US5459351A - Apparatus for mounting an absolute pressure sensor - Google Patents
Apparatus for mounting an absolute pressure sensor Download PDFInfo
- Publication number
- US5459351A US5459351A US08/267,634 US26763494A US5459351A US 5459351 A US5459351 A US 5459351A US 26763494 A US26763494 A US 26763494A US 5459351 A US5459351 A US 5459351A
- Authority
- US
- United States
- Prior art keywords
- die
- pressure sensor
- housing
- adhesive
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- 230000001070 adhesive effect Effects 0.000 claims abstract description 31
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 claims description 5
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- 230000000295 complement effect Effects 0.000 claims description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000002775 capsule Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 241000511976 Hoya Species 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
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- 238000010943 off-gassing Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
- G01L19/143—Two part housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
Claims (16)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/267,634 US5459351A (en) | 1994-06-29 | 1994-06-29 | Apparatus for mounting an absolute pressure sensor |
JP8503370A JPH10502449A (en) | 1994-06-29 | 1995-06-26 | Equipment for mounting absolute pressure sensors |
DE69509773T DE69509773T2 (en) | 1994-06-29 | 1995-06-26 | METHOD FOR INSTALLING AN ABSOLUTE PRESSURE SENSOR |
EP95924686A EP0767899B1 (en) | 1994-06-29 | 1995-06-26 | Method of mounting an absolute pressure sensor |
PCT/US1995/008020 WO1996000888A1 (en) | 1994-06-29 | 1995-06-26 | Apparatus for mounting an absolute pressure sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/267,634 US5459351A (en) | 1994-06-29 | 1994-06-29 | Apparatus for mounting an absolute pressure sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
US5459351A true US5459351A (en) | 1995-10-17 |
Family
ID=23019587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/267,634 Expired - Lifetime US5459351A (en) | 1994-06-29 | 1994-06-29 | Apparatus for mounting an absolute pressure sensor |
Country Status (5)
Country | Link |
---|---|
US (1) | US5459351A (en) |
EP (1) | EP0767899B1 (en) |
JP (1) | JPH10502449A (en) |
DE (1) | DE69509773T2 (en) |
WO (1) | WO1996000888A1 (en) |
Cited By (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5604363A (en) * | 1994-09-06 | 1997-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure sensor with package |
US5703393A (en) * | 1995-06-27 | 1997-12-30 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure detecting device and manufacturing method of the device |
US5821595A (en) * | 1996-05-15 | 1998-10-13 | Dresser Industries, Inc. | Carrier structure for transducers |
US5874319A (en) * | 1996-05-21 | 1999-02-23 | Honeywell Inc. | Vacuum die bond for known good die assembly |
US6006607A (en) * | 1998-08-31 | 1999-12-28 | Maxim Integrated Products, Inc. | Piezoresistive pressure sensor with sculpted diaphragm |
US6229190B1 (en) | 1998-12-18 | 2001-05-08 | Maxim Integrated Products, Inc. | Compensated semiconductor pressure sensor |
US6236095B1 (en) | 2000-02-15 | 2001-05-22 | Dresser Equipment Goup, Inc. | Carrier structure for semiconductor transducers |
US6255728B1 (en) | 1999-01-15 | 2001-07-03 | Maxim Integrated Products, Inc. | Rigid encapsulation package for semiconductor devices |
US6313514B1 (en) * | 1997-06-06 | 2001-11-06 | Infineon Technologies Ag | Pressure sensor component |
US6346742B1 (en) | 1998-11-12 | 2002-02-12 | Maxim Integrated Products, Inc. | Chip-scale packaged pressure sensor |
US6351996B1 (en) | 1998-11-12 | 2002-03-05 | Maxim Integrated Products, Inc. | Hermetic packaging for semiconductor pressure sensors |
US6369435B1 (en) * | 1998-11-17 | 2002-04-09 | Micronas Gmbh | Semiconductor component |
US20020149069A1 (en) * | 1998-08-27 | 2002-10-17 | Janusz Bryzek | Piezoresistive sensor with epi-pocket isolation |
US6570485B1 (en) | 2000-11-17 | 2003-05-27 | Honeywell International Inc. | Transducer packaging assembly for use in sensing unit subjected to high G forces |
US20030111441A1 (en) * | 2000-06-28 | 2003-06-19 | Institut National D'optique | Miniature microdevice package and process for making thereof |
US6686653B2 (en) | 2000-06-28 | 2004-02-03 | Institut National D'optique | Miniature microdevice package and process for making thereof |
US6747346B2 (en) * | 2001-04-12 | 2004-06-08 | Fuji Electric Co., Ltd. | Container for semiconductor sensor, manufacturing method therefor, and semiconductor sensor device |
EP1517598A1 (en) * | 2003-09-17 | 2005-03-23 | Asulab S.A. | Method for mounting an electronic component on a support |
US6945120B1 (en) | 2004-07-02 | 2005-09-20 | Honeywell International Inc. | Exhaust gas recirculation system using absolute micromachined pressure sense die |
US20060000288A1 (en) * | 2004-07-02 | 2006-01-05 | Honeywell International, Inc. | Differential pressure measurement using backside sensing and a single ASIC |
US20060000265A1 (en) * | 2004-07-02 | 2006-01-05 | Honeywell International, Inc. | Exhaust back pressure sensor using absolute micromachined pressure sense die |
WO2006023936A1 (en) * | 2004-08-23 | 2006-03-02 | Honeywell International Inc. | Exhaust gas recirculation system using absolute micromachined pressure sense die |
US7216547B1 (en) * | 2006-01-06 | 2007-05-15 | Honeywell International Inc. | Pressure sensor with silicon frit bonded cap |
EP1785710A2 (en) | 2005-11-10 | 2007-05-16 | Honeywell International Inc. | Pressure Sensor Housing and Configuration |
US20070271070A1 (en) * | 2006-05-17 | 2007-11-22 | Honeywell International Inc. | Flow sensor with conditioning-coefficient memory |
US20070289389A1 (en) * | 2006-06-16 | 2007-12-20 | Honeywell International Inc. | Pressure transducer with differential amplifier |
US20080047366A1 (en) * | 2006-08-24 | 2008-02-28 | Honda Motor Co., Ltd. | Force sensor and method for producing the same |
US20090288484A1 (en) * | 2008-05-21 | 2009-11-26 | Honeywell International Inc. | Integrated mechanical package design for combi sensor apparatus |
US20100013041A1 (en) * | 2008-07-15 | 2010-01-21 | Micron Technology, Inc. | Microelectronic imager packages with covers having non-planar surface features |
US20100064818A1 (en) * | 2005-09-27 | 2010-03-18 | Honeywell International Inc. | Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby |
US8065917B1 (en) | 2010-05-18 | 2011-11-29 | Honeywell International Inc. | Modular pressure sensor |
US20130098160A1 (en) * | 2011-10-25 | 2013-04-25 | Honeywell International Inc. | Sensor with fail-safe media seal |
US8616065B2 (en) | 2010-11-24 | 2013-12-31 | Honeywell International Inc. | Pressure sensor |
US20140007850A1 (en) * | 2012-07-09 | 2014-01-09 | Ford Global Technologies, Llc | Gas backpressure sensor assembly |
US8656772B2 (en) | 2010-03-22 | 2014-02-25 | Honeywell International Inc. | Flow sensor with pressure output signal |
US8695417B2 (en) | 2011-01-31 | 2014-04-15 | Honeywell International Inc. | Flow sensor with enhanced flow range capability |
US8718981B2 (en) | 2011-05-09 | 2014-05-06 | Honeywell International Inc. | Modular sensor assembly including removable sensing module |
US20140230557A1 (en) * | 2013-02-20 | 2014-08-21 | Agency for Science Technology and Research (A"STAR) | Sensor with vacuum-sealed cavity |
US9003897B2 (en) | 2012-05-10 | 2015-04-14 | Honeywell International Inc. | Temperature compensated force sensor |
US9052217B2 (en) | 2012-11-09 | 2015-06-09 | Honeywell International Inc. | Variable scale sensor |
US9359198B2 (en) | 2013-08-22 | 2016-06-07 | Massachusetts Institute Of Technology | Carrier-substrate adhesive system |
US9470593B2 (en) | 2013-09-12 | 2016-10-18 | Honeywell International Inc. | Media isolated pressure sensor |
US10046550B2 (en) | 2013-08-22 | 2018-08-14 | Massachusetts Institute Of Technology | Carrier-substrate adhesive system |
US10065853B2 (en) * | 2016-05-23 | 2018-09-04 | Rosemount Aerospace Inc. | Optimized epoxy die attach geometry for MEMS die |
US10107662B2 (en) | 2015-01-30 | 2018-10-23 | Honeywell International Inc. | Sensor assembly |
US20210341346A1 (en) * | 2020-04-30 | 2021-11-04 | Robert Bosch Gmbh | Method for producing a pressure sensor device and pressure sensor device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012047527A (en) * | 2010-08-25 | 2012-03-08 | Denso Corp | Method for manufacturing physical quantity sensor device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57100038A (en) * | 1980-12-15 | 1982-06-22 | Matsushita Electric Works Ltd | Manufacture of board for construction |
JPS58168930A (en) * | 1982-03-31 | 1983-10-05 | Hitachi Ltd | Pressure sensor unit |
JPS62203381A (en) * | 1986-03-03 | 1987-09-08 | Mitsubishi Electric Corp | Semiconductor pressure detector |
US4838089A (en) * | 1986-05-07 | 1989-06-13 | Nippondenso Co., Ltd. | Semiconductor pressure sensor |
US5029478A (en) * | 1990-07-19 | 1991-07-09 | Honeywell Inc. | Fluid isolated self-compensating absolute pressure sensor transducer |
US5097841A (en) * | 1988-09-22 | 1992-03-24 | Terumo Kabushiki Kaisha | Disposable pressure transducer and disposable pressure transducer apparatus |
US5257547A (en) * | 1991-11-26 | 1993-11-02 | Honeywell Inc. | Amplified pressure transducer |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2643029B2 (en) * | 1990-12-18 | 1997-08-20 | 三菱電機株式会社 | Semiconductor pressure sensor device |
-
1994
- 1994-06-29 US US08/267,634 patent/US5459351A/en not_active Expired - Lifetime
-
1995
- 1995-06-26 WO PCT/US1995/008020 patent/WO1996000888A1/en active IP Right Grant
- 1995-06-26 JP JP8503370A patent/JPH10502449A/en active Pending
- 1995-06-26 DE DE69509773T patent/DE69509773T2/en not_active Expired - Fee Related
- 1995-06-26 EP EP95924686A patent/EP0767899B1/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57100038A (en) * | 1980-12-15 | 1982-06-22 | Matsushita Electric Works Ltd | Manufacture of board for construction |
JPS58168930A (en) * | 1982-03-31 | 1983-10-05 | Hitachi Ltd | Pressure sensor unit |
JPS62203381A (en) * | 1986-03-03 | 1987-09-08 | Mitsubishi Electric Corp | Semiconductor pressure detector |
US4838089A (en) * | 1986-05-07 | 1989-06-13 | Nippondenso Co., Ltd. | Semiconductor pressure sensor |
US5097841A (en) * | 1988-09-22 | 1992-03-24 | Terumo Kabushiki Kaisha | Disposable pressure transducer and disposable pressure transducer apparatus |
US5029478A (en) * | 1990-07-19 | 1991-07-09 | Honeywell Inc. | Fluid isolated self-compensating absolute pressure sensor transducer |
US5257547A (en) * | 1991-11-26 | 1993-11-02 | Honeywell Inc. | Amplified pressure transducer |
Cited By (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5604363A (en) * | 1994-09-06 | 1997-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure sensor with package |
US5703393A (en) * | 1995-06-27 | 1997-12-30 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure detecting device and manufacturing method of the device |
US5811321A (en) * | 1995-06-27 | 1998-09-22 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure detecting device and manufacturing method of the device |
US5821595A (en) * | 1996-05-15 | 1998-10-13 | Dresser Industries, Inc. | Carrier structure for transducers |
US5874319A (en) * | 1996-05-21 | 1999-02-23 | Honeywell Inc. | Vacuum die bond for known good die assembly |
US6313514B1 (en) * | 1997-06-06 | 2001-11-06 | Infineon Technologies Ag | Pressure sensor component |
US20020149069A1 (en) * | 1998-08-27 | 2002-10-17 | Janusz Bryzek | Piezoresistive sensor with epi-pocket isolation |
US6006607A (en) * | 1998-08-31 | 1999-12-28 | Maxim Integrated Products, Inc. | Piezoresistive pressure sensor with sculpted diaphragm |
US6346742B1 (en) | 1998-11-12 | 2002-02-12 | Maxim Integrated Products, Inc. | Chip-scale packaged pressure sensor |
US6351996B1 (en) | 1998-11-12 | 2002-03-05 | Maxim Integrated Products, Inc. | Hermetic packaging for semiconductor pressure sensors |
US6369435B1 (en) * | 1998-11-17 | 2002-04-09 | Micronas Gmbh | Semiconductor component |
US6229190B1 (en) | 1998-12-18 | 2001-05-08 | Maxim Integrated Products, Inc. | Compensated semiconductor pressure sensor |
US6255728B1 (en) | 1999-01-15 | 2001-07-03 | Maxim Integrated Products, Inc. | Rigid encapsulation package for semiconductor devices |
US6236095B1 (en) | 2000-02-15 | 2001-05-22 | Dresser Equipment Goup, Inc. | Carrier structure for semiconductor transducers |
US6686653B2 (en) | 2000-06-28 | 2004-02-03 | Institut National D'optique | Miniature microdevice package and process for making thereof |
US7077969B2 (en) | 2000-06-28 | 2006-07-18 | Institut National D'optique | Miniature microdevice package and process for making thereof |
US20030111441A1 (en) * | 2000-06-28 | 2003-06-19 | Institut National D'optique | Miniature microdevice package and process for making thereof |
US6570485B1 (en) | 2000-11-17 | 2003-05-27 | Honeywell International Inc. | Transducer packaging assembly for use in sensing unit subjected to high G forces |
US6747346B2 (en) * | 2001-04-12 | 2004-06-08 | Fuji Electric Co., Ltd. | Container for semiconductor sensor, manufacturing method therefor, and semiconductor sensor device |
EP1517598A1 (en) * | 2003-09-17 | 2005-03-23 | Asulab S.A. | Method for mounting an electronic component on a support |
US6945120B1 (en) | 2004-07-02 | 2005-09-20 | Honeywell International Inc. | Exhaust gas recirculation system using absolute micromachined pressure sense die |
US20060000288A1 (en) * | 2004-07-02 | 2006-01-05 | Honeywell International, Inc. | Differential pressure measurement using backside sensing and a single ASIC |
US20060000265A1 (en) * | 2004-07-02 | 2006-01-05 | Honeywell International, Inc. | Exhaust back pressure sensor using absolute micromachined pressure sense die |
US7077008B2 (en) | 2004-07-02 | 2006-07-18 | Honeywell International Inc. | Differential pressure measurement using backside sensing and a single ASIC |
US7073375B2 (en) | 2004-07-02 | 2006-07-11 | Honeywell International Inc. | Exhaust back pressure sensor using absolute micromachined pressure sense die |
WO2006023936A1 (en) * | 2004-08-23 | 2006-03-02 | Honeywell International Inc. | Exhaust gas recirculation system using absolute micromachined pressure sense die |
WO2006023987A1 (en) * | 2004-08-23 | 2006-03-02 | Honeywell International Inc. | Differential pressure measurement using backside sensing and a single asic |
US8061212B2 (en) * | 2005-09-27 | 2011-11-22 | Honeywell International Inc. | Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby |
US20100064818A1 (en) * | 2005-09-27 | 2010-03-18 | Honeywell International Inc. | Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby |
EP1785710A2 (en) | 2005-11-10 | 2007-05-16 | Honeywell International Inc. | Pressure Sensor Housing and Configuration |
US20070113668A1 (en) * | 2005-11-10 | 2007-05-24 | Honeywell International, Inc. | Pressure Sensor Housing and Configuration |
US7597005B2 (en) * | 2005-11-10 | 2009-10-06 | Honeywell International Inc. | Pressure sensor housing and configuration |
EP1785710A3 (en) * | 2005-11-10 | 2008-06-25 | Honeywell International Inc. | Pressure Sensor Housing and Configuration |
US7216547B1 (en) * | 2006-01-06 | 2007-05-15 | Honeywell International Inc. | Pressure sensor with silicon frit bonded cap |
US20070271070A1 (en) * | 2006-05-17 | 2007-11-22 | Honeywell International Inc. | Flow sensor with conditioning-coefficient memory |
US8175835B2 (en) | 2006-05-17 | 2012-05-08 | Honeywell International Inc. | Flow sensor with conditioning-coefficient memory |
US20070289389A1 (en) * | 2006-06-16 | 2007-12-20 | Honeywell International Inc. | Pressure transducer with differential amplifier |
US7493823B2 (en) | 2006-06-16 | 2009-02-24 | Honeywell International Inc. | Pressure transducer with differential amplifier |
US20080047366A1 (en) * | 2006-08-24 | 2008-02-28 | Honda Motor Co., Ltd. | Force sensor and method for producing the same |
US8033009B2 (en) * | 2006-08-24 | 2011-10-11 | Honda Motor Co., Ltd | Method for producing a force sensor |
US20090288484A1 (en) * | 2008-05-21 | 2009-11-26 | Honeywell International Inc. | Integrated mechanical package design for combi sensor apparatus |
US20100013041A1 (en) * | 2008-07-15 | 2010-01-21 | Micron Technology, Inc. | Microelectronic imager packages with covers having non-planar surface features |
US8656772B2 (en) | 2010-03-22 | 2014-02-25 | Honeywell International Inc. | Flow sensor with pressure output signal |
US8065917B1 (en) | 2010-05-18 | 2011-11-29 | Honeywell International Inc. | Modular pressure sensor |
US8616065B2 (en) | 2010-11-24 | 2013-12-31 | Honeywell International Inc. | Pressure sensor |
US8695417B2 (en) | 2011-01-31 | 2014-04-15 | Honeywell International Inc. | Flow sensor with enhanced flow range capability |
US8718981B2 (en) | 2011-05-09 | 2014-05-06 | Honeywell International Inc. | Modular sensor assembly including removable sensing module |
US20130098160A1 (en) * | 2011-10-25 | 2013-04-25 | Honeywell International Inc. | Sensor with fail-safe media seal |
US9003897B2 (en) | 2012-05-10 | 2015-04-14 | Honeywell International Inc. | Temperature compensated force sensor |
US20140007850A1 (en) * | 2012-07-09 | 2014-01-09 | Ford Global Technologies, Llc | Gas backpressure sensor assembly |
US9004048B2 (en) * | 2012-07-09 | 2015-04-14 | Ford Global Technologies, Llc | Gas backpressure sensor assembly |
US9052217B2 (en) | 2012-11-09 | 2015-06-09 | Honeywell International Inc. | Variable scale sensor |
US20140230557A1 (en) * | 2013-02-20 | 2014-08-21 | Agency for Science Technology and Research (A"STAR) | Sensor with vacuum-sealed cavity |
US9321630B2 (en) * | 2013-02-20 | 2016-04-26 | Pgs Geophysical As | Sensor with vacuum-sealed cavity |
US9359198B2 (en) | 2013-08-22 | 2016-06-07 | Massachusetts Institute Of Technology | Carrier-substrate adhesive system |
US10046550B2 (en) | 2013-08-22 | 2018-08-14 | Massachusetts Institute Of Technology | Carrier-substrate adhesive system |
US9470593B2 (en) | 2013-09-12 | 2016-10-18 | Honeywell International Inc. | Media isolated pressure sensor |
US10107662B2 (en) | 2015-01-30 | 2018-10-23 | Honeywell International Inc. | Sensor assembly |
US10065853B2 (en) * | 2016-05-23 | 2018-09-04 | Rosemount Aerospace Inc. | Optimized epoxy die attach geometry for MEMS die |
US20210341346A1 (en) * | 2020-04-30 | 2021-11-04 | Robert Bosch Gmbh | Method for producing a pressure sensor device and pressure sensor device |
US11619559B2 (en) * | 2020-04-30 | 2023-04-04 | Robert Bosch Gmbh | Method for producing a pressure sensor device and pressure sensor device |
Also Published As
Publication number | Publication date |
---|---|
EP0767899B1 (en) | 1999-05-19 |
DE69509773D1 (en) | 1999-06-24 |
JPH10502449A (en) | 1998-03-03 |
DE69509773T2 (en) | 2000-05-11 |
WO1996000888A1 (en) | 1996-01-11 |
EP0767899A1 (en) | 1997-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HONEYWELL INC., MINNESOTA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:BENDER, TERRENCE D.;REEL/FRAME:007071/0081 Effective date: 19940629 |
|
FEPP | Fee payment procedure |
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