US3705321A - Electron tube with bonded external semiconductor electrode - Google Patents
Electron tube with bonded external semiconductor electrode Download PDFInfo
- Publication number
- US3705321A US3705321A US89190A US3705321DA US3705321A US 3705321 A US3705321 A US 3705321A US 89190 A US89190 A US 89190A US 3705321D A US3705321D A US 3705321DA US 3705321 A US3705321 A US 3705321A
- Authority
- US
- United States
- Prior art keywords
- electrode
- envelope
- ring
- semiconductor
- junction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000011521 glass Substances 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 239000010941 cobalt Substances 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- XIKYYQJBTPYKSG-UHFFFAOYSA-N nickel Chemical compound [Ni].[Ni] XIKYYQJBTPYKSG-UHFFFAOYSA-N 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000003993 interaction Effects 0.000 abstract description 4
- 229910000833 kovar Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005513 bias potential Methods 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical group [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical group [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Chemical group 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J43/00—Secondary-emission tubes; Electron-multiplier tubes
- H01J43/04—Electron multipliers
- H01J43/28—Vessels, e.g. wall of the tube; Windows; Screens; Suppressing undesired discharges or currents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J43/00—Secondary-emission tubes; Electron-multiplier tubes
- H01J43/04—Electron multipliers
- H01J43/06—Electrode arrangements
- H01J43/12—Anode arrangements
Definitions
- ABSTRACT AB! 313/953 315/3 A semiconductor element is hermetically sealed to an I [51] Int. Cl .1101; 31/26, H01 1 39/ 14 evacuated electron tube envelope to provide a target [58] held of sarch"3l3/94 65 65 --electrode which collects electrons within the tube 313/65 315/3 while the junction area and output electrode are exter- 56 f Ct nal to the vacuum environment.
- photocathode materials used in light sensitive tubes may migrate onto the semiconductor or the photocathode surface may be poisoned by materials emitted from thesemiconductor or passivating substances employed to protect the semiconductor.
- Sodium and potassium are commonly employed photocathode materials which, when heated, can attack the silicon oxide protecting layers of planar type silicon semiconductor devices.
- the junction areas of the different conductivity type materials of the semiconductor are sensitive to such contamination.
- One approach which has been explored to overcome these problems is the use of in-vacuum photoprocessing and transfer wherein photocathodes may be processed separately and then cooled and assembled within a vacuum environment. This however, is slow and expensive.
- a semiconductor device is .bonded and hermetically sealed to one end of a vacuum tube envelope so that one electrode surface is exposed through a small aperture to collect electrons within the tube while the sensitive junction area and other electrodes are external to the envelope.
- a metallic alloy ring or plate such as a composition of nickel, cobalt and iron, known as Kovar, is preferably used to provide a bond between the semiconductor and the glass envelope.
- FIGURE schematically shows a cross-section of a typical photomultiplier tube employing the semiconductor output device sealed at one end in accordance with the invention.
- a photomultiplier tube glass envelope 10 includes a light transparent faceplate 12 at one end, having a photosensitive electron emissive coating 14 on the inner surface which emits electrons in response to the impingement of light thereon from an external source.
- a semiconductor device 16 such as an NP diode, having a junction 18 between the two opposite conductivity type electrodes 20, 22, is disposed at the other end of the tube.
- One surface of the semiconductor, including an inner first electrode 20, is bonded conductively to a metallic ring or plate 24 which is sealed at the outer periphery 25 to the glass envelope.
- the ring ispreferably made of a nickel,
- cobalt and iron composition commonly known as Kovar which is particularly suitable'for sealing directly to glass by well known heating and fusion techniques.
- Kovar cobalt and iron composition commonly known as Kovar which is particularly suitable'for sealing directly to glass by well known heating and fusion techniques.
- a nickel-nickel-alloy bond is preferably utilized, while for P-type materials a gold-germanium bond may be employed-In aperture 26 in the ring provides an opening for electrode 20 which is exposed to the electron beam to act as a target for the collection of electrons from the photocathode 14 within the tube.
- -A potential source is preferably connected between the photocathode an electrode 20 or ring 24, and for example, may apply an accelerating voltage of from -5,000 to l0,000 volts d.c.
- an electrostatic focusing electrode 28 may be utilized for focusing electrons from the photocathode onto electrode 20.
- the potential on the focusing electrode is preferably close to that of the cathode.
- Element 30 represents an emissive coated electrode utilized during the high temperature processing within the tube to direct a supply of photocathode materials onto the faceplate.
- the electrons emitted from photocathode 14 normally penetrate the first or input electrode 20, which may be an N-conductivity type layer, and pass into the depletion region associated with the junction which extends for the most part into the P-type conductivity material of electrode 22.
- the electron passage through the depletion region operates in a well known manner to cause an electron multiplication action.
- a suitable bias potential between electrodes 20, 22 provides proper operation of the semiconductor. For example, a reverse bias of 50 volts d.c. is applied to the P output electrode with respect to the N input electrode.
- Use of a PN semiconductor element having reversed positions of the two opposite conductivity type electrodes would require opposite polarity potentials thereacross.
- the output signal in the form of current or a voltage pulse developed across a load resistor 32, is extracted from the connection 34 to the output electrode 22.
- the output electrode connection may be in the form of a longitudinally extending stud which can connect to a central conductor of a coaxial output cable.
- the external portions of the semiconductor including the remaining surface of electrode 20 bonded to the metal ring around the aperture, the underlying junction and the adjacent surface of electrode 22 are preferably hermetically sealed by an expoxy resin coating or other suitable dielectric encapsulant.
- the concentric junction and outer electrode surfaces have coatings of protective isolating layers which prevent direct electrical contact to the bonded metal ring.
- the connections to the electrodes and the hermetic sealing have the same configurations as described above.
- the semiconductor device may also be a transistor which can be bonded and sealed in a similar manner and the tube may be of an image dissector type or other like device utilizing photocathodes and electron multiplier structures.
- the semiconductor may be bonded to tantalum, tungsten or other metals which may in turn be bonded to ceramic tube bodies It may thus be seen that placement of the sensitive junction area and output electrode of the semiconductor external to the tube and use a narrow aperture exposing only the input electrode to the internal tube environment, as in the present invention, provides a simple inexpensive photosensitive tube which minimizes interaction of semiconductor and cathode materials within an electron tube enclosure. While only a single embodiment has been illustrated and described, it is to be understood that many variations may be made in the particular design and configuration without departing from the scope of the invention as set forth in the appended claims.
- An electron tube device comprising:
- a semiconductor device providing an output electrode at the other end, said semiconductor device having a junction therein of two electrodes of opposite conductivity type materials, said envelope including a metallic ring having a narrow aperture at said other end, said semi-conductor device being hermetically sealed onto said ring over said aperture and enclosing said envelope, said semiconductor device having a first electrode surface exposed to the vacuum and to electrons within said envelope, said junction and a second electrode being external to said envelope and vacuum,
- the device of claim 2 including potential means connected between said cathode and said first electrode.
- said metallic alloy ring is made of a composition of nickel, cobalt and iron.
- said electron emissive cathode includes a photosensitive coating emitting electrons in response to light impingement thereon.
- the device of claim 6, including electron optical means focusing said electrons upon said first electrode.
- said output means includes a longitudinal stud connected to said second electrode providing a conductor adapted for connection to a coaxial connector.
Landscapes
- Cold Cathode And The Manufacture (AREA)
- Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)
- Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8919070A | 1970-11-13 | 1970-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3705321A true US3705321A (en) | 1972-12-05 |
Family
ID=22216220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US89190A Expired - Lifetime US3705321A (en) | 1970-11-13 | 1970-11-13 | Electron tube with bonded external semiconductor electrode |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3705321A (OSRAM) |
| FR (1) | FR2114686A5 (OSRAM) |
| GB (1) | GB1319008A (OSRAM) |
| NL (1) | NL7115477A (OSRAM) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3818363A (en) * | 1972-12-12 | 1974-06-18 | Us Army | Electron beam semiconductor amplifier device |
| EP0495283A1 (en) * | 1991-01-17 | 1992-07-22 | Burle Technologies, Inc. | Semiconductor anode photomultiplier tube |
| US5874728A (en) * | 1996-05-02 | 1999-02-23 | Hamamatsu Photonics K.K. | Electron tube having a photoelectron confining mechanism |
| US5883466A (en) * | 1996-07-16 | 1999-03-16 | Hamamatsu Photonics K.K. | Electron tube |
| US5917282A (en) * | 1996-05-02 | 1999-06-29 | Hamamatsu Photonics K.K. | Electron tube with electron lens |
| US6198221B1 (en) | 1996-07-16 | 2001-03-06 | Hamamatsu Photonics K.K. | Electron tube |
| US6297489B1 (en) | 1996-05-02 | 2001-10-02 | Hamamatsu Photonics K.K. | Electron tube having a photoelectron confining mechanism |
-
1970
- 1970-11-13 US US89190A patent/US3705321A/en not_active Expired - Lifetime
-
1971
- 1971-11-11 NL NL7115477A patent/NL7115477A/xx unknown
- 1971-11-11 GB GB5237971A patent/GB1319008A/en not_active Expired
- 1971-11-15 FR FR7140745A patent/FR2114686A5/fr not_active Expired
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3818363A (en) * | 1972-12-12 | 1974-06-18 | Us Army | Electron beam semiconductor amplifier device |
| EP0495283A1 (en) * | 1991-01-17 | 1992-07-22 | Burle Technologies, Inc. | Semiconductor anode photomultiplier tube |
| JP2567774B2 (ja) | 1991-01-17 | 1996-12-25 | バール テクノロジース インコーポレイテツド | 光電子増倍管 |
| US5874728A (en) * | 1996-05-02 | 1999-02-23 | Hamamatsu Photonics K.K. | Electron tube having a photoelectron confining mechanism |
| US5917282A (en) * | 1996-05-02 | 1999-06-29 | Hamamatsu Photonics K.K. | Electron tube with electron lens |
| EP0805478A3 (en) * | 1996-05-02 | 2000-01-26 | Hamamatsu Photonics K.K. | Electron tube |
| US6297489B1 (en) | 1996-05-02 | 2001-10-02 | Hamamatsu Photonics K.K. | Electron tube having a photoelectron confining mechanism |
| US5883466A (en) * | 1996-07-16 | 1999-03-16 | Hamamatsu Photonics K.K. | Electron tube |
| US6198221B1 (en) | 1996-07-16 | 2001-03-06 | Hamamatsu Photonics K.K. | Electron tube |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2114686A5 (OSRAM) | 1972-06-30 |
| GB1319008A (en) | 1973-05-31 |
| NL7115477A (OSRAM) | 1972-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: ITT CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:INTERNATIONAL TELEPHONE AND TELEGRAPH CORPORATION;REEL/FRAME:004389/0606 Effective date: 19831122 |