US3914634A - Channel plate acting as discrete secondary-emissive dynodes - Google Patents
Channel plate acting as discrete secondary-emissive dynodes Download PDFInfo
- Publication number
- US3914634A US3914634A US317411A US31741172A US3914634A US 3914634 A US3914634 A US 3914634A US 317411 A US317411 A US 317411A US 31741172 A US31741172 A US 31741172A US 3914634 A US3914634 A US 3914634A
- Authority
- US
- United States
- Prior art keywords
- channel plate
- metal layers
- separator elements
- separator
- apertures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 238000003491 array Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 35
- 239000011521 glass Substances 0.000 claims description 11
- 229910001209 Low-carbon steel Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 108091006146 Channels Proteins 0.000 description 82
- 239000010410 layer Substances 0.000 description 52
- 239000004020 conductor Substances 0.000 description 33
- 239000011159 matrix material Substances 0.000 description 8
- 238000010276 construction Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001962 electrophoresis Methods 0.000 description 2
- 229910021397 glassy carbon Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000002196 Pyroceram Substances 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J43/00—Secondary-emission tubes; Electron-multiplier tubes
- H01J43/04—Electron multipliers
- H01J43/06—Electrode arrangements
- H01J43/18—Electrode arrangements using essentially more than one dynode
- H01J43/22—Dynodes consisting of electron-permeable material, e.g. foil, grid, tube, venetian blind
Definitions
- ABSTRACT Perforate metal layers having aligned apertures defining channels are closely spaced from each other by uniformly distributed arrays of separator elements which accurately maintain relative spacing under varying temperature conditions even though the separator elements and metal layers have different coefficients of thermal expansion.
- This invention relates to electron multipliers and more particularly to electron multipliers of the channel plate type.
- the invention is applicable to channel plates for use in electronic imaging and display applications.
- the type of device now known as a channel plate is a secondary-emissive electron-multiplier device comprising a matrix in the form of a plate having a large number of elongate channels passing through its thickness, said plate having a first conductive layer on its input face and a separate second conductive layer on its output face to act respectively as input and output electrodes.
- the channel plates described in these specifications can be regarded as continuous-dynode devices in that the material of the matrix is continuous (though not necessarily uniform) in the direction of thickness, i.e. the direction of the channels.
- a potential difference is applied between the two electrode layers of the matrix so as to set up an electric field to accelerate the electrons, which field establishes a potential gradient created by current flowing through resistive surfaces formed inside the channels or (if such channel surfaces are absent) through the bulk material of the matrix.
- secondaryemissive multiplication takes place in the channels.
- plates of laminated construction have been described having a matrix formed of alternate conductor and separator layers so that the inner wall of each channel is discontinuous along its length.
- One known type of laminated construction is in the form of a channel plate wherein the matrix is formed as a sandwich of alternate conductor layers and insulating separator layers with aligned apertures providing the channels, the arrangement being such that each insulator layer is set back with respect to the preceding conductor layer in order to prevent charging of the insulator, and the conductor layers act as discrete dynodes.
- An alternative laminated construction is described in British pat. application No. 53371/71 in the form of a channel plate as herein defined wherein the matrix is formed as a laminated structure comprising alternate conductor layers and resistive separator layers with aligned apertures providing the channels.
- the insulating separator layers have been replaced by resistive separator layers, so that the laminated channel plate structure has alternate layers of conductor and resistor.
- the separator layer between two conductors is resistive, any charge accumulated thereon by the arrival of electrons will flow to the more positive adjacent conductor. Similarly, electrons will flow from the more negative adjacent conductor to replace any secondary electrons emitted from the resistive layer.
- each separator layer is a continuous layer which surrounds each of the apertures in the adjacent conductor layers.
- the present invention provides a channel plate comprising a laminated structure formed by perforate conductor layers having aligned apertures defining the channels and separated from each other by separator elements which are discontinuous in the sense that they do not completely surround the individual apertures of the conductor layers, and wherein the conductor layers constitute discrete secondary-emissive dynodes of the channel plate.
- Each separator element may, for example, be formed as a set of parallel lines of separator material having the same pitch as the channels (i.e. as the array of apertures in an adjacent conductor layer) and an example will be given with reference to FIGS. 3A3B.
- a set of separator lines may have a multiple of said pitch (e.g. as in FIGS. 4A-4B).
- a separator may be formed as two (e.g. as in FIG. 4C) or three (e.g. as in FIG. 4D) intersecting sets of parallel lines having a pitch which is a multiple of the channel pitch.
- islands of separator material may be used. Such islands may be dots provided in rows having the same pitch as the channels in both of two co-ordinate directions (e.g. as in FIGS. 5A5B) or a pitch which is a multiple thereof (e.g. as in FIG. 6).
- the thickness of the separators be less than the thickness of the conductor layers.
- the first and last conductor layers or plates can take the place of the input and output electrodes of a conventional continuous-dynode channel plate.
- the separators are resistive, it is possible to eliminate external resistor chain and other external means of setting the potentials of intermediate conductors, it being sufficient in some cases to apply an overall potential between the input and output dynodes or electrodes and to rely on the current flowing through the resistive elements to determine the potentials of the intermediate dynodes.
- the separators are of insulating material, each conductor layer or dynode must be supplied individually from the EI-IT source.
- the apertures of successive conductor layers have to be aligned with sufficient accuracy to form uninterrupted channels through the channel plate structure, but such alignment does not imply that the channels are necessarily straight and normal to the input and output faces of the channel plate.
- successive conductor layers may be deliberately displaced progressively with respect to each other so as to enable their apertures to form channels which are not straight and/or not normal to the channel plate faces.
- Discontinuous separators have two main advantages over continuous separators.
- the more restricted separator coverage means that the separators are less likely to be exposed to electron trajectories, hence in the insulating separator case charging is less of a problem.
- wider differences in expansion coefficient can be tolerated between the conductor and separator. Slight expansion differences can result in bending of the conductor-separator combination when separator coverage is continuous.(as in the prior arrangements) thus making subsequent assembly of a number of such combinations difficult.
- FIG. 1 is an enlarged fragmentary axial section, i.e. a section containing the axes of several adjacent channels,
- FIG. 2 is an elevation taken from the line IIII of FIG. 1,
- FIGS. 3A and 3B show two examples of separators formed as sets of parallel lines having the same pitch as the channel pitch
- FIGS. 4A, 4B, 4C and 4D show examples of separators formed as sets of parallel lines having a pitch greater than that of the channels
- FIGS. 5A, 5B and 6 show separators formed as arrays of islands in the form of dots
- FIGS. 7 and 8 show, in fragmentary axial section, ar-
- this construction can, for example, have relative dimensions dl-d3 and y (where 'y is the angle formed between the channel wall and the plate surface) as follows:
- the apertures of the metal plates are shown conical although this is not in any way essential and may be very difficult to achieve in practice. Equal or greater efficiencies can be obtained with curved pro files which depart from the conical form of FIG. 1 and have the added advantage of being easier to achieve with present technologies (the efficiency of a channel in the present context can be considered as the percentage of the secondary electrons of one conductor layer M which proceed to cause further secondaries in the next conductor layer).
- FIG. 3 shows two arrangements, each using a single array of parallel lines d of separator material deposited on a metal plate or sheet having apertures C which define the channels. Instead of being straight as shown, the separator lines d of FIG. 3A may be waved in accordance with the pattern of apertures C.
- FIG. 4 More economic patterns can be achieved by reducing the number of lines d so that not every channel has separator adjacent to it, the rigidity of the metal components being relied on to maintain accurate spacing.
- FIGS. 4A and 4B employing one set of lines, FIG. 4C two sets and FIG. 4D three sets. (The FIG. 4A arrangement is similar to that of FIGS. 1-2).
- FIG. 5 shows two patterns of dot separators in which there is one separator dot d per channel while FIG. 6 shows a pattern in which there is less than one dot per channel.
- the separator dots can be of substantially the same size as the apertures C
- the FIG. 5 arrangement can be obtained conveniently by using one perforate metal plate as a template for the deposition of the separator material on an identical metal plate.
- separator patterns may be used, these depending to some extent on separator and metal compositions and including such techniques as screen printing, electrophoresis, anodising and evaporation.
- One method of overcoming this is to use two types of separator, one for spacing and one for bonding plus support. These may for example be arranged as alternate lines in the arrangements of FIG. 3 or as alternate dots in the arrangements of FIG. 5.
- the spacing separator should be applied first and it may be glass having a high melting temperature or a PYROCE- RAM type material. These spacer elements may be machined to accurate thickness after application.
- the bonding separator elements can then be applied and plates subsequently joined by heating them to such a temperature that the bonding separator softens but the spacing separator does not.
- glasses of high lead (Pb) content may be used, in which case a resistive surface layer can be produced on the glass by heating the finished channel plate structure in hydrogen, so reducing PbO to Pb at the exposed glass surfaces.
- Pb lead
- Many enamel-type glasses have high Pb content and may be used in this manner.
- glasses described in US. Pat. No. 3,641,382 can be adopted.
- Vitreous carbon is made from various plastic-like materials which, when fired at high temperature, are converted to carbon.
- the resistivity is a bulk property (as opposed to the surface conduction property of lead glasses) and it can be controlled by the firing temperature (see B. Ler'smacher, H. Lydtin andW. F. Knippenberg Chemie. Ing. Techn. 42 Cipheral, adiol, adiol, kaolin, kaolin, etc.
- aluminium or aluminium alloy plates may beused with aluminium oxide separator elements formed thereon.
- FIG. 2 shows the cross-sections of the channels to be circular, this is not essential and may not be the preferable form.
- a substantially rectangular channel cross-section may be preferred in some applications and such a channel form can be achieved by manufacturing methods as described providing similar effects can be achieved by combining two oppositely tilted stacks of the FIG. 7 type into a single stack in which the channels follow a chevron patv tern.
- a tilted stack can be combined with an orthogonal one (as shown in FIG. 8) to provide channelswhich approximate some of the curved 'chan nel. forms. described in the Patent Specification just referred to. I (In FIGS. 7 8 the separator elements shown may be lines such as the lines d of FIG. 38 normal to the plane of the drawingor they may be arrays of dots'as in FIG.
- the secondary-emissive properties of some or all of the conductors can be enhanced by providing a coating of a more emissive material on the exposed surfaces of the conductors inside the channels. This may be done on all the conductors but it may be preferable to apply the coatings only on the first few conductors located on the input side of the channel plate.
- Channel plates according to the present invention can incorporate various features which have been described and claimed for continuous dynode channel plates.
- the laminated construction of thematrix permits successive conductor layers to be displaced with respect to each other as aforementioned so as to enable their apertures to form channels which depart from the conventional configuration of straight channels normal to the channel plate faces. This may be done to achieve various effects which have been described earlier in re lation to continuousdynode plates, and the following are specific examples:
- A. Progressively staggered conductor layers arranged to provide channels which are at an acute angle to the normal to the faces of the channel plate (this arrangement can e.g. prevent orthogonal electrons from passing through the channels and it can also prevent optical and ion feedback from a display screen to a photo-cathode on the input side of the plate).
- An example of such a construction is shown schematically in FIG. 7 where a stack of about 13-15 stages is staggered to tilt the channel axes Xc Xc at an angle a to the normal to the faces.
- the conductors which act as input and output electrodes are shown at M( 1) and M(n).
- photo-cathode in the form of photo-emissive surface areas on, or in contact with, the input electrode as described for example:
- Channel plates according to the present invention can be used in a variety ofimaging tubes, typical examples being image intensifiers and cathode-ray tubes.
- the invention has particular advantages in applications requiring large-area viewing screens, for example television display applications.
- channel plates according to the invention may replace those used in the colour display applications described in copending U.S. Pat. application Ser. No. 529,263, filed Dec. 4, 1974, which is a continuation of copending U.S. Pat. application Ser. No, 288,597, filed Sept. 13, 1972, now abandoned.
- the separator lines d of FIG. 3A may be waved in accordance with the pattern of apertures C.
- a channel plate comprising a laminated structure of perforate electrically conducting metal layers having aligned apertures defining channels, said metal layers being spaced from each other by a distance less than the thickness of said metal layers by uniformly distributed arrays of mutually spaced individual separator elements that do not surround or block individual apertures of said metal layers, the material of said separator elements being substantially less conductive than said metal layers, thereby allowing said metal layers to be maintained at successively higher electrical potentials in order to act as discrete secondary-emissive dynodes, said uniformly distributed arrays of mutually spaced individual separator elements accurately maintaining said metal layers in a parallel relationship even though the coefficients of thermal expansion of the material of said separator elements and said metal be different and a temperature change occurs.
Landscapes
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)
- Electron Tubes For Measurement (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB5996671A GB1402549A (en) | 1971-12-23 | 1971-12-23 | Electron multipliers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3914634A true US3914634A (en) | 1975-10-21 |
Family
ID=10484763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US317411A Expired - Lifetime US3914634A (en) | 1971-12-23 | 1972-12-21 | Channel plate acting as discrete secondary-emissive dynodes |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3914634A (OSRAM) |
| JP (1) | JPS5331594B2 (OSRAM) |
| DE (1) | DE2260864C2 (OSRAM) |
| FR (1) | FR2164790B1 (OSRAM) |
| GB (1) | GB1402549A (OSRAM) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4649314A (en) * | 1983-07-11 | 1987-03-10 | U.S. Philips Corporation | Electron multiplier element, electron multiplier device comprising said multiplying element, and the application to a photomultiplier tube |
| FR2608316A1 (fr) * | 1986-12-12 | 1988-06-17 | Radiotechnique Compelec | Multiplicateur d'electrons du type a feuilles, a pont diviseur integre |
| US4908545A (en) * | 1983-07-08 | 1990-03-13 | U.S. Philips Corporation | Cathode ray tube |
| US4950939A (en) * | 1988-09-15 | 1990-08-21 | Galileo Electro-Optics Corp. | Channel electron multipliers |
| US5083058A (en) * | 1989-06-19 | 1992-01-21 | Matsushita Electric Industrial Co., Ltd. | Flat panel display device |
| US5667655A (en) * | 1996-04-15 | 1997-09-16 | Zenith Electronics Corporation | Method of making color screens for FED and other cathodoluminscent displays |
| EP1276135A4 (en) * | 2000-04-03 | 2003-06-04 | Hamamatsu Photonics Kk | ELECTRONIC FORCING MACHINERY AND PHOTOVERMAKER |
| WO2005006387A3 (en) * | 2003-07-09 | 2005-05-12 | Council Cent Lab Res Councils | Method of fabricating an electron multiplier array |
| US20060291882A1 (en) * | 2003-07-09 | 2006-12-28 | Council For The Centeral Laboratory Of The Researc | Imaging machine using a large area electron multiplier |
| US20070007462A1 (en) * | 2003-04-01 | 2007-01-11 | Robert Stevens | Large area detectors and displays |
| US20160172173A1 (en) * | 2014-12-11 | 2016-06-16 | Thermo Finnigan Llc | Cascaded-Signal-Intensifier-Based Ion Imaging Detector for Mass Spectrometer |
| CN113539780A (zh) * | 2020-04-10 | 2021-10-22 | 群创光电股份有限公司 | 气体电子倍增器复合膜及包含其的气体电子倍增器和检测装置 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2023332B (en) * | 1978-06-14 | 1982-10-27 | Philips Electronic Associated | Electron multipliers |
| GB2023333B (en) * | 1978-06-14 | 1982-09-08 | Philips Electronic Associated | Electron multipliers |
| GB2048561B (en) * | 1979-04-02 | 1983-02-23 | Philips Electronic Associated | Method of forming a secondary emissive coating on a dynode |
| FR2888036B1 (fr) * | 2005-06-29 | 2007-10-05 | Photonis Sas Soc Par Actions S | Cassette pour tube phothomultiplicateur |
| JP5284635B2 (ja) * | 2007-12-21 | 2013-09-11 | 浜松ホトニクス株式会社 | 電子増倍管 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2872721A (en) * | 1956-04-12 | 1959-02-10 | Mcgee James Dwyer | Electron image multiplier apparatus |
| US3408532A (en) * | 1965-12-06 | 1968-10-29 | Northrop Corp | Electron beam scanning device |
| US3634712A (en) * | 1970-03-16 | 1972-01-11 | Itt | Channel-type electron multiplier for use with display device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3182221A (en) * | 1963-07-22 | 1965-05-04 | Jr Edmund W Poor | Secondary emission multiplier structure |
| GB1090406A (en) * | 1963-08-19 | 1967-11-08 | Mullard Ltd | Improvements in or relating to image intensifiers and the like |
| GB1072276A (en) * | 1965-06-22 | 1967-06-14 | William H Johnston Lab Inc | Improvements in and relating to electron multipliers |
| GB1154515A (en) * | 1967-05-15 | 1969-06-11 | Mullard Ltd | Improvements in or relating to Image Intensifiers |
| GB1175599A (en) * | 1967-11-28 | 1969-12-23 | Mullard Ltd | Improvements in or relating to Image Intensifiers and the like |
-
1971
- 1971-12-23 GB GB5996671A patent/GB1402549A/en not_active Expired
-
1972
- 1972-12-13 DE DE2260864A patent/DE2260864C2/de not_active Expired
- 1972-12-20 JP JP12732372A patent/JPS5331594B2/ja not_active Expired
- 1972-12-21 FR FR7245632A patent/FR2164790B1/fr not_active Expired
- 1972-12-21 US US317411A patent/US3914634A/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2872721A (en) * | 1956-04-12 | 1959-02-10 | Mcgee James Dwyer | Electron image multiplier apparatus |
| US3408532A (en) * | 1965-12-06 | 1968-10-29 | Northrop Corp | Electron beam scanning device |
| US3634712A (en) * | 1970-03-16 | 1972-01-11 | Itt | Channel-type electron multiplier for use with display device |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4908545A (en) * | 1983-07-08 | 1990-03-13 | U.S. Philips Corporation | Cathode ray tube |
| US4649314A (en) * | 1983-07-11 | 1987-03-10 | U.S. Philips Corporation | Electron multiplier element, electron multiplier device comprising said multiplying element, and the application to a photomultiplier tube |
| FR2608316A1 (fr) * | 1986-12-12 | 1988-06-17 | Radiotechnique Compelec | Multiplicateur d'electrons du type a feuilles, a pont diviseur integre |
| US4950939A (en) * | 1988-09-15 | 1990-08-21 | Galileo Electro-Optics Corp. | Channel electron multipliers |
| US5083058A (en) * | 1989-06-19 | 1992-01-21 | Matsushita Electric Industrial Co., Ltd. | Flat panel display device |
| US5667655A (en) * | 1996-04-15 | 1997-09-16 | Zenith Electronics Corporation | Method of making color screens for FED and other cathodoluminscent displays |
| US20050110379A1 (en) * | 2000-04-03 | 2005-05-26 | Hamamatsu Photonicks K.K. | Electron-multiplier and photo-multiplier having dynodes with partitioning parts |
| US6998778B2 (en) | 2000-04-03 | 2006-02-14 | Hamamatsu Photonics, K.K. | Electron-multiplier and photo-multiplier having dynodes with partitioning parts |
| US6841935B2 (en) | 2000-04-03 | 2005-01-11 | Hamamatsu Photonics, K. K. | Electron-multiplier and photo-multiplier having dynodes with partitioning parts |
| EP1560254A3 (en) * | 2000-04-03 | 2008-10-01 | Hamamatsu Photonics K. K. | Electron multiplier and photomultiplier |
| EP1276135A4 (en) * | 2000-04-03 | 2003-06-04 | Hamamatsu Photonics Kk | ELECTRONIC FORCING MACHINERY AND PHOTOVERMAKER |
| EP1560254A2 (en) | 2000-04-03 | 2005-08-03 | Hamamatsu Photonics K. K. | Electron multiplier and photomultiplier |
| US20060028134A1 (en) * | 2000-04-03 | 2006-02-09 | Hamamatsu Photonics K.K. | Electron-multiplier and photo-multiplier having dynodes with partitioning parts |
| US20030102802A1 (en) * | 2000-04-03 | 2003-06-05 | Hiroyuki Kyushima | Electron multiplier and photomultiplier |
| US7042155B2 (en) | 2000-04-03 | 2006-05-09 | Hamamatsu Photonics K.K. | Electron-multiplier and photo-multiplier having dynodes with partitioning parts |
| US20070007462A1 (en) * | 2003-04-01 | 2007-01-11 | Robert Stevens | Large area detectors and displays |
| US20060291882A1 (en) * | 2003-07-09 | 2006-12-28 | Council For The Centeral Laboratory Of The Researc | Imaging machine using a large area electron multiplier |
| WO2005006387A3 (en) * | 2003-07-09 | 2005-05-12 | Council Cent Lab Res Councils | Method of fabricating an electron multiplier array |
| US20160172173A1 (en) * | 2014-12-11 | 2016-06-16 | Thermo Finnigan Llc | Cascaded-Signal-Intensifier-Based Ion Imaging Detector for Mass Spectrometer |
| US9524855B2 (en) * | 2014-12-11 | 2016-12-20 | Thermo Finnigan Llc | Cascaded-signal-intensifier-based ion imaging detector for mass spectrometer |
| CN113539780A (zh) * | 2020-04-10 | 2021-10-22 | 群创光电股份有限公司 | 气体电子倍增器复合膜及包含其的气体电子倍增器和检测装置 |
| CN113539780B (zh) * | 2020-04-10 | 2024-11-12 | 群创光电股份有限公司 | 气体电子倍增器复合膜及包含其的气体电子倍增器和检测装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5331594B2 (OSRAM) | 1978-09-04 |
| FR2164790A1 (OSRAM) | 1973-08-03 |
| GB1402549A (en) | 1975-08-13 |
| DE2260864C2 (de) | 1983-05-05 |
| DE2260864A1 (de) | 1973-06-28 |
| FR2164790B1 (OSRAM) | 1977-12-30 |
| JPS4874167A (OSRAM) | 1973-10-05 |
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