GB2042809A - Mounting printed circuit boards - Google Patents
Mounting printed circuit boards Download PDFInfo
- Publication number
- GB2042809A GB2042809A GB7904302A GB7904302A GB2042809A GB 2042809 A GB2042809 A GB 2042809A GB 7904302 A GB7904302 A GB 7904302A GB 7904302 A GB7904302 A GB 7904302A GB 2042809 A GB2042809 A GB 2042809A
- Authority
- GB
- United Kingdom
- Prior art keywords
- sheet
- mounting means
- printed circuit
- heat
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004411 aluminium Substances 0.000 claims abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 238000004891 communication Methods 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims description 7
- 238000005266 casting Methods 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 230000000717 retained effect Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 230000002745 absorbent Effects 0.000 claims description 2
- 239000002250 absorbent Substances 0.000 claims description 2
- 238000005219 brazing Methods 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000001125 extrusion Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
Landscapes
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A mounting means for a printed circuit board 10 has a support for the board which supports also, spaced from the board, at least one sheet 19, 20 of heat conductive material. The support is of cast aluminium and constitutes a heat sink 12 in thermal communication with the sheets 19, 20. The sheets have a black coating to absorb heat given off by components on the board, the heat being conducted away from the sheet to the heat sink for subsequent dissipation by cooling fins 13. <IMAGE>
Description
SPECIFICATION
Improvements in or relating to mounting means for printed circuit boards
The present invention concerns improvements in or relating to mounting means for printed circuit boards.
It is desirable to remove heat generated by the components on a printed circuit board. The present invention relates to a novel arrangement for efficient heat removal.
According to the present invention there is provided a mounting means for a printed circuit board comprising a suppport for the board, at least one sheet of a heat conductive material arranged alongside the board and a heat sink in thermal communication with said sheet.
Preferably said support for the board is formed from such material that it provides also said heat sink.
Preferably the heat conductive sheet is aluminium or copper which may be provided with a heat absorbent coating, a sheet being provided on each side of the printed circuit board.
Preferably the heat sink comprises an aluminium casting or extrusion having means for receiving at least one lateral edge of the printed circuit board and the or each sheet and cooling means to enhance dissipation of heat collected from the sheet or sheets.
The casting may be provided with grooves to accommodate the edges of the printed circuit board and sheet or sheets and a groove may be provided for each board and sheet. Alternatively one groove may accommodate a printed circuit board and sheet, the board and sheet being held in spaced apart relationship against the sides of the groove by holding and spacing means.
Where the boards and sheets are accommodated in individual grooves they may be retained in position by spring clips or by brazing or soldering.
Preferably a heat sink is provided at a pair of opposite edges of the printed circuit board and the sheet or sheets, the sinks being connected by a bridge member of a thermal conductive material.
Heat pipes may be included in the bridge member.
A cover may be provided to co-operate with the heat sinks and bridge member to enclose the printed circuit board and sheets. Sealing means, preferably of the limited compression type, may be provided between the casing and the heat sinks and bridge.
Usually a plurality of printed circuit boards are provided each having a sheet on each of its sides.
Where a number of boards are provided the support for the boards and sheets may be provided by side members of a housing, the said side members providing or being in thermal communication with one or more heat sinks.
Embodiments of the present invention will now be described by way of example only with
reference to the accompanying drawings in which;
Fig. 1 shows diagrammatically an exploded perspective view of a first printed circuit board mounting means;
Fig. 2 shows a transverse cross section in the plane of the line II - II of Fig. 1;
Fig. 3 shows a sectional plan through a further printed circuit board mounting means; and
Fig. 4 shows a detail from Fig. 3 on an enlarged scale.
A mounting means for a printed circuit board 10 (Fig. 2) comprises a support cast from aluminium and including a first heat sink 11, a second heat sink 12 with cooling fins 13 cast integrally therewith, and a bridge member 14 between the first and second heat sinks. The heat sinks 1 1, 12 are each provided with three substantially parallel grooves 15, 16 and 17 running longitudinally of the heat sink.
The centre grooves 16 are adopted to accommodate the opposite edges of the board 10 which is retained in the grooves 16 by spring clips 18. The grooves 15 and 17 on either side of groove 16 accommodate the opposite edges of aluminium sheets. Thus a sheet 19, 20 is arranged on either side of the board 10 and is fixed in its grooves by any suitable means which will permit the transmission of heat from the sheet to the heat sinks. Two methods are illustrated in Fig. 2, sheet 19 being shown to be shrink-fitted into its grooves 17 whereas sheet 20 is brazed into its grooves 15.
The spacing between the grooves 15, 16, 17 and consequently the sheets and boards may be equal but generally is governed by the components mounted on the board 10. Thus if the components are mounted on the right hand side of the board as viewed in Fig. 2 the spacing between the grooves 1 5 and 1 6 will be greater than that between grooves 16 and 17 so that the components can be readily accommodated in the space between board 10 and sheet 19, normally the space between the board 10 and the sheet 19 accommodating only the soldered connections for the components on the other side of the board.
It will be realised that in operation heat given off by the component is absorbed principally by sheet 20, the heat being conducted to the heat sinks 1 1 and 12. Sink 12 is cooled by the passage of cooling medium over and between its fins 13 and the bridge portion 14 serves not only to conduct heat from sink 1 1 to heat sink 12 but also absorbs heat rising by convection from the components on the board.
As it is often advantageous to provide a dust-free atmosphere for the board a casing 21 in the form of a U-shaped metal sheet may be provided to engage against the outer faces of the heat sinks 1 1, 12 and bridge member 14 and sealing means (not shown) is incorporated between said casing and the sinks and bridge member. To enhance their heat absorption qualities the sheets 19, 20 may have a black coating.
This arrangement has been shown to be particularly efficient in the removal of heat from the printed circuit board components and compared to other methods, for example those incorporating heat conductive printed circuit
boards, is relatively inexpensive.
In a first modification of the arrangement
shown in Fig. 1 one or more heat pipes can be
incorporated in the bridge member 14 or can be
substituted for the bridge member 14.
In a further modification several printed circuit
boards can be accommodated in a plurality of
grooves formed in the heat sinks, each board
having a heat conductive sheet on each of its
sides, the sheets, with the exception of the outer
sheets, serving two neighbouring boards.
In the modified arrangement shown in Fig. 3 a
hollow aluminium box section casting is provided to mount the printed circuit boards 10 which are
arranged transversely of the section. One of the shorter edges of the casing is provided with cooling fins 31 and a series of parallel ridges 32 protrude inwardly into the casing, the ridges being equally spaced.
A printed circuit board 10 is arranged against one face of each ridge and a heat conductive sheet 33 against the other. Thus, as can be seen from
Fig. 3, each printed circuit board has a heat conducting sheet 33 arranged on each of its sides.
Means are provided for maintaining the printed circuit boards 10 and heat conducting sheets 33 spaced apart and in contact with the ridges 32.
One such holding and spacing means is shown in
Fig. 4 and comprises a block 34 which mounts at one side an eccentrically mounted rotatable cam 35. The cam enables the block 34 to be positioned between a board 10 and sheet 33 without any force being exerted on the board or sheet, subsequent rotation of the cam 35 clamping the board and sheet against the facing faces of adjacent ridges 32.
In this embodiment the casing may be sealed above and below by appropriate closure plates having peripheral sealing means which mate with the ends of the casing 30 to provide a gas-tight seal; the sealing means preferably being of the limited compression type the sealing effect of which increases when a clamping force is applied thereto, the amount of the clamping force being limited.
Various modifications can be made without departing from the scope of the invention, for example the printed circuit board and sheets shown in Fig. 3 could be arranged longitudinally
rather than transversely of the casing axis.
Furthermore the spacing between the boards and
sheets may be varied although it is desirable to
arrange the sheet as close as possible to the board
or the components thereon to obtain the most
efficient heat absorption. The spacing may also be
determined by other factors, for example, the
dimensions of standard components for use with the boards, such as multichannel plugs, the boards
and sheets being spaced apart such that said
plugs can be accommodated therebetween. The
boards and sheets may be mounted to the sinks in
any suitable manner additional to those described
herein.
In a further modification the cooling fins may be
substituted by a water cooled wall. Additionally
water-cooled walls may be provided above and/or
below the boards.
Whilst endeavouring in the foregoing
specification to draw attention to those features of the invention believed to be of particular
importance it should be understood that the
applicant claims protection in respect of any
patentable feature or combination of features
hereinbefore referred to whether or not particular emphasis has been placed thereon.
Claims (19)
1. A mounting means for a printed circuit board comprising a support for the board, at least one sheet of a heat conductive material arranged alongside the board and a heat sink in thermal communication with said sheet.
2. A mounting means as claimed in claim 1, in which said support for the board is formed from such material that it provides also said heat sink.
3. A mounting means as claimed in claim 2, in which the heat conductive sheet is aluminium or copper.
4. A mounting means as claimed in any one of claims 1 to 3, in which the sheet is provided with a heat absorbent coating.
5. A mounting means as claimed in any one of the preceding claims, in which a sheet is provided on each side of the printed circuit board.
6. A mounting means as claimed in any one of the preceding claims in which the heat sink comprises an aluminium casting or extrusion having means for receiving at least one lateral edge of the printed circuit board and the or each sheet and cooling means to enhance dissipation of heat collected from the sheet or sheets.
7. A mounting means as claimed in claim 6, in which the casting is provided with grooves to accommodate the edges of the printed circuit board and sheet or sheets.
8. A mounting means as claimed in claim 7, in which a groove is provided for each board and sheet.
9. A mounting means as claimed in claim 7, in which a groove accommodates a printed circuit board and sheet, the board and sheet being held in spaced apart relationship against the sides of the groove by holding and spacing means.
10. A mounting means as claimed in claim 8, in which the sheets are retained in position by spring clips or by brazing or soldering.
11. A mounting means as claimed in any one of the preceding claims, in which a heat sink is provided at a pair of opposite edges of the printed circuit board and the sheet or sheets, the sinks being connected by a bridge member of a thermal conductive material.
12. A mounting means as claimed in claim 1 1, in which heat pipes are included in the bridge member.
13. A mounting means as claimed in claim 1 1 or claim 12, in which a cover is provided to cooperate with the heat sinks and bridge member to enclose the printed circuit board and sheets.
14. A mounting means as claimed in claim 13, in which sealing means are provided between the casing and the heat sinks and bridge.
15. A mounting means as claimed in claim 14, in which the sealing means are of the limited compression type.
16. A mounting means as claimed in any one of the preceding claims, in which a plurality of printed circuit boards are provided each having a sheet on each of its sides.
17. A mounting means as claimed in claim 16, in which the support for the boards and sheets is provided by side members of a housing, the said side members providing or being in thermal communication with one or more heat sinks.
18. A mounting means for a printed circuit board substantially as hereinbefore described with reference to Figs. 1 and 2 or Figs. 3 and 4 of the accompanying drawings.
19. Any novel subject matter or combination including novel subject matter herein disclosed, whether or not within the scope of or relating to the same invention as any of the preceding claims.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7904302A GB2042809B (en) | 1979-02-07 | 1979-02-07 | Mouting printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7904302A GB2042809B (en) | 1979-02-07 | 1979-02-07 | Mouting printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2042809A true GB2042809A (en) | 1980-09-24 |
| GB2042809B GB2042809B (en) | 1984-02-08 |
Family
ID=10503030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB7904302A Expired GB2042809B (en) | 1979-02-07 | 1979-02-07 | Mouting printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2042809B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2514601A1 (en) * | 1981-10-13 | 1983-04-15 | Socapex | Thermal contacts to dissipate printed circuit board component heat - has water-cooled, base-plate heat-sink metal heat drain layers adjacent to components |
| US5520976A (en) * | 1993-06-30 | 1996-05-28 | Simmonds Precision Products Inc. | Composite enclosure for electronic hardware |
| US5700342A (en) * | 1993-06-30 | 1997-12-23 | Simmonds Precision Products Inc. | Composite enclosure for electronic hardware |
| JP2011003904A (en) * | 2009-06-19 | 2011-01-06 | General Electric Co <Ge> | Chassis for avionics |
| WO2011019420A3 (en) * | 2009-06-19 | 2011-04-21 | General Electric Company | Avionics chassis |
| US8023267B2 (en) | 2009-06-19 | 2011-09-20 | General Electric Company | Avionics chassis |
| US8222541B2 (en) | 2009-06-19 | 2012-07-17 | General Electric Company | Avionics chassis |
| DE202019103795U1 (en) * | 2019-07-10 | 2020-10-14 | Elma Electronic Gmbh | Electronic device, housing assembly, and slide-in assembly |
-
1979
- 1979-02-07 GB GB7904302A patent/GB2042809B/en not_active Expired
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2514601A1 (en) * | 1981-10-13 | 1983-04-15 | Socapex | Thermal contacts to dissipate printed circuit board component heat - has water-cooled, base-plate heat-sink metal heat drain layers adjacent to components |
| US5520976A (en) * | 1993-06-30 | 1996-05-28 | Simmonds Precision Products Inc. | Composite enclosure for electronic hardware |
| US5700342A (en) * | 1993-06-30 | 1997-12-23 | Simmonds Precision Products Inc. | Composite enclosure for electronic hardware |
| US5827585A (en) * | 1993-06-30 | 1998-10-27 | Simmonds Precision Products, Inc. | Composite enclosure for electronic hardware |
| JP2011003904A (en) * | 2009-06-19 | 2011-01-06 | General Electric Co <Ge> | Chassis for avionics |
| WO2011019420A3 (en) * | 2009-06-19 | 2011-04-21 | General Electric Company | Avionics chassis |
| US8023267B2 (en) | 2009-06-19 | 2011-09-20 | General Electric Company | Avionics chassis |
| US8059409B2 (en) | 2009-06-19 | 2011-11-15 | General Electric Company | Avionics chassis |
| GB2483583A (en) * | 2009-06-19 | 2012-03-14 | Gen Electric | Avionics chassis |
| US8222541B2 (en) | 2009-06-19 | 2012-07-17 | General Electric Company | Avionics chassis |
| GB2483583B (en) * | 2009-06-19 | 2013-10-02 | Gen Electric | Avionics chassis |
| DE202019103795U1 (en) * | 2019-07-10 | 2020-10-14 | Elma Electronic Gmbh | Electronic device, housing assembly, and slide-in assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2042809B (en) | 1984-02-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
| 732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |