US5980188A - Semiconductor manufacturing device including sensor for sensing mis-loading of a wafer - Google Patents

Semiconductor manufacturing device including sensor for sensing mis-loading of a wafer Download PDF

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US5980188A
US5980188A US08/977,883 US97788397A US5980188A US 5980188 A US5980188 A US 5980188A US 97788397 A US97788397 A US 97788397A US 5980188 A US5980188 A US 5980188A
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cassette
wafers
wafer
optical sensors
support
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US08/977,883
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Yong-in Ko
Jae-sang Park
Kyung-Soo Kim
Jae-bum Park
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, KYUNG-SOO, KO, YONG-IN, PARK, JAE-BUM, PARK, JAE-SANG
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette

Definitions

  • the present invention relates to an apparatus and method for manufacturing a semiconductor device. More particularly, the present apparatus is used to carry a wafer during the semiconductor manufacturing process and includes a sensor for sensing a mis-loaded wafer.
  • Semiconductor devices are manufactured through a multi-step process.
  • a wafer, held in a cassette is transferred through each step of the process until the semiconductor device is complete.
  • one or more of the wafers may be removed or added from the cassette and subjected to a subsequent process step, either individually or in a batch mode.
  • the cassette containing the wafers is placed in a processing bath containing a reactive solution for batch processing.
  • the cassette is composed of a material, e.g., quartz or TEFLON (a non-stick, heat resistant coating), which is stable in the presence of the reactive solution.
  • a more cost-effective method employs a guide with a plurality of slots, where the wafers are unloaded onto the guide from the cassette and subsequently moved to a second guide in a processing bath by a robot arm.
  • the guide is illustrated in FIG. 1.
  • the plurality of wafers 20 are separated from the cassette and loaded onto the guide 10 having a plurality of slots 30.
  • a wafer 20A is shown improperly loaded in slot 30 of guide 10.
  • An undetected mis-loaded wafer 20A can be dropped and broken during transfer to a second guide, for example, a guide in a processing bath having the same pitch.
  • a wafer 20, during transfer to the second guide may be mis-loaded onto the second guide and dropped in the processing bath, resulting in wafers of different batches mixing in the same processing bath.
  • the present invention provides for an apparatus for sensing a mis-loaded wafer, having a cassette with an open top surface for receiving a plurality of wafers, and an opposing partially open bottom surface.
  • the apparatus includes a cassette support which horizontally supports the cassette, with the cassette support having a support opening formed corresponding to the partially opened bottom surface of the cassette.
  • a moving means is connected to the cassette support for moving the cassette support up and down, and a guide is disposed in the support opening.
  • the guide has a plurality of slots to receive corresponding of the plurality of wafers.
  • a sensor housing, positioned above the cassette has a plurality of sensors provided on the sensor housing and aligned with a circumferential edge of a properly positioned wafer for sensing a mis-loaded wafer.
  • the present invention provides a method for carrying a plurality of wafers loaded in a cassette to a processing bath for performing a process, comprising the steps of: unloading the plurality of wafers from the cassette to a first guide; separating the plurality of wafers from the cassette; transmitting light past circumferential edges of the plurality of wafers; sensing whether one or more wafers are mis-loaded; and carrying only properly loaded wafers to a second guide in the processing bath.
  • the senor is an optical sensor.
  • Suitable optical sensors include, for example, a photo sensor, a laser sensor, and a fiber-optic sensor.
  • the optical sensor is installed such that light is transmitted perpendicular to the surfaces of the plurality of wafers along the circumferential edge of the wafers. The optical sensor thus senses whether the wafer is properly loaded by transmitting and/or receiving light.
  • the present semiconductor manufacturing device including the present apparatus for carrying a wafer is preferably used in a wet process.
  • the apparatus prevents wafers from being broken or mixed during processing, by monitoring wafers which are not correctly loaded into slots of the guide before starting the process.
  • FIG. 1 is a sectional view showing wafers loaded on a conventional guide
  • FIG. 2 is a front view of an apparatus for sensing a misloaded wafer in accordance with the present invention.
  • FIG. 3 is a perspective view of the sensing section of the present inventive apparatus.
  • FIG. 2 is a front view of the present wafer carrying apparatus 99, which generally comprises a cassette carrying section 50, a guide section 60, and a sensor section 70.
  • the cassette carrying section 50 comprises a cassette moving means including a movable cylinder 100 attached to a stationary cylinder support 102, and a cassette support 110.
  • Cassette support 110 horizontally supports a cassette 116 loaded with a plurality of wafers 114.
  • Cassette support 110 includes an opening 122 formed corresponding to an opening in the lower surface of the cassette 116 for exposing a lower part of the wafer 114.
  • the cassette support 110 is connected to cylinder 100 through the stationary cylinder support 102, such that the cassette support 110 and cassette 116 thereon move up and down with respect to the wafer guide 108.
  • the guide section 60 includes a guide fixing shaft 104, a guide support 106 connected to the stationary cylinder support 102, and the wafer guide 108, installed in the cassette support opening 122, in which a plurality of slots 130 (shown as dashed lines in FIG. 2) are formed.
  • a cassette fixing shaft 104 a guide fixing shaft 104
  • a guide support 106 connected to the stationary cylinder support 102
  • the wafer guide 108 installed in the cassette support opening 122, in which a plurality of slots 130 (shown as dashed lines in FIG. 2) are formed.
  • the sensor section 70 includes a sensor housing 118 connected to the stationary cylinder support 102 and a plurality of sensors 120 being installed on the sensor housing 118.
  • the sensors 120 preferably use light as a sensing medium.
  • FIG. 3 illustrates an enlarged perspective view of the sensor section 70.
  • the sensor housing 118 has a pair of first parallel plates 118a, 118b, on which a plurality of sensors 120 are installed, and a pair of second parallel plates 118c, 118d, connected perpendicular to the first parallel plates to form a box-shaped housing.
  • the sensor housing 118 thus forms a rectangular or square column whose upper and lower surfaces are removed, and which has an open central region.
  • the sensors 120 extend downwardly from first parallel plates 118a, 118b at various distances such that each of the sensors 120 are aligned with the circumferential edge 114c of the wafer 114 (see FIG. 2). As shown in FIG. 2, two of the sensors 120 extend from the housing 118 at a first distance d 1 , and one sensor extends from the housing 118 at a second distance d 2 . The distances d 1 and d 2 are equal to the distance from the circumferential edge 114c of the wafer 114 to the sensor housing, as measured after the wafers 114 have been properly loaded in the guide 108.
  • the sensors 120 are preferably optical sensors including for example, a photosensor, a laser sensor, and a fiber-optic sensor. As shown in FIGS. 2 and 3, a first plurality of optical sensors 120 are provided on one of the first pair 118a of opposing parallel plates, which plurality of optical sensors transmit light past the circumferential edge 114c of the wafer 114, and a second plurality of optical sensors 120 are provided on the other of the first pair of opposing parallel plates 118b, which receive the transmitted light. The transmitting and receiving sides could be switched within the scope of the present invention. Also, each of the optical sensors 120 may include light emitting means and light receiving means. Note that the optical sensor is installed such that the transmitted or received light travels along the circumferential edges 114c of the wafers 114.
  • the semiconductor manufacturing device When one of the wafers 114 is mis-loaded into the slots of the guide 108, like the wafer 20A of FIG. 1, the light emitted from the light sensor 120 is interrupted and the mis-loaded wafer is thereby detected. When a mis-loaded wafer is sensed, the semiconductor manufacturing device would be configured to stop and sound an alarm, thereby alerting the operator to the problem.
  • An alarm system can be implemented by modifying the program of the programmable logic controller (PLC), which controls the operation of the particular piece of manufacturing equipment and the sensors 120.
  • PLC programmable logic controller
  • the present wafer carrying apparatus shown in FIGS. 2 and 3 is preferably installed in a wafer loading portion of a semiconductor manufacturing device to improve yields by preventing wafer breakage and mixing during a designated manufacturing process.
  • the cassette 116 loaded with a plurality of wafers 114, is placed onto the cassette support 110.
  • the cassette support 110 connected to the movable cylinder 100 through the stationary cylinder support 102, is slowly moved downward by operating the movable cylinder 100. Since only the cassette 116 on the cassette support 110 moves downward, the plurality of wafers 114 located in the slots 130 of the guide 108 are separated from the cassette 116.
  • the sensors 120 may commence operations, for example, when the cassette support 110 has descended approximately 1/3 of the total downward distance. Another interval for commencing the sensing operation may be selected within the scope of the present invention, as long as there is sufficient time for the wafers 114 to properly seat in the slots 130 of the guide 108 as the cassette 116 separates from the wafers 114.
  • a set of sensors 120 are positioned at each end of the sensor housing 118 to transmit and/or receive light past the circumferential edge 114c of the exposed wafers 114. Therefore, any wafer 114 which is not correctly loaded into the slot 130 of the guide 108 interrupts the path of light. Accordingly, the mis-loaded wafer is detected.
  • the semiconductor manufacturing device including the wafer carrying apparatus 99 stops operating so that the problem can be corrected.
  • the wafers 114 are completely separated from the cassette 116 by moving the cassette support 110 further downward using cylinder 100, until the cassette 116 is moved completely away from the wafers 114.
  • the separated plurality of wafers 114 may then be moved, for example, by a robot arm (not shown) to the second guide (not shown) in a processing bath to carry out a wet process.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Control Of Conveyors (AREA)

Abstract

An apparatus and method for carrying wafers through a multi-step process for producing a semiconductor, without using a cassette, where the apparatus senses whether a wafer is mis-loaded. The apparatus includes a plurality of optical sensors positioned above the wafers for sensing whether a wafer is mis-loaded by transmitting light past circumferential edges of the wafers.

Description

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an apparatus and method for manufacturing a semiconductor device. More particularly, the present apparatus is used to carry a wafer during the semiconductor manufacturing process and includes a sensor for sensing a mis-loaded wafer.
2. Description of the Related Art
Semiconductor devices are manufactured through a multi-step process. A wafer, held in a cassette, is transferred through each step of the process until the semiconductor device is complete. During the multi-step process, one or more of the wafers may be removed or added from the cassette and subjected to a subsequent process step, either individually or in a batch mode. For example, during a wet etching step or a cleaning step, the cassette containing the wafers is placed in a processing bath containing a reactive solution for batch processing. In this case, the cassette is composed of a material, e.g., quartz or TEFLON (a non-stick, heat resistant coating), which is stable in the presence of the reactive solution.
However, as the diameter of the wafer increases beyond the standard eight inch wafer currently used, the size of a cassette necessary to hold and transfer the wafer would be too large to employ with standard manufacturing equipment. One solution would be to enlarge the manufacturing equipment to accommodate the larger sized cassette; however, the cost involved in increasing the size of the manufacturing equipment is prohibitive.
A more cost-effective method employs a guide with a plurality of slots, where the wafers are unloaded onto the guide from the cassette and subsequently moved to a second guide in a processing bath by a robot arm. The guide is illustrated in FIG. 1.
In FIG. 1, the plurality of wafers 20 are separated from the cassette and loaded onto the guide 10 having a plurality of slots 30. A wafer 20A is shown improperly loaded in slot 30 of guide 10. In the device illustrated in FIG. 1, it is impossible to determine whether there are any mis-loaded wafers. An undetected mis-loaded wafer 20A can be dropped and broken during transfer to a second guide, for example, a guide in a processing bath having the same pitch. Also, a wafer 20, during transfer to the second guide may be mis-loaded onto the second guide and dropped in the processing bath, resulting in wafers of different batches mixing in the same processing bath.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide an apparatus for carrying a wafer which senses mis-loaded wafers.
It is another object of the present invention to provide a semiconductor manufacturing device including the present apparatus for carrying a wafer.
It is still another object of the present invention to provide a method for carrying a wafer and sensing mis-loaded wafers using the present apparatus for carrying a wafer.
To achieve these and other objects, the present invention provides for an apparatus for sensing a mis-loaded wafer, having a cassette with an open top surface for receiving a plurality of wafers, and an opposing partially open bottom surface. The apparatus includes a cassette support which horizontally supports the cassette, with the cassette support having a support opening formed corresponding to the partially opened bottom surface of the cassette. A moving means is connected to the cassette support for moving the cassette support up and down, and a guide is disposed in the support opening. The guide has a plurality of slots to receive corresponding of the plurality of wafers. A sensor housing, positioned above the cassette, has a plurality of sensors provided on the sensor housing and aligned with a circumferential edge of a properly positioned wafer for sensing a mis-loaded wafer.
In another aspect, the present invention provides a method for carrying a plurality of wafers loaded in a cassette to a processing bath for performing a process, comprising the steps of: unloading the plurality of wafers from the cassette to a first guide; separating the plurality of wafers from the cassette; transmitting light past circumferential edges of the plurality of wafers; sensing whether one or more wafers are mis-loaded; and carrying only properly loaded wafers to a second guide in the processing bath.
According to a preferred embodiment of the present invention, the sensor is an optical sensor. Suitable optical sensors include, for example, a photo sensor, a laser sensor, and a fiber-optic sensor. The optical sensor is installed such that light is transmitted perpendicular to the surfaces of the plurality of wafers along the circumferential edge of the wafers. The optical sensor thus senses whether the wafer is properly loaded by transmitting and/or receiving light.
The present semiconductor manufacturing device including the present apparatus for carrying a wafer is preferably used in a wet process. The apparatus prevents wafers from being broken or mixed during processing, by monitoring wafers which are not correctly loaded into slots of the guide before starting the process.
BRIEF DESCRIPTION OF THE DRAWINGS
The accompanying drawings illustrate an embodiment of the invention, in which:
FIG. 1 is a sectional view showing wafers loaded on a conventional guide;
FIG. 2 is a front view of an apparatus for sensing a misloaded wafer in accordance with the present invention; and
FIG. 3 is a perspective view of the sensing section of the present inventive apparatus.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Hereinafter, the present invention will be described in detail with reference to the attached drawings. However, the present invention is not restricted to the embodiments provided hereinafter and many variations are possible. The present embodiments are provided to describe the present invention and to indicate the scope of the invention to those who are skilled in the art. In the attached drawings, a sensor is exaggerated in order to clarify the characteristics of the present invention. Identical reference numerals indicate like elements throughout.
FIG. 2 is a front view of the present wafer carrying apparatus 99, which generally comprises a cassette carrying section 50, a guide section 60, and a sensor section 70.
The cassette carrying section 50 comprises a cassette moving means including a movable cylinder 100 attached to a stationary cylinder support 102, and a cassette support 110. Cassette support 110 horizontally supports a cassette 116 loaded with a plurality of wafers 114. Cassette support 110 includes an opening 122 formed corresponding to an opening in the lower surface of the cassette 116 for exposing a lower part of the wafer 114. The cassette support 110 is connected to cylinder 100 through the stationary cylinder support 102, such that the cassette support 110 and cassette 116 thereon move up and down with respect to the wafer guide 108.
The guide section 60 includes a guide fixing shaft 104, a guide support 106 connected to the stationary cylinder support 102, and the wafer guide 108, installed in the cassette support opening 122, in which a plurality of slots 130 (shown as dashed lines in FIG. 2) are formed. When the cassette 116 loaded with a plurality of wafers 114 is placed on the cassette support 110 and fixed by a cassette support plate 112, the wafers 114 are aligned with and loaded into, the slots 130 of the guide 108.
The sensor section 70 includes a sensor housing 118 connected to the stationary cylinder support 102 and a plurality of sensors 120 being installed on the sensor housing 118. The sensors 120 preferably use light as a sensing medium.
FIG. 3 illustrates an enlarged perspective view of the sensor section 70. The sensor housing 118 has a pair of first parallel plates 118a, 118b, on which a plurality of sensors 120 are installed, and a pair of second parallel plates 118c, 118d, connected perpendicular to the first parallel plates to form a box-shaped housing. The sensor housing 118 thus forms a rectangular or square column whose upper and lower surfaces are removed, and which has an open central region.
The sensors 120 extend downwardly from first parallel plates 118a, 118b at various distances such that each of the sensors 120 are aligned with the circumferential edge 114c of the wafer 114 (see FIG. 2). As shown in FIG. 2, two of the sensors 120 extend from the housing 118 at a first distance d1, and one sensor extends from the housing 118 at a second distance d2. The distances d1 and d2 are equal to the distance from the circumferential edge 114c of the wafer 114 to the sensor housing, as measured after the wafers 114 have been properly loaded in the guide 108.
The sensors 120 are preferably optical sensors including for example, a photosensor, a laser sensor, and a fiber-optic sensor. As shown in FIGS. 2 and 3, a first plurality of optical sensors 120 are provided on one of the first pair 118a of opposing parallel plates, which plurality of optical sensors transmit light past the circumferential edge 114c of the wafer 114, and a second plurality of optical sensors 120 are provided on the other of the first pair of opposing parallel plates 118b, which receive the transmitted light. The transmitting and receiving sides could be switched within the scope of the present invention. Also, each of the optical sensors 120 may include light emitting means and light receiving means. Note that the optical sensor is installed such that the transmitted or received light travels along the circumferential edges 114c of the wafers 114.
When one of the wafers 114 is mis-loaded into the slots of the guide 108, like the wafer 20A of FIG. 1, the light emitted from the light sensor 120 is interrupted and the mis-loaded wafer is thereby detected. When a mis-loaded wafer is sensed, the semiconductor manufacturing device would be configured to stop and sound an alarm, thereby alerting the operator to the problem. An alarm system can be implemented by modifying the program of the programmable logic controller (PLC), which controls the operation of the particular piece of manufacturing equipment and the sensors 120.
The present wafer carrying apparatus shown in FIGS. 2 and 3 is preferably installed in a wafer loading portion of a semiconductor manufacturing device to improve yields by preventing wafer breakage and mixing during a designated manufacturing process.
The present method for carrying wafers and detecting misloaded wafers will now be discussed with reference to FIGS. 2 and 3.
First, the cassette 116, loaded with a plurality of wafers 114, is placed onto the cassette support 110. The cassette support 110, connected to the movable cylinder 100 through the stationary cylinder support 102, is slowly moved downward by operating the movable cylinder 100. Since only the cassette 116 on the cassette support 110 moves downward, the plurality of wafers 114 located in the slots 130 of the guide 108 are separated from the cassette 116. The sensors 120 may commence operations, for example, when the cassette support 110 has descended approximately 1/3 of the total downward distance. Another interval for commencing the sensing operation may be selected within the scope of the present invention, as long as there is sufficient time for the wafers 114 to properly seat in the slots 130 of the guide 108 as the cassette 116 separates from the wafers 114.
A set of sensors 120 are positioned at each end of the sensor housing 118 to transmit and/or receive light past the circumferential edge 114c of the exposed wafers 114. Therefore, any wafer 114 which is not correctly loaded into the slot 130 of the guide 108 interrupts the path of light. Accordingly, the mis-loaded wafer is detected. When there is a mis-loaded wafer, the semiconductor manufacturing device (not shown) including the wafer carrying apparatus 99 stops operating so that the problem can be corrected.
When all of the wafers are properly loaded and no mis-loaded wafers are detected, the wafers 114 are completely separated from the cassette 116 by moving the cassette support 110 further downward using cylinder 100, until the cassette 116 is moved completely away from the wafers 114. The separated plurality of wafers 114 may then be moved, for example, by a robot arm (not shown) to the second guide (not shown) in a processing bath to carry out a wet process.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention that come within the scope of the appended claims and their equivalents.

Claims (14)

What is claimed is:
1. An apparatus for sensing a mis-loaded wafer, having a cassette with an open top surface for receiving a plurality of wafers, and an opposing, partially-open bottom surface, said apparatus comprising:
a cassette support, which horizontally supports said cassette, said cassette support having a support opening formed corresponding to said partially opened bottom surface of said cassette;
moving means connected to said cassette support for moving said cassette support up and down;
a guide disposed in said support opening and having a plurality of slots to receive corresponding ones of said plurality of wafers;
a sensor housing positioned above said cassette;
a first plurality of sensors provided on said sensor housing and transmitting light past circumferential edges of the wafers in a direction substantially perpendicular to top and bottom surfaces of the wafers; and
a second plurality of sensors for receiving the transmitted light and for sensing a vertically mis-loaded wafer.
2. The apparatus of claim 1, said sensor housing comprising:
a first pair of opposing parallel plates formed parallel to top and bottom surfaces of said wafers, said plates separated from each other by a predetermined distance; and
a second pair of opposing parallel plates, formed perpendicular to said first pair of parallel plates, said second pair of parallel plates separated from each other by a predetermined distance.
3. The apparatus of claim 2, wherein said plurality of sensors are disposed on said first pair of opposing parallel plates.
4. The apparatus of claim 3, wherein said sensors are optical sensors.
5. The apparatus of claim 4, wherein said optical sensors are selected from the group consisting of a photo sensor, a laser sensor, and a fiber-optic sensor.
6. An apparatus for sensing a mis-loaded wafer, having a cassette with an open top surface for receiving a plurality of wafers, and an opposing, partially-open bottom surface, the apparatus comprising:
a cassette support, which horizontally supports the cassette, the cassette support having a support opening formed corresponding to the partially opened bottom surface of the cassette;
moving means connected to the cassette support for moving the cassette support up and down;
a guide disposed in the support opening and having a plurality of slots to receive corresponding ones of the plurality of wafers;
a sensor housing positioned above the cassette, the sensor housing comprising
a first pair of opposing parallel plates formed parallel to top and bottom surfaces of the wafers, the plates separated from each other by a predetermined distance; and
a second pair of opposing parallel plates, formed perpendicular to the first pair of parallel plates, the second pair of parallel plates separated from each other by a predetermined distance; and
a plurality of optical sensors disposed on the first pair of opposing parallel plates and aligned with a circumferential edge of a properly positioned wafer, for sensing a misloaded wafer,
wherein the optical sensors are selected from the group consisting of a photo sensor, a laser sensor, and a fiber-optic sensor, and
wherein the optical sensors extend downwardly from the sensor housing at designated distances equal to corresponding distances from the sensor housing to the circumferential edge of the properly positioned wafer.
7. The apparatus of claim 6, said optical sensors comprising a first plurality of optical sensors provided on one of said first pair of opposing parallel plates, which plurality of optical sensors transmit light past said circumference of said wafer, and a second plurality of optical sensors provided on another of said first pair of opposing parallel plates, which receive said transmitted light.
8. A method for carrying a plurality of wafers loaded in a cassette to a processing bath for performing a process, comprising the steps of:
unloading said plurality of wafers from said cassette to a first guide;
separating said plurality of wafers from said cassette;
operating a first plurality of optical sensors to transmit light past the circumferential edges of the wafers, in a direction substantially perpendicular to top and bottom surfaces of the wafers;
simultaneously operating a second plurality of optical sensors to receive the transmitted light to sense whether one or more wafers are mis-loaded; and
carrying only properly loaded wafers to a second guide in said processing bath.
9. The method of claim 8, said unloading step comprising steps of:
placing said cassette having said plurality of wafers onto a cassette support; and
transferring said plurality of wafers from slots in said cassette to corresponding slots in said first guide, said first guide being positioned in an opening in said cassette support below said cassette.
10. The method of claim 9, said separating step comprising a step of:
lowering said cassette support relative to said guide using a moving means connected to said cassette support, wherein said plurality of wafers stay positioned in said slots of said guide as said cassette support moves downwardly with respect to said guide.
11. The method of claim 8, wherein if said second plurality of optical sensors receives said transmitted light, then all of said plurality of wafers are properly positioned, and if second plurality of optical sensors does not receive said transmitted light, then one or more of said plurality of wafers are mis-loaded.
12. The method of claim 11, wherein said optical sensors in said sensing step are selected from the group consisting of a photo sensor, a laser sensor, and a fiber-optic sensor.
13. The method of claim 8, wherein said steps of unloading, separating transmitting, sensing, and carrying, are controlled by a programmable logic controller (PLC).
14. The method of claim 8, wherein said transmitting and sensing steps commence after said cassette support moves downwardly one-third of a total downward movement distance required for the cassette support to be moved completely away from the wafers.
US08/977,883 1997-05-09 1997-11-28 Semiconductor manufacturing device including sensor for sensing mis-loading of a wafer Expired - Lifetime US5980188A (en)

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Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6256555B1 (en) * 1998-12-02 2001-07-03 Newport Corporation Robot arm with specimen edge gripping end effector
US6269822B1 (en) * 1996-04-17 2001-08-07 Steag Microtech Gmbh Installation for wet-treating substrates
US6270307B1 (en) * 1999-01-25 2001-08-07 Chartered Semiconductor Manufacturing Company Method for aligning wafers in a cassette
WO2001073824A1 (en) * 2000-03-28 2001-10-04 Infineon Technologies Ag Semiconductor wafer pod
US6360144B1 (en) * 1995-07-10 2002-03-19 Newport Corporation Self-teaching robot arm position method
US6366830B2 (en) 1995-07-10 2002-04-02 Newport Corporation Self-teaching robot arm position method to compensate for support structure component alignment offset
US6438460B1 (en) 1998-12-02 2002-08-20 Newport Corporation Method of using a specimen sensing end effector to determine the thickness of a specimen
US6476899B2 (en) * 2000-09-28 2002-11-05 Minolta Co., Ltd. Display panel and method of producing the same
US20040012363A1 (en) * 2002-03-20 2004-01-22 Fsi International, Inc. Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector
US20040012214A1 (en) * 2000-08-04 2004-01-22 Casarotti Sean A. Detection and handling of semiconductor wafers and wafers-like objects
US6763281B2 (en) 1999-04-19 2004-07-13 Applied Materials, Inc Apparatus for alignment of automated workpiece handling systems
US20040193554A1 (en) * 2003-03-28 2004-09-30 Hillerich Thomas A. Automated induction systems and methods for mail and/or other objects
US20040245714A1 (en) * 2003-05-13 2004-12-09 Ryan Patrick J. Enhanced object-feeder pre-processing system
US20050006916A1 (en) * 2003-06-27 2005-01-13 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
US20050077217A1 (en) * 2003-03-28 2005-04-14 Hillerich Thomas A. Carrier for mail and/or the like thin objects
US20050203664A1 (en) * 1999-04-19 2005-09-15 Applied Materials, Inc. Method and apparatus for aligning a cassette
US20060000752A1 (en) * 2003-03-28 2006-01-05 Northrop Grumman Corporation Stack correction system and method
US20060087068A1 (en) * 2004-09-24 2006-04-27 Northrop Grumman Corporation Anti-toppling device for mail and/or the like
US20060099065A1 (en) * 2004-08-27 2006-05-11 Northrop Grumman Corporation Preparation operator flex-station for carrier preparation
US20070147982A1 (en) * 2005-12-22 2007-06-28 Applied Materials, Inc. Method of retaining a substrate during a substrate transferring process
US20080166210A1 (en) * 2007-01-05 2008-07-10 Applied Materials, Inc. Supinating cartesian robot blade
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7766171B2 (en) 2008-02-28 2010-08-03 Northrop Grumman Systems Corporation Rigid storage tray for flat and letter mail
US20100234992A1 (en) * 2009-03-12 2010-09-16 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor wafer robot alignment system and method
CN102915937A (en) * 2012-10-08 2013-02-06 上海华力微电子有限公司 Device and method for preventing wafer from slipping off
US8550031B2 (en) 2004-12-22 2013-10-08 Applied Materials, Inc. Cluster tool architecture for processing a substrate
US8911193B2 (en) 2004-12-22 2014-12-16 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
CN110681606A (en) * 2019-09-17 2020-01-14 天津华伟精工电子有限公司 Brake pump piston bottom thickness measuring and stepping type sorting device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010066612A (en) * 1999-12-31 2001-07-11 황인길 semiconductor wafer detection apparatus
KR101048525B1 (en) * 2010-11-09 2011-07-11 박일용 Fixing device of laser sensor for inspection automobile components
KR101425137B1 (en) 2013-02-08 2014-08-01 주식회사 엘지실트론 Apparatus for inspecting wafer

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4720130A (en) * 1984-03-21 1988-01-19 Sharp Kabushiki Kaisha Industrial robot hand with position sensor
US4721427A (en) * 1987-05-12 1988-01-26 Thermco Systems, Inc. Wafer transfer stand
US4806057A (en) * 1986-04-22 1989-02-21 Motion Manufacturing, Inc. Automatic wafer loading method and apparatus
US4987407A (en) * 1988-04-22 1991-01-22 Asq. Boats, Inc. Wafer interleaving with electro-optical safety features
US5266812A (en) * 1991-07-26 1993-11-30 Tokyo Electron Limited Substrate detector with light emitting and receiving elements arranged in a staggered fashion
US5533243A (en) * 1993-12-28 1996-07-09 Tokyo Electron Limited Notch position aligning apparatus and process for using the apparatus to independently align individual wafers in a wafer cassette
US5836736A (en) * 1994-04-28 1998-11-17 Semitool, Inc. Semiconductor processing system with wafer container docking and loading station

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230245A (en) * 1987-11-16 1989-09-13 Teru Yamanashi Kk Transfer apparatus
JPH04312953A (en) * 1991-03-18 1992-11-04 Mitsubishi Electric Corp Semiconductor device transferring apparatus

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4720130A (en) * 1984-03-21 1988-01-19 Sharp Kabushiki Kaisha Industrial robot hand with position sensor
US4806057A (en) * 1986-04-22 1989-02-21 Motion Manufacturing, Inc. Automatic wafer loading method and apparatus
US4721427A (en) * 1987-05-12 1988-01-26 Thermco Systems, Inc. Wafer transfer stand
US4987407A (en) * 1988-04-22 1991-01-22 Asq. Boats, Inc. Wafer interleaving with electro-optical safety features
US5266812A (en) * 1991-07-26 1993-11-30 Tokyo Electron Limited Substrate detector with light emitting and receiving elements arranged in a staggered fashion
US5533243A (en) * 1993-12-28 1996-07-09 Tokyo Electron Limited Notch position aligning apparatus and process for using the apparatus to independently align individual wafers in a wafer cassette
US5836736A (en) * 1994-04-28 1998-11-17 Semitool, Inc. Semiconductor processing system with wafer container docking and loading station

Cited By (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6360144B1 (en) * 1995-07-10 2002-03-19 Newport Corporation Self-teaching robot arm position method
US6366830B2 (en) 1995-07-10 2002-04-02 Newport Corporation Self-teaching robot arm position method to compensate for support structure component alignment offset
US6269822B1 (en) * 1996-04-17 2001-08-07 Steag Microtech Gmbh Installation for wet-treating substrates
US6275748B1 (en) * 1998-12-02 2001-08-14 Newport Corporation Robot arm with specimen sensing and edge gripping end effector
US6256555B1 (en) * 1998-12-02 2001-07-03 Newport Corporation Robot arm with specimen edge gripping end effector
US6898487B2 (en) 1998-12-02 2005-05-24 Newport Corporation Specimen sensing and edge gripping end effector
US6438460B1 (en) 1998-12-02 2002-08-20 Newport Corporation Method of using a specimen sensing end effector to determine the thickness of a specimen
US6453214B1 (en) 1998-12-02 2002-09-17 Newport Corporation Method of using a specimen sensing end effector to align a robot arm with a specimen stored on or in a container
US20040039486A1 (en) * 1998-12-02 2004-02-26 Paul Bacchi Specimen sensing and edge gripping end effector
US6618645B2 (en) 1998-12-02 2003-09-09 Newport Corporation Method of using a specimen sensing end effector to determine angular orientation of a specimen
US6554560B2 (en) * 1999-01-25 2003-04-29 Chartered Semiconductor Manufacturing Ltd. Method for aligning wafers in a cassette
US6270307B1 (en) * 1999-01-25 2001-08-07 Chartered Semiconductor Manufacturing Company Method for aligning wafers in a cassette
US20050203664A1 (en) * 1999-04-19 2005-09-15 Applied Materials, Inc. Method and apparatus for aligning a cassette
US6763281B2 (en) 1999-04-19 2004-07-13 Applied Materials, Inc Apparatus for alignment of automated workpiece handling systems
US7158857B2 (en) 1999-04-19 2007-01-02 Applied Materials, Inc. Method and apparatus for aligning a cassette
EP1139390A1 (en) * 2000-03-28 2001-10-04 Infineon Technologies AG Semiconductor wafer pod
US20030062578A1 (en) * 2000-03-28 2003-04-03 James Dougan Semiconductor wafer pod
WO2001073824A1 (en) * 2000-03-28 2001-10-04 Infineon Technologies Ag Semiconductor wafer pod
US6884639B2 (en) 2000-03-28 2005-04-26 Infineon Technologies Ag Semiconductor wafer pod
US7144056B2 (en) 2000-08-04 2006-12-05 Tru-Si Technologies, Inc. Detection and handling of semiconductor wafers and wafers-like objects
US20040150237A1 (en) * 2000-08-04 2004-08-05 Casarotti Sean A. Detection and handling of semiconductor wafers and wafer-like objects
US20040012214A1 (en) * 2000-08-04 2004-01-22 Casarotti Sean A. Detection and handling of semiconductor wafers and wafers-like objects
US7104579B2 (en) * 2000-08-04 2006-09-12 Tru-Si Technologies Inc. Detection and handling of semiconductor wafers and wafer-like objects
US6476899B2 (en) * 2000-09-28 2002-11-05 Minolta Co., Ltd. Display panel and method of producing the same
US6822413B2 (en) 2002-03-20 2004-11-23 Fsi International, Inc. Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector
US20040012363A1 (en) * 2002-03-20 2004-01-22 Fsi International, Inc. Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector
US20040193554A1 (en) * 2003-03-28 2004-09-30 Hillerich Thomas A. Automated induction systems and methods for mail and/or other objects
US20050077217A1 (en) * 2003-03-28 2005-04-14 Hillerich Thomas A. Carrier for mail and/or the like thin objects
US20060000752A1 (en) * 2003-03-28 2006-01-05 Northrop Grumman Corporation Stack correction system and method
US7195236B2 (en) 2003-03-28 2007-03-27 Northrop Grumman Corporation Automated induction systems and methods for mail and/or other objects
US20040245714A1 (en) * 2003-05-13 2004-12-09 Ryan Patrick J. Enhanced object-feeder pre-processing system
US20050006916A1 (en) * 2003-06-27 2005-01-13 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
US8109549B2 (en) 2003-06-27 2012-02-07 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
US7654596B2 (en) 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
US20100096869A1 (en) * 2003-06-27 2010-04-22 Mattson Thermal Products Gmbh Endeffectors for handling semiconductor wafers
US8622451B2 (en) 2003-06-27 2014-01-07 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
US20060099065A1 (en) * 2004-08-27 2006-05-11 Northrop Grumman Corporation Preparation operator flex-station for carrier preparation
US20060087068A1 (en) * 2004-09-24 2006-04-27 Northrop Grumman Corporation Anti-toppling device for mail and/or the like
US7467792B2 (en) 2004-09-24 2008-12-23 Northrop Grumman Corporation Anti-toppling device for mail with retractable protrusion
US8911193B2 (en) 2004-12-22 2014-12-16 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US8550031B2 (en) 2004-12-22 2013-10-08 Applied Materials, Inc. Cluster tool architecture for processing a substrate
US20070147982A1 (en) * 2005-12-22 2007-06-28 Applied Materials, Inc. Method of retaining a substrate during a substrate transferring process
US7374391B2 (en) 2005-12-22 2008-05-20 Applied Materials, Inc. Substrate gripper for a substrate handling robot
US7374393B2 (en) 2005-12-22 2008-05-20 Applied Materials, Inc. Method of retaining a substrate during a substrate transferring process
US20080166210A1 (en) * 2007-01-05 2008-07-10 Applied Materials, Inc. Supinating cartesian robot blade
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7766171B2 (en) 2008-02-28 2010-08-03 Northrop Grumman Systems Corporation Rigid storage tray for flat and letter mail
US8215890B2 (en) * 2009-03-12 2012-07-10 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor wafer robot alignment system and method
US20100234992A1 (en) * 2009-03-12 2010-09-16 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor wafer robot alignment system and method
CN102915937A (en) * 2012-10-08 2013-02-06 上海华力微电子有限公司 Device and method for preventing wafer from slipping off
CN102915937B (en) * 2012-10-08 2015-08-19 上海华力微电子有限公司 A kind of device and method preventing wafer landing
CN110681606A (en) * 2019-09-17 2020-01-14 天津华伟精工电子有限公司 Brake pump piston bottom thickness measuring and stepping type sorting device

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