG) or spinnel.
  • the lens can be bonded into the cavity in a variety of means such as epoxy, solder or aluminum oxide bonding (AlO bonding).
  • AlO bonding A generally preferred method is AlO bonding, since it forms an inorganic bond, and therefore no organic material is present after bonding. (See, e.g., U.S. Pat. No. 5,178,319 issued to Coucoulas.)
  • the aluminum bonding layer is typically formed by means of a lift off patterning technique using a photoresist mask covering the laser bonding pad which is usually a multilayer of titanium/platinum/gold. This is done to prevent the formation of gold/Aluminum intermetallic.
  • a galvanic potential develops between the Ti/Pt/Au and the aluminum, which can lead to anodization (i.e., corrosion) of the aluminum. This corrosion product acts to reduce the bond strength of the Alo bonded lens.
  • the invention is a method for fabricating an assembly on a substrate which includes the steps of depositing a multilayer structure comprising layers including gold on a surface of the substrate, forming a photoresist mask over the substrate including the multilayer structure, and depositing an aluminum layer through a photoresist mask at a portion of the surface spaced from the multilayer.
  • a protection layer comprising a material selected from the group consisting of Titanium, Zirconium, Hafnium, Niobium, Tantalum, Chromium, Molybdenum and Tungsten is deposited over the aluminum layer.
  • the photoresist is then stripped from the surface of the substrate, and the protection layer is subsequently removed from over the aluminum layer.
  • FIG. 1 is a perspective view of an assembly which can be fabricated in accordance with the invention.
  • FIGS. 2-9 are cross sectional views of the assembly taken along line 2--2 of FIG. 1 during different stages of fabrication in accordance with an embodiment of the invention.
  • FIG. 1 illustrates a typical optical subassembly.
  • the subassembly, 10 is an optical subassembly which is described in more detail in the Application of Anigbo et al, cited previously.
  • the subassembly comprises a semiconductor substrate, 11, which is typically silicon.
  • the surface, 12, of the substrate lies in the top plane in this example.
  • a laser, 13, and a photodiode, 14, are mounted on the surface, 12, with the photodiode aligned to receive light from the backface of the laser.
  • a spherical lens, 16, is also mounted in a cavity, 30, in the substrate, 11, and aligned with the laser to focus light received therefrom.
  • the lens, 16, is typically made of high refractive index material such as YAG or spinnel.
  • a cavity, 31, formed in the substrate between the laser, 13, and photodiode, 14, helps to couple light.
  • Metallization, 21-24, is also included on the substrate surface to provide electrical contact to the laser and photodiode.
  • FIG. 2 illustrates an initial stage of fabrication of the assembly, 10.
  • Cavities 30 and 32 are etched in the surface, 12, to a certain depth, typically, approximately 450 microns, and cavity 31, is etched to a smaller depth, typically approximately 100 microns, using standard photolithographic etching techniques.
  • the silicon dioxide portions, 37 and 38 are also formed from a silicon dioxide layer on the surface, 12, during the etching of the cavities, 30, 31 and 32.
  • the entire surface of the substrate, 11, is covered by successive layers of titanium, 33, platinum, 34, and gold, 35.
  • the layers may be deposited by standard deposition techniques, such as sputtering or e-beam evaporation.
  • the thickness of the titanium layer is 1000 ⁇
  • the thickness of the platinum layer is 2000 ⁇
  • the thickness of the gold layer is 5000 ⁇ .
  • a photoresist mask layer, 36 of FIG. 4, is then formed over the layers, 33-35, by depositing a standard photoresist material, such as, PRS1000, Eagle® 2100 ED from Shipley, essentially over the entire surface of the substrate, and then exposing and developing the resist so as to expose the portions of the multilayer which are to be removed. As illustrated in FIG. 5, the exposed portions of the layers 33-35 are removed by standard etching such as wet etching or ion milling. This etching defines the interconnect metallization for both the laser and the photodiode, the pads which will be used for bonding the laser and photodetector and the reflective mirror in the cavity 31.
  • a standard photoresist material such as, PRS1000, Eagle® 2100 ED from Shipley
  • another photoresist layer, 41 typically a dry laminate resist such as Riston®, is deposited and then defined.
  • This photoresist is used as a mask for the deposition of a layer, 39, comprising aluminum on the walls of the large cavities (30 and 32) while preventing aluminum from contacting the Ti/Pt/Au metallizations.
  • the layer, 39 can be formed by standard techniques such as electron-beam evaporation to deposit approximately 6.0 microns of aluminum. In general, a thickness in the range 2 to 10 ⁇ m can be employed.
  • a layer, 40 comprising titanium on the aluminum layer as illustrated in FIG. 7.
  • the titanium layer, 40 can be deposited in situ in the same electron-beam evaporation chamber utilized for the deposition of the aluminum layer.
  • the thickness of the titanium layer, 40 was approximately 500 ⁇ (0.050 microns), but thicknesses in the range 250 ⁇ to 2000 ⁇ could be useful.
  • the photoresist mask, 41 was then stripped off resulting in the structure illustrated in FIG. 8.
  • a standard photoresist stripper such as that sold under the trade designation ACT15OI from Ashland Chemical, was used to dissolve the photoresist by soaking the patterned substrate in a beaker of the resist stripper for a period of approximately 30 minutes.
  • the titanium layer, 40 served to protect the aluminum layer, 39, from corrosion which might otherwise result from the stripping operation due to the galvanic current established between the aluminum and the Ti/Pt/Au multilayer when immersed in a conductive solution such as a commercial stripper.
  • the invention is applicable, therefore, whenever an electrolytic solution is employed to strip a photoresist.
  • the titanium layer, 40 serves only to protect the aluminum layer, 39, in this embodiment, the titanium layer was then stripped off to produce the structure illustrated in FIG. 9.
  • the layer may be removed by any standard etching, such as applying a solution of EDTA, NH 4 OH, H 2 O, and H 2 O 2 for a period of approximately 1 to 8 minutes.
  • the structure can then be processed according to standard techniques, such as bonding the laser, 13 of FIG. 1, and the photodetector, 14, to their appropriate pads, and bonding the lens, 16, to the aluminum layer, 39.
  • titanium is preferred as the protective layer
  • other elements from groups IVA, VA, and VIA, of the periodic table may be employed, i.e., Zirconium, Hafnium, Vanadium, Niobium, Tantalum, Chromium, Molybdenum, or Tungsten.
  • metallizations other than Ti/Pt/Au as the substrate could benefit, for example, Ti/Pd/Au and Ti/Ni/Au.
  • the invention may be advantageously employed whenever metallization including Au or the top layer is used on the substrate.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Semiconductor Lasers (AREA)
US09/291,854 1997-08-28 1999-04-15 Corrosion protection in the fabrication of optoelectronic assemblies Expired - Lifetime US6130107A (en)

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US09/291,854 US6130107A (en) 1997-08-28 1999-04-15 Corrosion protection in the fabrication of optoelectronic assemblies

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US91991897A 1997-08-28 1997-08-28
US09/291,854 US6130107A (en) 1997-08-28 1999-04-15 Corrosion protection in the fabrication of optoelectronic assemblies

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US (1) US6130107A (fr)
EP (1) EP0899781A3 (fr)
JP (1) JPH11177186A (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030168745A1 (en) * 2002-03-05 2003-09-11 Yu-Sik Kim Multi-layer structure for reducing capacitance and manufacturing method thereof
US20050285131A1 (en) * 2004-06-24 2005-12-29 Gallup Kendra J Lids for wafer-scale optoelectronic packages
US20100290030A1 (en) * 2007-09-18 2010-11-18 Continental Teves Ag & Co. Ohg Sensor device and method for detecting the motion of a vehicle
US20130069107A1 (en) * 2010-05-20 2013-03-21 Panasonic Corporation Nitride semiconductor light emitting device and method of manufacturing the same
US9341792B2 (en) 2010-06-29 2016-05-17 Cisco Technology, Inc. Vent structures for encapsulated components on an SOI-based photonics platform
CN108736317A (zh) * 2018-05-15 2018-11-02 深圳市光脉电子有限公司 一种发光二极管外延结构及其矩阵式激光器器件

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116918199A (zh) * 2021-02-26 2023-10-20 京瓷株式会社 半导体器件的制造方法、半导体器件以及半导体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5178319A (en) * 1991-04-02 1993-01-12 At&T Bell Laboratories Compression bonding methods

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3654526A (en) * 1970-05-19 1972-04-04 Texas Instruments Inc Metallization system for semiconductors
US4158613A (en) * 1978-12-04 1979-06-19 Burroughs Corporation Method of forming a metal interconnect structure for integrated circuits
DE69611282T2 (de) * 1995-12-22 2001-04-26 Lucent Technologies Inc., Murray Hill Optische Unteranordnung mit niedriger Abmessung

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5178319A (en) * 1991-04-02 1993-01-12 At&T Bell Laboratories Compression bonding methods

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030168745A1 (en) * 2002-03-05 2003-09-11 Yu-Sik Kim Multi-layer structure for reducing capacitance and manufacturing method thereof
US6747292B2 (en) * 2002-03-05 2004-06-08 Samsung Electronics Co., Ltd. Multi-layer structure for reducing capacitance and manufacturing method thereof
US20050285131A1 (en) * 2004-06-24 2005-12-29 Gallup Kendra J Lids for wafer-scale optoelectronic packages
US7534636B2 (en) 2004-06-24 2009-05-19 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Lids for wafer-scale optoelectronic packages
US20100290030A1 (en) * 2007-09-18 2010-11-18 Continental Teves Ag & Co. Ohg Sensor device and method for detecting the motion of a vehicle
US20130069107A1 (en) * 2010-05-20 2013-03-21 Panasonic Corporation Nitride semiconductor light emitting device and method of manufacturing the same
US9006778B2 (en) * 2010-05-20 2015-04-14 Panasonic Intellectual Property Mangement Co., Ltd. Nitride semiconductor light emitting device and method of manufacturing the same
US9341792B2 (en) 2010-06-29 2016-05-17 Cisco Technology, Inc. Vent structures for encapsulated components on an SOI-based photonics platform
CN108736317A (zh) * 2018-05-15 2018-11-02 深圳市光脉电子有限公司 一种发光二极管外延结构及其矩阵式激光器器件

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EP0899781A3 (fr) 2000-03-08
JPH11177186A (ja) 1999-07-02
EP0899781A2 (fr) 1999-03-03

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