US5755278A - Heat sink attached to a heat plate - Google Patents

Heat sink attached to a heat plate Download PDF

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Publication number
US5755278A
US5755278A US08/799,185 US79918597A US5755278A US 5755278 A US5755278 A US 5755278A US 79918597 A US79918597 A US 79918597A US 5755278 A US5755278 A US 5755278A
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United States
Prior art keywords
heat
plate
heat plate
cooling fin
aluminum
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Expired - Fee Related
Application number
US08/799,185
Inventor
Tatsuo Shinohara
Makoto Takeshita
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Fanuc Corp
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Fanuc Corp
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Filing date
Publication date
Priority claimed from JP30809093A external-priority patent/JP3203458B2/en
Application filed by Fanuc Corp filed Critical Fanuc Corp
Priority to US08/799,185 priority Critical patent/US5755278A/en
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Publication of US5755278A publication Critical patent/US5755278A/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This invention relates to an improvement applicable to a heat sink attached to a heat plate. More specifically, this invention relates to an improvement developed for decreasing the production cost of a heat sink attached to a heat plate by decreasing number of the parts to be employed for production thereof, and by enabling the production thereof without employing an aluminum soldering process.
  • a heat sink attached to a heat plate is available in the prior art.
  • a heat plate is defined as a small sized vertical type heat exchanger produced by sticking two aluminum plates with an adhesive, together leaving a closed path for allowing a medium for heat exchange, such as Freon or the like, to flow therein.
  • a heat plate is placed in the vertical position to allow the heat exchange medium, such as Freon, to circulate in the vertical direction within the closed path, to allow heat exchange to occur between the gas of the heat exchange medium, which is inclined to go upward, and the liquid of the heat exchange medium, which is inclined to go downward.
  • a heat plate transmits heat from an object to be cooled, which is attached to the bottom of the heat plate, toward a cooling fin etc., which is attached to the top of the heat plate, to radiate the heat therefrom.
  • FIG. 1 illustrates a broken perspective view of a heat sink attached to a heat plate, available in the prior art
  • FIG. 2 illustrates an assembled perspective view of a heat sink attached to a heat plate, available in the prior art.
  • a heat sink attached to a heat plate available in the prior art consists of a heat plate 1, a cooling fin 21 produced by employing an aluminum extrusion process, a heat transmission plate 31 with which an object to be cooled 5 is attached to the heat plate 1, and of which the object is improvement of heat transmission efficiency between an object to be cooled 5 and the heat plate 1, and a flange 41, produced by employing an aluminum die casting process, and which is employed to mount the heat sink on a cubicle etc., which is employed for mounting electrical equipment or the like. Since the surface of the heat plate 1 is not even due to the closed path for a heat exchange medium between the two aluminum plates, employment of an aluminum soldering process is essential to stick a cooling fin 21 on the heat plate 1.
  • the production of a heat sink attached to a heat plate available in the prior art requires a large number of parts and employment of an aluminum soldering process. Therefore, the heat sink attached to a heat plate available in the prior art has the drawback in that its fabrication is long and complicated, resulting in high production cost.
  • the object of this invention is to provide a heat sink attached to a heat plate which requires a small number of parts to be employed for fabrication thereof, and which requires a short and simple process for fabrication thereof, and which does not require employment of an aluminum soldering process. Accordingly, only a short and simple process for fabrication thereof is required at a lower production cost.
  • a heat sink attached to a heat plate comprising: a heat plate (1) which is produced by sticking two aluminum plates (11 and 12) to each other, leaving a closed path (13) therebetween for allowing a heat exchange medium to be confined therein and to circulate therein, in the vertical direction, and of which the bottom is attached to an object to be cooled, a cooling fin (2) which is stuck to at least the upper region of one surface of the heat plate (1), and a flange (4) which is employed for mounting the assembly of the heat plate (1) and the cooling fin (2), wherein: the surface of the heat plate (1) on which the cooling fin (2) is to be attached, is even, and the cooling fin (2) and the flange (4) are fabricated in one body by employing a die casting process.
  • FIG. 1 is a broken perspective view of a heat sink attached by a heat plate available in the prior art.
  • FIG. 2 is an assembled perspective view of a heat sink attached to a heat plate available in the prior art.
  • FIG. 3 is a cross-sectional view of a heat plate employed for a heat sink attached to a heat plate in accordance with one embodiment of this invention.
  • FIG. 4 is a perspective view of the assembly of a cooling fin and a flange employed for a heat sink attached to a heat plate in accordance with one embodiment of this invention, which assembly is fabricated by employing a die casting process.
  • FIG. 5 is a broken perspective view of a heat sink attached to a heat plate in accordance with one embodiment of this invention.
  • FIG. 6 is an assembled perspective view of a heat sink attached to a heat plate in accordance with one embodiment of this invention.
  • a heat plate 1 consists of two aluminum plates 11 and 12, which are stuck to each other.
  • the surface of the aluminum plate 11 on which surface a cooling fin 2 is to be stuck is made even and the surface of the other aluminum plate 12 is allowed to be uneven.
  • a path for a heat exchange medium 13 exists between the two aluminum plates 11 and 12 at a location corresponding to the projection caused by the path for the heat exchange medium 13.
  • the heat plate 1 having the foregoing cross-section can be readily produced by employing the steps described below.
  • Two aluminum plates 11 and 12 are piled on a table having a flat surface.
  • a fluid is forced with high pressure between the two aluminum plates 11 and 12 at the region at which a path for a heat exchange medium 13 is to be produced, while the surface of the aluminum plate 12 is being pressed with high pressure on the region at which a path for a heat exchange medium 13 is not produced. In this manner, a path for a heat exchange medium 13 is inflated with a fluid.
  • a die casting process is conducted to fabricate the assembly of a cooling fin 2 and a flange 4. Since the assembly of the cooling fin 2 and the flange 4 are fabricated in one body, the number of the parts to be employed for production thereof is reduced.
  • the heat plate 1 is assembled into the assembly of a cooling fin 2 and a flange 4, as illustrated by an arrow A. Since one surface (the rear surface in the drawing) of the heat plate 1 is an even plane, the heat plate 1 can be attached fast with screws, an adhesive or the like, without employing an aluminum soldering process.
  • an object to be cooled 5 can be fitted on one surface (the rear surface in the drawing) of the heat plate 1 with screws, an adhesive or the like, in the direction of an arrow B. Since the surface (the rear surface in the drawing) of the heat plate 1 on which surface the object to be cooled 5 is attached, is an even plane, the heat transmission plate 31 is unnecessary, though the heat transmission plate 31 is essential in the prior art. In this manner, the number of parts to be employed for production thereof is reduced.
  • the surface of the heat plate employed for a heat sink attached by a heat plate in accordance with this invention, on which surface a cooling fin 2 is stuck, is an even plane. Therefore, employment of an aluminum soldering process is unnecessary in the entire process for fabrication of the heat sink attached by a heat plate in accordance with this invention.
  • a cooling fin 2 and a flange 4 are fabricated in one body by employing a die casting process. Therefore, the number of the parts to be employed for production thereof is reduced, and the assembly process is made short and simple. As a result, the production cost of the heat sink attached by a heat plate in accordance with this invention is considerably less than that of the prior art.
  • a heat sink attached to heat plate in accordance with this invention requires less number of parts to be employed for production thereof and a shorter and less complicated fabrication process, and does not require an aluminum soldering process in the entire process for production thereof. Therefore, the heat plate in accordance with this invention is definitely useful for cooling articles, such as semiconductor devices, or the like, which are usually mounted in cubicles or the like.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink attached to a heat plate comprising a heat plate (1) produced by sticking two aluminum plates (11, 12) to each other, leaving a closed path (13) therebetween for confining a heat exchange medium therein, and of which the bottom is attached by an object to be cooled, a cooling fin (2) which is stuck to the upper region of the heat plate (1), and a flange (4) for mounting the assembly of the heat plate (1) and the cooling fin 92), wherein the surface of the heat plate (1) on which the cooling fin (2) is to be attached, is even and the cooling fin (2) and the flange (4) are a one-piece structure fabricated by employing die casting.

Description

This application is a continuation of application Ser. No. 08/491,903, filed Sep. 29, 1995, now abandoned.
FIELD OF THE INVENTION
This invention relates to an improvement applicable to a heat sink attached to a heat plate. More specifically, this invention relates to an improvement developed for decreasing the production cost of a heat sink attached to a heat plate by decreasing number of the parts to be employed for production thereof, and by enabling the production thereof without employing an aluminum soldering process.
BACKGROUND OF THE INVENTION
A heat sink attached to a heat plate is available in the prior art. A heat plate is defined as a small sized vertical type heat exchanger produced by sticking two aluminum plates with an adhesive, together leaving a closed path for allowing a medium for heat exchange, such as Freon or the like, to flow therein. When employed, a heat plate is placed in the vertical position to allow the heat exchange medium, such as Freon, to circulate in the vertical direction within the closed path, to allow heat exchange to occur between the gas of the heat exchange medium, which is inclined to go upward, and the liquid of the heat exchange medium, which is inclined to go downward. In this manner, a heat plate transmits heat from an object to be cooled, which is attached to the bottom of the heat plate, toward a cooling fin etc., which is attached to the top of the heat plate, to radiate the heat therefrom.
FIG. 1 illustrates a broken perspective view of a heat sink attached to a heat plate, available in the prior art, and FIG. 2 illustrates an assembled perspective view of a heat sink attached to a heat plate, available in the prior art. Referring to FIGS. 1 and 2, a heat sink attached to a heat plate available in the prior art consists of a heat plate 1, a cooling fin 21 produced by employing an aluminum extrusion process, a heat transmission plate 31 with which an object to be cooled 5 is attached to the heat plate 1, and of which the object is improvement of heat transmission efficiency between an object to be cooled 5 and the heat plate 1, and a flange 41, produced by employing an aluminum die casting process, and which is employed to mount the heat sink on a cubicle etc., which is employed for mounting electrical equipment or the like. Since the surface of the heat plate 1 is not even due to the closed path for a heat exchange medium between the two aluminum plates, employment of an aluminum soldering process is essential to stick a cooling fin 21 on the heat plate 1.
As was described above, the production of a heat sink attached to a heat plate available in the prior art requires a large number of parts and employment of an aluminum soldering process. Therefore, the heat sink attached to a heat plate available in the prior art has the drawback in that its fabrication is long and complicated, resulting in high production cost.
The object of this invention is to provide a heat sink attached to a heat plate which requires a small number of parts to be employed for fabrication thereof, and which requires a short and simple process for fabrication thereof, and which does not require employment of an aluminum soldering process. Accordingly, only a short and simple process for fabrication thereof is required at a lower production cost.
DISCLOSURE OF THE INVENTION
According to this invention, there is provided a heat sink attached to a heat plate comprising: a heat plate (1) which is produced by sticking two aluminum plates (11 and 12) to each other, leaving a closed path (13) therebetween for allowing a heat exchange medium to be confined therein and to circulate therein, in the vertical direction, and of which the bottom is attached to an object to be cooled, a cooling fin (2) which is stuck to at least the upper region of one surface of the heat plate (1), and a flange (4) which is employed for mounting the assembly of the heat plate (1) and the cooling fin (2), wherein: the surface of the heat plate (1) on which the cooling fin (2) is to be attached, is even, and the cooling fin (2) and the flange (4) are fabricated in one body by employing a die casting process.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a broken perspective view of a heat sink attached by a heat plate available in the prior art.
FIG. 2 is an assembled perspective view of a heat sink attached to a heat plate available in the prior art.
FIG. 3 is a cross-sectional view of a heat plate employed for a heat sink attached to a heat plate in accordance with one embodiment of this invention.
FIG. 4 is a perspective view of the assembly of a cooling fin and a flange employed for a heat sink attached to a heat plate in accordance with one embodiment of this invention, which assembly is fabricated by employing a die casting process.
FIG. 5 is a broken perspective view of a heat sink attached to a heat plate in accordance with one embodiment of this invention.
FIG. 6 is an assembled perspective view of a heat sink attached to a heat plate in accordance with one embodiment of this invention.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENT
Referring to the drawings, a heat sink attached to a heat plate in accordance with one embodiment of this invention will be described below.
Referring to FIG. 3, a heat plate 1 consists of two aluminum plates 11 and 12, which are stuck to each other. The surface of the aluminum plate 11 on which surface a cooling fin 2 is to be stuck is made even and the surface of the other aluminum plate 12 is allowed to be uneven. A path for a heat exchange medium 13 exists between the two aluminum plates 11 and 12 at a location corresponding to the projection caused by the path for the heat exchange medium 13. The heat plate 1 having the foregoing cross-section can be readily produced by employing the steps described below. Two aluminum plates 11 and 12 are piled on a table having a flat surface. A fluid is forced with high pressure between the two aluminum plates 11 and 12 at the region at which a path for a heat exchange medium 13 is to be produced, while the surface of the aluminum plate 12 is being pressed with high pressure on the region at which a path for a heat exchange medium 13 is not produced. In this manner, a path for a heat exchange medium 13 is inflated with a fluid.
Referring to FIG. 4, a die casting process is conducted to fabricate the assembly of a cooling fin 2 and a flange 4. Since the assembly of the cooling fin 2 and the flange 4 are fabricated in one body, the number of the parts to be employed for production thereof is reduced.
Referring to FIG. 5, the heat plate 1 is assembled into the assembly of a cooling fin 2 and a flange 4, as illustrated by an arrow A. Since one surface (the rear surface in the drawing) of the heat plate 1 is an even plane, the heat plate 1 can be attached fast with screws, an adhesive or the like, without employing an aluminum soldering process.
Referring to FIG. 6, an object to be cooled 5 can be fitted on one surface (the rear surface in the drawing) of the heat plate 1 with screws, an adhesive or the like, in the direction of an arrow B. Since the surface (the rear surface in the drawing) of the heat plate 1 on which surface the object to be cooled 5 is attached, is an even plane, the heat transmission plate 31 is unnecessary, though the heat transmission plate 31 is essential in the prior art. In this manner, the number of parts to be employed for production thereof is reduced.
As was described above, the surface of the heat plate employed for a heat sink attached by a heat plate in accordance with this invention, on which surface a cooling fin 2 is stuck, is an even plane. Therefore, employment of an aluminum soldering process is unnecessary in the entire process for fabrication of the heat sink attached by a heat plate in accordance with this invention. A cooling fin 2 and a flange 4 are fabricated in one body by employing a die casting process. Therefore, the number of the parts to be employed for production thereof is reduced, and the assembly process is made short and simple. As a result, the production cost of the heat sink attached by a heat plate in accordance with this invention is considerably less than that of the prior art.
POSSIBILITY TO EMPLOY THIS INVENTION FOR THE INDUSTRIAL PURPOSES
As was described above, a heat sink attached to heat plate in accordance with this invention requires less number of parts to be employed for production thereof and a shorter and less complicated fabrication process, and does not require an aluminum soldering process in the entire process for production thereof. Therefore, the heat plate in accordance with this invention is definitely useful for cooling articles, such as semiconductor devices, or the like, which are usually mounted in cubicles or the like.

Claims (2)

What is claimed is:
1. A heat sink assembly comprising:
a heat plate structure comprising first and second aluminum plates, each having attachment surfaces,
said first and second aluminum plates being attached to each other with said attachment surfaces thereof in contacting relationship,
said first aluminum plate having an entire planar surface opposite said attachment surface of said first aluminum plate, and wherein said attachment surface of said first aluminum plate has an entire planar surface,
at least one of said plates being configured to provide a closed path for confining a heat exchange medium located between said first and second aluminum plates to bring said heat exchange medium into contact with each of said first and second aluminum plates during circulation of said heat exchange medium, said path being oriented so that said heat exchange medium circulates therethrough in a vertical direction between said first and second aluminum plates; and
a one-piece structure comprising a cooling fin and a flange, said cooling fin having an entire surface directly attached to a portion of said planar surface of said first aluminum plate so that another portion of said planar surface remains available for direct attachment to an entire surface of an object to be cooled;
whereby said cooling fin and said object to be cooled are directly attached by screws to said planar surface of said first aluminum plate.
2. A heat sink attached to a heat plate according to claim 1, wherein said flange has a slot for receiving said another portion of said heat plate.
US08/799,185 1993-12-08 1997-02-12 Heat sink attached to a heat plate Expired - Fee Related US5755278A (en)

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Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP30809093A JP3203458B2 (en) 1993-12-08 1993-12-08 Heat sink with heat plate
JP5-308090 1993-12-08
US49190395A 1995-09-29 1995-09-29
US08/799,185 US5755278A (en) 1993-12-08 1997-02-12 Heat sink attached to a heat plate

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6044899A (en) * 1998-04-27 2000-04-04 Hewlett-Packard Company Low EMI emissions heat sink device
US20030056942A1 (en) * 2001-09-05 2003-03-27 Showa Denko K.K. Heat sink, control device having the heat sink and machine tool provided with the device
US20030178182A1 (en) * 2002-03-25 2003-09-25 Anatoly Pikovsky Apparatus and method for circuit board liquid cooling
EP1424532A1 (en) * 2001-09-05 2004-06-02 Showa Denko K.K. HEAT SINK, CONTROL DEVICE WITH THE HEAT SINK, AND MACHINE TOOL WITH THE DEVICE
US20070277962A1 (en) * 2006-06-01 2007-12-06 Abb Research Ltd. Two-phase cooling system for cooling power electronic components
US20090116183A1 (en) * 2007-11-01 2009-05-07 Dell Products L.P. Gas Assisted Thixotropic Molded Chassis For Cooling A Computer Chassis
US7861768B1 (en) * 2003-06-11 2011-01-04 Apple Inc. Heat sink
US20120111553A1 (en) * 2009-05-18 2012-05-10 Vadim Tsoi Heat spreading device and method therefore
US20190195567A1 (en) * 2017-12-26 2019-06-27 Cooler Master Co.,Ltd. Heat dissipation structure

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US3226602A (en) * 1962-10-29 1965-12-28 Thore M Elfving Heat transferring mounting panels for electric components and circuits
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US3476177A (en) * 1967-02-16 1969-11-04 Philips Corp Contact cooling and mounting device for a discharge tube
US3971435A (en) * 1971-07-13 1976-07-27 Ncr Corporation Heat transfer device
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US3035419A (en) * 1961-01-23 1962-05-22 Westinghouse Electric Corp Cooling device
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US3209062A (en) * 1963-01-25 1965-09-28 Westinghouse Electric Corp Mounting and coolant system for semiconductor heat generating devices
DE1284506B (en) * 1964-10-24 1968-12-05 Linde Ag Support plate for temperature-sensitive electrical circuit parts
US3412566A (en) * 1965-06-21 1968-11-26 Borg Warner Thermoelectric apparatus
US3476177A (en) * 1967-02-16 1969-11-04 Philips Corp Contact cooling and mounting device for a discharge tube
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US4830100A (en) * 1985-11-25 1989-05-16 The Nippon Aluminium Mfg. Co., Ltd. Heat-pipe device and heat-sink device
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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6044899A (en) * 1998-04-27 2000-04-04 Hewlett-Packard Company Low EMI emissions heat sink device
US6109343A (en) * 1998-04-27 2000-08-29 Hewlett-Packard Company Low EMI emissions heat sink device
US6167949B1 (en) 1998-04-27 2001-01-02 Hewlett-Packard Company Low EMI emissions heat sink device
EP1424532A4 (en) * 2001-09-05 2011-12-14 Showa Denko Kk Heat sink, control device with the heat sink and machine tool with the device
US20030056942A1 (en) * 2001-09-05 2003-03-27 Showa Denko K.K. Heat sink, control device having the heat sink and machine tool provided with the device
EP1424532A1 (en) * 2001-09-05 2004-06-02 Showa Denko K.K. HEAT SINK, CONTROL DEVICE WITH THE HEAT SINK, AND MACHINE TOOL WITH THE DEVICE
US7080680B2 (en) * 2001-09-05 2006-07-25 Showa Denko K.K. Heat sink, control device having the heat sink and machine tool provided with the device
CN1316224C (en) * 2001-09-05 2007-05-16 昭和电工株式会社 Heat sink, control device having the heat sink and machine tool provided with the device
US6942019B2 (en) * 2002-03-25 2005-09-13 Ltx Corporation Apparatus and method for circuit board liquid cooling
US20030178182A1 (en) * 2002-03-25 2003-09-25 Anatoly Pikovsky Apparatus and method for circuit board liquid cooling
US7861768B1 (en) * 2003-06-11 2011-01-04 Apple Inc. Heat sink
US20070277962A1 (en) * 2006-06-01 2007-12-06 Abb Research Ltd. Two-phase cooling system for cooling power electronic components
US20090116183A1 (en) * 2007-11-01 2009-05-07 Dell Products L.P. Gas Assisted Thixotropic Molded Chassis For Cooling A Computer Chassis
US20120111553A1 (en) * 2009-05-18 2012-05-10 Vadim Tsoi Heat spreading device and method therefore
US9423192B2 (en) * 2009-05-18 2016-08-23 Huawei Technologies Co., Ltd. Heat spreading device and method with sectioning forming multiple chambers
US20190195567A1 (en) * 2017-12-26 2019-06-27 Cooler Master Co.,Ltd. Heat dissipation structure
US10907907B2 (en) * 2017-12-26 2021-02-02 Cooler Master Co., Ltd. Heat dissipation structure
US11686532B2 (en) 2017-12-26 2023-06-27 Cooler Master Co., Ltd. Heat dissipation structure

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