US3753871A - Multihardness electrodeposits - Google Patents
Multihardness electrodeposits Download PDFInfo
- Publication number
- US3753871A US3753871A US00201360A US3753871DA US3753871A US 3753871 A US3753871 A US 3753871A US 00201360 A US00201360 A US 00201360A US 3753871D A US3753871D A US 3753871DA US 3753871 A US3753871 A US 3753871A
- Authority
- US
- United States
- Prior art keywords
- electrodeposit
- activation
- electrodeposition
- zone
- rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002659 electrodeposit Substances 0.000 title abstract description 24
- 238000004137 mechanical activation Methods 0.000 abstract description 8
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 238000001994 activation Methods 0.000 description 19
- 230000004913 activation Effects 0.000 description 17
- 238000000034 method Methods 0.000 description 17
- 238000004070 electrodeposition Methods 0.000 description 16
- 239000002245 particle Substances 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 235000019589 hardness Nutrition 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 238000007747 plating Methods 0.000 description 11
- 238000000151 deposition Methods 0.000 description 9
- 230000008021 deposition Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 239000012190 activator Substances 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000001427 coherent effect Effects 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 230000003213 activating effect Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920004934 Dacron® Polymers 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910001570 bauxite Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- BQJTUDIVKSVBDU-UHFFFAOYSA-L copper;sulfuric acid;sulfate Chemical compound [Cu+2].OS(O)(=O)=O.[O-]S([O-])(=O)=O BQJTUDIVKSVBDU-UHFFFAOYSA-L 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/22—Electroplating combined with mechanical treatment during the deposition
Definitions
- the present invention relates to the field of electrodeposition and, while useful in any electrodeposition process, is of particular utility in the fields of industrial plating and electroforming.
- the activation can be carried out by loose particles which are vibrated over the surface of the electrodeposit as described and claimed in US. Pat. No. 3,699,014 or by moving an activator belt or disc or the like having the small particles affixed to its surface over the surface of the electrodeposit as described and claimed in US. Pat. No. 3,619,384.
- the final 6 seconds of deposition were carried out at a slower deposition rate by dropping the current density to 500 amps per square foot while maintaining the same degree of activation (surface speed of the activator disc at 1,000 feet per minute and pressure against the deposit of 3 p.s.i.). While the portion of the deposit formed at this slower rate at the end of the deposition cycle was itself too thin to permit a direct hardness measurement,
- Plating was carried out for 6 minutes at 2,100 cycles per minute and a /s" amplitude of vibration at a current density of 150 amps per square foot. The plating rate was then dropped by reducing the current density to 73 amps per square foot an additional run at 500 a.s.f. under the same degree of Example 2 Using the type of activation process described and claimed in U.S. Pat. No. 3,699,014, a nickel electrodeposit was laid down using a commercial /3 cu. ft. vibratory abrasive finishing machine (Vibratub Model 33) modified to contain two flat nickel anodes spaced two and plating continued for 13 minutes. The resulting plate had an initial layer of nickel on the substrate having a hardness of 198 Knoop and a thickness of 0.5 mil with an outer layer or skin of nickel approximately 0.5 mil thick and having a Knoop hardness value of 223.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US20136071A | 1971-11-23 | 1971-11-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3753871A true US3753871A (en) | 1973-08-21 |
Family
ID=22745524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US00201360A Expired - Lifetime US3753871A (en) | 1971-11-23 | 1971-11-23 | Multihardness electrodeposits |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3753871A (ref) |
| JP (1) | JPS4863931A (ref) |
| DE (1) | DE2257322A1 (ref) |
| FR (1) | FR2160944B3 (ref) |
| IT (1) | IT975823B (ref) |
-
1971
- 1971-11-23 US US00201360A patent/US3753871A/en not_active Expired - Lifetime
-
1972
- 1972-11-22 DE DE2257322A patent/DE2257322A1/de active Pending
- 1972-11-22 IT IT70675/72A patent/IT975823B/it active
- 1972-11-22 FR FR7241435A patent/FR2160944B3/fr not_active Expired
- 1972-11-22 JP JP47117669A patent/JPS4863931A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| FR2160944A1 (ref) | 1973-07-06 |
| JPS4863931A (ref) | 1973-09-05 |
| DE2257322A1 (de) | 1973-06-20 |
| IT975823B (it) | 1974-08-10 |
| FR2160944B3 (ref) | 1976-01-09 |
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