US4690793A - Nuclear fusion reactor - Google Patents

Nuclear fusion reactor Download PDF

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US4690793A
US4690793A US06/581,076 US58107684A US4690793A US 4690793 A US4690793 A US 4690793A US 58107684 A US58107684 A US 58107684A US 4690793 A US4690793 A US 4690793A
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metal
base body
ceramic tiles
nuclear fusion
fusion reactor
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Inventor
Hisanori Okamura
Kunio Miyazaki
Hirosi Akiyama
Shinichi Itoh
Tomio Yasuda
Kousuke Nakamura
Yukio Okoshi
Mutuo Kamoshita
Akio Chiba
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Hitachi Ltd
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Hitachi Ltd
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    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21B—FUSION REACTORS
    • G21B1/00—Thermonuclear fusion reactors
    • G21B1/11—Details
    • G21B1/13—First wall; Blanket; Divertor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E30/00—Energy generation of nuclear origin
    • Y02E30/10—Nuclear fusion reactors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/903—Metal to nonmetal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S376/00—Induced nuclear reactions: processes, systems, and elements
    • Y10S376/90—Particular material or material shapes for fission reactors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
    • Y10T428/12507—More than two components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12576—Boride, carbide or nitride component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y10T428/12764—Next to Al-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Definitions

  • This invention is related to a new nuclear fusion reactor and especially to the improvement of the wall structure of a vacuum vessel of the reactor.
  • a nuclear fusion reactor e.g. a torus-type nuclear fusion reactor
  • a ring-like vacuum vessel for confining plasma therein.
  • the vacuum vessel is surrounded by toroidal magnetic field coils which produce a magnetic field for keeping the plasma in a confined space.
  • a plurality of the coils are distributed around the vacuum vessel at fixed intervals.
  • a plurality of magnetic field coils are distributed along the vacuum vessel, to produce a magnetic field which heats the plasma and controls the position of the field.
  • non-magnetic alloy steel containing nickel As the materials for constructing the vacuum vessel, non-magnetic alloy steel containing nickel have been proposed.
  • the vacuum vessel of the nuclear fusion reactor is deteriorated by the radiation of the nuclear fusion reaction, e.g. the irradiation of fast neutrons of 14 MeV. It was therefore proposed that Mo plate or W plate etc. of high melting point may be bolted to the water-cooled metal-base body of vacuum vessel as described in (Japanese Patent laid-open No. 55-94181).
  • Mo or W etc. have such large atomic numbers that they are sputtered by plasma particles and permeate the plasma and thus cause a reduction in the temperature of the plasma.
  • It is an object of this invention is to provide nuclear fusion reactors with a reactor wall made of strong structural members composed of composites which have an excellent cooling property, a small thermal stress and a ceramic property.
  • This invention is concerned with the nuclear fusion reactor which has a vacuum vessel for confining plasma, coils around the vacuum vessel to generate magnetic field, and a reactor wall to be exposed to plasma, the reactor wall having a piled construction by metallurgically bonding a number of separate pieces of a heat-resisting ceramic material to a water-cooled metal-base body by providing fixed gaps formed between adjoining ceramic pieces and by grooves formed in a corresponding part of the metal-base body underlying at least some of the gaps.
  • the ceramic pieces are desirable tiles to be bound to the metal-base body through an intermediate material to relieve the difference of thermal expansion between them.
  • the intermediate material made of a metallic material is having a coefficient of thermal expansion intermediate between the tiles and the metal-base body.
  • the metal-base body is desirably so constructed that it may avoid direct irradiation by plasma particles.
  • FIG. 1 is the sectional construction view of the vacuum vessel of a toroidal nuclear reactor of this invention
  • FIG. 2, FIG. 4 and FIG. 7 are oblique views of the reactor wall constructions of this invention.
  • FIG. 3 is the sectional plane view of section A--A' in FIG. 2;
  • FIG. 5 is the sectional view of section B--B' in FIG. 4;
  • FIG. 6 is another sectional view of section B--B' in FIG. 4;
  • FIG. 8 is the sectional view of section C--C' in FIG. 7;
  • FIG. 9 is the diagram showing the relation between the modulus of elasticity and coefficient of thermal expansion of the intermediate material.
  • Ceramic tiles must be excellently sputtering-proof against irradiation by plasma particles. Therefore, it is preferable for the ceramic material to be heat-resisting and especially to be made of compounds of elements of low atomic numbers.
  • the coefficient of thermal expansion is preferable to be more than 0.05 cal/cm. sec. °C. and the electric resistance more than 10 -3 ⁇ /cm at room temperature for both. The ceramic is less damaged by sputtering, if it has a higher coefficient of thermal conductivity, because of much cooling effect. Therefore, the temperature of ceramic tiles can be kept low enough to be resisting against sputtering, if its thermal conductivity is more than 0.4 cal/cm.sec. °C.
  • the material with the electric resistance of more than 10 -3 ⁇ cm at room temperature is preferable to be used.
  • Ceramic tiles are composed of sintered ceramics of refractory compounds having a melting point higher than 1900° C. This temperature is needed for sputtering-proof property as well.
  • Oxides, carbides, nitrides, and silicides etc. of metals can be used as the material for ceramic tiles.
  • Oxides e.g. BeO, MgO, Al 2 O 3 , SiO 2 , CaO, TiO 2 , Cr 2 O 3 , Fe 2 O 3 , Y 2 O 3 , ZrO 2 etc.
  • carbides e.g. Cr 3 C 2 , NbC, ZrC, Be 2 C, SiC, TiC, VC etc.
  • nitrides e.g. AlN, Si 3 N 4 , TiN, VN, ZrN, NbN, TaN etc. and silicides e.g.
  • Ti-silicide, Zr-silicide, V-silicide, Nb-silicide, Ta-silicide, Cr-silicide etc. can be used.
  • compounds of elements of low atomic numbers less than 14 are preferable.
  • compounds of Si, Al, Mg and Be are preferable.
  • Such compounds as SiC, AlN, Si 3 N 4 , BeO, Al 2 O 3 , MgO and SiO 2 , or the mixtures or compounds of them are preferable.
  • the compounds described above are used as raw materials of sintered ceramics, while the other compounds which produce the compounds described above may be used.
  • the sintered ceramics which contains 0.1-5% of total Be in weight, in the form of metallic Be or a Be compound, the balance being 80% of silicon carbide in weight, is preferable material, because its thermal conductivity is much larger than 0.2 cal/cm.sec. °C. and the electric resistance is more than 10 8 ⁇ cm at room temperature.
  • the sintered silicon carbide ceramics incorporate with a little quantity of beryllium oxide e.g. 0.05-10% in weight is especially preferable because its thermal conductivity is higher than 0.4 cal/cm.sec. °C. and the electric resistance is more than 10 8 ⁇ cm at room temperature.
  • the separate ceramic tiles are joined metallurgically by various methods to the metal-base body with a cooling structure.
  • the plasma particles it is preferable to put one end of a ceramic tile upon the end of an adjacent tile to provide a protective covering.
  • the ceramic tiles In order to arrange the ceramic tiles in an over lapping, manner edges are constructed to superimpose over each other. Instead of over-lapping the edges of ceramic tiles, the tiles may be arranged with a fixed gap and a ceramic bar may be inserted in the groove of the metal-base body.
  • metal-base body must be non-magnetic at temperature for use.
  • austenite steel, copper, copper alloy, aluminium, aluminium alloy, titanium, titanium alloy and nickel-base alloy can be used.
  • the cooling structure is composed of the body piled up by partial seam welding, which has the space for flowing refrigerant, and the space is manufactured by putting the non-welded part of the constructed body in a form and expanding it with high pressure air. This is called corrugate structure.
  • Another partial bonding method is diffusion bonding, pressure welding, brazing and so on.
  • Plural grooves are formed in the metal-base body.
  • the hollow parts of the corrugate structure having the space made by high pressure air described above is utilized for the grooves.
  • the necessary groove can be formed by cutting a metal plate.
  • the grooves act to reduce a thermal stress when the ceramic tiles are bonded and the nuclear fusion reactor is in operation.
  • the width of the groove may be wide enough lest neighbouring tiles should touch together forcing out the solder material between them when they are soldered.
  • the neighbouring ceramic tiles are not bound because surplus solder flows into the groove and does not remain in the gaps between them. Consequently, the thermal stress by the cooling of metal base-body after bonding can be reduced.
  • the grooves can be made plurality in the same direction or in the both directions of length and breadth on the surface of the metal-base body. In case of manufacturing, the former is preferable, while the latter is preferable from the point of view of stress relief.
  • the metal-base body on which plural ceramic tiles can be bonded, may be divided as well.
  • the divided metal-base body is composed or the fixed form of the furnace wall of a nuclear fusion reactor by bonding mechanically to a constructive part.
  • the metal-base body it is to be made with enough precision to eliminate surplus resistance against the flow of refrigerant.
  • the ceramic tiles are bonded to cover the surface as described above lest the metallic body should be irradiated by the plasma particles.
  • Ceramic tiles are metallurgically bonded to the metal-base body.
  • Metallurgical bonding includes e.g. brazing, diffusion bonding, anodic bonding etc. and does not include physical or mechanical bonding e.g. bolting, fitting, etc.
  • the gaps made between each ceramic tiles reduce thermal stress, and relax the thermal stress of bonding layer by the contraction of metal-base body after bonding. Therefore, they do not only prevent the cracking and tearing off of the ceramic tiles but also bond tightly the tiles to the base-body.
  • the width of the gap is determined considering the volume of the expansion and contraction in operation.
  • the melting point of bonding material must be lower than that of the metal-base body. Copper alloy containing manganese and silver are preferable for the bonding material when stainless steel and nickel base alloy are used for the metal-base body. These bonding materials can be used at about 900° C.
  • the gap between tiles before bonding is as wide as the difference between the contraction of the metal-base body and that of ceramics in the cooling process from the bonding temperature to the room temperature, naturally including allowance.
  • Copper alloy containing manganese 25-55% in weight may preferably be used as a brazing material of copper alloys mentioned-above.
  • the melting point of this alloy is 870°-1,000° C., therefore the bonding at comparatively low temperatures becomes possible.
  • copper alloys containing manganese 35-45% in weight is preferable.
  • This bonding material is available for the bonding of ceramic tiles composed of non-oxide ceramics and more effective for the bonding of carbide.
  • the brazing material of copper-manganese alloys is effective for the bonding of such ceramics to a nickel base alloy, as to contain 0.1-5% in weight of Be and more than one kind of Be compounds and more than 80% in weight of silicon carbide and to have electric insulation at room temperature.
  • Silver solders in JIS standard can be available for the bonding at high temperatures.
  • a silver solder should be imposed on the metallized layer of Mo-Mn etc. on the bonding surface.
  • a brazing material of aluminium alloy containing silicon 8-15% in weight is preferable.
  • This brazing alloy can braze at about 550°-620° C.
  • the gaps between each ceramic tile before bonding are controlled according to a brazing temperature.
  • This brazing material is effective to bond ceramic tiles of sintered material, the principal ingredient of which is silicon carbide, to a substrate of aluminium or aluminium alloy.
  • each ceramic tile can be bonded by heating under its own weight or under the pressure of 1-20 kg/cm 2 , the tiles are placed on the whole surface of the metal-base body with the bonding material located in between.
  • the atmosphere during heating is air or non oxidizing gas.
  • the thickness or depth of the bonding layer is preferable to be 10-100 ⁇ m.
  • the intermediate material which supports ceramic tiles on the metal-base body
  • a metallic material having the intermediate coefficient of thermal expansion between those of ceramic tiles and metal-base body.
  • the composite material of copper in which carbon fibers are buried, is preferable.
  • the carbon fiber reinforced copper composite material is prepared by hot-pressing stacked copper-clad carbon fiber cloths at a temperature high enough to unit the cloths.
  • the copper-clad carbon fibers are covered by a thin copper film in the form of bundles.
  • the bundles are woven two-dimensionally. This shows two-dimensionally equidirectional coefficient of thermal expansion.
  • This composite material does not reduce the coefficient of thermal conductivity in the direction of the thickness of the composite.
  • the composite has a coefficient of thermal expansion of 5-10 ⁇ 10 -6 /°C. and thermal conductivity of 0.3-1.0 cal/cm. sec. °C. at room temperature.
  • Carbon fibers are preferable to be 30-60% by volume. Up to 5% by weight of the elements (such as Ti, Cr, V etc.) for forming carbides with carbon fibers may be contained in the matrix of copper as well.
  • the intermediate material made of this copper-carbon fiber composite material is effective for bonding the above sintered silicon carbide ceramics to the metal-base body.
  • this intermediate material has the modulus of elasticity of 5-13 ⁇ 10 3 kg/mm 2 and the coefficient of thermal expansion of 3-12 ⁇ 10 -6 /°C. both at room temperature. It is effective for bonding the silicon carbide ceramics to the metal-base body.
  • Materials other than copper-carbon fiber composite material can also be used for bonding the sintered silicon carbide ceramics to the metal-base body, if they have the same modulus of elasticity and coefficient of thermal expansion as above.
  • the intermediate materials are bonded to the metal-base body with clearance between the materials such materials are arranged between grooves provided on the metal-base body like the ceramic tiles.
  • the ceramics tiles are bonded on the intermediate materials with clearance between adjacent tiles.
  • the ceramic tiles may be bonded apart from each other on the intermediate materials with grooves made in the tiles.
  • the above ceramic tiles of sintered silicon carbide face to face to use the above copper-manganese alloy solder.
  • the above ceramic tiles and the above composite material are previously bonded by the above copper-manganese alloy solder. After that, the above composite material is put upon by aluminium, then heated till about 548° C. and bonded under a certain pressure. In this case, the above composite material whose the principal ingredient is copper can be bonded by eutectic reaction between the composite material and aluminium.
  • the thickness of the intermediate material is preferable to be more than 0.5 mm. Because the intermediate material, the thickness of which is more than 0.5 mm, can be used for the cushion which relieves enough the difference in the coefficient of thermal expansion at the bonding area between the ceramics and the metal-base body. The effect of the intermediate material is considered to be satulated when its thickness exceeds about 2 mm. Owing to the intermediate material, the larger area of the ceramic tiles can be bonded to the base without cracking, because the intermediate material reduces the thermal stress at the bonding area.
  • FIG. 1 is the sectional view showing the outline of a torus-type nuclear fusion reactor as one example applying in the reactor wall construction of this invention.
  • Vacuum vessel 1 is the ring-like (torus) around the center line 10 as base line and plasma 2 is generated in its space.
  • the toroidal magnetic field coils 8, which generate a doughnut-like magnetic field for enclosing plasma 2 in the space of vacuum vessel 1, are distributed at the fixed interval along the round of the vacuum vessel.
  • This magnetic coils 8 are composed of super electric conductivity coils which are cooled by liquid helium.
  • plural poloidal coils 9 are distributed so as to control the position of plasma 2.
  • the inside of vacuum vessel 1 is evacuated by a vacuum exhauster (not shown).
  • the reactor wall 3 of this invention is set up near the plasma 2, and breeding bracket 6 and shelter 7 are set up outside the reactor wall in the vacuum vessel 1.
  • the reactor wall 3 is set up along the breeding bracket 6.
  • the reactor wall 3 is constructed by bonding the ceramic tiles 4 to the metal-base body 5 which is provided with a cooling means where refrigerant is circulated.
  • FIG. 2 is the drawing on the perspective showing a part of the reactor wall 3 of this invention.
  • FIG. 3 is the sectional view of section A--A' in FIG. 2.
  • the reactor wall 3 is constructed by bonding the ceramic tiles 4 to the metal-base body 5 having a cooling structure with path way 12 for the flow of refrigerant through the bonding layer 11.
  • the ceramic tiles 4 are arranged with gaps 14 between them.
  • Each assembly of FIG. 2 is bonded by welding, bolting, etc. and constructed as is shown in FIG. 1. 25 pieces of ceramic tiles 4 are bonded in FIG. 2, but these numbers may be variously changed.
  • the dotted line 15 in FIG. 3 shows the bonding plane in case of the metal-base body 5 having a cooling structure.
  • FIG. 4 is the oblique view of a part of reactor wall 3 in another case.
  • FIG. 5 is the sectional view of section B--B' in FIG. 4.
  • the ceramic tiles are so arranged that edges of the tiles are superposed lest the metal-base body should be directly irradiated by plasma 2.
  • the ceramic tiles are formed stepwise with projecting part 4' and cut part 4", so as to combine the projecting part 4' with the cut part 4", therefore the metal-base body are prevented from being exposed to plasma through the gap 14.
  • the projecting part 4' and cut part 4" are arranged in the longitudinal and transverse directions. In order to lap edges of the ceramic tiles over other edges of not adjoining tiles not to expose the metal-base body 5, its end is to be inclined or one side of the tile is to be let into another.
  • FIG. 6 is the sectional view of the reactor wall, in which ceramic tiles 4 are all made in the same form and bonded to the metal-base body alternating the top and bottom of tiles side by side in setting. This sectional view corresponds to that of the section B--B' of FIG. 4.
  • the metal-base body 5 was made of an aluminium plate, which was 5 mm thick, or a stainless steel plate of SUS 304 in JIS standard, which was 2 mm thick.
  • brazing material As the brazing material, a foil of 25 ⁇ m thick, which is composed of Mn 40% in weight and the balance being Cu, was used for SUS 304, and a foil 50 ⁇ m thick, which is composed of Si 12% in weight and the balance being Al, was used for aluminium after the bonding surface of ceramic tiles was metallized.
  • the ceramic tiles and the metal-base body were pressed under the pressure of 5-10 kg/cm 2 and heated in the atmosphere of Ar by a high frequency heating coil. The heating temperature was 860° C. for SUS 304, and 580° C. for aluminium. After heating, the assemblies were cooled in the air. The melted brazing material mostly remained between the bonding surfaces, but only a little was excluded from the bonding surfaces.
  • FIG. 7 is the oblique view showing one block composed of ceramic tiles 4 and metal-base body 5 with a cooling means, where they are bonded each other through intermediate material 16.
  • FIG. 8 is the sectional view of section C--C' in FIG. 7. In this case gap 14 is made between ceramic tiles 4 as in FIG. 4, and the ends of ceramic tiles 4 are formed stepwise. Then the tiles are bonded so as to be lapped over each other lest the metal-base body 5 should be irradiated by plasma particle 2.
  • Groove 13 is made corresponding to the gap 14 in the metal-base body.
  • the gap 14 can be smaller than the groove 13 in width, because it has only to prevent the generation of thermal stress by the thermal expansion in operation.
  • the stress exerted on the ceramic tiles and the metal-base body can be reduced by selecting intermediate material 16 of a proper coefficient of thermal expansion at room temperature and proper modulus of elasticity.
  • a bonding method is shown as follows. A sintered SiC ceramics of 10 mm thick and 40 mm square, which was made in the same way as in Example 1, was used as ceramic tiles, and copper-carbon fiber composite material was used as an intermediate material.
  • the copper-carbon fiber composite material was made by the next method.
  • the carbon fibers of several ⁇ m in diameter was plated with copper in the thickness of several ⁇ m by electroless copper plating.
  • a bundle of the copper-plated carbon fibers consisted of several thousands fibers and the bundle of fibers was woven into a plain weave. This weave was piled by 5 sheets and then heated and pressed at 800° C. in the atmosphere of nitrogen to make a sheet of composite material of 1 mm in thickness. A desired thickness can be obtained by stacking a necessary number of weaves.
  • the composite material is useful from the view points of characteristics and smoothness of finishing. Besides weaving fabric, the method of curling fibers and the method of dispersing short fibers may be applied.
  • the Cu-C fiber composite material made as above and the sintered SiC were bonded by heating at 860° C. under the pressure of 5-10 kg/cm 2 through the bonding material which is composed of manganese 40% in weight and the rest being copper and is 50 ⁇ m thick.
  • Three kinds of Cu-C fiber composite which contain carbon fibers of 35%, 45% and 54% in volume respectively, were made.
  • verious metals and alloys of different coefficient of thermal expansion and different modulus of elasticity were used. These intermediate materials are an invar alloy containing Ni35% and Ni42%, kovar, SUS430, hastelloy B, pure Ni, Mo, and W.
  • a brazing material which is composed of Mn 40% in weight and the rest being Cu and is 50 ⁇ m thick, is interposed between the sintered SiC and the above intermediate material. Then a foil of silver solder, which is composed of Cu 30% in weight and Ag 70% in weight and is 100 ⁇ m thick, is interposed between the intermediate material and a SUS304 stainless steel plate. The assembly was heated at 860° C. under the pressure of 5-10 kg/cm 2 in the atmosphere or Ar to unit altogether.
  • FIG. 9 shows the coefficient of thermal expansion at room temperature and modulus of elasticity of the above various intermediate materials which were used and the bonding properiety.
  • the Cu-C fiber composite material can be bonded without any cracking and tearing off, because its modulus of elasticity can be selectively regulated by the quantity of carbon fibers.
  • mark X shows the case of cracking in the sintered SiC
  • mark ⁇ shows the case of bonding strength of less than 5 kg/mm 2
  • mark o shows the case of bonding strength of more than 30 kg/mm 2 . It became clear that a high bonding strength was obtained when the intermediate material had the coefficient of thermal expansion of 3-12 ⁇ 10 -6 /°C. at room temperature and modulus of elasticity of 5-13 ⁇ 10 13 kg/mm 2 .
  • the metal-base body was used as the metal-base body.
  • This composite was bonded in advance to the above sintered SiC ceramics by the brazing material composed of Mn 40% in weight and the rest being Cu.
  • the bonding surface of copper-carbon fiber composite material was placed on the metal-base body of aluminium through the copper foil of 100 ⁇ m, and then they were bonded by a eutectic reaction method ⁇ where the reaction takes place between copper and aluminium at 580° C. under the pressure of 5-10 kg/cm 2 in the atmosphere of Ar.
  • Table 2 shows the result of heat load test irradiating laser beam on the surface of the ceramic tiles which was set up by the above method.
  • laser beam of 300 W/cm 2 was irradiated on the surface of ceramic tiles at a 100 second period.
  • water of 8 l/min was flowed as the refrigerant for the metal-base body.
  • any break down or tearing from the bonding part of the ceramic tiles was not observed even after 1000 times of heat load tests. And it was proved that heat dissipating characteristics were excellent, because the surface temperature of ceramic tiles and the temperature of the bonding part between ceramic tiles and the metal-base body were very low.
  • the metal-base body which had a corrugated structure made of an aluminium plate of 5 mm thick in stead of SUS 304, was used. Beforehand, SiC ceramics and Cu-C fiber composite material were bonded. For bonding this Cu-C fiber composite material to the metal-base body, bonding material, which was composed of Si 12% in weight and the rest being Al and was 50 ⁇ m thick, was used and they were heated at 580° C. under the pressure of 5-10 kg/cm 2 , in the next place, taken out of the furnace. Then, one side of the assembly was cooled and the other side was heated with burner.
  • An alumina plate on the market which was 10 mm thick and 40 mm square, was used as ceramic tiles.
  • the brazing material foil which was composed of Mn 40% in weight and the rest being Cu and was 40 mm square and 50 ⁇ m thick, was placed on the metal-base body 5. 49 pieces of alumina tiles were placed at intervals of 1 mm on the brazing foil. This set was put in the electric furnace, and held in heating for 30 seconds at 870° C. under the pressure of 10 kg/cm 2 in the atmosphere of Ar, and then cooled in the air after it was taken out of the furnace. As a result the reactor wall was bent to be concave on the side of metal-base body, but the cracking and tearing off of sintered alumina did not take place at all. This bent can be removed by pressing the assembly on the side of ceramic tiles at room temperature, consequently the thermal stress of bonding part was remarkably relieved.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Products (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Discharge Heating (AREA)
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EP (1) EP0117136B1 (enrdf_load_stackoverflow)
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DE (1) DE3476487D1 (enrdf_load_stackoverflow)

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AT390688B (de) * 1987-12-04 1990-06-11 Plansee Metallwerk Mechanisch verbundener, mehrteiliger koerper mit elementen zur verbesserung des waermeflusses zwischen den teilen
US4981761A (en) * 1988-06-03 1991-01-01 Hitachi, Ltd. Ceramic and metal bonded composite
US5012860A (en) * 1988-08-25 1991-05-07 Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E.V. Actively cooled heat protective shield
US5182075A (en) * 1989-05-24 1993-01-26 Hitachi, Ltd. Nuclear fusion reactor
US5277720A (en) * 1992-06-08 1994-01-11 Fears Clois D Method of preparing an exposed surface of marine structures to prevent detrimental adherence of living organisms thereto
US5447683A (en) * 1993-11-08 1995-09-05 General Atomics Braze for silicon carbide bodies
WO1996019910A1 (en) * 1994-12-22 1996-06-27 Research Triangle Institute High frequency induction plasma method and apparatus
US5953511A (en) * 1997-04-08 1999-09-14 National Instruments Corporation PCI bus to IEEE 1394 bus translator
US6302966B1 (en) * 1999-11-15 2001-10-16 Lam Research Corporation Temperature control system for plasma processing apparatus
US6394026B1 (en) * 1998-03-31 2002-05-28 Lam Research Corporation Low contamination high density plasma etch chambers and methods for making the same
US6408786B1 (en) * 1999-09-23 2002-06-25 Lam Research Corporation Semiconductor processing equipment having tiled ceramic liner
US20030132270A1 (en) * 2002-01-11 2003-07-17 Weil K. Scott Oxidation ceramic to metal braze seals for applications in high temperature electrochemical devices and method of making
US20060011583A1 (en) * 1999-11-15 2006-01-19 Bailey Andrew D Iii Materials and gas chemistries for processing systems
WO2006015864A1 (en) * 2004-08-12 2006-02-16 John Sved Proton generator apparatus for isotope production
EP1465205A3 (de) * 2003-04-02 2007-01-17 Plansee Se Verbundbauteil für Fusionsreaktor
US20070237278A1 (en) * 2005-04-12 2007-10-11 Lamont John S Inertial fusion reactor device
US20070271867A1 (en) * 2006-05-19 2007-11-29 Saint-Gobain Ceramics & Plastics, Inc. Refractory tiles for heat exchangers
US20090044753A1 (en) * 2006-06-23 2009-02-19 Deenesh Padhi Methods to improve the in-film defectivity of pecvd amorphous carbon films
US20090123696A1 (en) * 2007-11-09 2009-05-14 Ibiden Co., Ltd. Carbon-based composite material and producing method thereof
US20100140330A1 (en) * 2007-03-08 2010-06-10 Dilip Kumar Chatterjee Conductive Coatings, Sealing Materials and Devices Utilizing Such Materials and Method of Making
CN104446593A (zh) * 2013-09-20 2015-03-25 阿尔斯通技术有限公司 用于将耐热部件固定在暴露于热的部件的表面上的方法
US20170316871A1 (en) * 2016-04-29 2017-11-02 Trench Limited - Trench Group Canada Intergrated barrier for protecting the coil of air core reactor from projectile attack
US10879053B2 (en) 2013-06-03 2020-12-29 Lam Research Corporation Temperature controlled substrate support assembly
CN112539233A (zh) * 2020-11-30 2021-03-23 湖南世鑫新材料有限公司 一种碳陶制动摩擦块及制备方法

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JPS60172199A (ja) * 1984-02-16 1985-09-05 株式会社東芝 核融合装置の受熱機器の製造方法
FR2584525B1 (fr) * 1985-07-05 1987-09-25 Stein Industrie Paroi pour couverture de reacteur nucleaire a fusion controlee dans un plasma, et procede de fabrication d'une telle paroi
FR2610088B1 (fr) * 1987-01-23 1989-08-04 Lorraine Carbone Dispositif de refroidissement d'une structure soumise a un flux thermique intense et procede de realisation de ce dispositif
FR2610136A1 (fr) * 1987-01-23 1988-07-29 Novatome Dispositif de refroidissement d'un reacteur a fusion thermonucleaire et bloc modulaire de garnissage pour la realisation d'une paroi d'un tel dispositif
JPH0560242A (ja) * 1991-08-28 1993-03-09 Japan Atom Energy Res Inst セラミツクス製真空容器及びその製造方法
RU2154310C2 (ru) * 1998-02-23 2000-08-10 Государственное унитарное предприятие Научно-исследовательский и конструкторский институт энерготехники Бланкет термоядерного реактора
RU2179340C2 (ru) * 2000-05-06 2002-02-10 Государственное унитарное предприятие "Научно-исследовательский и конструкторский институт энерготехники" Первая стенка термоядерного реактора
RU2267173C1 (ru) * 2004-04-05 2005-12-27 Российская Федерация в лице Министерства Российской Федерации по атомной энергии Бридинговый элемент для термоядерного реактора синтеза
DE102007016375A1 (de) * 2007-03-31 2008-10-02 Deutsches Zentrum für Luft- und Raumfahrt e.V. Bauteile für Wärmesenken
FR3013497B1 (fr) * 2013-11-15 2018-11-30 Atmostat Composant a geometrie variable pour une structure a grande dimension et procede d'assemblage
US10688577B2 (en) * 2015-06-25 2020-06-23 Delavan Inc. Braze joints
CN109081702B (zh) * 2018-08-14 2021-06-08 常熟理工学院 一种碳纤维复合材料板材与陶瓷板材焊接的方法
CN109595879A (zh) * 2018-10-16 2019-04-09 中国科学院合肥物质科学研究院 一种真空烘烤装置
CN112927823B (zh) * 2021-03-09 2024-01-30 中国科学院合肥物质科学研究院 一种偏滤器第一壁的封闭式v型锐角结构
CN117038115A (zh) * 2023-09-20 2023-11-10 中国科学院合肥物质科学研究院 用于托克马克装置第一壁面向等离子体部件的复合瓦结构

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Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT390688B (de) * 1987-12-04 1990-06-11 Plansee Metallwerk Mechanisch verbundener, mehrteiliger koerper mit elementen zur verbesserung des waermeflusses zwischen den teilen
US4981761A (en) * 1988-06-03 1991-01-01 Hitachi, Ltd. Ceramic and metal bonded composite
US5012860A (en) * 1988-08-25 1991-05-07 Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E.V. Actively cooled heat protective shield
US5182075A (en) * 1989-05-24 1993-01-26 Hitachi, Ltd. Nuclear fusion reactor
US5277720A (en) * 1992-06-08 1994-01-11 Fears Clois D Method of preparing an exposed surface of marine structures to prevent detrimental adherence of living organisms thereto
US5447683A (en) * 1993-11-08 1995-09-05 General Atomics Braze for silicon carbide bodies
US5800620A (en) * 1994-12-22 1998-09-01 Research Triangle Institute Plasma treatment apparatus
US5643639A (en) * 1994-12-22 1997-07-01 Research Triangle Institute Plasma treatment method for treatment of a large-area work surface apparatus and methods
WO1996019910A1 (en) * 1994-12-22 1996-06-27 Research Triangle Institute High frequency induction plasma method and apparatus
US5953511A (en) * 1997-04-08 1999-09-14 National Instruments Corporation PCI bus to IEEE 1394 bus translator
US6394026B1 (en) * 1998-03-31 2002-05-28 Lam Research Corporation Low contamination high density plasma etch chambers and methods for making the same
US6583064B2 (en) * 1998-03-31 2003-06-24 Lam Research Corporation Low contamination high density plasma etch chambers and methods for making the same
US6408786B1 (en) * 1999-09-23 2002-06-25 Lam Research Corporation Semiconductor processing equipment having tiled ceramic liner
US6302966B1 (en) * 1999-11-15 2001-10-16 Lam Research Corporation Temperature control system for plasma processing apparatus
US20060011583A1 (en) * 1999-11-15 2006-01-19 Bailey Andrew D Iii Materials and gas chemistries for processing systems
US20030132270A1 (en) * 2002-01-11 2003-07-17 Weil K. Scott Oxidation ceramic to metal braze seals for applications in high temperature electrochemical devices and method of making
US7055733B2 (en) * 2002-01-11 2006-06-06 Battelle Memorial Institute Oxidation ceramic to metal braze seals for applications in high temperature electrochemical devices and method of making
EP1465205A3 (de) * 2003-04-02 2007-01-17 Plansee Se Verbundbauteil für Fusionsreaktor
WO2006015864A1 (en) * 2004-08-12 2006-02-16 John Sved Proton generator apparatus for isotope production
US20080089460A1 (en) * 2004-08-12 2008-04-17 John Sved Proton Generator Apparatus for Isotope Production
US20070237278A1 (en) * 2005-04-12 2007-10-11 Lamont John S Inertial fusion reactor device
US20070271867A1 (en) * 2006-05-19 2007-11-29 Saint-Gobain Ceramics & Plastics, Inc. Refractory tiles for heat exchangers
US20090044753A1 (en) * 2006-06-23 2009-02-19 Deenesh Padhi Methods to improve the in-film defectivity of pecvd amorphous carbon films
US8282734B2 (en) * 2006-06-23 2012-10-09 Applied Materials, Inc. Methods to improve the in-film defectivity of PECVD amorphous carbon films
US20100140330A1 (en) * 2007-03-08 2010-06-10 Dilip Kumar Chatterjee Conductive Coatings, Sealing Materials and Devices Utilizing Such Materials and Method of Making
US20090123696A1 (en) * 2007-11-09 2009-05-14 Ibiden Co., Ltd. Carbon-based composite material and producing method thereof
US8329283B2 (en) * 2007-11-09 2012-12-11 Ibiden Co., Ltd. Carbon-based composite material and producing method thereof
US10879053B2 (en) 2013-06-03 2020-12-29 Lam Research Corporation Temperature controlled substrate support assembly
EP2851151A1 (en) * 2013-09-20 2015-03-25 Alstom Technology Ltd Method of fixing through brazing heat resistant component on a surface of a heat exposed component
EP2851151B1 (en) 2013-09-20 2017-08-23 Ansaldo Energia IP UK Limited Method of fixing through brazing a heat resistant component on a surface of a heat exposed component
CN104446593A (zh) * 2013-09-20 2015-03-25 阿尔斯通技术有限公司 用于将耐热部件固定在暴露于热的部件的表面上的方法
US20170316871A1 (en) * 2016-04-29 2017-11-02 Trench Limited - Trench Group Canada Intergrated barrier for protecting the coil of air core reactor from projectile attack
US11101068B2 (en) * 2016-04-29 2021-08-24 Trench Limited—Trench Group Canada Integrated barrier for protecting the coil of air core reactor from projectile attack
CN112539233A (zh) * 2020-11-30 2021-03-23 湖南世鑫新材料有限公司 一种碳陶制动摩擦块及制备方法
CN112539233B (zh) * 2020-11-30 2022-06-14 湖南世鑫新材料有限公司 一种碳陶制动摩擦块及制备方法

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JPS59151084A (ja) 1984-08-29
EP0117136A2 (en) 1984-08-29
EP0117136B1 (en) 1989-01-25
EP0117136A3 (en) 1985-12-18
DE3476487D1 (en) 1989-03-02
JPH0233111B2 (enrdf_load_stackoverflow) 1990-07-25

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