US3883335A - Method of forming microchannel plates having curved microchannels - Google Patents

Method of forming microchannel plates having curved microchannels Download PDF

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Publication number
US3883335A
US3883335A US361287A US36128773A US3883335A US 3883335 A US3883335 A US 3883335A US 361287 A US361287 A US 361287A US 36128773 A US36128773 A US 36128773A US 3883335 A US3883335 A US 3883335A
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United States
Prior art keywords
microchannels
layer
microchannel
jigs
ribs
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Expired - Lifetime
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US361287A
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English (en)
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Remy Henri Francois Polaert
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US Philips Corp
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US Philips Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J43/00—Secondary-emission tubes; Electron-multiplier tubes
    • H01J43/04—Electron multipliers
    • H01J43/06—Electrode arrangements
    • H01J43/18—Electrode arrangements using essentially more than one dynode
    • H01J43/24—Dynodes having potential gradient along their surfaces
    • H01J43/246—Microchannel plates [MCP]
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00—Re-forming shaped glass
    • C03B23/02—Re-forming glass sheets
    • C03B23/023—Re-forming glass sheets by bending
    • C03B23/03—Re-forming glass sheets by bending by press-bending between shaping moulds
    • C03B23/0302—Re-forming glass sheets by bending by press-bending between shaping moulds between opposing full-face shaping moulds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00—Re-forming shaped glass
    • C03B23/20—Uniting glass pieces by fusing without substantial reshaping
    • C03B23/203—Uniting glass sheets

Definitions

  • a profiled microchannel plate is obtained from a bun- [52] Us Cl 65/4, H05, 65/44 dle which is formed from monolayers of microchan- [5 I] (303C1 23/20 nels. These channels are adjacently arranged and have [58] Fieid 17 25 '8 the same curvature which is obtained by the profiling 29/592. 5. 6 6 of each monolayer.
  • the microchannel plate is ob- 36 I 1 I tained by cutting such a channel bundle into segments along mutually parallel planes which. however, are not [56] References Cited parallel to the longitudinal direction of the channels.
  • the invention relates to a secondary emissive electrode for electron tubes, and to a method of manufacturing such an electrode.
  • This electrode comprises microchannels, extending between an entrance face and an exit face, on the inner surfaces of which secondary electron emission occurs with an emission coefficient which is larger than 1 as a result of the application of a potential difference between said faces.
  • the invention relates in particular to electrodes having curved channels. The curvature of the channels reduces, on the one hand, the parasitic electron emission and radiation which is due to the known ion feedback phenomenon and, on the other hand, the transmission of stray light through the microchannels.
  • Electr des comprising curved microchannels are described inter alia in US. Pat. No. 3,461,332.
  • This patent specification describes an electrode of the kind set forth, but it does not describe a method of realizing the curvature of the microchannels.
  • This patent teaches many different constructions for the fibers. For example, at col. 4, lines 25-32, fibers are described having a core of one kind of glass and a coating of another kind of glass. These fibers are then fused together by heating and the glass cores subsequently etched out without attacking the glass coating.
  • the desired curved channel plate is subsequently cut from the part of the fibre bundle thus distorted.
  • One of the drawbacks of such a method is that a comparatively large quantity of material in the form of a fiber bundle is required, a substantial part of which is lost after bending and cutting.
  • Another drawback of the said method is that the curvature of the channels in the plate thus obtained is not the same everywhere; this is due to the fact that the distortion at the centre of the bundle is not the same as that on its circumference.
  • the operations are performed on a preformed microchannel plate.
  • the quantity of material lost is thus substantially reduced.
  • the channel plate is subjected to a mechanical stress which engages at an angle with respect to the end faces of the plate.
  • the planes which are parallel to the said end faces are isothermal, whilst, at least in a part of the plate, measured along the normal to the end faces of the plate, the temperature varies and therewith the glass on this traject may vary between the plastic phase and the elastic phase.
  • This method requires the manufacture of a special holder in order to apply the said mechanical stress.
  • This holder consists, for example, of a die which is composed of two parts,
  • a difficulty in said method is how to obtain the same curvature for all micro-channels of the plate.
  • the method requires a geometry of the edges of the die such as to prevent barrel-like distortion of the plate due to the bending of the microchannels situated on the periphery under the influence of the mechanical stress.
  • the means used to apply the mechanical stress can also be formed by two end pieces, each of which is fused to one of the end faces of the plate.
  • a difficulty in this respect is that the mechanical and thermal properties of the material used for these end pieces must be adapted to the conditions in which the fibre material exists when the mechanical stress is applied.
  • the uniformity of the curvature can be obtained in a more reliable and simpler manner as a result of the fact that this curvature is uniformly imparted to a series of sub-elements which are subsequently assembled in a compact form so as to obtain a channel bundle of large cross-section from which the microchannel plates are cut.
  • the method is particularly suitable for microchannels having a square or a rectangular cross-section. These channels are adjacently arranged without clearance there between.
  • the curvature of the channels is obtained by subsequently applying a shearing force in a direction transverse to the longitudinal direction of the channels.
  • a secondary electron emissive electrode of the microchannel plate type is composed of a stack of microchannel layers, the curvature in the axial direction of adjacently arranged channels being the same, and extending in the same direction.
  • the invention also relates to a method of manufacturing such an electrode.
  • straight microchannels of the same cross-section are adjacently arranged in order to form a layer, this layer being subsequently arranged between two clamping jigs, each jig having a ribbed profile which can engage in that of the other jig, the ribs being directed perpendicular to the axes of the microchannels, the layer being distorted under the influence of a force which is exerted on said jigs in a direction transverse to the microchannel layer, whilst the layers which are thus profiled are subsequently stacked to form a compact unit by thermal treatment, after which curved microchannel plates are cut from the stack thus obtained along planes which are not parallel to the longitudinal axes of the microchannels.
  • the method according to the invention is suitable for microchannels having inter alia circular, square, rectangular or polygonal cross-section, a maximum fill rate of the microchannels of the plate being attainable, for example, in the case of a rectangular, triangular or hexagonal cross-section.
  • a preferred embodiment of the method according to the invention is adapted to bulk manufacture. A plural- 3 ity of microchannel layers are then simultaneously profiled.
  • FIG. 1 shows a layer of adjacently arranged micro channels (monolayer).
  • FIG. 2 shows a preferred embodiment of a clamping jig to be used for clamping the monolayer during profilmg.
  • FIG. 3 is a side elevation of a device for the profiling of such a layer.
  • FIG. 4 shows a plurality of stacked and profiled monolayers.
  • FIG. 5 shows a diagram of a method of simultaneously profiling a plurality of such microchannel monolayers.
  • microchannels having a square cross-section For the sake of clarity, the figures show only microchannels having a square cross-section. However, the invention obviously also relates to microchannels having an arbitrary other cross-section.
  • FIG. I denotes a surface on which identical microchannels I], having a cross-section 12, the specific structure of which is not shown because the specific structure is not relevant to the present inven tion, are adjacently arranged so as to form a monolayer I.
  • Each microchannel II can also be replaced by a small number of microchannels which are combined to form a compact bundle which also has a square crosssection.
  • FIG. 2 shows a clamping jig 20, for example, made of stainless steel.
  • One of the surfaces of this clamping jig is provided with a succession of parallel ribs and recesses which are alternately arranged in two parallel planes.
  • the ribs 21, 23 and 25 are situated, for example, in one common plane, whilst the recesses 22, 24 and 26 are situated in a different common plane.
  • the ribs and recesses are separated by inclined surfaces, for example, the surface 27, the angle between each surface 27 and the normal to the said ribs and recesses being the same.
  • the surfaces of the clamping jigs which are provided with the said profile are arranged opposite to each other, as is shown in FIG. 3.
  • a layer of microchannels is arranged between said clamping jibs as is shown in FIG. 1.
  • a force C directed transverse to the outer surfaces 32 and 33 ofthe clamping jigs 30 and 31, a given distortion is imparted to the monolayer l.
  • the compression is preferably performed under the following circumstances:
  • the temperature of the monolayer I is raised to a value such that its material (glass) assumes a phase between the plastic phase and the elastic phase;
  • the clamping jigs are made of a material which does not readily oxidize during the treatment, for example, stainless steel covered with a layer of tungsten carbide. As a result, the material of the channels does not adhere to the clamping jigs;
  • the compression is effected under vacuum or in a reducing atmosphere in order to minimize the risk of oxidation of the metal during the treatment;
  • the said heating means are preferably formed by 5 the clamping jigs themselves which can be pro vided with electrical heating elements for this purpose.
  • the temperature at which the said treatment takes place is, for example, approximately 500 C.
  • the profiling can be combined with the fusing of the glass fibres of the monolayer.
  • one of the edges of the microchannel layer for example, the edge 33 is arranged to be flush with a side face of the jigs against a flat abutment 34, which is connected to the clamping jig 31 at the points 35, 36 and 37 as shown in FIG. 3.
  • the force C is directed at an angle which is not 90 with respect to the plane of the monolayer, the force will have a component in the plane of the monolayer such that the elements of the monolayer are pressed against the abutment 34.
  • curved microchannel plates are obtained by cutting pieces from this stack, preferably in a direction transverse to the longitudinal direction of the microchannels, for example, along the lines 40 and 50 shown in FIG. 4.
  • a preferred method according to the invention enables bulk manufacture of curved microchannel plates by the simultaneous profiling of a plurality of monolayers.
  • a stack of alternately a monolayer 1 and a separating element 51 is arranged between the clampingjigs 30 and 31.
  • the separating element 51 is made, for example, of stainless steel covered with a layer of tungsten carbide so as to prevent adhesion of the glass. This assembly is subjected to compression between the said clamping jigs.
  • Each of the main surfaces of the separating element 51 has the same profile as the clamping jig which it faces. A number of monolayers is thus profiled simultaneously.
  • clamping jigs which are each provided on a main surface with a succession of alternating ribs and recesses. It is obvious that the invention also relates to the case where one of the main surfaces of each clamping jig has an arbitrary other profile, the profile of a first clamping jig engaging in the profile of a second clamping jig.
  • the profile of the separating elements to be arranged between the monolayers can be adapted to the relevant profile of the clamping jigs.
  • a method of forming microchannel plates having curved microchannels extending between major faces thereof, for use in making secondary emissive electrodes comprising the steps of:
  • microchannels are between their plastic phase and their elastic phase at an elevated temperature and said microchannels are brought to said elevated temperature by suitably heating at least one of said jigs.
  • step of bonding said microchannels of said layer together is performed by pressure bonding said microchannels of said layer together simultaneously with the shaping thereof in the pressing step.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electron Tubes For Measurement (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
US361287A 1972-05-19 1973-05-17 Method of forming microchannel plates having curved microchannels Expired - Lifetime US3883335A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7218043A FR2184516B1 (enrdf_load_stackoverflow) 1972-05-19 1972-05-19

Publications (1)

Publication Number Publication Date
US3883335A true US3883335A (en) 1975-05-13

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US (1) US3883335A (enrdf_load_stackoverflow)
JP (1) JPS4943560A (enrdf_load_stackoverflow)
DE (1) DE2325245C3 (enrdf_load_stackoverflow)
FR (1) FR2184516B1 (enrdf_load_stackoverflow)
GB (1) GB1423543A (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019886A (en) * 1975-12-12 1977-04-26 International Business Machines Corporation Method of manufacture of multiple glass nozzle arrays
US5093177A (en) * 1989-12-15 1992-03-03 Ppg Industries, Inc. Shaping glass sheets
US6379777B1 (en) * 1997-12-24 2002-04-30 Ngk Insulators, Ltd. Die and production method thereof, glass substrate and production method thereof and method of forming pattern on the glass substrate
US7000434B2 (en) * 2000-12-19 2006-02-21 Intel Corporation Method of creating an angled waveguide using lithographic techniques
US20070194713A1 (en) * 2004-02-17 2007-08-23 Hiroyuki Kyushima Photomultiplier and its manufacturing method
US7290407B1 (en) * 2001-12-19 2007-11-06 Jesse Chienhua Shan Triangle-shaped planar optical waveguide having reduced scattering loss
US20090127995A1 (en) * 2007-11-16 2009-05-21 Itt Manufacturing Enterprises, Inc. Curved mcp channels
JP2016162640A (ja) * 2015-03-03 2016-09-05 浜松ホトニクス株式会社 電子増倍体の製造方法、光電子増倍管、及び光電子増倍器
CN112255666A (zh) * 2020-10-23 2021-01-22 中国工程物理研究院激光聚变研究中心 中子灵敏微通道板
US20210387891A1 (en) * 2020-06-15 2021-12-16 Samsung Display Co., Ltd. Window molding apparatus and window molding method using the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
UST920001I4 (en) * 1972-06-15 1974-03-05 Cooper method and apparatus for removing iodine from a nuclear reactor coolant
US4444460A (en) * 1981-05-26 1984-04-24 Gould Inc. Optical fiber apparatus including subtstrate ruggedized optical fibers

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3244922A (en) * 1962-11-05 1966-04-05 Itt Electron multiplier having undulated passage with semiconductive secondary emissive coating
US3331670A (en) * 1963-09-09 1967-07-18 American Optical Corp Method of making multichannelled electron multiplier component
US3461332A (en) * 1965-11-26 1969-08-12 Edward E Sheldon Vacuum tubes with a curved electron image intensifying device
US3558377A (en) * 1967-11-09 1971-01-26 Zenith Radio Corp Process of manufacturing a channel-multiplier plate
US3594457A (en) * 1967-06-12 1971-07-20 Polaroid Corp Method of press forming birefringent transparent polyethylene terephthalate sheets
US3669639A (en) * 1968-10-23 1972-06-13 Nippon Sheet Glass Co Ltd Method for production of fused energy-conducting structure
US3761234A (en) * 1968-01-02 1973-09-25 American Optical Corp Method of making fiber optical multifibers and devices formed thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5334711B2 (enrdf_load_stackoverflow) * 1971-09-16 1978-09-21

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3244922A (en) * 1962-11-05 1966-04-05 Itt Electron multiplier having undulated passage with semiconductive secondary emissive coating
US3331670A (en) * 1963-09-09 1967-07-18 American Optical Corp Method of making multichannelled electron multiplier component
US3461332A (en) * 1965-11-26 1969-08-12 Edward E Sheldon Vacuum tubes with a curved electron image intensifying device
US3594457A (en) * 1967-06-12 1971-07-20 Polaroid Corp Method of press forming birefringent transparent polyethylene terephthalate sheets
US3558377A (en) * 1967-11-09 1971-01-26 Zenith Radio Corp Process of manufacturing a channel-multiplier plate
US3761234A (en) * 1968-01-02 1973-09-25 American Optical Corp Method of making fiber optical multifibers and devices formed thereof
US3669639A (en) * 1968-10-23 1972-06-13 Nippon Sheet Glass Co Ltd Method for production of fused energy-conducting structure

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019886A (en) * 1975-12-12 1977-04-26 International Business Machines Corporation Method of manufacture of multiple glass nozzle arrays
US5093177A (en) * 1989-12-15 1992-03-03 Ppg Industries, Inc. Shaping glass sheets
US6379777B1 (en) * 1997-12-24 2002-04-30 Ngk Insulators, Ltd. Die and production method thereof, glass substrate and production method thereof and method of forming pattern on the glass substrate
US7000434B2 (en) * 2000-12-19 2006-02-21 Intel Corporation Method of creating an angled waveguide using lithographic techniques
US7290407B1 (en) * 2001-12-19 2007-11-06 Jesse Chienhua Shan Triangle-shaped planar optical waveguide having reduced scattering loss
US8242694B2 (en) 2004-02-17 2012-08-14 Hamamatsu Photonics K.K. Photomultiplier and its manufacturing method
US9147559B2 (en) 2004-02-17 2015-09-29 Hamamatsu Photonics K.K. Photomultiplier and its manufacturing method
EP1717842A4 (en) * 2004-02-17 2008-06-18 Hamamatsu Photonics Kk PHOTOMULTIPLIER
US9460899B2 (en) 2004-02-17 2016-10-04 Hamamatsu Photonics K.K. Photomultiplier and its manufacturing method
US7602122B2 (en) 2004-02-17 2009-10-13 Hamamatsu Photonics K.K. Photomultiplier
US20080018246A1 (en) * 2004-02-17 2008-01-24 Hamamatsu Photonics K.K. Photomultiplier
US7977878B2 (en) 2004-02-17 2011-07-12 Hamamatsu Photonics K.K. Photomultiplier and its manufacturing method
US8643258B2 (en) 2004-02-17 2014-02-04 Hamamatsu Photonics K.K. Photomultiplier and its manufacturing method
US20110221336A1 (en) * 2004-02-17 2011-09-15 Hamamatsu Photonics K.K. Photomultiplier and its manufacturing method
US20070194713A1 (en) * 2004-02-17 2007-08-23 Hiroyuki Kyushima Photomultiplier and its manufacturing method
US20090127995A1 (en) * 2007-11-16 2009-05-21 Itt Manufacturing Enterprises, Inc. Curved mcp channels
EP2063451A3 (en) * 2007-11-16 2011-01-26 ITT Manufacturing Enterprises, Inc. Curved MPC channels
US7994693B2 (en) 2007-11-16 2011-08-09 Itt Manufacturing Enterprises, Inc. Curved MCP channels
US9892892B2 (en) * 2015-03-03 2018-02-13 Hamamatsu Photonics K.K. Method of manufacturing electron multiplier body, photomultiplier tube, and photomultiplier
CN105938787A (zh) * 2015-03-03 2016-09-14 浜松光子学株式会社 电子倍增体的制造方法、光电倍增管和光电倍增器
US20160260592A1 (en) * 2015-03-03 2016-09-08 Hamamatsu Photonics K.K. Method of manufacturing electron multiplier body, photomultiplier tube, and photomultiplier
JP2016162640A (ja) * 2015-03-03 2016-09-05 浜松ホトニクス株式会社 電子増倍体の製造方法、光電子増倍管、及び光電子増倍器
US10037871B2 (en) 2015-03-03 2018-07-31 Hamamatsu Photonics K.K. Method of manufacturing electron multiplier body, photomultiplier tube, and photomultiplier
CN105938787B (zh) * 2015-03-03 2019-06-25 浜松光子学株式会社 电子倍增体的制造方法、光电倍增管和光电倍增器
US20210387891A1 (en) * 2020-06-15 2021-12-16 Samsung Display Co., Ltd. Window molding apparatus and window molding method using the same
US12330978B2 (en) * 2020-06-15 2025-06-17 Samsung Display Co., Ltd. Window molding apparatus and window molding method using the same
CN112255666A (zh) * 2020-10-23 2021-01-22 中国工程物理研究院激光聚变研究中心 中子灵敏微通道板
CN112255666B (zh) * 2020-10-23 2022-11-18 中国工程物理研究院激光聚变研究中心 中子灵敏微通道板

Also Published As

Publication number Publication date
GB1423543A (en) 1976-02-04
FR2184516A1 (enrdf_load_stackoverflow) 1973-12-28
DE2325245C3 (de) 1978-11-16
JPS4943560A (enrdf_load_stackoverflow) 1974-04-24
DE2325245A1 (de) 1973-11-29
FR2184516B1 (enrdf_load_stackoverflow) 1978-09-01
DE2325245B2 (de) 1978-03-09

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