US5141919A - Superconducting device and method of producing superconducting thin film - Google Patents
Superconducting device and method of producing superconducting thin film Download PDFInfo
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- US5141919A US5141919A US07/325,683 US32568389A US5141919A US 5141919 A US5141919 A US 5141919A US 32568389 A US32568389 A US 32568389A US 5141919 A US5141919 A US 5141919A
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- 239000010409 thin film Substances 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title description 9
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 229910014454 Ca-Cu Inorganic materials 0.000 claims abstract description 17
- 238000004544 sputter deposition Methods 0.000 claims abstract description 16
- 229910002370 SrTiO3 Inorganic materials 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000000137 annealing Methods 0.000 abstract description 10
- 229910052761 rare earth metal Inorganic materials 0.000 abstract description 4
- 230000001590 oxidative effect Effects 0.000 abstract description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- 239000007789 gas Substances 0.000 description 6
- 238000002441 X-ray diffraction Methods 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 description 4
- 239000003153 chemical reaction reagent Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000005292 diamagnetic effect Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000002887 superconductor Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910002480 Cu-O Inorganic materials 0.000 description 1
- 229910001632 barium fluoride Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 229910001179 chromel Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 238000010671 solid-state reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/087—Oxides of copper or solid solutions thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5846—Reactive treatment
- C23C14/5853—Oxidation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0408—Processes for depositing or forming copper oxide superconductor layers by sputtering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/93—Electric superconducting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
- Y10S505/701—Coated or thin film device, i.e. active or passive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
- Y10S505/701—Coated or thin film device, i.e. active or passive
- Y10S505/702—Josephson junction present
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
- Y10S505/701—Coated or thin film device, i.e. active or passive
- Y10S505/703—Microelectronic device with superconducting conduction line
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/70—High TC, above 30 k, superconducting device, article, or structured stock
- Y10S505/704—Wire, fiber, or cable
Definitions
- the present invention relates to a superconducting device provided with a superconducting thin film of an oxide, specifically of the Tl-Ba-Ca-Cu oxide, and a method of producing the superconducting thin film.
- the Tl-Ba-Ca-Cu oxide exhibits a superconductivity at a critical temperature (120 K) higher than the boiling point of liquid nitrogen (77 K), which attracted attentions of the researchers and engineers (41 NATURE VOL. 332 Mar. 10, 1988 pages 138-139).
- This superconductor prepared from the Tl-Ba-Ca-Cu oxide is advantageous in a high critical (transition) temperature, without any rare earth element.
- a thin film superconductor is used. Consequently, it is necessary to prepare a thin film of superconductor Tl-Ba-Ca-Cu oxide and produce a superconducting device.
- the present invention has been achieved in such a circumstance.
- the superconducting device according to the present invention is provided with a superconducting thin film of the Tl-Ba-Ca-Cu oxide deposited on a substrate thereof.
- a first object of the present invention is to provide a superconducting device at a low cost since rare earth elements are not required.
- a superconducting thin film is prepared by sputtering on a substrate from a Tl-Ba-Ca-Cu oxide target by means of the sputtering method, followed by annealing in an oxidizing atmosphere.
- a second object of the present invention is to provide a method of producing superconducting thin film devices wherein it is possible to produce a superconducting thin film by using an ordinary sputtering apparatus.
- a third object of the present invention is to provide a method of producing superconducting thin film devices wherein it is possible to produce superconducting thin film easily in a simple way.
- FIG. 1 is a schematic view of a sputtering apparatus used for carrying out the method of producing superconducting thin film according to the present invention
- FIGS. 2, 4, 7 and 9 are charts showing temperature dependence of resistivity in a superconducting thin film obtained by the present invention.
- FIGS. 3, 5, 6 and 8 are X-ray diffraction patterns of a superconducting thin film obtained by the present invention.
- the superconducting device has a superconducting thin film of the Tl-Ba-Ca-Cu oxide on a substrate.
- the substrate is a substrate in a superconducting device, or an insulation layer or a buffer layer on an active layer formed on the substrate in a superconducting device.
- no rare earth metals are required. Consequently, the device can be produced at a low cost.
- FIG. 1 shows the structure of a RF (radiofrequency) magnetron sputtering apparatus used in practicing the process of the present invention to make the device thereof, wherein numeral 1 denotes a bell jar of the sputtering apparatus to which an exhaust system 2 is linked. Also linked to the bell jar 1, is an argon gas cylinder 3 for supplying argon gas, that is discharge gas into the bell jar 1, via a variable leak valve 4 and a stop valve 5. In the bell jar 1, an anode 6 and a cathode 7 that are counter electrodes are provided oppositely with a movable shutter 8 between.
- a RF radiofrequency
- the anode 6 is grounded, and SrTiO 3 substrates 9 are put on the anode 6 for depositing superconducting thin films on the surfaces thereof.
- Numerals 10 and 11 in the figure denoted a high vacuum gauge and a low vacuum gauge respectively.
- This sintered target forming the cathode 7 is made by a solid-state reaction of high-purity reagents.
- high-purity reagents 34.3 g of Tl 2 O 3 of a purity of 99.9%, 19.7 g of BaCO 3 , 10.0 g of CaCO 3 and 11.9 g of CuO, of a purity of 99.9%
- organic solvent such as methanol, ethanol or the like
- Tl, two of Ba, two of Ca and three of Cu by preparation composition, stirred with a stirrer.
- the reagents are ground into powder in a mortar.
- this powder is calcined in an electric furnace at 930° C. for half an hour. This calcined powder is put into a mold, pressed into a pellet at a pressure of 750 kgf/cm 2 . Put in an alumina boat covered with an alumina cap, this pellet is then sintered at 925° C. in air for one minute to obtain a 10 cm diameter and 0.5 cm thick sintered Tl 3 Ba 2 Ca 2 Cu 3 O X target.
- 0.5 to 5 ⁇ m thick thin films are prepared on the substrates 9 by supplying argon gas of a purity of 99.9995% with a pressure of 3.0 to 30.0 mTorr from the argon gas cylinder 3 into the bell jar 1, and at the same time by sputtering at a sputtering power of 100 to 250 W.
- the growing rate is 400 ⁇ /min. under a condition where the sputtering power is 120 W, the applying voltage is 2.6 kV and the distance between both electrodes is 3.5 cm, when 1.5 to 3.5 ⁇ m thick thin films are prepared on the substrates.
- the substrates 9 on which thin films are formed are put in an electric furnace, wherein the temperature is raised from room temperature to 940° C. at a rate of 1° C./sec. in an oxygen atmosphere with a flow rate of 2 l/min. and annealing is carried out at 940° C. for ten minutes, followed by cooling to room temperature at a rate of -20° C./sec. to prepare superconducting thin films of Tl 3 Ba 2 Ca 2 Cu 3 O X on the SrTiO 3 substrates 9.
- the above-mentioned temperature is optimum as the annealing temperature.
- the cooling condition after annealing does not affect so much in obtaining a superconducting state.
- FIG. 2 is a chart showing resistivity vs. temperature curve for an obtained superconducting thin film of the Tl-Ba-Ca-Cu oxide.
- the temperature dependence of the film resistivity is measured by the standard four-probe technique using pressed indium contacts.
- the temperature is measured by an Au+0.07% Fe-Chromel thermocouple.
- the applied constant current density ranges from 0.5 ⁇ /cm 2 to 5 ⁇ /cm 2 .
- the zero-resistivity temperature is 86 K for a film on a substrate, and a resistance anomaly is observed around 110 K, which suggests that a superconducting phase of 110 K class is contained in part of the formed film.
- FIG. 3 shows a X-ray diffraction pattern of a superconducting thin film obtained in this first embodiment.
- a Meissner effect in a superconducting thin film obtained in this first embodiment shows that a diamagnetic state begins to be observed from around 110 K and a perfect diamagnetic state is observed at 86 K.
- a second embodiment is a case where (100) MgO substrates are used as substrates 9 in the first embodiment.
- the sputtering condition and the annealing condition in this second embodiment as those in the first embodiment.
- FIG. 4 is a chart showing resistivity vs. temperature curve for a superconducting thin film obtained in the second embodiment, wherein the zero-resistivity temperature is 116 K.
- FIG. 5 shows a X-ray diffraction pattern of a superconducting thin film obtained in the second embodiment, wherein observed is that both 2223 and 2212 phases are contained in this superconducting thin film.
- a Meissner effect in a superconducting thin film obtained in the second embodiment shows that a diamagnetic state begins to be observed from around 115 K.
- a third embodiment is a case where a sinter of the Tl-Ba-Ca-Cu oxide is used with one part of Tl, two of Ba, two of Ca and three of Cu, by composition ratio, as the sintered target forming the cathode 7 in the first embodiment.
- This sintered target is obtained by the same processes as in the case for obtaining the sintered target in the first embodiment, using four kinds of high-purity reagents (16.3 g of Tl 2 O 3 of a purity of 99.9%, 28.2 g of BaCO 3 , 14.3 g of CaCO 3 and 17.0 g of CuO, of a purity of 99.9%).
- Prepared are thin films of the same thickness as those prepared in the first embodiment on the substrates 9 under the same condition as in the first embodiment as for the structure of the sputtering apparatus and preparing conditions (the argon gas pressure, the sputtering power etc.), except that the cathode 7 is made of the sintered target of the Tl-Ba-Ca-Cu oxide (with the composition ratio Tl:Ba:Ca:Cu 1:2:2:3) obtained in this way. Then, annealing is carried out under the same condition as in the first embodiment to prepare superconducting thin films of Tl 1 Ba 2 Ca 2 Cu 3 O X on the SrTiO 3 substrates 9.
- FIG. 6 shows an X-ray diffraction pattern of a superconducting thin film obtained in this third embodiment, wherein shown is that this superconducting thin film is a single phase of Tl 1 Ba 2 Ca 2 Cu 3 O 9 (1223 phase).
- FIG. 7 is a chart showing resistivity vs. temperature curve for a superconducting thin film obtained in this third embodiment, wherein observed is the zero-resistivity at 103 K.
- a fourth embodiment is a case where (100)MgO substrates are used as substrates 9 in the third embodiment.
- the same are the sintered target, the sputtering condition and the annealing condition in this fourth embodiment as those in the third embodiment.
- FIG. 8 shows a X-ray diffraction pattern of a superconducting thin film obtained in the fourth embodiment, wherein shown is that this superconducting thin film is a single phase of Tl 1 Ba 2 Ca 2 Cu 3 O 9 (1222 phase).
- FIG. 9 is a chart showing resistivity vs. temperature curve for a superconducting thin film obtained in the fourth embodiment, wherein observed is the zero-resistivity at 106 K.
- SrTiO 3 substrates and MgO substrates are used as substrates. They, however, should not be limited as such. Sapphire substrates and YSZ (yttria-stabilized ZrO 2 ) substrates are usable. It is also possible to use Si substrates coated with BaF 2 or CaF 2 .
- annealing is carried out in an oxygen atmosphere. It is also possible to carry out annealing in other oxidizing atmosphere.
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Abstract
Description
Claims (10)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7239088 | 1988-03-25 | ||
| JP63-72390 | 1988-05-31 | ||
| JP29143688 | 1988-11-17 | ||
| JP63-291436 | 1988-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US5141919A true US5141919A (en) | 1992-08-25 |
Family
ID=26413528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US07/325,683 Expired - Fee Related US5141919A (en) | 1988-03-25 | 1989-03-20 | Superconducting device and method of producing superconducting thin film |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US5141919A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5346882A (en) * | 1991-07-19 | 1994-09-13 | Mueller Paul | Josephson contacts in high temperature superconductors and method of fabrication thereof |
| CN106544636A (en) * | 2016-11-14 | 2017-03-29 | 南开大学 | Without the method that roasting target prepares thallium system high-temperature superconducting thin film |
| CN108677154A (en) * | 2018-04-08 | 2018-10-19 | 南开大学 | The method for preparing Tl-1223 high-temperature superconducting thin films without the sources roasting Tl |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4939119A (en) * | 1987-04-22 | 1990-07-03 | Sumitomo Electric Industries, Inc. | Process for producing a superconducting article |
-
1989
- 1989-03-20 US US07/325,683 patent/US5141919A/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4939119A (en) * | 1987-04-22 | 1990-07-03 | Sumitomo Electric Industries, Inc. | Process for producing a superconducting article |
Non-Patent Citations (14)
| Title |
|---|
| Applied Physics Letts., vol. 53, No. 15, Oct. 10, 1988, pp. 1434 1436. * |
| Applied Physics Letts., vol. 53, No. 15, Oct. 10, 1988, pp. 1434-1436. |
| Bulk Superconductivity at 120 K. in the Tl Ca/Ba Cu O System by Z. Z. Sheng and A. M. Hermann Nature, vol. 332 Mar. 10, 1988 at pp. 138 139. * |
| Bulk Superconductivity at 120° K. in the Tl-Ca/Ba-Cu-O System by Z. Z. Sheng and A. M. Hermann Nature, vol. 332 Mar. 10, 1988 at pp. 138-139. |
| CA110(2):14979g, Legoves 1988. * |
| Nature, vol. 332, Mar. 31, 1988, pp. 420ff, Subramanian et al. * |
| Nature, vol. 332, No. 6159, Mar. 3, 1988, pp. 55 58. * |
| Nature, vol. 332, No. 6159, Mar. 3, 1988, pp. 55-58. |
| Phys. Rev. Letters, vol. 61, No. 6, Aug. 8, 1988, pp. 750 753. * |
| Phys. Rev. Letters, vol. 61, No. 6, Aug. 8, 1988, pp. 750-753. |
| Phys. Rev. Letts., vol. 60, No. 16, Apr. 18, 1988, pp. 1657 and 1660. * |
| Science, vol. 241, Sep. 1988, pp. 1198FF, Halder et al. * |
| Technical Applications of Superconductivity . . . Bogner, Organ of the Haus der Technik e.V., Essen, FRG, Issue 8, Sep. Oct. 1987. * |
| Technical Applications of Superconductivity . . . -Bogner, Organ of the Haus der Technik e.V., Essen, FRG, Issue 8, Sep.-Oct. 1987. |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5346882A (en) * | 1991-07-19 | 1994-09-13 | Mueller Paul | Josephson contacts in high temperature superconductors and method of fabrication thereof |
| CN106544636A (en) * | 2016-11-14 | 2017-03-29 | 南开大学 | Without the method that roasting target prepares thallium system high-temperature superconducting thin film |
| CN106544636B (en) * | 2016-11-14 | 2018-10-02 | 南开大学 | The method for preparing thallium system high-temperature superconducting film without roasting target |
| CN108677154A (en) * | 2018-04-08 | 2018-10-19 | 南开大学 | The method for preparing Tl-1223 high-temperature superconducting thin films without the sources roasting Tl |
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