US6111750A - Electronic apparatus - Google Patents

Electronic apparatus Download PDF

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Publication number
US6111750A
US6111750A US09/232,418 US23241899A US6111750A US 6111750 A US6111750 A US 6111750A US 23241899 A US23241899 A US 23241899A US 6111750 A US6111750 A US 6111750A
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US
United States
Prior art keywords
recess
heat pipe
wall
external enclosure
clamped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US09/232,418
Inventor
William George Gates
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Bell Semiconductor LLC
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to EP97309028A priority Critical patent/EP0917418B1/en
Priority to DE69724972T priority patent/DE69724972T2/en
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Priority to US09/232,418 priority patent/US6111750A/en
Priority to CA002260305A priority patent/CA2260305C/en
Priority to JP11024534A priority patent/JP3084015B2/en
Priority to AU15433/99A priority patent/AU720799B1/en
Priority to KR1019990003869A priority patent/KR100324072B1/en
Priority to BR9901119-0A priority patent/BR9901119A/en
Assigned to LUCENT TECHNOLOGIES INC. reassignment LUCENT TECHNOLOGIES INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GATES, WILLIAM GEORGE
Publication of US6111750A publication Critical patent/US6111750A/en
Application granted granted Critical
Assigned to DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT reassignment DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT PATENT SECURITY AGREEMENT Assignors: AGERE SYSTEMS LLC, LSI CORPORATION
Assigned to AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. reassignment AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AGERE SYSTEMS LLC
Assigned to LSI CORPORATION, AGERE SYSTEMS LLC reassignment LSI CORPORATION TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Assignors: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Assigned to BANK OF AMERICA, N.A., AS COLLATERAL AGENT reassignment BANK OF AMERICA, N.A., AS COLLATERAL AGENT PATENT SECURITY AGREEMENT Assignors: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Assigned to AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. reassignment AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Assignors: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Assigned to BELL SEMICONDUCTOR, LLC reassignment BELL SEMICONDUCTOR, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD., BROADCOM CORPORATION
Assigned to CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT reassignment CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BELL NORTHERN RESEARCH, LLC, BELL SEMICONDUCTOR, LLC, HILCO PATENT ACQUISITION 56, LLC
Anticipated expiration legal-status Critical
Assigned to BELL SEMICONDUCTOR, LLC, HILCO PATENT ACQUISITION 56, LLC, BELL NORTHERN RESEARCH, LLC reassignment BELL SEMICONDUCTOR, LLC SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CORTLAND CAPITAL MARKET SERVICES LLC
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This invention relates to electronic apparatus contained in a heat dissipative external enclosure.
  • Heat pipes have been used to conduct heat away from components to cooler positions in the external enclosure.
  • the evaporator of a heat pipe is in direct thermal contact with a power component e.g. by clamping or bonding.
  • the condenser is conventionally pressed into a groove in the wall of the external enclosure, being an interference fit in the groove so as to ensure good thermal contact.
  • the heat pipe has a round cross section and the groove has a corresponding round bottom.
  • the step of pressing the heat pipe into the groove may also be used to distort the pipe so that it finishes flush with the top of the groove.
  • a heat dissipative external enclosure containing at least one unit contained in a thermally conductive internal housing providing RF isolation and mounted on a wall of the external enclosure in thermal contact therewith; a wall of the unit having therein a first recess receiving the evaporator of a heat pipe, the heat pipe being clamped between the external enclosure and the internal housing, the condenser of the heat pipe being lower, in use, than the evaporator, being received by a recess in the wall of the external enclosure and clamped therein by a clamp member.
  • the inner housing can maintain RF isolation.
  • the first recess is preferably located adjacent one or more power components inside the internal housing.
  • the condenser is preferably clamped in its recess by another unit which fulfils the function of clamp member. That other unit may comprise only low power components.
  • the heat pipe has two opposed substantially flat sides, and the first and second recesses are flat bottomed. This simplifies machining the recesses, and allows the surface of the wall or clamp member opposite the first and second recess respectively to be plain.
  • FIG. 1 is a schematic section through part of electronic apparatus embodying the invention and showing internal housings mounted on a wall of an external enclosure;
  • FIG. 2 is a view of the internal housings taken from the right of FIG. 1;
  • FIG. 3 is a section on arrows A-a of FIG. 1;
  • FIG. 4 is a sectional view of a heat pipe on arrows B-Bm in FIG. 2.
  • a base station of a mobile communications network has electronic apparatus mounted in an external enclosure 2, only part of which is shown in the drawings.
  • the enclosure contains, amongst other units, a wide band power amplifier 4, contained by an aluminium internal housing 8 to provide RF isolation, and a duplexer 6.
  • the internal units, including the power amplifier 8 and the duplexer 6, are mounted in thermal contact with a wall 7 of the enclosure 2.
  • the enclosure 2 is manufactured from light metal and has extended surfaces or fins 9 so as to dissipate heat generated by its internal units including the power amplifier 4 and the duplexer 6.
  • the enclosure 2 is environmentally sealed. Convection within the enclosure is not possible due to very small internal spaces left by the units contained therein. Convection round the external enclosure is not forced so the top of the enclosure is hotter significantly than the bottom. A relatively large amount of heat is generated by the power amplifier 4 compared with the duplexer 6 and it would be better to locate the power amplifier below the duplexer in a lower temperature. Other design constraints require the power amplifier 4 to be above the duplexer, however.
  • a heat pipe 12 is provided.
  • the evaporator 13 of the heat pipe 12 is received by a recess 14 in the wall 11 of aluminium housing 8.
  • the heat pipe has two generally flat opposed sides 16.
  • the bottom 18 of the recess 14 is plain.
  • the surface of the part of the wall 7 on which the power amplifier 4 is mounted is plain.
  • the power amplifier 4 is mounted on the wall by four screws 20.
  • the depth of the recess 14 compared to the thickness of the heat pipe between its flat sides is such that the heat pipe is clamped between the wall 7 and the bottom 18 of the recess in the housing 8.
  • the width of the recess is sufficient that the heat pipe 12 is a clearance fit and can easily be removed.
  • the recess 14 locates the evaporator 13 adjacent power components 21, such as power transistors, which dissipate large amounts of heat.
  • the condenser 22 of the heat pipe 12 is received by a recess 24 in the wall 7.
  • the bottom of the recess is plain.
  • the width of the recess is sufficient that the condenser is a clearance fit so that it can easily be removed.
  • the condenser is clamped in the recess by a clamp member in the form of the duplexer 6.
  • the duplexer 6 is mounted by screws 26. It has a plain surface 28 for thermal contact with both the wall 7 and the heat pipe 12.
  • the depth of the recess 24 compared to the thickness of the heat pipe between its flat sides is such that the heat pipe is clamped between the bottom of the recess 24 in the wall 7 and the plain surface 28 of the duplexer 6.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Electronic apparatus is contained in a heat dissipative external enclosure 2. The enclosure contains at least one unit contained in a thermally conductive internal housing 4,6 providing RF isolation and mounted on a wall 7 of the enclosure in thermal contact therewith. A wall 11 of the unit has a first recess 14 receiving the evaporator 13 of a heat pipe 12. The heat pipe is clamped between the external enclosure and the internal housing. The condenser 22 of the heat pipe is lower than the evaporator and is received by a recess 24 in the wall 7. The evaporator is clamped in the recess by a clamp member e.g. another unit 6.
Because the heat pipe is clamped at its ends, it does not need to be an interference fit in either recess and may thus easily be removed. The inner housing can maintain RF isolation.

Description

A FIELD OF THE INVENTION
This invention relates to electronic apparatus contained in a heat dissipative external enclosure.
DESCRIPTION OF THE RELATED ART
In the absence of forced convection, electronic apparatus will be hotter at the top of its external enclosure than at the bottom. The situation is worse for apparatus which is sealed for use outside where internally generated heat has to be dissipated by the external enclosure. Ideally components which dissipate large amounts of heat would be sited lower in the external enclosure than components which dissipate less heat. That is not always possible.
Heat pipes have been used to conduct heat away from components to cooler positions in the external enclosure. Conventionally, the evaporator of a heat pipe is in direct thermal contact with a power component e.g. by clamping or bonding. The condenser is conventionally pressed into a groove in the wall of the external enclosure, being an interference fit in the groove so as to ensure good thermal contact. The heat pipe has a round cross section and the groove has a corresponding round bottom. The step of pressing the heat pipe into the groove may also be used to distort the pipe so that it finishes flush with the top of the groove.
Removal of the heat pipe is virtually impossible which makes removal of the circuit board on which the component is mounted very difficult.
In some external enclosures individual units have to be isolated from one another against radio frequency (RF) interference by closed internal housings. It would be difficult to maintain the RF isolation around a heat pipe which would have to enter the internal housing.
SUMMARY OF THE INVENTION
Against this background there is provided electronic apparatus contained in a heat dissipative external enclosure, the external enclosure containing at least one unit contained in a thermally conductive internal housing providing RF isolation and mounted on a wall of the external enclosure in thermal contact therewith; a wall of the unit having therein a first recess receiving the evaporator of a heat pipe, the heat pipe being clamped between the external enclosure and the internal housing, the condenser of the heat pipe being lower, in use, than the evaporator, being received by a recess in the wall of the external enclosure and clamped therein by a clamp member.
Because the heat pipe is clamped at its ends, it does not need to be an interference fit in either recess and may thus easily be removed. The inner housing can maintain RF isolation.
The first recess is preferably located adjacent one or more power components inside the internal housing.
In order to reduce the size of the external enclosure, the condenser is preferably clamped in its recess by another unit which fulfils the function of clamp member. That other unit may comprise only low power components.
Most preferably the heat pipe has two opposed substantially flat sides, and the first and second recesses are flat bottomed. This simplifies machining the recesses, and allows the surface of the wall or clamp member opposite the first and second recess respectively to be plain.
BRIEF DESCRIPTION OF THE DRAWINGS
One embodiment of the invention will now be described, by way of example, with reference to the accompanying drawings, in which:
FIG. 1 is a schematic section through part of electronic apparatus embodying the invention and showing internal housings mounted on a wall of an external enclosure;
FIG. 2 is a view of the internal housings taken from the right of FIG. 1;
FIG. 3 is a section on arrows A-a of FIG. 1; and
FIG. 4 is a sectional view of a heat pipe on arrows B-Bm in FIG. 2.
DETAILED DESCRIPTION
Referring to the drawings, a base station of a mobile communications network has electronic apparatus mounted in an external enclosure 2, only part of which is shown in the drawings. The enclosure contains, amongst other units, a wide band power amplifier 4, contained by an aluminium internal housing 8 to provide RF isolation, and a duplexer 6. The internal units, including the power amplifier 8 and the duplexer 6, are mounted in thermal contact with a wall 7 of the enclosure 2. The enclosure 2 is manufactured from light metal and has extended surfaces or fins 9 so as to dissipate heat generated by its internal units including the power amplifier 4 and the duplexer 6.
The enclosure 2 is environmentally sealed. Convection within the enclosure is not possible due to very small internal spaces left by the units contained therein. Convection round the external enclosure is not forced so the top of the enclosure is hotter significantly than the bottom. A relatively large amount of heat is generated by the power amplifier 4 compared with the duplexer 6 and it would be better to locate the power amplifier below the duplexer in a lower temperature. Other design constraints require the power amplifier 4 to be above the duplexer, however.
In order to reduce the temperature of the power amplifier 4, a heat pipe 12 is provided. The evaporator 13 of the heat pipe 12 is received by a recess 14 in the wall 11 of aluminium housing 8. The heat pipe has two generally flat opposed sides 16. The bottom 18 of the recess 14 is plain. The surface of the part of the wall 7 on which the power amplifier 4 is mounted is plain. The power amplifier 4 is mounted on the wall by four screws 20. The depth of the recess 14 compared to the thickness of the heat pipe between its flat sides is such that the heat pipe is clamped between the wall 7 and the bottom 18 of the recess in the housing 8. As may be seen in FIG. 4, the width of the recess is sufficient that the heat pipe 12 is a clearance fit and can easily be removed.
Inside the housing 8, components are mounted on a circuit board 19. The recess 14 locates the evaporator 13 adjacent power components 21, such as power transistors, which dissipate large amounts of heat.
The condenser 22 of the heat pipe 12 is received by a recess 24 in the wall 7. The bottom of the recess is plain. The width of the recess is sufficient that the condenser is a clearance fit so that it can easily be removed. The condenser is clamped in the recess by a clamp member in the form of the duplexer 6. The duplexer 6 is mounted by screws 26. It has a plain surface 28 for thermal contact with both the wall 7 and the heat pipe 12. The depth of the recess 24 compared to the thickness of the heat pipe between its flat sides is such that the heat pipe is clamped between the bottom of the recess 24 in the wall 7 and the plain surface 28 of the duplexer 6.

Claims (4)

The invention claimed is:
1. Electronic apparatus contained in a heat dissipative external enclosure, the external enclosure containing at least one unit contained in a thermally conductive internal housing providing RF isolation and mounted on a wall of the external enclosure in thermal contact therewith; a wall of the unit having therein a first recess receiving the evaporator of a heat pipe, the heat pipe being clamped between the external enclosure and the internal housing, the condenser of the heat pipe being lower, in use, than the evaporator, being received by a recess in the wall of the external enclosure and clamped therein by a clamp member.
2. Electronic apparatus as claimed in claim 1, wherein the first recess is located adjacent one or more power components inside the internal housing.
3. Electronic apparatus as claimed in claim 1 or 2, wherein the condenser is clamped in its recess by another unit which fulfils the function of clamp member.
4. Electronic apparatus as claimed in any preceding claim, wherein the heat pipe has two opposed substantially flat sides, and the first and second recesses are flat bottomed.
US09/232,418 1997-11-11 1999-01-15 Electronic apparatus Expired - Lifetime US6111750A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
EP97309028A EP0917418B1 (en) 1997-11-11 1997-11-11 Electronic apparatus
DE69724972T DE69724972T2 (en) 1997-11-11 1997-11-11 Electronic device
US09/232,418 US6111750A (en) 1997-11-11 1999-01-15 Electronic apparatus
CA002260305A CA2260305C (en) 1997-11-11 1999-01-25 Electronic apparatus
JP11024534A JP3084015B2 (en) 1997-11-11 1999-02-02 Electronic equipment
AU15433/99A AU720799B1 (en) 1997-11-11 1999-02-04 Electronic apparatus
KR1019990003869A KR100324072B1 (en) 1997-11-11 1999-02-05 Electronic apparatus
BR9901119-0A BR9901119A (en) 1997-11-11 1999-03-24 Electronic device

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
EP97309028A EP0917418B1 (en) 1997-11-11 1997-11-11 Electronic apparatus
US09/232,418 US6111750A (en) 1997-11-11 1999-01-15 Electronic apparatus
CA002260305A CA2260305C (en) 1997-11-11 1999-01-25 Electronic apparatus
JP11024534A JP3084015B2 (en) 1997-11-11 1999-02-02 Electronic equipment
AU15433/99A AU720799B1 (en) 1997-11-11 1999-02-04 Electronic apparatus
KR1019990003869A KR100324072B1 (en) 1997-11-11 1999-02-05 Electronic apparatus
BR9901119-0A BR9901119A (en) 1997-11-11 1999-03-24 Electronic device

Publications (1)

Publication Number Publication Date
US6111750A true US6111750A (en) 2000-08-29

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ID=33033363

Family Applications (1)

Application Number Title Priority Date Filing Date
US09/232,418 Expired - Lifetime US6111750A (en) 1997-11-11 1999-01-15 Electronic apparatus

Country Status (8)

Country Link
US (1) US6111750A (en)
EP (1) EP0917418B1 (en)
JP (1) JP3084015B2 (en)
KR (1) KR100324072B1 (en)
AU (1) AU720799B1 (en)
BR (1) BR9901119A (en)
CA (1) CA2260305C (en)
DE (1) DE69724972T2 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6412479B1 (en) 2001-06-20 2002-07-02 Dana Corporation Thermal management system for positive crankcase ventilation system
US6574963B1 (en) 2001-11-16 2003-06-10 Intel Corporation Electrical energy-generating heat sink system and method of using same to recharge an energy storage device
US6639799B2 (en) 2000-12-22 2003-10-28 Intel Corporation Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
US20050029903A1 (en) * 2001-11-16 2005-02-10 Pooya Tadayon Electrical energy-generating heat sink system and method of using same to recharge an energy storage device
US20050201061A1 (en) * 2004-03-12 2005-09-15 Nader Nikfar RF power amplifier assembly with heat pipe enhanced pallet
US20060037735A1 (en) * 2002-01-03 2006-02-23 Connors Matthew J Bi-level heat sink
US20080266801A1 (en) * 2007-04-30 2008-10-30 Rockwell Automation Technologies, Inc. Phase change cooled power electronic module
US20100061053A1 (en) * 2008-09-08 2010-03-11 Intergraph Technologies Company Ruggedized Computer Capable of Operating in High-Temperature Environments
US20140078673A1 (en) * 2012-09-19 2014-03-20 General Electric Company Heat transfer assembly with heat pipe brace and method for assembling a heat transfer assembly
US9768096B2 (en) 2014-03-20 2017-09-19 Huawei Device Co., Ltd. Mobile terminal
US20180096913A1 (en) * 2016-10-05 2018-04-05 Jaehong Park Semiconductor Packages
GB2570462A (en) * 2018-01-24 2019-07-31 Moog Unna Gmbh Cabinet comprising heat pipes

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0932330B1 (en) * 1998-01-27 2001-11-28 Lucent Technologies Inc. Electronic apparatus
DE19960840A1 (en) * 1999-12-16 2001-07-05 Siemens Ag Electronic circuit with cooling device
KR100687718B1 (en) 2004-12-16 2007-02-27 한국전자통신연구원 Electron beam device adopting heat pipe
KR100628321B1 (en) 2004-12-16 2006-09-27 한국전자통신연구원 Micro column electron beam device
JP6127429B2 (en) * 2012-09-28 2017-05-17 富士通株式会社 Cooling device and electronic device

Citations (1)

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US5764483A (en) * 1993-11-15 1998-06-09 Hitachi, Ltd. Cooling unit for electronic equipment

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US4012089A (en) * 1974-04-08 1977-03-15 The United States Of America As Represented By The Secretary Of The Navy Electronic equipment enclosure
FR2533364B1 (en) * 1982-09-17 1985-11-08 Thomson Csf HEAT DISTRIBUTION DEVICE FOR ELECTRONIC COMPONENTS OF THE TYPE COMPRISING AT LEAST ONE HOT ELEMENT AND A COLD ELEMENT SUCH AS PROGRESSIVE WAVE TUBES AND METHOD FOR PRODUCING SUCH A DEVICE
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation

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Publication number Priority date Publication date Assignee Title
US5764483A (en) * 1993-11-15 1998-06-09 Hitachi, Ltd. Cooling unit for electronic equipment

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6661660B2 (en) * 2000-12-22 2003-12-09 Intel Corporation Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
US6639799B2 (en) 2000-12-22 2003-10-28 Intel Corporation Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
US6412479B1 (en) 2001-06-20 2002-07-02 Dana Corporation Thermal management system for positive crankcase ventilation system
US7411337B2 (en) 2001-11-16 2008-08-12 Intel Corporation Electrical energy-generating system and devices and methods related thereto
US6877318B2 (en) 2001-11-16 2005-04-12 Intel Corporation Electrical energy-generating heat sink system and method of using same to recharge an energy storage device
US6574963B1 (en) 2001-11-16 2003-06-10 Intel Corporation Electrical energy-generating heat sink system and method of using same to recharge an energy storage device
US20050029903A1 (en) * 2001-11-16 2005-02-10 Pooya Tadayon Electrical energy-generating heat sink system and method of using same to recharge an energy storage device
US20060037735A1 (en) * 2002-01-03 2006-02-23 Connors Matthew J Bi-level heat sink
CN101142459B (en) * 2004-03-12 2010-12-08 电力波技术公司 RF power amplifier assembly with heat pipe enhanced pallet
US20050201061A1 (en) * 2004-03-12 2005-09-15 Nader Nikfar RF power amplifier assembly with heat pipe enhanced pallet
WO2005089197A3 (en) * 2004-03-12 2007-10-04 Powerwave Technologies Inc Rf power amplifier assembly with heat pipe enhanced pallet
US7342788B2 (en) * 2004-03-12 2008-03-11 Powerwave Technologies, Inc. RF power amplifier assembly with heat pipe enhanced pallet
US20080266801A1 (en) * 2007-04-30 2008-10-30 Rockwell Automation Technologies, Inc. Phase change cooled power electronic module
US20100061053A1 (en) * 2008-09-08 2010-03-11 Intergraph Technologies Company Ruggedized Computer Capable of Operating in High-Temperature Environments
US8031464B2 (en) * 2008-09-08 2011-10-04 Intergraph Technologies Corporation Ruggedized computer capable of operating in high-temperature environments
US20140078673A1 (en) * 2012-09-19 2014-03-20 General Electric Company Heat transfer assembly with heat pipe brace and method for assembling a heat transfer assembly
US8988880B2 (en) * 2012-09-19 2015-03-24 Ge Intelligent Platforms, Inc. Heat transfer assembly with heat pipe brace and method for assembling a heat transfer assembly
US9768096B2 (en) 2014-03-20 2017-09-19 Huawei Device Co., Ltd. Mobile terminal
US20180096913A1 (en) * 2016-10-05 2018-04-05 Jaehong Park Semiconductor Packages
US10177072B2 (en) * 2016-10-05 2019-01-08 Samsung Electronics Co., Ltd. Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the package
US10446471B2 (en) 2016-10-05 2019-10-15 Samsung Electronics Co., Ltd. Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the package
GB2570462A (en) * 2018-01-24 2019-07-31 Moog Unna Gmbh Cabinet comprising heat pipes

Also Published As

Publication number Publication date
KR20000055312A (en) 2000-09-05
KR100324072B1 (en) 2002-02-16
EP0917418A1 (en) 1999-05-19
JP3084015B2 (en) 2000-09-04
CA2260305C (en) 2002-09-03
DE69724972T2 (en) 2004-07-22
BR9901119A (en) 2000-10-10
EP0917418B1 (en) 2003-09-17
CA2260305A1 (en) 2000-07-25
JP2000223877A (en) 2000-08-11
DE69724972D1 (en) 2003-10-23
AU720799B1 (en) 2000-06-15

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