US3870460A - Single or multi-track fluid bearing heating apparatus and method - Google Patents
Single or multi-track fluid bearing heating apparatus and method Download PDFInfo
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- US3870460A US3870460A US457432A US45743274A US3870460A US 3870460 A US3870460 A US 3870460A US 457432 A US457432 A US 457432A US 45743274 A US45743274 A US 45743274A US 3870460 A US3870460 A US 3870460A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
- H01L21/6779—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/52—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for wires; for strips ; for rods of unlimited length
- C21D9/54—Furnaces for treating strips or wire
- C21D9/56—Continuous furnaces for strip or wire
- C21D9/63—Continuous furnaces for strip or wire the strip being supported by a cushion of gas
Definitions
- F27b 9/14 positive drive belt and a pair of fluid bearing track [58] Field of Search 432/11, 124, 235; 302/2 R, structures for supporting the articles and moving the 302/30, 31 same in conjunction with the belt, preferably while the articles are rotated during movement past the heat [56] References Cited source to insure uniform article heating.
- the apparatus comprises a plural- 2,605,091 7/1952 Socke 432 11 itY of Parallel tracks each by a and fluid M63134 12/1964 Stanford I I I I H 432/1] bearing track structure synchronously actuated for 1184224, 5/1965 Shelley g 3 1 moving a plurality of parallel streams of wafers simul- 3 627183 12/1971 Hittner v 432/11 taneously past the heating station.
- This invention relates to the field of transporting articles. More particularly, this invention relates to the field of moving articles between predetermined stations and past a heating station at which the temperature of thearticles being transported is uniformly elevated for previously known treating purposes.
- this invention relates to the field of handling and transporting fragile articles, such as silicon and like wafers commonly utilized in the electronics industry in the manufacture of semiconductor devices, and for uniformly heating such wafers during manufacturing procedures thereon utilized to convert such wafers into semiconductor devices.
- this invention relates to the field of wafer transportation means which utilizes a track defined by a combined fluid bearing positive drive pacing belt structure, and the method for transporting wafers between predetermined stations during the manufacture of semiconductor devices from such wafers.
- Fluid bearing track structures of various types have been generally known heretofore and the following patents disclose devices and structures which are exemplary thereof: Hazel U.S. Pat. No. 2,778,691 dated Jan. 22, 1957', Cole U.S. Pat. No. 3,l03,388 dated Sept. 10, 1963', Coville U.S. Pat. No. 3,318,640 dated May 9, 1967; Lasch, Jr. et al. U.S. Pat. No. 3,645,581 dated Feb. 29, 1972; and Lasch, Jr. U.S. Pat. No. 3,7l8,37l dated Feb. 27, 1973.
- Lasch, Jr. application Ser. No. 203,086 illustrates and describes a fluid bearing utilized in conjunction with a heating mechanism, and other prior art cited thereagainst relates generally to fluid bearings for transporting articles, both in ambient and heated atmospheres.
- the present invention relates to an improved single or multi-track heating apparatus and method. More particularly, this invention relates to an improved apparatus and method for supporting a single stream or plural streams or articles on a fluid base, and spacing individual articles from each other while the same are paced by a positive drive pacing belt engaged with successive articles in each of such single or plural streams.
- a multistream apparatus is disclosed in which a plurality of parallel streams of articles are transported in synchronization to and past a treating station between in-feed and out-feed stations of the apparatus.
- this invention relates to a combined fluid bearing track structure positive drive belt structure by means of which flat fragile wafers are transported to and past a heating station in a generally straight line path without requiring manual contact.
- this invention relates to an improved heating apparatus and method by means of which streams of wafers utilized in the manufacture of semiconductor devices are carried at predetermined paced rates to and past a heating unit; in conjunction with such movement, each of the wafers preferably is continuously rotated as the same is exposed to the ele vated temperature of the heating element so that uniform heating of each wafer is insured.
- objects of this invention include: the provision of an improved apparatus and method for transporting articles. such as fragile semiconductor wafers, between prede' termined stations; the provision of a combined handling track defined by an improved fluid bearing track structure positive drive pacing belt structure in combination for moving articles between predetermined stations; the provision of an improved apparatus and method for heating articles while positively transporting the same relative to a heating source; the provision in an improved heating apparatus and method of means for continuously rotating the articles being subjected to heat during movement past the heating element to insure uniform heating of each article; the provision in a fluid bearing apparatus of fluid bearing track structures having supporting fluid emanating in opposite directions from adjacent track structures to effect rotation of articles supported thereby; and the provision of improved procedures for handling and transporting articles relative to a heating station utilizing combined fluid bearing and positive drive techniques.
- FIG. 1 is a plan view of a multi-track apparatus of this invention.
- FIG. 2 is a vertical sectional view through the apparatus taken inthe plane of line 2-2 of FIG. 1.
- FIG. 3 is a vertical sectional view, on an enlarged scale, taken in the plane of line 33 of FIG. 2.
- FIGS. 4A and 4B are horizontal sectional views (comprising continuations of each other) taken in the plane of line 4-4 of FIG. 3.
- FIG. 5 is a vertical sectional view taken in the plane ofline 5-5 of FIG. 3 illustrating details of construction of the positive drive belt utilized in the subject apparatus.
- FIG. 6 is a vertical sectional view through one track of the apparatus taken in the plane of line 66 of FIG. 4A.
- FIGS. 7 and 8 are vertical sectional views through a track taken in the planes of lines 77 and 8-8, respectively, of FIG. 6.
- FIG. 9 is a diagrammatic view of the pneumatic system utilized in conjunction with the illustrated embodiment of the multi'track apparatus disclosed herein.
- the subject apparatus utilizes conveyor track means which combines a linear fluid bearing with a positive drive pacing conveyor belt which controls the speed and movement of articlesbeing supported by and transported on the fluid bearing to and pasta station, such as the heating station of the illustrated apparatus.
- conveyor track means which combines a linear fluid bearing with a positive drive pacing conveyor belt which controls the speed and movement of articlesbeing supported by and transported on the fluid bearing to and pasta station, such as the heating station of the illustrated apparatus.
- the total heat treating time of the articles may be precisely controlled.
- the articles being transported are continuously rotated during exposure to the heat source to insure uniform heating thereof in a procedure heretofore unknown.
- the fluid utilized to support wafers during movement through subject apparatus may vary, depending upon the nature of the water treatment effected therein.
- nitrogen preferably is utilized as the article levitating and transporting fluid.
- the preferred embodiment of the illustrated apparatus is generally designated 1 as seen in FIG. 1 and comprises three principal sections or stations, namely, an infeed end or station 2, a central or heat treating station 3, and an outfeed end or discharge station 4. It is between the infeed station 2 and the outfeed station 4 that wafers W are transported past the heating station 3 at a predetermined rate as will be described.
- the illustrated apparatus may be self contained, as illustrated in the attached drawings, in which a plurality wafers are inserted in carriers at the infeed station 2 and are removed in groups in carriers at the outfeed station 4 upon completion of the heat treating step thereon.
- the subject apparatus also is adaptable to be interfaced directly with other apparatus utilized in the manufacture of semiconductor devices so that wafers may be fed sequentially directly to the infeed station from another apparatus and/or directly from the outfeed station 4 into another apparatus without intermediate storage or handling in groups in wafer carriers.
- the subject apparatus is illustrated as being self contained as described.
- the illustrated apparatus is multi-track in construction and is defined by a plurality of discrete parallel tracks, four in number in the illustrated embodiment, designated 6, 7, 8 and 9 respectively.
- the plural tracks are operated synchronously to move parallel streams of aligned correspondingly spaced wafers W to and past the heating station 3 between the infeed and outfeed stations 2 and 4.
- the infeed station 2 is defined by a plurality of wafer feeding mechanisms, designated 11, 12, 13 and 14 respectively, from which individual wafers W are discharged in sequence onto associated tracks commencing at such feed mechanisms.
- the feed mechanisms to be described could be eliminated and wafers could be sequentially positioned on the respective tracks directly from other semiconductor manufacturing apparatus.
- the respective feed mechanisms are utilized which include carriers or feed magazines [6, 17, 18 and 19 respectively. Each magazine is supported for downward sequential indexing so that the lowermost wafer in each magazine may be sequentially removed therefrom and placed on an associated track as required in the treating procedure.
- wafer receiving mechanisms designated 21, 22, 23 and 24 respectively, are provided for receiving wafers W discharged thereto from the associated tracks.
- wafer receiving carriers or magazines 26, 27, 28 and 29 are supported by the respective receiving mechanisms for indexing sequentially upwardly upon receipt of individual wafers sequentially therein.
- the four tracks of the illustrated apparatus are intended for synchronous operation pursuant to which full magazines each containing a predetermined number of wafers therein, such as twenty-five, are positioned on the respective feed mechanisms.
- the feed magazines are sequentially emptied by placing wafers onto the associated tracks; the wafers are then moved past the heating station synchronously, and are sequentially inserted into the receiving magazines at the discharge station.
- full magazines are substituted therefor; when the receiving magazines are filled. empty magazines are substituted therefor.
- feed mechanism 11 and its associated feed magazine 16, and discharge mechanism 21 and itsassoeiated receiving magazine 26, are supported for opposite indexing downwardlly and upwardly respectively in conjunction with feeding and receiving of wafers in sequence onto and from track 6 during transportation thereof between the predetermined stations 2 and 4 mentioned previously.
- indexing means utilized for sequentially and automatically indexing magazines 16 and 26 downwardly and upwardly have not been disclosed herein in detail because such indexing means have been known in the art heretofore, as illustrated, for example, in Lasch, Jr. et al. U.S. Pat. No. 3,645,581 and in Lasch, Jr. et al. application Ser. No. 404,287 filed Oct. 9, 1973.
- a lower supporting framework generally designated 31, which includes a plurality of depending legs 32 of desired length.
- Framework 31 includes a plurality of frame members 33 joined by welding or the like with each other and with the supporting legs 32 to provide a horizontal generally rectangular base for the operative components of the apparatus, collectively designated 34.
- the respective tracks 6, 7, 8 and 9 extend longitudinally of base 34 and are supported thereby.
- a plurality of horizontal frame members 36 upon which the tracks are directly supported and between which the actuating mechanism for the belts are positioned.
- Additional frame members extend upwardly from base 34 and are secured thereto by welding or the like, as also seen in FIGS. 2 and 3.
- Such upright frame members are designated 37 and are joined by welding or the like to additional horizontal frame members 38 positioned at vertically spaced locations as seen in FIG. 2 above the base 34.
- the upright frame members and horizontal frame members 37 and 38 provide mounting means for the wafer heating unit 41 to be described.
- Such horizontal and upright frame members also provide means for supporting an insulating enclosure for the heating unit, which surrounds the same substantially completely on all sides, and is designated 42 generally. Opposite longitudinal sides of the enclosures are designated 43, the top thereof is designated 44, and opposite ends are designated 46.
- the insulating enclosure 42 is supported by the upright and vertical frame members 37 and 38 so that limited clearance is provided above the respective tracks to permit wafers to pass over the tracks through narrow slots provided in the opposite end walls 46 thereof.
- Any suitable form of insulation may be utilized so long as the same is capable of withstanding and effectively retaining heat within enclosure 42 at the level generated by heater 41.
- the heating unit 41 preferably is vertically adjustably supported by a plurality of supporting rods 47 depending from and supported by the upper framework described previously.
- a series of aperturcd plates 48 are secured to outer margins of the heating unit 41 with the supporting rods 47 passing therethrough.
- the supporting rods are threaded so that adjusting nuts 49 may be threaded to predetermined positions to locate the heating unit a predetermined distance above the tracks passing therebeneath to satisfy predetermined temperature requirements.
- any commercially available form of heating unit 41 may be utilized in the subject apparatus, depending upon the nature of the heat treating operation to be effected on the wafers passing therebeneath.
- an infra-red radiation heater is utilized for applying a uniform area of radiant heat to wafers carried therebeneath.
- One such infra-red heater well suited for the stated purpose is identified as Triple Power Infra-Red Solar Heater" distributed by CassoSolor Corporation of Kew Gardens, New York.
- Such a heating unit comprises a quartz block in which heating elements are inlaid so their full heating power can be utilized to heat the quartz body in which the heating elements are embedded so that the quartz body transmits virtually all the energy created downwardly against the wafers to be heated thereby.
- the infra-red heater of the type described is preferred, the specific type of heating unit utilized may vary, depending upon heating requirements and manufacturing needs.
- the heating unit employed is positioned to overlie the major portion of the tracks between the feed magazines and dis charge magazines.
- one elongated heating unit, or a plurality of two or more discrete heating unit sections combined to define a substantially continuous heating unit may be utilized.
- each of the plural tracks of the illustrated apparatus is defined by a combined fluid bearing structure positive drive pacing belt over which and by which a stream of spaced wafers is transported synchronously and sequentially beneath the heating unit 41.
- the synchronous drive mechanism for the respective belts 56 of the apparatus is designated generally 57.
- Such synchronous drive mechanism 57 includes a pair of transversely extending parallel shafts 58 and 59 positioned adjacent the opposite infeed and outfeed ends of the apparatus. Each such shaft has mounted thereon a plurality of laterally spaced pulley wheels 61 and 62 around which the belts 56 pass, as will be described in greater detail hereinafter.
- Shaft 58 comprises the drive shaft of the belt drive mechanism and is positively actuated through a chainmotor drive.
- Such drive includes a chain 63 which passes around a toothed sprocket 64 secured to shaft 58 and a second toothed sprocket 66 driven by an electrical stepping motor of known design. Sprocket 66, chain 63 and sprocket 64 are rotated by the motor in predetermined stepped increments to correspondingly rotate drive shaft 58 and each of the plurality of belts 56 driven thereby in corresponding increments. That is,
- the belts 56 of the respective tracks are moved synchronously and for uniform distances at uniform rates so that wafers positioned on the respective tracks are synchronously and simultaneously moved through the apparatus beneath the heating unit in step fashion.
- Each of the shafts 58 and 59 is mounted for rotation at its opposite ends in a pair of opposed bearing blocks 68 and 69 for the stated purpose. Note FIG. 2 in that regard with respect to shaft 58.
- the stepping motor is operatively mounted in known fashion to a supporting plate 71 bolted or otherwise secured to a second supporting plate 72 depending from the aforementioned frame members 36 supported by base 34 of the apparatus.
- Such means regulate the speed of movement of individual wafers through the apparatus as the same are supported upon and moved longitudinally of the tracks by the fluid bearing structure of the tracks in the manner to be described.
- Such wafer spacing means comprises a series of spacer buttons each of which is designated 76 and each of which is defined by a metal (such as stainless steel) or temperature resistant plastic (such as Teflon or Kapton) pin 77 having a head 78 at one end thereof and a shank 79 which extends through an aperture provided in the belt 56.
- Each pin 77 is held in place by a metal or plastic sleeve 81 which surrounds shank 79 and is held in engagement with the shank by a spring washer 82, preferably of high temperature resistant metal or plastic, which passes over the end of pin shank 79 to hold the sleeve in place in engagement with the surface of the belt which is opposite from the surface with which pin head 78 is engaged.
- a metal or plastic sleeve 81 which surrounds shank 79 and is held in engagement with the shank by a spring washer 82, preferably of high temperature resistant metal or plastic, which passes over the end of pin shank 79 to hold the sleeve in place in engagement with the surface of the belt which is opposite from the surface with which pin head 78 is engaged.
- the spacer buttons 76 constructed as described are positioned through spaced apertures provided in belt 56 at predetermined uniform locations along the belt.
- Belt 56 preferably is formed from a high temperature material with a flexible plastic being preferred, although a high temperature metal, such as stainless steel could be employed.
- a non-metallic belt formed of Kapton polyamide plastic (produced and marketed by E. l. DuPont de Nemours Co.) is particularly well suited for the stated purpose because of its high temperature resistance and wide range of temperature utilization, ranging from -200C or lower to +400C or higher.
- wafer temperatures desirably reach +200C or more in conjunction with their heat treatment by the subject apparatus so that the Kapton material described is particularly well suited for the stated purpose.
- the spacer buttons 76 also provide means for pacing the rate of movement of the wafers via the belt drive mechanism described previously.
- each drive pulley 61 adjacent the discharge end of the apparatus is provided with a series of recesses 86 at spaced peripheral locations around its outer edge (as best seen in FIG. 3) contoured to receive therein the head 78 of each spacer button as a belt passes around such pulley 61.
- the respective spacer buttons 76 limit movement of the respective wafers passing through the apparatus in accordance with the speed of movement of the pacing belt. That is, each belt is actuated to impede or pace each wafer in accordance with the predetermined speed desired for wafer movement as transmitted by the belt drive mechanism to the belt. It should be understood that during such pacing by the belt, the wafers are supported upon and moved longitudinally of the track by the levitating and transporting effect of the fluid emanating from the fluid bearing structure which combines with the positive drive belt in defining each operating track.
- each wafer W moving along a track is supported slightly above the upper surface of the track during movement to prevent wafer damage and to permit, when desired, rotation of the individual wafers by the fluid bearing track structure in the manner to be described.
- Fluid bearing track structure 6 is of elongated configuration and, as seen in FIG. 1, extends the full longitudinal distance of the apparatus between the infeed and outfeed stations 2 and 4.
- the fluid bearing is produced, in the illustrated embodiment, in four structurally discrete but functionally cooperable sections 91, 92, 93 and 94. Such four sections are arranged as end to end continuations ofeach other as seen in FIGS. 4A and 4B.
- the opposite end sections 9] and 94 preferably constitute unidirectional sections and the central sections 92 and 93 preferably constitute bi-directional sections for the purpose to be described.
- fluid bearing track structure 6 comprises an elongated supporting plate 97 which extends the length of the apparatus and provides a mounting base for the fluid bearing track structure.
- Plate 97 may be formed as one elongated member or in cooperable segments, depending upon manufacturing limitations. In either event, plate 97 is operatively mounted between opposed longitudinally extending bracket members 98 and 99 which in turn are secured in a suitable fashion, such as by welding, to the frame members 36 described previously. Screw type fasteners 101 may be utilized for securing plate 97 between brackets 98 and 99 as seen in FIG. 6.
- the plate 97 may be formed of metal or temperature resistance plastic, with metal, such as stainless steel or high temperature aluminum or aluminum alloy, being preferred.
- Plate 97 is formed with two parallel spaced elongated longitudinal slots 102 and 103 therein as seen in FIG, 6 for its full extent. Such slots preferably are symmetrically arranged on opposite sides of the longitudinal axis of the plate.
- plate 97 Extending longitudinally along its axis between the axes of shafts 58 and 59 mentioned previously, as best seen in FIGS. 3 and 6, plate 97 is also provided with a stepped slot 104 having a central depressed area 106,
- Plate 97 as seen in FIGS. 3 and 4, also is provided with a pair of slots 108 and 109 in line with the pulleys 61 and 62 about which the belt 56 passes. Such slots accommodate the upper portions of the pulleys as the same rotate relative to the plate.
- the opposite end sections 91 and 94 of the fluid bearing track structure extend into and substantially entirely through the associated feed magazine 16 and discharge magazine 26. Each such magazine straddles the fluid bearing track structure to permit the upward and downward indexing of such magazines as mentioned previously.
- Such end sections of the fluid bearing track structure include electrical or pneumatic sensing means 110 and 110' for transmitting control signals to the magazines for effecting magazine indexing as required.
- Such magazine sensing control has been known heretofore as described in the previously identified Lasch, Jr. patent and application.
- section 91 of the fluid bearing track structure within magazine 16 permits the directional fluid bearing to sequentially withdraw the lowermost wafer from the magazine when the magazine is properly indexed and to automatically transfer each such wafer sequentially over track section 91 onto track section 92.
- the positioning oftrack section 94 into magazine 26 permits such section 94 to receive wafers in sequence from track section 93 and to sequentially insert the same directly into magazine 26 as the magazine is sequentially indexed into position.
- the intermediate track sections 92 and 93 carry wafers generally beneath the heating unit 41 and, because of the bidirectional capability preferably imparted to such intermediate sections, effect rotation of such wafers as the same are passing beneath the heating unit to effect uniform heating thereof and to preclude the formation of hot spots on the wafers.
- each section is identically constructed as best seen in FIGS. 4 and 6.
- Guide rails 111 and 112 are provided along lateral margins of the fluid bearing track structure and in the embodiment illustrated preferably are defined by elongated strips of Kapton plastic of the type noted previously. Such guide rails are held in place between the plate 97 and the brackets 98 and 99 between which plate 97 is mounted. For wafers of smaller diameter such guide rails may be moved inwardly and clamped in place in the respective slots 102 and 103 as shown in dotted lines in FIG. 6.
- the slots 102 and 103 are dimensioned to receive therein generally L-shaped track members designated 113 and 114 respectively.
- Such track members are formed in separate sections but as longitudinal continuations of each other, as seen from FIG. 4.
- Each such track member is provided with a longitudinal plenum recess 116 and 117 respectively for its full length.
- the respective track members are held in place in slots 102 and 103 by screw fasteners extending vertically therethrough into plate 97 at predetermined locations (not shown).
- the plenums of the respective tracks are operatively connected with a source of fluid bearing material, such as the nitrogen gas mentioned previously, via recesses 118 and 119 (FIG. 6) provided at spaced locations through plate 97.
- a source of fluid bearing material such as the nitrogen gas mentioned previously
- Pneumatic fittings 121 and 122, having hoses 123 and 124 connected with a suitable source of nitrogen or other fluid bearing gas are engaged with the plate 97 in communication with the recesses 118 and 119.
- a wafer supporting fluid medium may be introduced into the plenums defined by track members 113 and 114 and therethrough into contact with wafers positioned on the tracks.
- flexible insert strips are interposed between the respective track members 113 and 114 and an adjacent wall of slots 102 and 103, as best seen in FIG. 6.
- Such insert strips preferably are formed in accordance with the teachings of Lasch, Jr. US. Pat. No. 3,718,371, and each is provided with a series of equidistant similarly contoured directional fluid passages 126 and 127, as best seen in FIGS. 7 and 8.
- Each such strip is formed with recesses 128 and 129 extending therethrough which adapt such strips to receive bearing fluid from the plenum provided by track members 113 and 114 and to introduce such bearing fluid into the directional fluid passages 126 and 127 to emanate therefrom as a layer of supporting fluid in the manner and for the purpose described in said Lasch, Jr. US. Pat. No. 3,718,37l.
- the end sections 91 and 94 of the fluid bearing track structure are unidirectional as shown by the directional arrows in FIG. 4.
- Such uni-directional effect is produced by inserting each of the jet strips 123 and 124 with their directional fluid passages facing in the same direction.
- the central bi-directional track sections 92 and 93 are provided with their bi-directional capability by reversely orienting the jet strips 123 and 124 relative to each other so that the directional fluid passages therein face in opposite directions, as shown by the directional arrows in FIG. 4.
- wafers moving along end track sections 91 and 94 move generally in a straight non-rotational fashion because streams of fluid emanating from the two jet strips 123 and 124 are directed in the same direction.
- wafers moving along the central track sections 92 and 93 move rotationally and longitudinally over the bi-directional track sections 92 and 93 because streams of fluid emanate in opposite directions from the jet strips.
- fluid striking the underside of a wafer positioned effects rotational movement of such wafer as seen in FIG. 4 by the directional arrows shown therein.
- each belt 56 By regulating the speed of movement of each belt 56 the rate of movement of each wafer through the heating apparatus, and therefore its total heat treating or bake time, may be closely controlled. Different bake times may be achieved by varying the dwell time after each incremental feed movement of the belt is effected.
- the stepping motor 67 utilized effects 120 degree rotational incremental movement of the belt before the motor halts for a predetermined time.
- wafers entering beneath the heating unit at spaced intervals progress therethrough at a predetermined rate determined by the rate of belt movement.
- approximately two seconds is utilized to move each wafer a 3V2 inches increment, with an intermediate dwell time being chosen as desired to meet particular needs.
- a control switch (not shown) of conventional construction may be selectively set to determine the aggregate time of bake for each wafer, within wide range limits of 40 seconds to 15 minutes, for example.
- the fluid supporting nitrogen gas passes through the plenum defined by the fluid bearing track structure, (which is subjected to heat from heating unit 41 such gas becomes heated by the track structure.
- the wafers are levitated and moved on hot nitrogen gas which further enhances temperature stabilization of the wafers being treated.
- the nitrogen supply may be cut off during each wafer dwell period, thereby allowing individual wafers to settle upon the upper surface ofa track structure and to be heated directly by conduction from the track structure while the same is simultaneously being heated from above from the intra-red radiation source 41.
- gas Prior to movement of the pacing conveyor another next increment, gas is introduced under the wafers to levitate them prior to movement of the belt so that damage to the wafers due to sticking thereof to the track structure is obviated.
- the heating unit 41 preferably is 36 inches long and spans ten wafer dwell positions between the infeed and outfeed ends of the apparatus.
- a known vacuum brake structure 131 is incorporated at the infeed end of the apparatus and is timed to release a wafer only during a dwell period of the pacing belt.
- Vacuum brake 131 is provided in conjunction with the aforemention sensor 110' as seen in FIGS. 3 and 4 and as will be described hereinafter with respect to FIG. 9.
- a similar vacuum brake structure 132 is provided in conjunction with sensor 110 provided at the outfeed end of the apparatus as seen in FIGS. 3 and 4. Such vacuum brake halts wafers fed into the discharge magazine sequentially prior to indexing of the magazine.
- each of the multiple tracks of the subject apparaus are actuated simultaneously and sequentially to move a plurality of streams of wafers in equally spaced relationship to and past the heating station as described.
- FIG. 9 diagrammatic illustration .of the pneumatic system utilized with the illustrated four track apparatus.
- Supporting fluid is introduced through a central supply line 136 from any suitable gas source and passes through a pressure regulator 137 into supply line 138 and therefrom into a series of branch supply lines 139, 140 and 141.
- Solenoid valves 142, 143 and 144 which are regulated by associated needle control valves 146, I47 and 148, control fluid pressure in branch supply lines 149, and 151 which are continuations of lines 139, 140 and 141.
- Supporting fluid may thus be introduced into the various track sections of each fluid hearing track structure.
- a manifold 152 receives bearing fluid from supply line 151 and distributes the same through a series of conduits 154 to each of the plenums provided in the uni-directional fluid bearings in each of the end track sections 91 of the respective tracks 6, 7, 8 and 9.
- Supply line 150 is connected through a T-joint 155 with a pair of manifolds 156 and 157 with a series of conduits 158 and 159 connected with the plenums provided in the bidirectional track sections 92 and 93 of tracks 6, 7, 8 and 9.
- supply line 149 is connected through manifold 161 with each of the plenums in the other unidirectional end track sections 94 provided adjacent the discharge end of the apparatus.
- each track is provided with a vacuum stop 131 to preclude introduction of a wafer prematurely into the heating zone.
- Each such vacuum stop is connected through a manifold 161 and cooperating conduit 162 through a control gate 163 with a suitable source of vacuum 164.
- each of the aforementioned vacuum stops 132 is connected via manifold 166 and associated conduit 167 through a control gate 168 with the vacuum source 164.
- Apparatus for transporting articles, such as semiconductor'wafers, past a treating station comprising A. infeed means at an infeed station for introducing articles in sequence into said apparatus, B. means at a station adjacent said infeed station for treating articles presented thereto, C. conveyor track means for receiving articles in sequence from said infeed means and presenting the same in spaced sequence to said treating station, comprising 1. directional fluid bearing structure on which articles are supported and by which the articles are positively moved from said infeed station to and past said treating station,
- an endless pacer belt having article spacers carried thereon for maintaining articles spaced during transport past said treating station and for pacing movement of such articles by restricting movement thereof under controlled conditions as the articles are supported and moved by said fluid bearing structure, and
- D. means at a discharge station for receiving articles in sequence after the same have passed from said treating station.
- said treating means at said treating station comprises a heating unit positioned above said conveyor track means for heating articles transported therebeneath on said conveyor track means.
- said infeed means and said discharge means each comprises an indexable magazine for feeding and receiving, respectively, articles in sequence to and from said conveyor track means.
- said conveyor track means includes plural fluid bearing structures and belts extending in parallel relationship past said treating station, and plural infeed means and discharge means for feeding and receiving articles to and from respective tracks of said plural conveyor track means.
- said drive mech anism of said conveyor track structure includes means for moving each of said belts in synchronism so that parallel aligned streams of spaced articles may be transported past said treating stationv 8.
- said treating means at said treating station comprises a heating unit positioned above said plural fluid bearing structures and belts for heating articles transported thereon.
- each of said fluid bearing structures includes a bi-directional section at said heating station which introduces bearing fluid in opposite directions against said articles supported thereby to effect rotation of such articles as the same pass said treating station.
- said fluid bearing structure includes a slot extending logitudinally thereof within which said belt moves, said belt being positioned below the upper surface of said fluid bearing structure with only said spacers projecting thereabove so that said articles are free of contact with said belt during transport past said treating station.
- Apparatus for uniformly heating semiconductor wafers and like articles during manufacturing procedures for semiconductor devices comprising A. infeed means at an infeed station for introducing wafers in spaced sequence to a heating station,
- conveyor track means for receiving wafers in sequence from said infeed means and transporting the same in spaced sequence beneath said heating unit at said heating station, comprising 1. an elongated directional fluid bearing structure on which said wafers are supported and by which said wafers are positively moved from said infeed station to and past said heating unit,
- an endless pacer belt extending longitudinally of said fluid bearing structure having wafer spacers carried thereby, against which individual wafers come in contact, for maintaining said wafers spaced in predetermined positions and for pacing movement of said wafers by restricting movement thereof under controlled conditions during such movement past said heating unit, and
- D. means at a discharge station adjacent said heating station for receiving heat treated wafers in sequence after the same have passed said heating unit.
- said heating unit comprises a radiant heat source which transmits a field of radiant energy directly onto the wafers moving therebeneath.
- said fluid bearing structure includes a bi-directional section beneath said heating unit which introduces bearing fluid in opposite directions against said wafers supported thereby to effect rotation of said wafers, as the wafers move past said heating unit, to insure uniform heating thereof.
- said belt driving mechanism includes means for intermittently moving said belt so that wafers paced thereby are discontinuously moved beneath said heating unit.
- said conveyor track means includes plural fluid bearing structures and plural belts associated therewith which extend in parallel relationship beneath said heating unit, and plural infeed means and plural discharge means for feeding and receiving wafers to and from respective tracks of said plural conveyor track means.
- said drive mechanism of said conveyor track structure includes means for moving all of said belts in synchronism so that parallel aligned streams of spaced wafers may be transported past said heating station.
- each of said fluid bearing structures includes a bi-directional section at said heating station which introduces bearing fluid in opposite directions against said wafers supported thereby to effect rotation of such wafers as the same pass said heating station.
- a method of transporting articles to and past a treating station comprising A. introducing articles in spaced sequence onto a fluid bearing structure,
- a method of heat treating semiconductor wafers and like articles during manufacturing procedures for semiconductor devices comprising A. introducing a stream of spaced wafers in sequence onto a fluid bearing structure,
- Apparatus for transporting articles, such as semiconductor wafers, past a treating station comprising A. plural infeed means at an infeed station for introducing rows of articles in sequence into said apparatus,
- plural conveyor track means for receiving said rows of articles in sequence from said infeed means and presenting the same in spaced sequence to said treating station, comprising 1. plural fluid bearing structure on which said rows of articles are supported and moved from said infeed station to and past said treating station,
- said treating means at said treating station comprises a heating unit positioned above said plural fluid bearing strutures and said belts for heating said rows of articles transported thereon.
- each of said fluid bearing structures includes a bi-directional section at said heating station which introduces bearing fluid in opposite directions against said articles supported thereby to effect rotation of such articles as the same pass said treating station.
- Apparatus for transporting articles, such as semiconductor wafers, past a treating station comprising A. infeed means at an infeed station for introducing articles in sequence into said apparatus,
- B.. means at a station adjacent said infeed station for treating articles presented thereto
- said belt being positioned in said slot below the upper surface of said fluid bearing track structure with only said spacers projecting thereabove so that said articles are free of contact with said belt during transport past said treating station.
- D. means at a discharge station for receiving articles in sequence after the same have passed from said treating station.
- Apparatus for uniformly heating semiconductor wafers and like articles during manufacturing proce dures for semiconductor devices comprising A. infeed means at an infeed station for introducing wafers in spaced sequence to a heating station,
- said fluid bearing structure including a bi directional section beneath said heating unit which introduces bearing fluid in opposite directions against said wafers supported thereby to effect rotation of said wafers, as the wafers move past said heating unit, to insure uniform heating thereof,
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- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
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Abstract
Description
Claims (56)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US457432A US3870460A (en) | 1974-04-03 | 1974-04-03 | Single or multi-track fluid bearing heating apparatus and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US457432A US3870460A (en) | 1974-04-03 | 1974-04-03 | Single or multi-track fluid bearing heating apparatus and method |
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Publication Number | Publication Date |
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US3870460A true US3870460A (en) | 1975-03-11 |
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US457432A Expired - Lifetime US3870460A (en) | 1974-04-03 | 1974-04-03 | Single or multi-track fluid bearing heating apparatus and method |
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Cited By (4)
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FR2506074A1 (en) * | 1981-05-15 | 1982-11-19 | Gca Corp | APPARATUS FOR COOKING INSULATING COATINGS ON SEMICONDUCTOR WAFERS |
DE3402664A1 (en) * | 1983-03-28 | 1984-10-04 | Silicon Valley Group, 95054 Santa Clara, Calif. | METHOD FOR TREATING AND / OR HANDLING WAFERS AND DEVICE FOR CARRYING OUT THE METHOD |
WO2009153061A1 (en) * | 2008-06-19 | 2009-12-23 | Rena Gmbh | Method and device for transporting objects |
US20120060758A1 (en) * | 2011-03-24 | 2012-03-15 | Primestar Solar, Inc. | Dynamic system for variable heating or cooling of linearly conveyed substrates |
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US2605091A (en) * | 1948-04-13 | 1952-07-29 | American Can Co | Method and apparatus for treating articles with jets of fluid |
US3163134A (en) * | 1963-11-04 | 1964-12-29 | Clarence H Dicus | Method of burning out barrels |
US3184224A (en) * | 1962-10-09 | 1965-05-18 | Donald P Shelley | Tunnel kiln and method of operation |
US3627283A (en) * | 1969-12-22 | 1971-12-14 | Phillips Petroleum Co | Drive belt and rails to move article through flame |
US3718371A (en) * | 1971-08-25 | 1973-02-27 | Ind Modular Syst Corp | Fluid bearing track structure and components thereof |
US3731823A (en) * | 1971-06-01 | 1973-05-08 | Ibm | Wafer transport system |
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US2605091A (en) * | 1948-04-13 | 1952-07-29 | American Can Co | Method and apparatus for treating articles with jets of fluid |
US3184224A (en) * | 1962-10-09 | 1965-05-18 | Donald P Shelley | Tunnel kiln and method of operation |
US3163134A (en) * | 1963-11-04 | 1964-12-29 | Clarence H Dicus | Method of burning out barrels |
US3627283A (en) * | 1969-12-22 | 1971-12-14 | Phillips Petroleum Co | Drive belt and rails to move article through flame |
US3731823A (en) * | 1971-06-01 | 1973-05-08 | Ibm | Wafer transport system |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2506074A1 (en) * | 1981-05-15 | 1982-11-19 | Gca Corp | APPARATUS FOR COOKING INSULATING COATINGS ON SEMICONDUCTOR WAFERS |
US4518848A (en) * | 1981-05-15 | 1985-05-21 | Gca Corporation | Apparatus for baking resist on semiconductor wafers |
DE3402664A1 (en) * | 1983-03-28 | 1984-10-04 | Silicon Valley Group, 95054 Santa Clara, Calif. | METHOD FOR TREATING AND / OR HANDLING WAFERS AND DEVICE FOR CARRYING OUT THE METHOD |
US4507078A (en) * | 1983-03-28 | 1985-03-26 | Silicon Valley Group, Inc. | Wafer handling apparatus and method |
WO2009153061A1 (en) * | 2008-06-19 | 2009-12-23 | Rena Gmbh | Method and device for transporting objects |
US20110097160A1 (en) * | 2008-06-19 | 2011-04-28 | Rena Gmbh | Method and apparatus for the transporting of objects |
KR101225003B1 (en) * | 2008-06-19 | 2013-01-22 | 레나 게엠베하 | Method and device for transporting objects |
US9355880B2 (en) | 2008-06-19 | 2016-05-31 | Rena Gmbh | Method and apparatus for the transporting of objects |
US20120060758A1 (en) * | 2011-03-24 | 2012-03-15 | Primestar Solar, Inc. | Dynamic system for variable heating or cooling of linearly conveyed substrates |
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