US3865702A - Galvanic nickel bath for depositing silk-dull nickel coats - Google Patents

Galvanic nickel bath for depositing silk-dull nickel coats Download PDF

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Publication number
US3865702A
US3865702A US334298A US33429873A US3865702A US 3865702 A US3865702 A US 3865702A US 334298 A US334298 A US 334298A US 33429873 A US33429873 A US 33429873A US 3865702 A US3865702 A US 3865702A
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US
United States
Prior art keywords
nickel
galvanic
bath
dull
coats
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US334298A
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English (en)
Inventor
Waldemar Immel
Wennemar Strauss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dr W Kampschulte & Cie
Kampschulte & Cie Dr W
Original Assignee
Kampschulte & Cie Dr W
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE794695D priority Critical patent/BE794695A/xx
Priority to DE19722204171 priority patent/DE2204171B2/de
Priority to AT74273A priority patent/AT317625B/de
Priority to GB445273A priority patent/GB1376552A/en
Priority to FR7303080A priority patent/FR2169404B1/fr
Application filed by Kampschulte & Cie Dr W filed Critical Kampschulte & Cie Dr W
Priority to US334298A priority patent/US3865702A/en
Application granted granted Critical
Publication of US3865702A publication Critical patent/US3865702A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt

Definitions

  • ABSTRACT A galvanic nickel bath for precipitating silk-dull nickel coats, which includes anion active primary and/or secondary phosphoric acid esters of polyalkylene oxide adducts adapted to be produced from ethylene oxide and/or propylene oxide and/or butylene oxide, or of the salts of such propylene oxide aclducts.
  • the present invention relates to a galvanic nickel bath for precipitating dull, glare or dazzle free nickel coats with a certain content of basic luster substances.
  • the production of articles the surface of which is made glare-free by the galvanic precipitation of silk-dull nickel coats is to an ever increasing extent requested by consumers in a wide range of technical fields.
  • a silkdull nickel coat is characterized by a velvet-like luster and by a reduced reflection as compared to nickel coats having a high luster and strong reflection.
  • the bath contains such substituted or non-substituted ethylene oxide or propylene oxide or ethylene oxidepropylene oxide adducts in a concentration of from 5 100 mg/l which at a temperature of from 40 75C form a finely dispersed emulsion in the bath electrolyte.
  • addition compounds include, for instance, the high molecular polyethylene oxides, polypropylene oxides, mixing adducts of ethylene oxide and propylene oxide, addition compounds of ethylene oxide and propylene oxide or ethylene oxide and propylene oxide in any desired sequence on one or multi-valent saturated and unsaturated straight chained and branch chained aliphatic, cycloaliphatic, aromatic and heterocyclic-alcohols, ethyl hydrosulfides (mercaptanes), aldehydes, ketones, acetals, amines, carbonic acids, carbonic acid amides and phenols.
  • the high molecular polyethylene oxides polypropylene oxides
  • mixing adducts of ethylene oxide and propylene oxide addition compounds of ethylene oxide and propylene oxide or ethylene oxide and propylene oxide in any desired sequence on one or multi-valent saturated and unsaturated straight chained and branch chained aliphatic, cycloaliphatic, aromatic and heterocyclic-al
  • composition of the customary nickel baths which consists of nickel salts, such as nickel chloride, nickel sulfate, nickel fluorborate or nickel sulfamate and customarily contains a buffer, such as boric acid.
  • nickel salts such as nickel chloride, nickel sulfate, nickel fluorborate or nickel sulfamate
  • a buffer such as boric acid.
  • a frequently employed bath is the so-called Watt-bath with nickel chloride, nickel sulfate and boric acid.
  • the galvanic nickel bath contains anionactive primary and/or secondary phosphoric acid esters of polyalkylene oxide adducts adapted to be produced from ethylene oxide and/or propylene oxide and/or butylene oxide, or :by the fact that the galvanic nickel bath contains the salts of such polyalkylene oxide adducts.
  • the present invention concerns the teaching that anionactive primary and secondary phosphoric acid esters of polyalkylene oxide adducts prepared by the known reaction of polyalkylene adducts and P 2 O 5 when added to nickel baths containing basic luster substances, especially nickel baths of the Watt-type, during the galvanizing process will yield silk-dull nickel deposits.
  • polyalkylene oxide adducts intended for reaction with P 2 O there are meant addition compounds of ethylene oxide, propylene oxide, butylene oxide or mixtures of these alkylene oxides in any desired sequence with low molecular organic compounds.
  • ethyleneglycol, propyleneglycol, ethyleneglycol, etc. which with reference to active hydrogen represent bior polyfunctional low molecular organic compounds.
  • the galvanic nickel bath according to the invention contains the phosphoric acid esters in a con centration of from 20 8O mg/l.
  • the galvanic nickel bath according to the present invention makes possible the generation of a silky luster on articles in the form of a uniform coat even when low and very low current densities are involved. Black deposits do not occur so that above all with highly profiled and curved workpieces to be coated considerable advantages are realized by the present invention over the state of the art as it existed prior to the invention.
  • a galvanic nickel bath according to claim 1 which contains 1 g/l of saccharin.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Paints Or Removers (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
US334298A 1972-01-29 1973-02-21 Galvanic nickel bath for depositing silk-dull nickel coats Expired - Lifetime US3865702A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
BE794695D BE794695A (fr) 1972-01-29 Bain galvanique de nickel pour la separation de revetements de nickel satines mats
DE19722204171 DE2204171B2 (de) 1972-01-29 1972-01-29 Galvanisches nickelbad zur abscheidung seidenmatter nickelueberzuege
AT74273A AT317625B (de) 1972-01-29 1973-01-29 Galvanisches Nickelbad zur Abscheidung seidenmatter Nickelüberzüge
GB445273A GB1376552A (en) 1972-01-29 1973-01-29 Electrolytic nickel bahts
FR7303080A FR2169404B1 (enrdf_load_stackoverflow) 1972-01-29 1973-01-29
US334298A US3865702A (en) 1972-01-29 1973-02-21 Galvanic nickel bath for depositing silk-dull nickel coats

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19722204171 DE2204171B2 (de) 1972-01-29 1972-01-29 Galvanisches nickelbad zur abscheidung seidenmatter nickelueberzuege
US334298A US3865702A (en) 1972-01-29 1973-02-21 Galvanic nickel bath for depositing silk-dull nickel coats

Publications (1)

Publication Number Publication Date
US3865702A true US3865702A (en) 1975-02-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
US334298A Expired - Lifetime US3865702A (en) 1972-01-29 1973-02-21 Galvanic nickel bath for depositing silk-dull nickel coats

Country Status (6)

Country Link
US (1) US3865702A (enrdf_load_stackoverflow)
AT (1) AT317625B (enrdf_load_stackoverflow)
BE (1) BE794695A (enrdf_load_stackoverflow)
DE (1) DE2204171B2 (enrdf_load_stackoverflow)
FR (1) FR2169404B1 (enrdf_load_stackoverflow)
GB (1) GB1376552A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5897763A (en) * 1995-10-27 1999-04-27 Lpw-Chemie Gmbh Method of electroplating glare-free nickel deposits
EP1424407A1 (en) * 2002-11-26 2004-06-02 Furukawa Circuit Foil Co., Ltd. Plating bath for forming thin resistance layer, method of formation of resistance layer, conductive base with resistance layer, and circuit board material with resistance layer
US20050056542A1 (en) * 2003-07-04 2005-03-17 Seiko Epson Corporation Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2315802A (en) * 1940-04-20 1943-04-06 Harshaw Chem Corp Nickel plating
US2986500A (en) * 1959-04-21 1961-05-30 Metal & Thermit Corp Electrodeposition of bright nickel
US3084111A (en) * 1958-04-24 1963-04-02 Dehydag Gmbh Wetting agents for electroplating baths

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2315802A (en) * 1940-04-20 1943-04-06 Harshaw Chem Corp Nickel plating
US3084111A (en) * 1958-04-24 1963-04-02 Dehydag Gmbh Wetting agents for electroplating baths
US2986500A (en) * 1959-04-21 1961-05-30 Metal & Thermit Corp Electrodeposition of bright nickel

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5897763A (en) * 1995-10-27 1999-04-27 Lpw-Chemie Gmbh Method of electroplating glare-free nickel deposits
EP1424407A1 (en) * 2002-11-26 2004-06-02 Furukawa Circuit Foil Co., Ltd. Plating bath for forming thin resistance layer, method of formation of resistance layer, conductive base with resistance layer, and circuit board material with resistance layer
US20040144656A1 (en) * 2002-11-26 2004-07-29 Akira Matsuda Plating bath for forming thin resistance layer, method of formation of resistance layer, conductive base with resistance layer, and circuit board material with resistance layer
CN100466881C (zh) * 2002-11-26 2009-03-04 古河电路铜箔株式会社 附带电阻层的铜箔及附带电阻层的电路基板材料
US7794578B2 (en) 2002-11-26 2010-09-14 The Furukawa Electric Co., Ltd. Method for preparing a circuit board material having a conductive base and a resistance layer
US20050056542A1 (en) * 2003-07-04 2005-03-17 Seiko Epson Corporation Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product

Also Published As

Publication number Publication date
FR2169404A1 (enrdf_load_stackoverflow) 1973-09-07
GB1376552A (en) 1974-12-04
BE794695A (fr) 1973-05-16
AT317625B (de) 1974-09-10
FR2169404B1 (enrdf_load_stackoverflow) 1975-10-31
DE2204171A1 (de) 1973-08-16
DE2204171B2 (de) 1976-07-22

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