US3789263A - Rf filters with glass on a substrate - Google Patents
Rf filters with glass on a substrate Download PDFInfo
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- US3789263A US3789263A US00223624A US3789263DA US3789263A US 3789263 A US3789263 A US 3789263A US 00223624 A US00223624 A US 00223624A US 3789263D A US3789263D A US 3789263DA US 3789263 A US3789263 A US 3789263A
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- glass
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- 239000000758 substrate Substances 0.000 title claims abstract description 47
- 239000011521 glass Substances 0.000 title claims description 40
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 238000007747 plating Methods 0.000 claims abstract description 10
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910001415 sodium ion Inorganic materials 0.000 claims description 5
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 4
- 230000005012 migration Effects 0.000 claims description 4
- 238000013508 migration Methods 0.000 claims description 4
- 229910052708 sodium Inorganic materials 0.000 claims description 4
- 239000011734 sodium Substances 0.000 claims description 4
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 2
- 238000005816 glass manufacturing process Methods 0.000 claims description 2
- 229910000464 lead oxide Inorganic materials 0.000 claims description 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000005355 lead glass Substances 0.000 abstract description 5
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 5
- 229910002113 barium titanate Inorganic materials 0.000 description 5
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 238000001652 electrophoretic deposition Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000003570 air Substances 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
- H01R13/7197—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters with filters integral with or fitted onto contacts, e.g. tubular filters
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
- C04B35/4682—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates based on BaTiO3 perovskite phase
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/215—Frequency-selective devices, e.g. filters using ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H1/0007—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network of radio frequency interference filters
Definitions
- ABSTRACT A low pass RF filter for high voltage feed-through to the filament of a magnetron.
- the filter comprises a ferrite substrate in the form of a sleeve with the outer surface of the sleeve carrying a dielectric layer comprising a lead oxide glass.
- the dielectric layer also comprises aluminum oxide to provide a rough surface for metal plating without increasing the coefficient of thermal expansion of the dielectric layer relative to the ferrite substrate.
- This invention relates to low pass RF filters and more particularly to low pass RF filters having a substrate carrying a dielectric material.
- This invention also relates to low pass filters for high voltage feed-through applications.
- the filament of the microwave oven magnetron is supplied with a high voltage from the filament transformer. Unless a low pass RF filter is utilized, it is possible for rnicrowave energy to be propagated back to and along the power supply line creating a risk of radiation as warned by the Department of Health, Education and Welfare.
- a dielectric layer comprising barium titanate is carried by a ferrite substrate in the form of a tube or sleeve.
- the barium titanate is particularly desirable since it is relatively low cost and corrosion resistant.
- it may be electrophoretically deposited on the substrate to assure a uniform self-leveling dielectric layer.
- barium titanate makes it ill-suited for many high voltage feed-through applications, e.g., a microwave filter for use with the high voltage filament of a magnetron in a microwave oven.
- Tests on barium titanate indicate that it will undergo a breakdown with sustained use at a voltage of 600 to 700 volts which is the operating range of the magnetron filament on a microwave oven.
- many materials which could conceivably be substituted for the barium titanate exhibit leakage at the high ambient temperatures generated by the microwave oven. Other materials do not provide the desired electrical characteristics and other properties which are exhibited by the filter disclosed in the aforesaid Fritz application.
- a low pass RF filter of one specific embodiment comprises a ferrite substrate carrying a dielectric layer comprising glass.
- the glass is characterized by low leakage at ambient temperatures in excess of 200C.
- a lead oxide glass is particularly well suited for this purpose since it is characterized by low leakage due to a low migration of sodium ions at these ambient temperatures.
- the ferrite substrate is in the form of a tube and the dielectric layer including the glass is carried on the outer surface of the tube.
- the dielectric layer further comprises aluminum oxide (A1 0 so as to provide a dielectric layer with a rough surface permitting metal plating thereon. Since aluminum oxidehas a coefficient of expansion less than the ferrite substrate, the addition of aluminum oxide does not adversely affect the compressive force between the glass and the ferrite substrate.
- the dielectric layer is uniformly applied to the substrate without pin holes through the dielectric layer. This is accomplished by the electrophoretic deposition of the dielectric layer.
- the central opening in the tube of the filter receives a connector pin associated with the high voltage filament of a magnetron which may be used as a source of microwave energy in a microwave oven.
- the filter is effective to prevent the microwave energy from the magnetron from propagating back to and along the power supply line for the oven at the high ambient temperatures and operating voltages encountered in this particular application.
- FIG. 1 is an axially sectioned view of a filter constructed in accordance with the present invention
- FIG. 2 is an axially sectioned view of a connector assembly utilizing the filter of FIG. 1;
- FIG. 3 is a schematic diagram of a magnetron system wherein the filter of FIGS. 1- and 2 is utilized in conjunction with the magnetron filament.
- a filter constructed in accordance with this invention will now be described with reference to FIGS. 1 and 2.
- a substrate in the form of an extruded ferrite 10 carries a dielectric layer 12 comprising a glass characterized by low electrical leakage at ambient temperatures of 200 to 300C and operating voltages of 600 to 700 volts.
- Metal plating 14 is applied to the glass 12 and the ferrite 10 along its axial opening 6. Gaps 18 and 20 are left in the metal plating 14 to isolate the pin 22, which is received in the axial opening 6, from the ground plane 24.
- a lead oxide glass may be utilized in the dielectric layer 12 to obtain the desired low leakage at high ambient temperatures.
- a soft, Gl2 glass such as the KGl2 manufactured and sold by Owens-Illinois and 0120 glass manufactured and sold by Corning Glass Works may be utilized. These glasses are particularly advantageous since they are corrosive resistant at ambient temperatures of 200C to 300C and are also commercially available at a relatively reasonable cost.
- a lead oxide glass such as G12 which is a low sodium glass displays the necessary low leakage characteristics at ambient temperatures of 200C 300C since there is little sodium ion migration through the glass.
- the glass of the dielectric layer 12 is characterized by a coefficient of thermal expansion which is only slightly less than the coefficient of thermal expansion for the ferrite substrate 10, 90x10" per C as compared with 100 10" to ll 10"" per C at room temperature. These relative coefficients of thermal expansion establish a compressive force between the dielectric layer 12 and the ferrite substrate to improve the mechanical strength of the glass.
- the dielectric layer 12 includes aluminum oxide (Al- 0 which provides a rough outer surface to permit adhesion of the metal plating l4, e.g., silver, to the dielectric layer 12.
- Aluminum oxide is particularly desirable since it too has a coefficient of thermal expansion which is less than the ferrite substrate so as not to adversely affect the compressive force between the dielectric layer 12 and the ferrite substrate 10.
- the dielectric layer 12 is uniformly applied to the substrate 10 without any pin holes through the layer 12. This is accomplished by ball milling the glass for some 16 hours and then passing the glass through a 200 mesh screen. This is followed by the electrophoretic deposition of the glass and aluminum oxide using a slurry made with an organic solvent which will not adversely affect the glass components of the slurry to any appreciable degree. Ethyl acetate has been found to be particularly wellsuited for use as the organic solvent when utilized. in accordance with the electrophoretic deposition process described in the Senderoff et al. U.S. Pat. No. 2,843,541. The filter is then fired in a suitable atmosphere such as nitrogen, argon or air and at a temperature sufficient to fire the glass particles into a smooth dense layer. However, the firing temperature must not be too high to avoid damaging the ferrite.
- a suitable atmosphere such as nitrogen, argon or air
- ferrite substrate has been described, it will be understood that other high magnetic permeability, resistive substrates may be utilized.
- a doped semiconductive ceramic materialmight be utilized as disclosed in the aforesaid application Ser. No.
- the electrical characteristics of a filter constructed in accordance with this invention compare quite favorably with the excellent electrical characteristics of the filter described in the-aforesaid Fritz application Ser. No. 88,042.
- the filter of this invention exhibits an attenuation of 20dB at 915 MI-L. which is more than adequate to prevent any microwave radiation hazard due to the propogation of microwave energy from the magnetron filament back to-the power supply line.
- FIGS. 1 and 2 The filter of FIGS. 1 and 2 will now be described as part of a source of microwave energy which is particularly well suited for use in a microwave oven.
- a system comprises a magnetron 26 with a high voltage input circuit 28 and a filament 30.
- the filament 30 is supplied by a filament transformer 32 through a low pass RF filter means 34 constructed in accordance with this invention.
- the filter means 34 which is a distributed impedance filter is so illustrated.
- each line 36 of the filament 30 employs a filter assembly such as that shown in FIG. 2.
- a pin 22 of the assembly shown in FIG. 2 is connected between each line 36 and one terminal of the filament transformer 32.
- ground as shown in FIG. 3 is established by the ground plane 24 as shown in FIG. 2.
- An RF low pass filter for use in a high temperature environment comprising:
- a dielectricv layer comprising glass characterized by low electrical leakage at ambient temperatures of 200C to 300C, wherein said substrate is in the form of a tube and said dielectric layer is carried directly by the exterior surface of said tube, said dielectric layer being characterized by a coefficient of thermal expansion which is less than the coefi'icient of thermal expansion for said substrate,
- a microwave system for use in an ambient of high temperature comprising:
- a distributed low pass RF filter means for feeding said high voltage through to said filament while preventing microwave energy of said magnetronx from being propogated back to the input of said filament which is less than the coefficient of thermal expantfansfol'mel'
- Said Substrate is in the form of a tube and ment transformer inserted within the metal plated said dielectric layer is carried directly by the exteaxial Opening of said Substrate in electrical rior surface of said tube, said dielectric layer being 10 Pl g r n th
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- Chemical & Material Sciences (AREA)
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- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Microwave Tubes (AREA)
- Filters And Equalizers (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
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- Filtering Materials (AREA)
Abstract
A low pass RF filter for high voltage feed-through to the filament of a magnetron. The filter comprises a ferrite substrate in the form of a sleeve with the outer surface of the sleeve carrying a dielectric layer comprising a lead oxide glass. The dielectric layer also comprises aluminum oxide to provide a rough surface for metal plating without increasing the coefficient of thermal expansion of the dielectric layer relative to the ferrite substrate.
Description
United States Patent [191 Fritz et al.
[ Jan. 29, 1974 RF FILTERS WITH GLASS ON A SUBSTRATE [75] Inventors: William Baird Fritz, Hershey; John Wayne Tiley, Hatboro; Neil Harrison Sanders, Carlisle, all of Pa.
[73] Assignee: AMP Incorporated, Harrisburg, Pa.
[22] Filed: Feb. 4, 1972 [21] App]. No.: 223,624
[52] US. Cl 315/39.51, 333/79, 315/39.53, 315/85, 336/233, ll7/l24 C [51] Int. Cl. H01j 23/20 [58] Field of Search.. 333/79; 3l5/39.5l, 39.53, 85; 117/124 C; 336/233 [56] References Cited UNITED STATES PATENTS 3,588,758 6/1971 Hurst 333/79 3,425,004 1] 1969 Warner 333/79 3,456,151 7/1969 Staats.... 3l5/39.51 2,820,720 l/l958 lversen 336/233 X Primary ExaminerRudolph V. Rolinec Assistant Examiner--Saxfield Chatmon, Jr.
[57] ABSTRACT A low pass RF filter for high voltage feed-through to the filament of a magnetron. The filter comprises a ferrite substrate in the form of a sleeve with the outer surface of the sleeve carrying a dielectric layer comprising a lead oxide glass. The dielectric layer also comprises aluminum oxide to provide a rough surface for metal plating without increasing the coefficient of thermal expansion of the dielectric layer relative to the ferrite substrate.
9 Claims, 3 Drawing Figures PATENTED 3.789.263
1 DISTRIBUTED FILTER g oNE EACH WIRE TO GND) I 1 a l FILAMENT TRANSFORMER RF FILTERS WITH GLASS ON A SUBSTRATE BACKGROUND OF THE INVENTION This invention relates to low pass RF filters and more particularly to low pass RF filters having a substrate carrying a dielectric material.
This invention also relates to low pass filters for high voltage feed-through applications.
One very important high voltage feed-through application for such a filter is the microwave oven. The filament of the microwave oven magnetron is supplied with a high voltage from the filament transformer. Unless a low pass RF filter is utilized, it is possible for rnicrowave energy to be propagated back to and along the power supply line creating a risk of radiation as warned by the Department of Health, Education and Welfare.
A relatively low cost RF filter charcterized by excellent electrical properties, a distributed impedance and a high capacity is described in copending application of William B. Fritz, Coated Ferrite RF Filters," Ser. No. 88,042, filed Nov. 9, 1970, which is assigned to the assignee of this invention. In one embodiment of the filter disclosed in the aforesaid application, a dielectric layer comprising barium titanate is carried by a ferrite substrate in the form of a tube or sleeve. The barium titanate is particularly desirable since it is relatively low cost and corrosion resistant. In addition, it may be electrophoretically deposited on the substrate to assure a uniform self-leveling dielectric layer.
However, the dielectric strength of barium titanate makes it ill-suited for many high voltage feed-through applications, e.g., a microwave filter for use with the high voltage filament of a magnetron in a microwave oven. Tests on barium titanate indicate that it will undergo a breakdown with sustained use at a voltage of 600 to 700 volts which is the operating range of the magnetron filament on a microwave oven. Furthermore, many materials which could conceivably be substituted for the barium titanate exhibit leakage at the high ambient temperatures generated by the microwave oven. Other materials do not provide the desired electrical characteristics and other properties which are exhibited by the filter disclosed in the aforesaid Fritz application.
SUMMARY OF THE INVENTION It is an object of this invention to provide a low pass RF filter of the type comprising a substrate carrying a dielectric layer which exhibits the desired electrical characteristics at high operating voltages.
It is another object of this invention to provide such a filter wherein the dielectric layer is not characterized by leakage at high ambient temperatures and high operating voltages.
It is another object of this invention to provide such a filter wherein the dielectric layer is corrosion resistant.
It is a further object of this invention to provide such a filter wherein the dielectric layer is relatively inexpensive.
It is a still further object of this invention to provide such a filter wherein the dielectric layer is uniformly applied to the substrate. I
In accordance with these and other objects of the invention, a low pass RF filter of one specific embodiment comprises a ferrite substrate carrying a dielectric layer comprising glass. The glass is characterized by low leakage at ambient temperatures in excess of 200C. A lead oxide glass is particularly well suited for this purpose since it is characterized by low leakage due to a low migration of sodium ions at these ambient temperatures.
In accordance with one important aspect of the invention, the ferrite substrate is in the form of a tube and the dielectric layer including the glass is carried on the outer surface of the tube. By utilizing a glass with a lesser coefficient of expansion than the ferrite substrate, a compressive force is developed between the glass and the substrate to increase the mechanical strength of the glass.
In accordance with another important aspect of the invention, the dielectric layer further comprises aluminum oxide (A1 0 so as to provide a dielectric layer with a rough surface permitting metal plating thereon. Since aluminum oxidehas a coefficient of expansion less than the ferrite substrate, the addition of aluminum oxide does not adversely affect the compressive force between the glass and the ferrite substrate.
In accordance with another important aspect of the invention, the dielectric layer is uniformly applied to the substrate without pin holes through the dielectric layer. This is accomplished by the electrophoretic deposition of the dielectric layer.
In accordance with still another aspect of the invention, the central opening in the tube of the filter receives a connector pin associated with the high voltage filament of a magnetron which may be used as a source of microwave energy in a microwave oven. The filter is effective to prevent the microwave energy from the magnetron from propagating back to and along the power supply line for the oven at the high ambient temperatures and operating voltages encountered in this particular application.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an axially sectioned view of a filter constructed in accordance with the present invention;
FIG. 2 .is an axially sectioned view of a connector assembly utilizing the filter of FIG. 1; and
FIG. 3 is a schematic diagram of a magnetron system wherein the filter of FIGS. 1- and 2 is utilized in conjunction with the magnetron filament.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS A filter constructed in accordance with this invention will now be described with reference to FIGS. 1 and 2. A substrate in the form of an extruded ferrite 10 carries a dielectric layer 12 comprising a glass characterized by low electrical leakage at ambient temperatures of 200 to 300C and operating voltages of 600 to 700 volts. Metal plating 14 is applied to the glass 12 and the ferrite 10 along its axial opening 6. Gaps 18 and 20 are left in the metal plating 14 to isolate the pin 22, which is received in the axial opening 6, from the ground plane 24.
It has been found that a lead oxide glass may be utilized in the dielectric layer 12 to obtain the desired low leakage at high ambient temperatures. For example, a soft, Gl2 glass such as the KGl2 manufactured and sold by Owens-Illinois and 0120 glass manufactured and sold by Corning Glass Works may be utilized. These glasses are particularly advantageous since they are corrosive resistant at ambient temperatures of 200C to 300C and are also commercially available at a relatively reasonable cost. A lead oxide glass such as G12 which is a low sodium glass displays the necessary low leakage characteristics at ambient temperatures of 200C 300C since there is little sodium ion migration through the glass.
It will of course be understood that the desired low leakage at these temperatures might also be achieved with other low sodium glasses wherein the sodium ions are replaced by other alkali metal ions such as barium or potasium. In general, it is preferable to utilize a glass which is characterized by a resistance greater than I megaohm percube.
In accordance with one aspect of the invention, the glass of the dielectric layer 12 is characterized by a coefficient of thermal expansion which is only slightly less than the coefficient of thermal expansion for the ferrite substrate 10, 90x10" per C as compared with 100 10" to ll 10"" per C at room temperature. These relative coefficients of thermal expansion establish a compressive force between the dielectric layer 12 and the ferrite substrate to improve the mechanical strength of the glass.
In accordance with another aspect of the invention, the dielectric layer 12 includes aluminum oxide (Al- 0 which provides a rough outer surface to permit adhesion of the metal plating l4, e.g., silver, to the dielectric layer 12. Aluminum oxide is particularly desirable since it too has a coefficient of thermal expansion which is less than the ferrite substrate so as not to adversely affect the compressive force between the dielectric layer 12 and the ferrite substrate 10.
In accordance with another aspect of the invention, the dielectric layer 12 is uniformly applied to the substrate 10 without any pin holes through the layer 12. This is accomplished by ball milling the glass for some 16 hours and then passing the glass through a 200 mesh screen. This is followed by the electrophoretic deposition of the glass and aluminum oxide using a slurry made with an organic solvent which will not adversely affect the glass components of the slurry to any appreciable degree. Ethyl acetate has been found to be particularly wellsuited for use as the organic solvent when utilized. in accordance with the electrophoretic deposition process described in the Senderoff et al. U.S. Pat. No. 2,843,541. The filter is then fired in a suitable atmosphere such as nitrogen, argon or air and at a temperature sufficient to fire the glass particles into a smooth dense layer. However, the firing temperature must not be too high to avoid damaging the ferrite.
Although a ferrite substrate has been described, it will be understood that other high magnetic permeability, resistive substrates may be utilized. For example, a doped semiconductive ceramic materialmight be utilized as disclosed in the aforesaid application Ser. No.
' 88,042 which is incorporated herein by reference.
The electrical characteristics of a filter constructed in accordance with this invention compare quite favorably with the excellent electrical characteristics of the filter described in the-aforesaid Fritz application Ser. No. 88,042. For example, the filter of this invention exhibits an attenuation of 20dB at 915 MI-L. which is more than adequate to prevent any microwave radiation hazard due to the propogation of microwave energy from the magnetron filament back to-the power supply line.
The filter of FIGS. 1 and 2 will now be described as part of a source of microwave energy which is particularly well suited for use in a microwave oven. As shown in FIG. 3, a system comprises a magnetron 26 with a high voltage input circuit 28 and a filament 30. The filament 30 is supplied by a filament transformer 32 through a low pass RF filter means 34 constructed in accordance with this invention. The filter means 34 which is a distributed impedance filter is so illustrated.
It will be understood that each line 36 of the filament 30 employs a filter assembly such as that shown in FIG. 2. In other words, a pin 22 of the assembly shown in FIG. 2 is connected between each line 36 and one terminal of the filament transformer 32. It will also be understood that ground as shown in FIG. 3 is established by the ground plane 24 as shown in FIG. 2.
Although the filter described above is particularly useful for high voltage feed-through to the magnetron filament in a microwave oven, other high voltage feed through applications will occur to those of ordinary skill in the art.
It will be understood that, even though a particular embodiment of the invention has been shown and described, various modifications may be made without departing from the spirit and scope of the invention as set forth in the appended claims.
What is claimed is:
1. An RF low pass filter for use in a high temperature environment comprising:
a substrate, and
a dielectricv layer comprising glass characterized by low electrical leakage at ambient temperatures of 200C to 300C, wherein said substrate is in the form of a tube and said dielectric layer is carried directly by the exterior surface of said tube, said dielectric layer being characterized by a coefficient of thermal expansion which is less than the coefi'icient of thermal expansion for said substrate,
and electrically conductive means on the outer surface of the glass and inner surface of the substrate for connection in a circuit.
2. Thefilter of claim 1 wherein said dielectric layer is characterized by a rough surface, and said conduction'means comprising metal plating adhering to said rough surface.
3. The filter of claim I wherein said dielectric layer is uniformly applied to said substrate.
4. The filter of claim I wherein said glass comprises lead oxide.
5. The filter of claim 1 wherein said dielectric layer further comprises aluminum oxide.
6. The lossy filter of claim 1 wherein said substrate comprises ferrite.
7. The filter of claim 1 wherein said glass is a low sodium glass characterized by low sodium ion migration at high temperatures.
8. The filler of claim I wherein the resistance of said glass is no less than one megaohm per cube.
9. A microwave system for use in an ambient of high temperature comprising:
a magnetron having a filament;
a filament transformer supplying a high voltage to said filament; and
.a distributed low pass RF filter means for feeding said high voltage through to said filament while preventing microwave energy of said magnetronx from being propogated back to the input of said filament which is less than the coefficient of thermal expantfansfol'mel', Said filter means p g: sion for said substrate, the outer surface of said filter housmg havmg a ground Plane; glass and the axial opening of said substrate being a filter comprising a substrate and a dielectric layer T i by Said Substrate Said dielectric T com- 5 electrical contact with said ground plane, and prising glass characterized by low electrical leakage at ambient temperatures of 200C to 300C a pm connected betyveen said filament and said filawherein Said Substrate is in the form of a tube and ment transformer inserted within the metal plated said dielectric layer is carried directly by the exteaxial Opening of said Substrate in electrical rior surface of said tube, said dielectric layer being 10 Pl g r n th r with. characterized by a coefficient of thermal expansion metal plated, the metal plating of said glass making
Claims (8)
- 2. The filter of claim 1 wherein said dielectric layer is characterized by a rough surface, and said conduction means comprising metal plating adhering to said rough surface.
- 3. The filter of claim 1 wherein said dielectric layer is uniformly applied to said substrate.
- 4. The filter of claim 1 wherein said glass comprises lead oxide.
- 5. The filter of claim 1 wherein said dielectric layer further comprises aluminum oxide.
- 6. The lossy filter of claim 1 wherein said substrate comprises ferrite.
- 7. The filter of claim 1 wherein said glass is a low sodium glass characterized by low sodium ion migration at high temperatures.
- 8. The filler of claim 7 wherein the resistance of said glass is no less than one megaohm per cube.
- 9. A microwave system for use in an ambient of high temperature comprising: a magnetron having a filament; a filament transformer supplying a high voltage to said filament; and a distributed low pass RF filter means for feeding said high voltage through to said filament while preventing microwave energy of said magnetronx from being propogated back to the input of said filament transformer, said filter means comprising: a filter housing having a ground plane; a filter comprising a substrate and a dielectric layer carried by said substrate, said dielectric layer comprising glass characterized by low electrical leakage at ambient temperatures of 200*C to 300*C, wherein said substrate is in the form of a tube and said dielectric layer is carried directly by the exterior surface of said tube, said dielectric layer being characterized by a coefficient of thermal expansion which is less than the coefficient of thermal expansion for said substrate, the outer surface of said glass and the axial opening of said substrate being metal plated, the metal plating of said glass making electrical contact with said ground plane, and a pin connected between said filament and said filament transformer inserted within the metal plated axial opening of said substrate in electrical coupling relation therewith.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22362472A | 1972-02-04 | 1972-02-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3789263A true US3789263A (en) | 1974-01-29 |
Family
ID=22837318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US00223624A Expired - Lifetime US3789263A (en) | 1972-02-04 | 1972-02-04 | Rf filters with glass on a substrate |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3789263A (en) |
| JP (1) | JPS5747565B2 (en) |
| BR (1) | BR7300765D0 (en) |
| CA (1) | CA983134A (en) |
| GB (1) | GB1413021A (en) |
| HK (1) | HK20879A (en) |
| IT (1) | IT1046682B (en) |
| SE (1) | SE387494B (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4100463A (en) * | 1975-11-05 | 1978-07-11 | Hitachi, Ltd. | Magnetron, power supply, and fan integral assembly |
| US4104561A (en) * | 1975-11-28 | 1978-08-01 | New Nippon Electric Co., Ltd. | Magnetron operating circuit |
| US4164685A (en) * | 1976-09-14 | 1979-08-14 | Tokyo Shibaura Electric Co., Ltd. | Magnetron device |
| EP0025367A1 (en) * | 1979-08-31 | 1981-03-18 | The Bendix Corporation | Filter connector |
| US4652842A (en) * | 1983-03-21 | 1987-03-24 | Amp Incorporated | Stamped and formed filter pin terminal having an aperture for preventing solder wicking |
| US4698605A (en) * | 1982-11-04 | 1987-10-06 | Murata Manufacturing Co., Ltd. | Monolithic LC feed-through filter having a ferrite body with a re-oxidized capacitive layer |
| US4992060A (en) * | 1989-06-28 | 1991-02-12 | Greentree Technologies, Inc. | Apparataus and method for reducing radio frequency noise |
| EP0583809A1 (en) * | 1992-07-20 | 1994-02-23 | General Motors Corporation | Ferroelectric-ferromagnetic composite materials |
| US5382928A (en) * | 1993-01-22 | 1995-01-17 | The Whitaker Corporation | RF filter having composite dielectric layer and method of manufacture |
| EP0690528A2 (en) | 1994-06-27 | 1996-01-03 | General Motors Corporation | Filter elements having ferroelectric-ferromagnetic composite materials |
| US5604405A (en) * | 1993-07-07 | 1997-02-18 | Hitachi, Ltd. | Magnetron with feed-through capacitor having a dielectric constant effecting a decrease in acoustic noise |
| RU2121696C1 (en) * | 1997-04-24 | 1998-11-10 | Савенков Валерий Витальевич | Device for indication of current modes in electric equipment |
| US5838212A (en) * | 1996-01-11 | 1998-11-17 | Eev Limited | High frequency transition arrangement |
| US6346865B1 (en) | 1999-04-29 | 2002-02-12 | Delphi Technologies, Inc. | EMI/RFI filter including a ferroelectric/ferromagnetic composite |
| US9269797B2 (en) * | 2011-04-27 | 2016-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| CN107919518A (en) * | 2017-11-13 | 2018-04-17 | 西安电子工程研究所 | Gao Zhongying wide range high-power microwave oscillator based on gyromagnet type strip transmission line |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5978724U (en) * | 1982-11-18 | 1984-05-28 | 株式会社村田製作所 | LC filter |
| FI101330B1 (en) * | 1996-08-29 | 1998-05-29 | Nokia Telecommunications Oy | Procedure for tuning the summation network into a base station |
| FI101329B (en) * | 1996-08-29 | 1998-05-29 | Nokia Telecommunications Oy | Procedure for tuning the summation network into a base station |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2820720A (en) * | 1954-09-15 | 1958-01-21 | Hughes Aircraft Co | Glass-bonded ferrite |
| US3425004A (en) * | 1963-11-29 | 1969-01-28 | Mc Donnell Douglas Corp | Radio frequency energy attenuator |
| US3456151A (en) * | 1966-07-27 | 1969-07-15 | Gen Electric | Crossed-field discharge device and coupler therefor and microwave circuits incorporating the same |
| US3588758A (en) * | 1969-04-28 | 1971-06-28 | Itt | Electrical connector filter having dielectric and ferromagnetic tubes bonded together with conductive electrode layers and having nonintegral connecting spring |
-
1972
- 1972-02-04 US US00223624A patent/US3789263A/en not_active Expired - Lifetime
-
1973
- 1973-01-10 CA CA160,912A patent/CA983134A/en not_active Expired
- 1973-01-16 GB GB214073A patent/GB1413021A/en not_active Expired
- 1973-01-16 IT IT19276/73A patent/IT1046682B/en active
- 1973-01-31 BR BR73765A patent/BR7300765D0/en unknown
- 1973-02-02 SE SE7301465A patent/SE387494B/en unknown
- 1973-02-05 JP JP48013873A patent/JPS5747565B2/ja not_active Expired
-
1979
- 1979-03-29 HK HK208/79A patent/HK20879A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2820720A (en) * | 1954-09-15 | 1958-01-21 | Hughes Aircraft Co | Glass-bonded ferrite |
| US3425004A (en) * | 1963-11-29 | 1969-01-28 | Mc Donnell Douglas Corp | Radio frequency energy attenuator |
| US3456151A (en) * | 1966-07-27 | 1969-07-15 | Gen Electric | Crossed-field discharge device and coupler therefor and microwave circuits incorporating the same |
| US3588758A (en) * | 1969-04-28 | 1971-06-28 | Itt | Electrical connector filter having dielectric and ferromagnetic tubes bonded together with conductive electrode layers and having nonintegral connecting spring |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4100463A (en) * | 1975-11-05 | 1978-07-11 | Hitachi, Ltd. | Magnetron, power supply, and fan integral assembly |
| US4104561A (en) * | 1975-11-28 | 1978-08-01 | New Nippon Electric Co., Ltd. | Magnetron operating circuit |
| US4164685A (en) * | 1976-09-14 | 1979-08-14 | Tokyo Shibaura Electric Co., Ltd. | Magnetron device |
| EP0025367A1 (en) * | 1979-08-31 | 1981-03-18 | The Bendix Corporation | Filter connector |
| US4275945A (en) * | 1979-08-31 | 1981-06-30 | The Bendix Corporation | Filter connector with compound filter elements |
| US4698605A (en) * | 1982-11-04 | 1987-10-06 | Murata Manufacturing Co., Ltd. | Monolithic LC feed-through filter having a ferrite body with a re-oxidized capacitive layer |
| US4652842A (en) * | 1983-03-21 | 1987-03-24 | Amp Incorporated | Stamped and formed filter pin terminal having an aperture for preventing solder wicking |
| US4992060A (en) * | 1989-06-28 | 1991-02-12 | Greentree Technologies, Inc. | Apparataus and method for reducing radio frequency noise |
| US5512196A (en) * | 1992-07-20 | 1996-04-30 | General Motors Corporation | Ferroelectric-ferromagnetic composite materials |
| EP0583809A1 (en) * | 1992-07-20 | 1994-02-23 | General Motors Corporation | Ferroelectric-ferromagnetic composite materials |
| US5856770A (en) * | 1992-07-20 | 1999-01-05 | General Motors Corporation | Filter with ferroelectric-ferromagnetic composite materials |
| US5382928A (en) * | 1993-01-22 | 1995-01-17 | The Whitaker Corporation | RF filter having composite dielectric layer and method of manufacture |
| US5604405A (en) * | 1993-07-07 | 1997-02-18 | Hitachi, Ltd. | Magnetron with feed-through capacitor having a dielectric constant effecting a decrease in acoustic noise |
| EP0690528A2 (en) | 1994-06-27 | 1996-01-03 | General Motors Corporation | Filter elements having ferroelectric-ferromagnetic composite materials |
| US5497129A (en) * | 1994-06-27 | 1996-03-05 | General Motors Corporation | Filter elements having ferroelectric-ferromagnetic composite materials |
| US5838212A (en) * | 1996-01-11 | 1998-11-17 | Eev Limited | High frequency transition arrangement |
| RU2121696C1 (en) * | 1997-04-24 | 1998-11-10 | Савенков Валерий Витальевич | Device for indication of current modes in electric equipment |
| US6346865B1 (en) | 1999-04-29 | 2002-02-12 | Delphi Technologies, Inc. | EMI/RFI filter including a ferroelectric/ferromagnetic composite |
| US9269797B2 (en) * | 2011-04-27 | 2016-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| US20160163544A1 (en) * | 2011-04-27 | 2016-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| US9543145B2 (en) * | 2011-04-27 | 2017-01-10 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| US9911767B2 (en) * | 2011-04-27 | 2018-03-06 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device comprising oxide semiconductor |
| US10249651B2 (en) | 2011-04-27 | 2019-04-02 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| CN107919518A (en) * | 2017-11-13 | 2018-04-17 | 西安电子工程研究所 | Gao Zhongying wide range high-power microwave oscillator based on gyromagnet type strip transmission line |
Also Published As
| Publication number | Publication date |
|---|---|
| HK20879A (en) | 1979-04-06 |
| IT1046682B (en) | 1980-07-31 |
| AU5130273A (en) | 1974-07-25 |
| JPS4889646A (en) | 1973-11-22 |
| BR7300765D0 (en) | 1973-09-20 |
| JPS5747565B2 (en) | 1982-10-09 |
| GB1413021A (en) | 1975-11-05 |
| CA983134A (en) | 1976-02-03 |
| SE387494B (en) | 1976-09-06 |
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