US3737824A - Twisted multifilament superconductor - Google Patents

Twisted multifilament superconductor Download PDF

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Publication number
US3737824A
US3737824A US00280031A US3737824DA US3737824A US 3737824 A US3737824 A US 3737824A US 00280031 A US00280031 A US 00280031A US 3737824D A US3737824D A US 3737824DA US 3737824 A US3737824 A US 3737824A
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United States
Prior art keywords
substrate
superconductive
ribbon
masking material
photo resist
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Expired - Lifetime
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US00280031A
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English (en)
Inventor
W Coles
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National Aeronautics and Space Administration NASA
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National Aeronautics and Space Administration NASA
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0184—Manufacture or treatment of devices comprising intermetallic compounds of type A-15, e.g. Nb3Sn
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S336/00—Inductor devices
    • Y10S336/01—Superconductive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S424/00—Drug, bio-affecting and body treating compositions
    • Y10S424/08—Systemic pesticides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/825—Apparatus per se, device per se, or process of making or operating same
    • Y10S505/884—Conductor
    • Y10S505/887—Conductor structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/825—Apparatus per se, device per se, or process of making or operating same
    • Y10S505/917—Mechanically manufacturing superconductor
    • Y10S505/918—Mechanically manufacturing superconductor with metallurgical heat treating
    • Y10S505/919—Reactive formation of superconducting intermetallic compound
    • Y10S505/92—Utilizing diffusion barrier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49014—Superconductor

Definitions

  • This invention is directed -to-a twistedvmultifilament intermetallic compound. superconductive ribbon or tape.
  • the invention is.,particularly concei'nedvvith producing such'a material by controlling a diffusionzreaction process.
  • Existing technology has provided commercially available, flexible superconductive ribbon in t the form of T a substrate material .havirigabrittle superconductive intermetallic compound, such as Nb,'Sn or V Ga, formed onthe substrate by various means. Theseintermetallic,
  • the efiect is not solely determined-by the value'o'f the useful or transport current which niust ;-pass'th1rough' the-resistive region. It also dependsconrthe value of: the
  • Nontwisted current-sheet superconductors are subject to instabilities resulting from magnetization -'cur-' rents.
  • the severity o'flthe instability is stronglydependent on the rate ofchange'o'f magnetic field at theiconductor.
  • Nontwisted current-"sheet superconductors are totally unsuitable .for'alternatirrg.current applications.
  • Thin ribbons or tapes' of asuperconductive material such as Nb sn'or v Gafpresenta differentproblem.
  • a twisted Nb sn filamentary structure has been-produced in the form of cabled "strands and suggested'as strands in a matrix material.
  • these methods cannot produce the desired fle' xibility of the conductor because of the extreme brittleness of the intermetallic compound. Winding of the unreacted niobium and tin materials and then-reacting at'high temperatures to form a'compound in place has been used.
  • thisprocedure suffers from the disadvantages of requiring-hightemperature insulation-and results in a product that cannot be unwound or repaired.
  • Winding of conductor shapes other than thin ribbon results in excessive tensile stresses in the outer fibers of the conductor. This tends to destroy the brittle Nb Sn. The tensile stresses result'from the difference in circumferential distance traversed by the outer and inner'flbers of the conductor.
  • vStill another object of the invention is to 'form twisted filamentary current paths of superconductive intermetallic compounds having supporting structure between the filaments.
  • FIGS. 1 to '6 are sectional views illustrating the fabrication steps used to produce the superconductive ribbon of "the present invention
  • FIG. 7 is a-pei'spective view of a ribbon with masking material forming twisted filamentary paths.
  • FIG. '8 is a perspective view of a twisted filamentary superconductive ribbon constructed in accordance with the invention.
  • FIG. 8 a twisted, multifilament superconductive ribbon of an intermetallic compound constructed in accordance with the present invention.
  • This substrate is preferably in the form of a ribbon or tape a few hundredths of a millimeter thick and about 1.25 centimeters wide.
  • the substrate 10 shown in FIG. 1 is first cleaned of surface impurities. This is accomplished by degreasing, immersing in an alkali solution, ultrasonically cleaning, or abrasive cleaning. It is further contemplated that other forms of cleaning may be utilized.
  • the substrate 10 is then coated all over with an intermediate masking material 12, such as copper, as shown in FIG. 2. This may be accomplished by evaporative coating, plating, roll bonding, or metallic spraying.
  • an intermediate masking material 12 such as copper
  • Predetermined portions of the masking material 12 are then selectively removed to form the inverse of the final mask. Regions 14 in FIG. 4 are exposed base and regions 16 are covered with the intermediate mask. Removal of the masking material in the regions 14 is preferably accomplished by a photo resist process.
  • suitable photo resist material 18 such as Kodak KPR-3, as shown in FIG. 2.
  • the photo resist material is dried or baked. Then it is exposed to light selectively through previously prepared masks that are properly indexed on each side of the ribbon. In this manner the masks employed on each side of the ribbon are so positioned that continuous paths are formed across the faces of the ribbon and around the ribbon edges.
  • the final mask is formed on regions 20 of FIGS. and 7 by heating the substrate in an oxidizing atmosphere to a temperature between 200 C and 500 C.
  • the temperature is preferably near 370 C.
  • oxides of niobium form on the exposed niobium base, the photo resist material 18 burns off, and the copper 12 remains.
  • the heating is continued until an oxide layer forms on the region 14 of FIG. 4 to form the final mask 20 in FIGS. 5 to 8.
  • the intermediate mask on region 16 of FIG. 4 may then be removed or not. If the intermediate mask is copper it need not be removed.
  • a superconductive filament 22 shown in FIGS. 6 and 8 is then formed between the masked areas 20 by diffusion reaction. Copper will be displaced from the region 16 in the process.
  • Nb Sn is formed by such a diffusion reaction between the exposed niobium ribbonand molten tin at temperatures between 900 C to '1 200 C.
  • uncoated niobium ribbon may be masked with a plating resist material using a photo resist or printing process.
  • the ribbon is then selectively plated in the unmasked sections of the ribbon. After removal of the plating resist to expose the bare niobium,-the niobium oxide mask is formed. Then the diffusion reaction process is again used to form the Nb Sn superconductive compound.
  • Niobium ribbon 0.025 millimeters thick by 1.25 centimeters wide was cleaned in a sodium hydroxide solution for 10 minutes. The ribbon was then rinsed in distilled water and coated with a very thin film of copper in a vacuum chamber in which copper was evaporated and deposited on all surfaces of the niobium. This eliminates hydrogen contamination between the copper and the niobium.
  • the thinly copper coated strip was electroplated with copper to a copper thickness of about approximately 0.006 mm, rinsed, dried, and spray-coated on both sides and edges with Kodak KPR photo resist material. This was then air dried for 10 minutes and oven dried at F for 10 minutes.
  • Previously prepared photographic film masks with approximately 10 lines per inch and with an opaque line to transparent spacing width ratio of approximately 1:3 were placed on each side of the ribbon with opposite slopes as viewed from one side. They were indexed to match opaque to opaque and transparent to transparent at the edges of the ribbon sandwiched between them. Thin transparent sheets, such as Lucite, were placed on each side of the sandwich array to prevent inadvertentmisalignment. Exposure times of 5 h minutes were used on each side. This relatively long exposure time was required because the KPR is most sensitive in the near ultraviolet part of the spectrum and the added Lucite adsorbs ultraviolet light. After exposure, the ribbon was placed in Kodak photo resist developer for 2 12 minutes, rinsed, air dried for 10 minutes, and oven dried at a temperature of 170 F for 10 minutes.
  • the intermediate mask was formed by chemically etching away the unprotected copper to expose the niobium.
  • the final mask of niobium oxide was formed by heating the ribbon in air to a temperature of 370 C for 5 minutes. A light chemical etch in dilute nitric acid removed any remaining photo etch resist material and copper oxide. The niobium oxide is a very stable compound and was unaffected.
  • the ribbon was suspended from a stainless steel rod in a Vycor tube which extended into a vertical furnace.
  • the tube contained a tantalum crucible in the form of a tube with one closed end.
  • a chromel-alumel thermocouple was attached to the outside of the Vycor tube.
  • a transition to metal tubing was made, and in this section provision was made for attaching a vacuum pump, gage, and argon gas supply.
  • a sliding seal arrangement enabled vertical movement of the ribbon into and out of the furnace.
  • the apparatus was assembled, purged with argon gas, and pumped out several times to reduce contaminating residual gas levels. The apparatus was then pumped down to'the low micron range of 5l0p.. The furnace was then turned on, and when the thermocouple indicated a temperature of 970 C had been reached, the ribbon was lowered into the tantalum crucible containing the molten tin, allowed to remain in the tin for l A minutes, and withdrawn to just above the tin for an additional l 1% minutes still in the high temperature region of the furnace. The ribbon was then withdrawn from the hot section of the tube and the furnace shut off.
  • the ribbon was removed from the apparatus and tested for superconductive properties. Tests indicated the transition temperature was greater than l7.95 K and the critical current at 0.6 telsa is 150 amperes. Metallographic examination showed no traces of copper remaining.
  • a method of making a twisted multifilament superconductor comprising the steps of masking predetermined portions of a substrate to form a twisted configuration about said substrate,
  • a superconductive ribbon comprising a flexible substrate
  • each twisted multifilament is an intermetallic compound of the substrate material formed by diffusion reaction.
  • a superconductive ribbon as claimed in claim 9 wherein the superconductive compound is Nb Sn.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
US00280031A 1972-08-11 1972-08-11 Twisted multifilament superconductor Expired - Lifetime US3737824A (en)

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US28003172A 1972-08-11 1972-08-11

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US (1) US3737824A (pl)
JP (1) JPS4946177A (pl)
CA (1) CA971678A (pl)
DE (1) DE2324323C2 (pl)
FR (1) FR2195859B1 (pl)
GB (1) GB1401368A (pl)
NL (1) NL7306475A (pl)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3807041A (en) * 1971-12-22 1974-04-30 Imp Metal Ind Kynoch Ltd Method of fabricating a composite superconductor
US3811185A (en) * 1973-03-23 1974-05-21 Us Navy Method for enhancing v{11 ga thin film growth
US3868768A (en) * 1972-05-31 1975-03-04 Bbc Brown Boveri & Cie Method of producing a composite superconductor
US3874074A (en) * 1972-05-31 1975-04-01 Bbc Brown Boveri & Cie Method of fabricating a stabilized composite superconductor
US3876473A (en) * 1973-01-26 1975-04-08 Imp Metal Ind Kynoch Ltd Method of fabricating a composite intermetallic-type superconductor
US3900702A (en) * 1972-11-30 1975-08-19 Siemens Ag Ribbon-shaped conductor arrangement for superconductors which permits ease of cooling
US3902000A (en) * 1974-11-12 1975-08-26 Us Energy Termination for superconducting power transmission systems
US3997714A (en) * 1974-05-29 1976-12-14 Compagnie Generale D'electricite Superconductive lead having thin strips
US4080585A (en) * 1977-04-11 1978-03-21 Cubic Corporation Flat coil transformer for electronic circuit boards
US4367372A (en) * 1980-04-04 1983-01-04 Alsthom-Atlantique Flat multi-strand superconducting conductor with a separator
US5379019A (en) * 1993-10-12 1995-01-03 General Electric Company Apparatus for embossing superconducting tape for use in a superconducting magnet
US5593506A (en) * 1995-04-03 1997-01-14 General Electric Company Cleaning method for foil
WO2006078707A2 (en) * 2005-01-19 2006-07-27 Tosoh Smd Etna, Llc Automated sputtering target production and sub systems thereof
US20080217289A1 (en) * 2004-08-20 2008-09-11 Anelva Corporation Magnetoresistance effect device and method of production thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5370695A (en) * 1976-12-06 1978-06-23 Ulvac Corp Method of producing superconductive stock and composite material

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3187235A (en) * 1962-03-19 1965-06-01 North American Aviation Inc Means for insulating superconducting devices
US3366519A (en) * 1964-01-20 1968-01-30 Texas Instruments Inc Process for manufacturing multilayer film circuits
FR1532196A (fr) * 1966-07-25 1968-07-05 Oerlikon Maschf Conducteur fortement réfrigéré

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3187235A (en) * 1962-03-19 1965-06-01 North American Aviation Inc Means for insulating superconducting devices
US3366519A (en) * 1964-01-20 1968-01-30 Texas Instruments Inc Process for manufacturing multilayer film circuits
FR1532196A (fr) * 1966-07-25 1968-07-05 Oerlikon Maschf Conducteur fortement réfrigéré

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3807041A (en) * 1971-12-22 1974-04-30 Imp Metal Ind Kynoch Ltd Method of fabricating a composite superconductor
US3868768A (en) * 1972-05-31 1975-03-04 Bbc Brown Boveri & Cie Method of producing a composite superconductor
US3874074A (en) * 1972-05-31 1975-04-01 Bbc Brown Boveri & Cie Method of fabricating a stabilized composite superconductor
US3900702A (en) * 1972-11-30 1975-08-19 Siemens Ag Ribbon-shaped conductor arrangement for superconductors which permits ease of cooling
US3876473A (en) * 1973-01-26 1975-04-08 Imp Metal Ind Kynoch Ltd Method of fabricating a composite intermetallic-type superconductor
US3811185A (en) * 1973-03-23 1974-05-21 Us Navy Method for enhancing v{11 ga thin film growth
US3997714A (en) * 1974-05-29 1976-12-14 Compagnie Generale D'electricite Superconductive lead having thin strips
US3902000A (en) * 1974-11-12 1975-08-26 Us Energy Termination for superconducting power transmission systems
US4080585A (en) * 1977-04-11 1978-03-21 Cubic Corporation Flat coil transformer for electronic circuit boards
US4367372A (en) * 1980-04-04 1983-01-04 Alsthom-Atlantique Flat multi-strand superconducting conductor with a separator
US5379019A (en) * 1993-10-12 1995-01-03 General Electric Company Apparatus for embossing superconducting tape for use in a superconducting magnet
US5593506A (en) * 1995-04-03 1997-01-14 General Electric Company Cleaning method for foil
US20080217289A1 (en) * 2004-08-20 2008-09-11 Anelva Corporation Magnetoresistance effect device and method of production thereof
US7727409B2 (en) * 2004-08-20 2010-06-01 Canon Anelva Corporation Magnetoresistance effect device and method of production thereof
WO2006078707A2 (en) * 2005-01-19 2006-07-27 Tosoh Smd Etna, Llc Automated sputtering target production and sub systems thereof
WO2006078709A2 (en) * 2005-01-19 2006-07-27 Tosoh Smd Etna, Llc Automated sputtering target production
WO2006078709A3 (en) * 2005-01-19 2007-02-01 Tosoh Smd Etna Llc Automated sputtering target production
WO2006078707A3 (en) * 2005-01-19 2007-03-15 Tosoh Smd Etna Llc Automated sputtering target production and sub systems thereof
US20080110011A1 (en) * 2005-01-19 2008-05-15 Wiley Zane Reed Automated Sputtering Target Production and Sub Systems Thereof
US20080271305A1 (en) * 2005-01-19 2008-11-06 Tosoh Smd Etna, Llc Automated Sputtering Target Production
US7480976B2 (en) 2005-01-19 2009-01-27 Tosoh Smd Etna, Llc Automated sputtering target production and sub systems thereof

Also Published As

Publication number Publication date
FR2195859A1 (pl) 1974-03-08
GB1401368A (en) 1975-07-16
DE2324323C2 (de) 1982-09-16
CA971678A (en) 1975-07-22
DE2324323A1 (de) 1974-02-28
FR2195859B1 (pl) 1977-02-11
JPS4946177A (pl) 1974-05-02
NL7306475A (pl) 1974-02-13

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