JPS59184596A - Electronic device - Google Patents
Electronic deviceInfo
- Publication number
- JPS59184596A JPS59184596A JP5767083A JP5767083A JPS59184596A JP S59184596 A JPS59184596 A JP S59184596A JP 5767083 A JP5767083 A JP 5767083A JP 5767083 A JP5767083 A JP 5767083A JP S59184596 A JPS59184596 A JP S59184596A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- heat
- electronic
- present
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
この発明は、多量の熱を発生する電子部品、および冷却
を必要とする電子部品を塔載している電子機器装置に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic device equipped with electronic components that generate a large amount of heat and electronic components that require cooling.
従来の電子機器装置においては、例えば第１図に図例し
たように、電子部品を塔載した電子機器ユニット全体１
の筐体に空気吸込み孔２を配設してその内側に装着した
冷却ファン３によって冷却空気を吸入させ、該冷却空気
を放熱板５によって冷却を良好にさせている要冷却電子
部品４に導入して冷却を行なわせ、ついで排出孔６から
筐体外に矢印Ａのように排出させているが、このような
構造では冷却ファン３および放熱板５が筐体内に内蔵さ
れているために空気以外の冷媒の使用ができないという
欠点がある。例えば電子計算機全体が液冷を施されてい
ても、個々の要冷却電子部品の冷却には空気以外の冷媒
を利用できず、もし、液体を冷媒に使用しようとすれび
、電子機器ユニット全体を新しく製作し換えねばならな
いなど、従来においてはその電゛子部品の冷却方法が唯
一っに固定されている欠点がある。In a conventional electronic equipment device, for example, as shown in FIG.
An air suction hole 2 is provided in the casing, and a cooling fan 3 installed inside the air suction hole 2 sucks in cooling air, and the cooling air is introduced into an electronic component 4 that requires cooling, which is well cooled by a heat sink 5. The cooling is performed by cooling the housing, and then the exhaust is discharged from the exhaust hole 6 to the outside of the housing as shown by arrow A. However, in this structure, since the cooling fan 3 and the heat dissipation plate 5 are built into the housing, air other than air is discharged from the housing. The disadvantage is that it cannot use other refrigerants. For example, even if an entire electronic computer is liquid cooled, it is not possible to use a refrigerant other than air to cool individual electronic components that require cooling. Conventionally, there are disadvantages in that the cooling method for the electronic parts is uniquely fixed, such as the need to manufacture new ones.
この発明は、このような現状からなされたものであって
、内部で発生した熱を移動させる熱伝導装置、この熱を
冷却させる外部冷却装置、および該外部冷却装置と熱交
換するために前記熱伝導装置に設けられた熱交換接合部
から構成させることによって、この装置を収納する多種
多様な冷却方法に一種のユニットで任意の最適な方法で
の冷却を選択可能とした電子機器装置を提供することを
目的としている。The present invention has been made in view of the current situation, and includes a heat conduction device for transferring heat generated internally, an external cooling device for cooling the heat, and a heat transfer device for transferring heat generated internally, and an external cooling device for cooling the heat. To provide an electronic equipment device in which an arbitrary optimal method of cooling can be selected in a single unit for a wide variety of cooling methods in which the device is housed by configuring it from a heat exchange joint provided in a conduction device. The purpose is to
つぎに、この発明の実施例を図面によって説明すれば、
第２および３図において、要冷却電子部品４を内蔵した
この発明に係る電子機器ユニット全体１５は、要冷却電
子部品４を装着した銅またはアルミニウム等の熱伝導の
良好な材料で構成した熱伝導装置７に熱交換接合部８を
一体に構造させ、該接合部の外面には放熱板１６を多数
突設させである外部冷却装置１０を取付けねじ１１によ
って接面させて固設させてなるもので、前記外部冷却装
置に第４図に示す冷却ファン１２を付設させて該冷却装
置の放熱板１６に空気を送流させ、あるいは前述の放熱
板１６をもつ外部冷却装置１０に代えて第５図に示す液
体冷媒を送排する冷却管１４を内蔵させた液体冷媒冷却
装置１３を前記熱交換接合部に密着させてもよく、なお
前記熱伝導装置および熱交換接合部に保護カバー９を覆
設させて内蔵された電子部品等を保護させている。Next, an embodiment of the present invention will be described with reference to the drawings.
In FIGS. 2 and 3, the entire electronic device unit 15 according to the present invention incorporating the electronic components 4 that require cooling is constructed of a material with good thermal conductivity such as copper or aluminum, on which the electronic components 4 that require cooling are mounted. A device 7 is integrally constructed with a heat exchange joint 8, and an external cooling device 10, which has a large number of heat sinks 16 protruding from the outer surface of the joint, is fixedly attached to the external cooling device 10 in contact with the mounting screws 11. Then, the cooling fan 12 shown in FIG. A liquid refrigerant cooling device 13 having a built-in cooling pipe 14 for sending and discharging liquid refrigerant as shown in the figure may be brought into close contact with the heat exchange joint, and a protective cover 9 may be provided over the heat transfer device and the heat exchange joint. It is installed to protect the built-in electronic components.
したがって、この発明によれば、電子部品４０発生した
熱を熱移動の最良の方法である熱伝導によって熱伝導装
置７に移動させ、ついで該熱は前記熱伝導装置に一体化
させている熱交換接合部８に伝達させられ、さらに該伝
達熱は外部冷却装置１０の放熱板１６に移動して外部に
放熱されて自然空冷が行なわれて前記電子部品は冷却さ
れるが、前述したように冷却ファン１２を付設しである
場合には強制冷却を行なうことができ、また液体冷媒冷
却装置１３を付設させである場合には液体冷却による冷
却を実現できるもので、一種類の電子機器装置に対して
自然空冷、強制空冷、液体冷却など種々の冷却方法を実
施できて締めて至便である。なお、熱伝導装置７の材質
に前述した銅等の金属を使用した例について評明したが
、ヒートパイプ、または液冷装置を併用してもよく、こ
の発明に係る装置全体を熱伝導装置にするために液体、
およびガスを封入させてもよく、さらに熱交換接合部８
に外部冷却装置１０を固設させるに前述した取付けねじ
１１に代えてばね等による圧接接合でもよく、また前述
接合部間に熱伝導グリス、パツキン等を挿設して熱伝導
を向上させることも可能である。Therefore, according to the present invention, the heat generated by the electronic component 40 is transferred to the heat transfer device 7 by thermal conduction, which is the best method of heat transfer, and then the heat is transferred to the heat transfer device 7, which is integrated into the heat transfer device. The transferred heat is transferred to the joint 8, and further transferred to the heat sink 16 of the external cooling device 10, where the heat is radiated to the outside and natural air cooling is performed to cool the electronic components. If a fan 12 is attached, forced cooling can be performed, and if a liquid refrigerant cooling device 13 is attached, cooling by liquid cooling can be realized. Various cooling methods such as natural air cooling, forced air cooling, and liquid cooling can be implemented, making it convenient to use. Although an example in which the heat conduction device 7 is made of metal such as copper as described above has been described, a heat pipe or a liquid cooling device may also be used in combination, and the entire device according to the present invention may be used as a heat conduction device. liquid,
and a gas may be enclosed in the heat exchange joint 8.
In order to securely install the external cooling device 10, the above-mentioned mounting screws 11 may be replaced by pressure-welding using a spring or the like, and thermal conductive grease, packing, etc. may be inserted between the above-mentioned joints to improve heat conduction. It is possible.
上述したように、この発明は、多種多様の冷却方法を一
種類の電子機器装置に適用できて至便であるとともに、
電源装置に適用して冷却能力を向上させて出力容量を増
加させられるなど、この発明の産業上の利用価値に大な
るものがあるということができる。As described above, the present invention is convenient because a wide variety of cooling methods can be applied to one type of electronic device, and
It can be said that the present invention has great industrial utility value, such as being able to be applied to a power supply device to improve its cooling capacity and increase its output capacity.
第１図は、従来電子機器装置の要部を切開いてあられし
た斜視図、第２図は、この発明の実施例を示す要部を切
開いてあられした斜視図、第３図は、同じく縦断側面図
、第、４図は、同じく外部冷却装置に冷却ファンを付設
した斜視図、第５図は、同じく液体冷媒冷却装置を装備
した斜視図である。
４・・・要冷却電子部品、７・・・熱伝導装置、８・・
・熱交換接合部、１０・・・外部冷却装置、１２・・・
冷却ファン、１６・・・液体冷媒冷却装置、１５・・・
この発明に係る電子機器ユニット全体、１６・・・放熱
板。
なお、図中、同一符号は、同一、または相当部分を示す
。
代理人 大 岩 増 雄
第１図
第２図
第３図
５FIG. 1 is a perspective view of a conventional electronic device with the main part cut away, FIG. 2 is a perspective view of an embodiment of the present invention with the main part cut away, and FIG. 3 is a longitudinal side view of the same. 4 are perspective views in which a cooling fan is similarly attached to the external cooling device, and FIG. 5 is a perspective view in which the external cooling device is similarly equipped with a liquid refrigerant cooling device. 4...Electronic components requiring cooling, 7...Heat conduction device, 8...
- Heat exchange joint, 10...external cooling device, 12...
Cooling fan, 16...Liquid refrigerant cooling device, 15...
The entire electronic equipment unit according to the present invention, 16... heat sink. In addition, in the figures, the same reference numerals indicate the same or equivalent parts. Agent Masuo Oiwa Figure 1 Figure 2 Figure 3 Figure 5
Claims (1)
熱伝導が良好で外部に庭出されかつ外部冷却装置と密接
する熱交換接合部を有する熱伝導装置に取付けたことを
特徴とする電子機器装置。Parts that generate large amounts of heat and parts that require cooling, etc.
An electronic equipment device characterized in that it is attached to a heat conduction device having good heat conduction and having a heat exchange joint that is exposed to the outside and in close contact with an external cooling device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5767083A JPS59184596A (en) | 1983-04-01 | 1983-04-01 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5767083A JPS59184596A (en) | 1983-04-01 | 1983-04-01 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59184596A true JPS59184596A (en) | 1984-10-19 |
Family
ID=13062340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5767083A Pending JPS59184596A (en) | 1983-04-01 | 1983-04-01 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59184596A (en) |
-
1983
- 1983-04-01 JP JP5767083A patent/JPS59184596A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5966286A (en) | Cooling system for thin profile electronic and computer devices | |
| US6542359B2 (en) | Apparatus and method for cooling a wearable computer | |
| US6870736B2 (en) | Heat sink and package surface design | |
| JPH0621290A (en) | Cooling apparatus of compact three- dimensional electronic device | |
| US20020145852A1 (en) | Portable Computer and Docking Station Cooling | |
| US5725050A (en) | Integrated circuit with taped heat pipe | |
| US20090073654A1 (en) | Compact surface-mount heat exchanger | |
| US7589962B1 (en) | Apparatus for cooling a heat dissipating device located within a portable computer | |
| US6178088B1 (en) | Electronic apparatus | |
| JP2928236B1 (en) | Heat dissipating member for heating element | |
| JPS59184596A (en) | Electronic device | |
| JP3042541B2 (en) | Heat pipe type cooler | |
| JPH11307968A (en) | Heat-dissipating structure of electronic controller | |
| JPH06291480A (en) | Electronic circuit module | |
| JP2000075960A5 (en) | Expansion device | |
| JP2000315880A (en) | Circuit-accommodating body | |
| CN215222818U (en) | Heat dissipation device and electronic equipment | |
| JPH03177095A (en) | Method of dissipating heat of electronic component | |
| JPS6271300A (en) | Heat sink structure for electronic device | |
| JPH07106782A (en) | Cooling structure of electronic equipment | |
| JP2002093964A (en) | Frame structure of electronic apparatus | |
| JPH073675Y2 (en) | Cooling structure for mounted electronic components | |
| JPH05198714A (en) | Cooling structure for electronic equipment | |
| JPH0140520B2 (en) | ||
| JPS59155158A (en) | Cooling structure of semiconductor device |