US3811934A - Heating member - Google Patents

Heating member Download PDF

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Publication number
US3811934A
US3811934A US00176116A US17611671A US3811934A US 3811934 A US3811934 A US 3811934A US 00176116 A US00176116 A US 00176116A US 17611671 A US17611671 A US 17611671A US 3811934 A US3811934 A US 3811934A
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US
United States
Prior art keywords
percent
contact member
protective layer
layer
heating plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00176116A
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English (en)
Inventor
H Glaser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Flachglas Wernberg GmbH
Original Assignee
Flachglas Wernberg GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19702044675 external-priority patent/DE2044675C/de
Application filed by Flachglas Wernberg GmbH filed Critical Flachglas Wernberg GmbH
Application granted granted Critical
Publication of US3811934A publication Critical patent/US3811934A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/923—Physical dimension
    • Y10S428/924—Composite
    • Y10S428/926—Thickness of individual layer specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12597—Noncrystalline silica or noncrystalline plural-oxide component [e.g., glass, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y10T428/12618—Plural oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12722—Next to Group VIII metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component

Definitions

  • A-heating plate comprises a generally refractory substrate of, for example, glass upon which is deposited by flame spraying, a contact member occupying a limited portion of a surface of the substrate for connecting the heating element in an electric circuit.
  • contact member is preferably copper or a copperbased alloy (e.g. 90 99 percent by weight copper, 0 9 percent by weight titanium and 0 2 percent by weight chromium).
  • a protective metal (conductive) layer is provided on the contact member which is directly formed on the substrate and a heating element is constituted of a further conductive layer applied over the remainder of the substrate surface and on the protective layer covering the contact member.
  • the present invention relates to heating elements and, more particularly, to a method of making a heating element and to an improved heating element made by this method.
  • Heating elements, disks, plates and the like have been provided heretofore for many purposes, e.g., for furances, ovens and kilns, for domestic and industrial heating tasks and as a substitute for heating coils in appliances of varying sorts.
  • a heating element of the plate-like type may be used for the baking or reflowing of paints when mounted in a suitable array adjacent the transport path of mass-produced articles such as automobiles.
  • Smaller heating elements of the same general type may be used for the infrared heating and thawing of foods in toasters, broilers, masters and the like. Between these two extremes, there is a variety of applications for these heating elements which depend upon the generally planar configuration thereof.
  • a refractory plate (of circular or rectangular outline) has been formed with a coil of heating wire (e.g., nichrome) so that the wire lies substantially in the plane of the surface.
  • Other plate-like substrates have been formed with recesses or channels receiving strips or coils of heating wire.
  • Still another construction known to the art provides a refractory plate upon which a heating element is deposited or to which a heating element is bonded by an adhesive or the like so that, upon firing, a ceramic-metal bond is formed.
  • the heating element in this case may be a metallic conductor or a semiconductor and the passage of an electric current through the heating element, having spacedapart contact members which are applied to the material forming the heating element, results in resistive generation of heat.
  • Heating bodies of the latter type have proved to be especially desirable because the danger ofdamage to a heating coil can be excluded and the assembly made more compact than arrangements using wires, coils and the like.
  • heating bodies in which the heating element is deposited upon a refractory substrate and contact members are applied to the heating element to afford facilities for electrical connection of the device in a circuit) are characterized by a high production cost, poor solderability of the contact members to other elements of the circuit, and poor mechanical properties of the contact members. Thus the contact members may be dislodged from the heating elements to which they are bonded and cannot be soldered readily into a circuit.
  • a heating plate (of disk or circular configuration or of rectangular or any other desirable outline) which comprises a refractory substrate (e.g., of glass or a ceramic consisting of alumina, magnesia, silica, titania, zirconia and mixtures and combinations thereof or of other minerals containing same) at least one but preferably two or more metallic electrical contact members extending over only a limited portion of the substrate and bonded thereto directly by flamespraying a metal protective layer overlying this contact member or each of the contact members and, in turn, an electrically conductive layer overlies the protective layer in the region of the contact member and directly is formed upon the remainder of the substrate surface.
  • the electrically conductive layer is thus in electrically conducting relationship with the contact member (through the protective layer) and forms the heating element.
  • the invention comprises a generally flat support upon which is deposited a heating element of electrically conductive material in the form of a layer and conductive members electrically connected to the heating element.
  • the electrically conductive layer forming the heating element can be composed of transparent or nontransparent metals or semiconductors in the form of a thin film or layer, especially of gold, platinum, silver, copper or aluminum.
  • Suitable semiconductor heating-element layers are composed, for example, of zinc oxide, doped with antimony. This example merely represents one of a wide variety of semiconductive heating elements which may be used, these substances being generally described as metal oxide doped with a substance from Group III or V of the Periodic Table.
  • the electrically conductive layer forming the heating element may be deposited in vacuo upon the substrate (i.e., vapor-deposited) or can be formed on the substrate by wet-chemical process.
  • wet-chemical process is used herein to describe electroplating or electrodeposition and so-called chemical plating or electroless plating or deposition.
  • the invention resides in applying the contact members directly to the support by flame-spraying from a copper alloy and thereafter coating the copper-alloy Contact member with a metallic protective layer, and only thereafter applying the electrically conductive layer forming the heating element.
  • a heating plate of this type is of course of much simpler manufacture than earlier heating elements because complications which have faced prior-art systems in applying the contact members to the heating element are eliminated.
  • the contact members are mechanically locked in the structure and are both solderable and free from adhesion loss. In effect, therefore, the contact members are imbedded in a body forming the heating element, thereby ensuring excellent electrical connection between the heating element and the contact member.
  • the contact member is composed of an alloy containing copper and at least 1 percent by weight of alloying metals selected from the group which consists of titanium, chromium or combinations thereof.'Best results have been found with 90 to 99 percent by weight copper, 9 percent by weight titanium and 0 2 percent by weight chromium. For reasons it has been unable to fully ascertain, this alloy bonds directly to glass or ceramic substrates significantly better than other alloys and is particularly suitable for flamespraying without causing difficulties during the process. In addition, it has high solderability.
  • the protective layer is applied in a thickness ranging between molecular thickness and 1 micron, i.e., in a thickness up to 1 micron, and consists of gold or a gold alloy, or tin or a tin alloy.
  • the protective layer should be resistant to oxidation and should be solderable or capable of forming electrical connections of low contact resistance. Gold, tin and their alloys fulfill these requirements.
  • the protective layer may be applied by chemical plating, galvanic (electroplating) flame-spraying or vapor deposition, the latter being preferred.
  • the diffusion barrier layer of nickel to a thickness of 3 to microns, is applied between the copper-alloy contact member and the protective layer,
  • the electrically conductive layer which preferably covers the remainder of the surface of the substrate, is applied by vapor deposition.
  • the system described above has some significant advantages over the prior art, aside from the not unimportant advantage of substantially reduced cost.
  • the bond between the contact member and the substrate, especially when the latter is composed of glass, is specially strong and ablation of the contact member need not be feared.
  • the contact member can be soldered with ease to other circuit elements without the danger of dislodging because mechanical and thermal conditions during the soldering operation. While it is preferred to use a glass or ceramic support as described above, it has been found that even synthetic resin (e.g., phenolic supports) may be used.
  • FIG. 1 is a plan view of a portion of a heating plate according to the present invention.
  • FIG. 2 is a section taken along the line II II of FIG.
  • FIG. 3 is a view similar to FIG. 2 but illustrating another embodiment of the invention.
  • FIG. 4 is a flow diagram illustrating the method of the invention.
  • An electrically conductive layer 2 (e.g. of the order of thickness of l to 50 microns) is applied to this substrate over substantially its entire surface and directly adheres thereto.
  • the strip-like contact member 3, to which other circuit elements are connected by soldering, is applied adjacent an edge of the heating plate and represents a plurality (at least 2) contact members.
  • the contact members 3 are applied directly to the glass plate 1 by flame-spraying and consist of a copper-alloy body 4 which is coated with a layer 5 of gold, tin, or an alloy thereof. In the region of the contact members, the layer 2 overlies the protective layer 5.
  • FIG. 3 shows a modification wherein the substrate 1 carries directly the flame-sprayed strip 4 of copper alloy but is coated, in turn, with 3 to 5 microns of a nickel layer 10.
  • the gold or tin protective layer 5 is thereupon applied to the nickel layer and the heating element layer 2 formed thereover.
  • the substrate e.g., glass
  • the glass plate had a thickness of 10 mm and was composed of quartz glass.
  • a copper alloy consisting of 97.3 percent by weight copper, 2.3 percent by weight titanium :and 0.4 percent by weight chromium, was deposited on the glass in the form of a strip 4 at a temperature slightly above the melting point of the alloy.
  • a 4-micron layer of nickel was electro-plated at a temperature of about 40C with a cathode-density of 25 amp,.lsquare foot and an anode current density of 8 amp/square foot from a nickel sulfamate plating bath. After the layer was thoroughly dried, 0.9 microns of gold was vapordeposited followed by the heating element layer 2 to a thickness of 25 microns. The heating element layer was composed of copper. The contact member was found to be firmly adherent to the glass substrate and even during soldering was not released therefrom.
  • a heating plate comprising: an insulating substrate; at least one metallic electrical contact member of a copper alloy containing at least 1 percent by weight titanium, chromium or a combination thereof extending over only a portion of the surface of said substrate and bonded directly thereto; a metallic protective layer overlying said member; and an electrically conductive layer overlying said surface and said protective layer while being in electrically conductive relationship with said contact member through said protective layer, said conductive layer forming a heating element and being directly bonded to said surface over areas thereof devoid of said contact member.
  • said protective layer is a material selected from the group consisting of gold, a gold alloy, tin and a tin alloy.
  • a method of making a heating plate comprising the steps of:

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)
US00176116A 1970-09-09 1971-08-30 Heating member Expired - Lifetime US3811934A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702044675 DE2044675C (de) 1970-09-09 Heizscheibe und Verfahren zu ihrer Herstellung

Publications (1)

Publication Number Publication Date
US3811934A true US3811934A (en) 1974-05-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
US00176116A Expired - Lifetime US3811934A (en) 1970-09-09 1971-08-30 Heating member

Country Status (3)

Country Link
US (1) US3811934A (enrdf_load_stackoverflow)
BE (1) BE771372A (enrdf_load_stackoverflow)
FR (1) FR2105845A5 (enrdf_load_stackoverflow)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3895218A (en) * 1974-05-02 1975-07-15 Asg Ind Inc Electric heater plate and terminal thereof
US3931496A (en) * 1974-11-21 1976-01-06 General Electric Company Electrical heating plate with terminal means for high temperature film heater
US3944787A (en) * 1973-12-26 1976-03-16 Texas Instruments Incorporated Heater on metal composites
US4188358A (en) * 1976-03-29 1980-02-12 U.S. Philips Corporation Method of manufacturing a metallized plastic reflector
US4239827A (en) * 1979-01-15 1980-12-16 Union Carbide Corporation Flame-sprayed thermoplastic substrate is coated with an adhesive layer which bonds particles of an adsorbent like carbon to the substrate
US4303480A (en) * 1977-08-01 1981-12-01 General Dynamics, Pomona Division Electroplating of thick film circuitry
US4314230A (en) * 1980-07-31 1982-02-02 Raychem Corporation Devices comprising conductive polymers
US4385226A (en) * 1979-09-08 1983-05-24 Saint Gobain Vitrage Electrically heated window
US4424408A (en) 1979-11-21 1984-01-03 Elarde Vito D High temperature circuit board
US4453669A (en) * 1981-07-15 1984-06-12 Saint-Gobain Vitrage Electrically heated glass pane
DE3325204A1 (de) * 1983-07-13 1985-01-24 Reimbold & Strick GmbH & Co, 5000 Köln Auf einem traeger aus elektrisch isolierenden werkstoffen aufgebrachtes heizelement aus elektrisch leitenden werkstoffen, seine herstellung und verwendung
US4527050A (en) * 1981-07-08 1985-07-02 E.G.O. Elektro-Gerate Blanc Und Fischer Hotplate
US4933534A (en) * 1988-11-23 1990-06-12 Cunningham Paul A Electrical heater and plug
US5039840A (en) * 1987-06-27 1991-08-13 Deeman Product Development Ltd. Method of producing electrical heating elements and electrical heating elements so produced
US5099104A (en) * 1989-11-09 1992-03-24 Saint Gobain Vitrage International Electrically heatable laminated glass plates having an electrically conductive surface coating
US5225663A (en) * 1988-06-15 1993-07-06 Tel Kyushu Limited Heat process device
US5234715A (en) * 1989-12-11 1993-08-10 Advanced Technology Materials, Inc. Method of making galvanically dissipatable evanescent chaff fiber
US5504307A (en) * 1990-07-13 1996-04-02 Ebara Corporation Heat transfer material for heating and heating unit and heating apparatus using same material
US5643483A (en) * 1994-04-11 1997-07-01 Shin-Etsu Chemical Co., Ltd. Ceramic heater made of fused silica glass having roughened surface
US20090114639A1 (en) * 2003-11-20 2009-05-07 Koninklijke Philips Electronics N.V. Thin-film heating element
US7797863B2 (en) * 2006-01-31 2010-09-21 Celaya, Emparanza Y Galdos, Internacional, S.A. Iron sole and iron containing same
US20200397052A1 (en) * 2018-03-07 2020-12-24 Hauni Maschinenbau Gmbh Method for manufacturing an electrically operable heating body for an inhaler

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6299191U (enrdf_load_stackoverflow) * 1985-12-13 1987-06-24

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3944787A (en) * 1973-12-26 1976-03-16 Texas Instruments Incorporated Heater on metal composites
US3895218A (en) * 1974-05-02 1975-07-15 Asg Ind Inc Electric heater plate and terminal thereof
US3931496A (en) * 1974-11-21 1976-01-06 General Electric Company Electrical heating plate with terminal means for high temperature film heater
US4188358A (en) * 1976-03-29 1980-02-12 U.S. Philips Corporation Method of manufacturing a metallized plastic reflector
US4303480A (en) * 1977-08-01 1981-12-01 General Dynamics, Pomona Division Electroplating of thick film circuitry
US4239827A (en) * 1979-01-15 1980-12-16 Union Carbide Corporation Flame-sprayed thermoplastic substrate is coated with an adhesive layer which bonds particles of an adsorbent like carbon to the substrate
US4385226A (en) * 1979-09-08 1983-05-24 Saint Gobain Vitrage Electrically heated window
US4443691A (en) * 1979-09-08 1984-04-17 Saint-Gobain Vitrage Electrically heated window
US4424408A (en) 1979-11-21 1984-01-03 Elarde Vito D High temperature circuit board
US4314230A (en) * 1980-07-31 1982-02-02 Raychem Corporation Devices comprising conductive polymers
US4527050A (en) * 1981-07-08 1985-07-02 E.G.O. Elektro-Gerate Blanc Und Fischer Hotplate
US4453669A (en) * 1981-07-15 1984-06-12 Saint-Gobain Vitrage Electrically heated glass pane
DE3325204A1 (de) * 1983-07-13 1985-01-24 Reimbold & Strick GmbH & Co, 5000 Köln Auf einem traeger aus elektrisch isolierenden werkstoffen aufgebrachtes heizelement aus elektrisch leitenden werkstoffen, seine herstellung und verwendung
US5039840A (en) * 1987-06-27 1991-08-13 Deeman Product Development Ltd. Method of producing electrical heating elements and electrical heating elements so produced
US5225663A (en) * 1988-06-15 1993-07-06 Tel Kyushu Limited Heat process device
US4933534A (en) * 1988-11-23 1990-06-12 Cunningham Paul A Electrical heater and plug
US5099104A (en) * 1989-11-09 1992-03-24 Saint Gobain Vitrage International Electrically heatable laminated glass plates having an electrically conductive surface coating
US5234715A (en) * 1989-12-11 1993-08-10 Advanced Technology Materials, Inc. Method of making galvanically dissipatable evanescent chaff fiber
US5504307A (en) * 1990-07-13 1996-04-02 Ebara Corporation Heat transfer material for heating and heating unit and heating apparatus using same material
US5643483A (en) * 1994-04-11 1997-07-01 Shin-Etsu Chemical Co., Ltd. Ceramic heater made of fused silica glass having roughened surface
US20090114639A1 (en) * 2003-11-20 2009-05-07 Koninklijke Philips Electronics N.V. Thin-film heating element
US9493906B2 (en) * 2003-11-20 2016-11-15 Koninklijke Philips N.V. Thin-film heating element
US7797863B2 (en) * 2006-01-31 2010-09-21 Celaya, Emparanza Y Galdos, Internacional, S.A. Iron sole and iron containing same
US20200397052A1 (en) * 2018-03-07 2020-12-24 Hauni Maschinenbau Gmbh Method for manufacturing an electrically operable heating body for an inhaler
US11958068B2 (en) * 2018-03-07 2024-04-16 Körber Technologies Gmbh Method for manufacturing an electrically operable heating body for an inhaler

Also Published As

Publication number Publication date
DE2044675A1 (de) 1972-03-16
FR2105845A5 (enrdf_load_stackoverflow) 1972-04-28
DE2044675B2 (de) 1972-07-20
BE771372A (fr) 1971-12-31

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