US3929610A - Electroformation of metallic strands - Google Patents

Electroformation of metallic strands Download PDF

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Publication number
US3929610A
US3929610A US475098A US47509874A US3929610A US 3929610 A US3929610 A US 3929610A US 475098 A US475098 A US 475098A US 47509874 A US47509874 A US 47509874A US 3929610 A US3929610 A US 3929610A
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Prior art keywords
plating surface
strand
cathode
plating
loop
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Expired - Lifetime
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US475098A
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English (en)
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Chih-Chung Wang
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Kennecott Utah Copper LLC
Kennecott Corp
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Kennecott Copper Corp
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Priority to US475098A priority Critical patent/US3929610A/en
Priority to CA225,512A priority patent/CA1046446A/fr
Priority to GB1750575A priority patent/GB1478280A/en
Priority to JP50063408A priority patent/JPS58518B2/ja
Priority to FR7516478A priority patent/FR2273087B1/fr
Priority to DE19752524055 priority patent/DE2524055A1/de
Publication of US3929610A publication Critical patent/US3929610A/en
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Assigned to KENNECOTT CORPORATION reassignment KENNECOTT CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). EFFECTIVE MAY 7, 1980. (SEE DOCUMENT FOR DETAILS) Assignors: KENNECOTT COPPER CORPORATION
Assigned to KENNECOTT CORPORATION, 200 PUBLIC SQUARE, CLEVELAND OHIO, 44114, A CORP. OF DE. reassignment KENNECOTT CORPORATION, 200 PUBLIC SQUARE, CLEVELAND OHIO, 44114, A CORP. OF DE. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: KENNECOTT MINING CORPORATION
Assigned to KENNECOTT MINING CORPORATION reassignment KENNECOTT MINING CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). EFFECTIVE DEC. 31, 1986. (SEE DOCUMENT FOR DETAILS) Assignors: KENNECOTT CORPORATION
Assigned to GAZELLE CORPORATION, C/O CT CORPORATION SYSTEMS, CORPORATION TRUST CENTER, 1209 ORANGE STREET, WILMINGTON, DE., 19801, A DE. CORP. reassignment GAZELLE CORPORATION, C/O CT CORPORATION SYSTEMS, CORPORATION TRUST CENTER, 1209 ORANGE STREET, WILMINGTON, DE., 19801, A DE. CORP. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: RENNECOTT CORPORATION, A DE. CORP.
Assigned to KENNECOTT UTAH COPPER CORPORATION reassignment KENNECOTT UTAH COPPER CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). JULY 5, 1989 - DE Assignors: GAZELLE CORPORATION
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils

Definitions

  • ABSTRACT [52] U.S. Cl. 204/13; 204/208; 204/281' A fine metallic strand of infinte length is produced by [51] Int. Cl. C25D 1/04 continuous electrodeposition of metal on a conductive [58] Field of-Search 204/208, 216, 281, 12, strip having a narrow, closed-loop plating surface de- 204/13 fined by an insulating material bonded to sides of the conductive strip so that the bonding surface is gener- [56] References Cited ally transverse to the plating surface.
  • a well-known technique employed in the production of fine metal wires or strips involves the electrodeposition'of the metal on a conductive cathode, followed by stripping and spooling of this electroformed wire. This process is particularly useful in the production of very fine strands having a small cross-sectional area since the production of such strands by a conventional draw ing process is relatively slow and costly due, in part, to the large number of machines needed to implement a correspondingly large number of drawing operations.
  • a controlling factor in the electroformation process is the construction and shape of the cathode and its associated plating surface on which the metal is deposited.
  • One type of prior art cathode has a flat plating surface with the deposit forming in one or more grooves scribed on it. The bottom of the groove is typically the conductive plating surface and the sides are a non-conductive material that serves to mask or confine the area of deposit and to provide a crude mold that assists in forming the desired cross-sectional shape.
  • a common method of forming these grooves is to apply an insulating layer over a conductive surface and remove, for example, by scratching machining or similar techniques, a portion of the layer where it is desired to create the plating surface for electrodeposition.
  • cathode utilizes a cylindrical cathode with plating surfaces in the form of spiral or circular grooves. Again, as in the flat surface cathode, the metallic strands produced with this spiral groove construction, cathodes are of a finite length. In contrast, a technique employing a circular groove construction is capable of producing strands of infinite length.
  • U.S. Pat. No. 1,600,252 issued May 29, 1925 to C. K. Topping discloses a cylindrical cathode having a number of circular grooves formed on the surface of the cylinder and lying in parallel transverse planes.
  • An additional disadvantage of the prior art cathode structures is that they are subject to deterioration during frequent or continuous use. This problem is particularly acute when the masking insulation is in the form of a thin exterior layer bonded to an underlying conductive surface of either a flat or cylindrical geometry. In this situation, the insulating layer has a tendency, after repeated use, to separate from the conductive surface. During plating, some of the metal deposits in these separated regions or cracks. The metallic burr or ridge thus formed then impedes the removal of the strip from the plating surface and will frequently cause the strand to tear or deform as it is removed. Also, the thin masking edge of the insulating layer is highly susceptible to wear due to the abrasive action of the strand during its removal. This wear results in the formation of a strand that has irregularities in its cross-sectional dimensions.
  • Another object of this invention is to provide an electroformation process that minimizes the deterioration of the masking insulation and eliminates the formation of burrs that project under the insulation.
  • Still another object of this invention is to provide an electroforming process that utilizes a stationary cathode and promotes an improved bonding between the conductive portions and the insulating portions thereof.
  • the electroforming process according to this invention utilizes a cathode having a closed-loop conductive portion forming a plating surface which is exposed to a plating solution.
  • An insulating portion is bonded to the conductive portion at interfaces lying in a plane that is substantially perpendicular to the plating surface and is in continuous contact with the edges of the plating surface.
  • a closed-loop layer of the metal to be formed typically copper, is electrodeposited from the plating solution onto the plating surface. When the deposited metal reaches the desired thickness, the layer is cut and one of the ends formed by the cut is drawn away from the plating surface of the cathode to a spooler.
  • Control of the draw rate and the electrodeposit rate produces a continuous strand having preselected cross-sectional dimensions.
  • a cathode having a plating surface in the configuration of a double spiral offers an efficient utilization of the cathode area and an exceptionally high production speed.
  • FIG. 1 is a perspective view of one embodiment of a processing apparatus constructed in accordance with the principles of this invention
  • FIG. 2 is a cross-sectional view along the line 2-2 of the cathode shown in FIG. 1;
  • FIG. 3 is a plan view of a double spiral cathode constructed according to this invention.
  • FIG. 4 is a schematic drawing illustrating one method of forming the cathode shown in FIG. 3;
  • FIG. 5 is a cross-sectional view along the line 5--5 of the cathode shown in FIG. 3 and constructed according to the method shown in FIG. 4;
  • FIG. 6 is a cross sectional view corresponding to FIG. of a double spiral cathode constructed according to this invention by an alternative method.
  • a strand of metal 12 is formed on a cathode l4 immersed in a plating tank 16 containing an electrolytic solution 18. After formation, the strand is peeled from a plating surface or land 20 of the cathode l4 and directed to a spooler 22.
  • a power source 24 and rectifier 26 supply a direct electrical current between the cathodes 14 and an anode 28.
  • the cathode 14 has a closed-loop band 30 of a conductive material that is substantially inert or strippable with respect to the metal being plated. Layers of insulating material 32 are bonded to both side wall surfaces 30a of the band 30, leaving the edge of the band exposed as the plating surface 20.
  • the band 30 is a strip of a conductive material that has its ends welded or otherwise attached to each other,
  • the band material must be strippable with respect to the metal being deposited.
  • strippable excludes any material which would adversely affect the plating surface 20 or the metal being deposited, as well as materials which are physically reactive in the sense of a deposit which adheres so strongly to the plating surface that it renders the efficientremoval of the strand 12 impractical.
  • suitable strippable materials include stainless steel, chromium, titanium, rhenium and molybenum. Stainless steel is preferred for reasons of cost and availability.
  • the cross-sectional shape of the band 30 is generally rectangular, with one edge forming the plating surface 20.
  • the overall configuration of the illustrated band 30, and the associated plating surface 20, is that of a circle.
  • a wide variety of configurations such as ovals, kidney shapes and more complex convoluted forms are equally practicable provided that they constitute a closed, continuous loop.
  • the cross-sectional shape can assume forms such as a trapezoid or triangle.
  • the rectangular shape is preferred, however, since it is readily available as rolled stock and the edge surfaces 20 of such rolled stock are highly uniform and therefore particularly suited to the production of correspondingly uniform metallic strands 12.
  • the insulating layers 32 may be formed from any suitable material having the required dielectric, bonding and durability characteristics.
  • bonding includes resiliency and/or thermal properties that maintain the bond over a range of temperatures, and the term durability includes withstanding the environment of a plating bath.
  • Suitable insulating materials include epoxy resins, ceramics and plastics such as products marketed under the trademarks Lucite or Bakelite.
  • the insulating layers 32 are bonded to the broad side surfaces 30a of the band 30 leaving only the plating surface 20 exposed.
  • an oxide layer is formed on the side surfaces 30a prior to bonding in order to provide additional insulation and a stronger bond.
  • Stainless steel may be oxidized, and molybdenum, rhenium or other metals may be coated with an oxide such as alumina.
  • a metallo'graphic press can then be used for the actual bonding.
  • bonding the opposed edges of the insulating material that overhang the band 30 join together in an insulated edge portion 34. One or both of these insulated edge portions is then ground off to expose the edge plating surface 20.
  • the insulating layers 32 thus serve mask and define the plating surface 20.
  • a significant feature of this invention is that the insulating layers, and the bonding surface are substantially perpendicular to the plating surface 20. Further, if the insulating layers 32 should separate from the band 30, any metal that deposits in the separated region is automatically aligned in the general direction of the removal of the strand 12 from the surface 20. This reduces the likelihood of the strand shearing or deforming as it is removed and also markedly reduces the deterioration of the masking edges 36 of the insulating layers due to abrasion caused by the strand removal.
  • the formation of an electrode of this structure can be accomplished without the requirement of scratching or machining grooves or paths in the face of an exterior insulating layer bonded over the plating surface.
  • FIG. 1 schematically illustrates one embodiment of apparatus to continuously produce fine strands 12 of infinite length in accordance with this invention.
  • An insulated lead 38 that passes through the insulating layer 32 electrically connects an ac. power source 24 and the negative terminal of the rectifier 26 to the band 30 and the plating surface 20.
  • Another insulated lead 40 connects the positive terminal of the rectifier to the anode 28 which consists of a platinuim wire basket 28a containing lumps of copper 29 which may be of a relatively low grade.
  • the cathode l4 and anode 28 are immersed, in a spaced relationship, in the plating solution 18 of conventional composition.
  • a suitable test solution included 240 grams per liter of hydrated copper sulfate and 39 cubic centimeters per liter of sulfuric acid, at room temperature.
  • a layer of copper deposits on the plating surface 20 The rate of deposit depends in a well known manner on such variables as the area of the plating surface, the currentdensity, and the concentration of the plating solution. Given a constant current density at the cathode, the amount of the deposit is directly proportional to the elapsed time.
  • the deposit assumes the shape of the continuous, closed-loop plating surface 20, with uniform parallel edges defined by the edges of the surface 20 and the insulating layer edges 36.
  • the metal is allowed to deposit on surface 20 for a sufficient period of time to form a layer of the desired thickness and then a cut is made in the deposited layer.
  • One of the ends thus formed is drawn away from the plating surface and directed in a well known manner over an idler wheel 42 to the spooler 22. The spooler then continues to draw and wind a continuous strand of copper from the plating surface.
  • the strand 12 will have a uniform cross-sectional area, except for the initial segment removed from the cathode corresponding to the length of one loop around the plating surface 20.
  • This initial segment is generally thicker than the subsequent portion of the strand since, for the most part, it remains on the plating surface longer than any subsequent portion of the strand (the time for the initial formation of the first loop plus the time for its removal).
  • subsequent portions all remain on the plating surface for the same period of time, which is determined by the spooler draw rate (a constant for a given production run) and the length of a single, complete loop of the plating surface.
  • the production rate of this process and the cross-sectional dimensions of the strand being produced are interrelated, depending in part on the same parameters. Included among these parameters are the width and length of the plating surface.
  • the width of the plating surface controls the width of the strand l2, and, other factors being constant, widening the plating surface lengthens the time required to deposit a layer of a given thickness.
  • the length of the path influences the choice of the deposit rate, and determines, in conjunction with the draw rate, the amount of time a section of the strand 12 is on the plating surface.
  • Another variable parameter, the draw rate directly corresponds to the production rate.
  • a plating surface having a long path length is advantageous since it allows a high draw rate while giving the strand time to deposit to an acceptable thickness of the metal.
  • Other parameters affecting the production rate and strand dimensions are those controlling the deposit rate and include the current density at the cathode, the composition, concentration and temperature of the plating solution, and the condition of the plating surface.
  • the strand produced by this method generally has a rounded rectangular or trapezoidal cross section.
  • one or more reducing dies and pulling capstans can be placed before the spooler so that the spooled strand has the desired shape. Since the initial cross-sectional area of the strand is relatively small, the possibility of the strand shearing, deforming or developing strain points is reduced significantly.
  • FIG. 3 illustrates a preferred embodiment of a cathode suitable for the production of strands of infinite length in accordance with this invention.
  • the illustrated shape of the plating surface is a reverse or double spiral. This configuration can be visualized as being formed by spiral winding a long, continuous band having two closely spaced parallel sides each meeting in common end loops 44 and 46.
  • FIG. 4 illustrates in a simplified form one method for forming a reverse or double spiral cathode of the type illustrated in FIG. 3.
  • a strip 48 of a suitable plating surface material such as stainless steel and two spacer strips 50,51 are wound simultaneously from supply rolls 48a, 48b, 50a, 51a, on a cathode hub 52.
  • Each end of the strip 48 is wound on a separate supply roll (48a or 48b) and the interior end loop 44 is formed in a portion of the strip 48 that is intermediate the supply rolls 48a and 48b.
  • a slot 54 in the hub allows the inner loop end 44 to be formed and supported in an open central portion 52a of the hub 52.
  • a suitable method of forming the loop 46, and thereby making a closed loop plating strip, isto butt weld the outer ends of the strip 48 and accurately grind the weld joint to the same thickness as the strip.
  • the edge or edges of this loop form the plating surface or surfaces 20.
  • the strips 50 and 51 are narrower in the dimension perpendicular to the plating surface 20 than is the strip 48, and they are centered during the winding process so that they are spaced uniformly from one or both edges of the strip 48, depending on whether it is desired to plate on one or both faces of the cathode.
  • the spacer strips 50 and 51 are spaced only from the face shown bearing an electrodeposited strand 12. This spacing forms a groove between the spiral layers of the plating surface 20.
  • the spacing strips can be the same width as the strips 50 and etched down to form the grooves. The etching process is facilitated if the spacer strip'sare copper or a material having similar etching properties.
  • a conductive metal as the spacer strip has the added advantage of enhancing the electrical conductivity throughout the body of the cathode.
  • a copper backing layer 55 (FIG. 5) that is in electrical contact with all of the loops of the strips 48, 50, and 51 further enhances the electrical conductivity of the cathode.
  • An insulating material 56 is used to fill the grooves thus formed thereby masking the plating surface 20 in a manner similar to that of the layers 32 in FIGS. 1 and 2 and insulating the other conductive surfaces of the cathode.
  • the insulating material 56 is applied in a viscous form which allows it to flow into and till the grooves.
  • the degree of viscosity required is determined principally by the dimensions of the grooves. Typical groove dimensions for the production of 34 AWG wire are a width of 20 mils and depth of mils, separated by plating surfaces or lands having a thickness of 4 mils.
  • a preferred insulating mate rial is a low viscosity filled resin produced according to the following formula:
  • Another suitable insulating material is a low viscosity filled resin manufactured by Emerson and Cuming under the trademark designation Stycast 2651 MM.
  • the wound cathode is placed in a closed mold and sufficient resin' is added to completely coat the cathode.
  • the application of a vacuum and mild heating to the mold promotes the complete filling of the grooves and deaeration of the resin.
  • the resin is cured and the plating face of the cathode is ground and polished to expose the plating surface 20. Any cracks or irregularities are easily repaired by the application of more resin at these points. If the grinding exposes a portion of the copper spacer strips 50 or 51, they may be etched down and the area refilled with resin.
  • FIG. 6 illustrates a cathode formed by photo-etching.
  • a plate 58 preferably formed from stainless steel 316, is coated with a photoresist material on the surface (or surfaces) where it is desired to form the plating surface 20. This surface is preferably slightly roughened to enhance the adhesion of the photoresist material to the surface.
  • the desired double spiral pattern is then exposed on the photoresist in a well known manner, the photoresist is processed, and the unexposed areas are subsequently etched in a conventional manner to form the grooves 60.
  • a layer of a suitable strippable plating surface metal such as chromium is then plated or otherwise applied to the lands to form the plating surface 20.
  • the insulating material is applied in the same manner as for the wound cathode.
  • an insulated electrical connection is made to the cathode for introducing a uniform density current over the plating surface. In the embodiments illustrated in FIGS. and 6, this connection is made to the copper layers 55 and 58, respectively, through the adjacent insulating layer 56a.
  • a method for continuously producing a metallic strand of indeterminate length comprising the steps of A. providing a cathode having a conductive portion with at least one exposed, narrow, closed-loop plating surface formed thereon, said plating surface being substantially strippable with respect to said metal, and an insulating portion in continuous contact with the edges of said plating surface and bonded to said conductive portions along a surface substantially perpendicular to said plating surface, B. electrodepositing the metal on said plating surface with said plating surface totally immersed in a plating solution, and
  • said conductive portion is a band having a generally rectangular cross section and said plating surface is an edge of said band.
  • removing is further characterized by A. a first mode of operation comprising opening the closed-loop metallic strand formed on the plating surface when the strand attains a predetermined thickness, and drawing one of the ends formed by said opening away from said plating surface, and
  • a second mode of operation comprising continuing to draw the strand formed on the plating surface from the plating surface in a direction substantially normal to the plating surface, the point of the removal traveling continuously around said closed loop and drawings away the thickest portion of the layer deposited on the plating surface at a given time.
  • a cathode for the continuous electroformation of metallic strands of indeterminate length comprising, in combination,
  • a conductive base having a narrow, closed-loop plating surface formed on a first surface of the base, said plating surface being substantially strippable with respect to said metal, said plating surface having the general shape of a double spiral, and
  • a cathode according to claim 14 wherein said conductive base comprises wound strips of a material substantially strippable with respect to said metal and alternating spacer strips, an edge of said spacer strips B. electrodepositing the copper on said plating surbeing spaced from said plating surface to form a face with said plating surface totally immersed in a groove. plating solution,
  • a cathode according to claim 14 wherein said from said plating surface without interrupting said insulating portion is a filled epoxy resin. electrodepositing and without rotating said cath- 18.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
US475098A 1974-05-31 1974-05-31 Electroformation of metallic strands Expired - Lifetime US3929610A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US475098A US3929610A (en) 1974-05-31 1974-05-31 Electroformation of metallic strands
CA225,512A CA1046446A (fr) 1974-05-31 1975-04-25 Fabrication de torons metalliques
GB1750575A GB1478280A (en) 1974-05-31 1975-04-28 Production of metallic strands by electroforming
JP50063408A JPS58518B2 (ja) 1974-05-31 1975-05-27 金属線連続製造方法およびこの方法に用いる陰極
FR7516478A FR2273087B1 (fr) 1974-05-31 1975-05-27
DE19752524055 DE2524055A1 (de) 1974-05-31 1975-05-30 Verfahren und vorrichtung zum herstellen von metallstraengen unbestimmter laenge

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US475098A US3929610A (en) 1974-05-31 1974-05-31 Electroformation of metallic strands

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JP (1) JPS58518B2 (fr)
CA (1) CA1046446A (fr)
DE (1) DE2524055A1 (fr)
FR (1) FR2273087B1 (fr)
GB (1) GB1478280A (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4040942A (en) * 1976-08-23 1977-08-09 Kennecott Copper Corporation Multiple-track cathode for electroformation of metallic filaments
US4079510A (en) * 1976-08-23 1978-03-21 Kennecott Copper Corporation Method of manufacturing flexible electrical conductor
US4109028A (en) * 1976-08-23 1978-08-22 Kennecott Copper Corporation Fabrication of cathodes for electrodeposition
US4266987A (en) * 1977-04-25 1981-05-12 Kennecott Copper Corporation Process for providing acid-resistant oxide layers on alloys
USRE34664E (en) * 1987-01-28 1994-07-19 Asarco Incorporated Method and apparatus for electrolytic refining of copper and production of copper wires for electrical purposes
WO1996013624A1 (fr) * 1994-10-26 1996-05-09 Magma Copper Company Procede de fabrication de fil de cuivre
US5679232A (en) * 1993-04-19 1997-10-21 Electrocopper Products Limited Process for making wire
US5830583A (en) * 1993-04-19 1998-11-03 Clouser; Sidney J. Copper wire
US6123788A (en) * 1993-04-19 2000-09-26 Electrocopper Products Limited Copper wire and process for making copper wire
US20040159549A1 (en) * 2003-02-14 2004-08-19 Park Yong Bum Apparatus and method for fabricating metal fibers using electroforming
US20040258860A1 (en) * 2001-08-22 2004-12-23 Tokuji Oda Electroforming apparatus and electroforming method
US20050072967A1 (en) * 2003-10-07 2005-04-07 Pavel Kornilovich Fabrication of nanowires

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6451320U (fr) * 1987-09-22 1989-03-30
CN114069895A (zh) * 2021-11-16 2022-02-18 清华大学 一种通过电解铜制备的电机部件和电机

Citations (7)

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US528586A (en) * 1894-11-06 Apparatus for electrodeposition
US638917A (en) * 1899-05-04 1899-12-12 Elisha Emerson Process of producing wire-bars.
US799634A (en) * 1905-02-06 1905-09-19 Sherard Osborn Cowper-Coles Production of metallic strip, wire, rods, &c.
US2805986A (en) * 1952-01-11 1957-09-10 Harold B Law Method of making fine mesh screens
US2917438A (en) * 1955-04-21 1959-12-15 Sylvania Electric Prod Electrical component and manufacture
US3094476A (en) * 1960-07-13 1963-06-18 Armour Res Found Apparatus for forming metal fibers
US3409530A (en) * 1965-10-20 1968-11-05 Continental Oil Co Helical electrode

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US528586A (en) * 1894-11-06 Apparatus for electrodeposition
US638917A (en) * 1899-05-04 1899-12-12 Elisha Emerson Process of producing wire-bars.
US799634A (en) * 1905-02-06 1905-09-19 Sherard Osborn Cowper-Coles Production of metallic strip, wire, rods, &c.
US2805986A (en) * 1952-01-11 1957-09-10 Harold B Law Method of making fine mesh screens
US2917438A (en) * 1955-04-21 1959-12-15 Sylvania Electric Prod Electrical component and manufacture
US3094476A (en) * 1960-07-13 1963-06-18 Armour Res Found Apparatus for forming metal fibers
US3409530A (en) * 1965-10-20 1968-11-05 Continental Oil Co Helical electrode

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079510A (en) * 1976-08-23 1978-03-21 Kennecott Copper Corporation Method of manufacturing flexible electrical conductor
US4109028A (en) * 1976-08-23 1978-08-22 Kennecott Copper Corporation Fabrication of cathodes for electrodeposition
US4040942A (en) * 1976-08-23 1977-08-09 Kennecott Copper Corporation Multiple-track cathode for electroformation of metallic filaments
US4266987A (en) * 1977-04-25 1981-05-12 Kennecott Copper Corporation Process for providing acid-resistant oxide layers on alloys
USRE34664E (en) * 1987-01-28 1994-07-19 Asarco Incorporated Method and apparatus for electrolytic refining of copper and production of copper wires for electrical purposes
US5830583A (en) * 1993-04-19 1998-11-03 Clouser; Sidney J. Copper wire
US5516408A (en) * 1993-04-19 1996-05-14 Magma Copper Company Process for making copper wire
US5679232A (en) * 1993-04-19 1997-10-21 Electrocopper Products Limited Process for making wire
US6123788A (en) * 1993-04-19 2000-09-26 Electrocopper Products Limited Copper wire and process for making copper wire
WO1996013624A1 (fr) * 1994-10-26 1996-05-09 Magma Copper Company Procede de fabrication de fil de cuivre
AU696693B2 (en) * 1994-10-26 1998-09-17 Electrocopper Products Limited Process for making copper wire
WO1997039166A1 (fr) * 1996-04-18 1997-10-23 Electrocopper Products Limited Procede de fabrication de fil metallique
US20040258860A1 (en) * 2001-08-22 2004-12-23 Tokuji Oda Electroforming apparatus and electroforming method
US20040159549A1 (en) * 2003-02-14 2004-08-19 Park Yong Bum Apparatus and method for fabricating metal fibers using electroforming
US20050072967A1 (en) * 2003-10-07 2005-04-07 Pavel Kornilovich Fabrication of nanowires
WO2005038093A2 (fr) * 2003-10-07 2005-04-28 Hewlett-Packard Development Company, L.P. Fabrication de nanofils
WO2005038093A3 (fr) * 2003-10-07 2005-08-04 Hewlett Packard Development Co Fabrication de nanofils
GB2422378A (en) * 2003-10-07 2006-07-26 Hewlett Packard Development Co Fabrication of nanowires
US7223611B2 (en) 2003-10-07 2007-05-29 Hewlett-Packard Development Company, L.P. Fabrication of nanowires
GB2422378B (en) * 2003-10-07 2008-05-21 Hewlett Packard Development Co Fabrication of nanowires
CN1890406B (zh) * 2003-10-07 2010-12-15 惠普开发有限公司 纳米线的制作

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Publication number Publication date
DE2524055A1 (de) 1975-12-18
FR2273087A1 (fr) 1975-12-26
GB1478280A (en) 1977-06-29
FR2273087B1 (fr) 1980-02-22
JPS58518B2 (ja) 1983-01-06
CA1046446A (fr) 1979-01-16
JPS512634A (fr) 1976-01-10

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